CN104335373A - 热电模块及其运行方法 - Google Patents
热电模块及其运行方法 Download PDFInfo
- Publication number
- CN104335373A CN104335373A CN201380029788.2A CN201380029788A CN104335373A CN 104335373 A CN104335373 A CN 104335373A CN 201380029788 A CN201380029788 A CN 201380029788A CN 104335373 A CN104335373 A CN 104335373A
- Authority
- CN
- China
- Prior art keywords
- wall
- electrothermal module
- compression
- heat flow
- main direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Air-Conditioning For Vehicles (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Electromechanical Clocks (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210104927 DE102012104927A1 (de) | 2012-06-06 | 2012-06-06 | Thermoelektrisches Modul und Verfahren zum Betrieb |
DE102012104927.0 | 2012-06-06 | ||
PCT/EP2013/060765 WO2013182441A2 (de) | 2012-06-06 | 2013-05-24 | Thermoelektrisches modul und verfahren zum betrieb |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104335373A true CN104335373A (zh) | 2015-02-04 |
CN104335373B CN104335373B (zh) | 2018-04-03 |
Family
ID=48570100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380029788.2A Active CN104335373B (zh) | 2012-06-06 | 2013-05-24 | 热电模块及其运行方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20150114440A1 (zh) |
EP (1) | EP2859598B1 (zh) |
JP (1) | JP6173445B2 (zh) |
KR (1) | KR101657391B1 (zh) |
CN (1) | CN104335373B (zh) |
DE (1) | DE102012104927A1 (zh) |
IN (1) | IN2014DN09760A (zh) |
RU (1) | RU2630540C2 (zh) |
WO (1) | WO2013182441A2 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2521353A (en) * | 2013-12-17 | 2015-06-24 | Ibm | Thermoelectric device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3607444A (en) * | 1966-12-06 | 1971-09-21 | Siemens Ag | Thermoelectric assembly |
JPH08335722A (ja) * | 1995-06-08 | 1996-12-17 | Ngk Insulators Ltd | 熱電変換モジュール |
JPH0992890A (ja) * | 1995-09-25 | 1997-04-04 | Matsushita Electric Works Ltd | 熱電気変換装置 |
US20050016183A1 (en) * | 2003-07-25 | 2005-01-27 | Kabushiki Kaisha Toshiba | Thermoelectric device |
CN102439743A (zh) * | 2009-03-09 | 2012-05-02 | 住友化学株式会社 | 热电转换模块 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3090206A (en) * | 1960-06-23 | 1963-05-21 | Frank W Anders | Thermoelectric devices and circuits therefor |
WO1989003939A1 (en) * | 1987-10-20 | 1989-05-05 | Nova-Werke Ag | Linear drive with hydraulic reinforcement |
JPH08288557A (ja) * | 1995-02-17 | 1996-11-01 | Matsushita Electric Works Ltd | 熱電気変換装置 |
US7273981B2 (en) * | 2001-02-09 | 2007-09-25 | Bsst, Llc. | Thermoelectric power generation systems |
US6410971B1 (en) | 2001-07-12 | 2002-06-25 | Ferrotec (Usa) Corporation | Thermoelectric module with thin film substrates |
JP2004063656A (ja) * | 2002-07-26 | 2004-02-26 | Toshiba Corp | 熱電変換装置 |
JP2005127162A (ja) * | 2003-10-21 | 2005-05-19 | Toyota Motor Corp | 排熱回収装置 |
JP4266228B2 (ja) * | 2006-03-24 | 2009-05-20 | 株式会社東芝 | 熱電変換モジュールおよびその製造方法 |
US20070272292A1 (en) * | 2006-05-24 | 2007-11-29 | Jerrei Lin | Thermal-recycling system for a motor vehicle |
JP2008270618A (ja) * | 2007-04-23 | 2008-11-06 | Toyota Motor Corp | 熱電発電モジュール |
JP2008288535A (ja) * | 2007-05-21 | 2008-11-27 | Toyota Motor Corp | 熱電発電モジュール |
JPWO2009142240A1 (ja) * | 2008-05-23 | 2011-09-29 | 株式会社村田製作所 | 熱電変換モジュールおよび熱電変換モジュールの製造方法 |
DE102010044803A1 (de) * | 2010-09-09 | 2012-03-15 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Thermoelektrisches Modul für einen thermoelektrischen Generator eines Fahrzeugs mit einem Dichtelement |
-
2012
- 2012-06-06 DE DE201210104927 patent/DE102012104927A1/de not_active Withdrawn
-
2013
- 2013-05-24 JP JP2015515466A patent/JP6173445B2/ja active Active
- 2013-05-24 WO PCT/EP2013/060765 patent/WO2013182441A2/de active Application Filing
- 2013-05-24 RU RU2014154138A patent/RU2630540C2/ru active
- 2013-05-24 CN CN201380029788.2A patent/CN104335373B/zh active Active
- 2013-05-24 KR KR1020147035660A patent/KR101657391B1/ko active IP Right Grant
- 2013-05-24 EP EP13726479.2A patent/EP2859598B1/de active Active
-
2014
- 2014-11-18 IN IN9760DEN2014 patent/IN2014DN09760A/en unknown
- 2014-12-08 US US14/562,949 patent/US20150114440A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3607444A (en) * | 1966-12-06 | 1971-09-21 | Siemens Ag | Thermoelectric assembly |
JPH08335722A (ja) * | 1995-06-08 | 1996-12-17 | Ngk Insulators Ltd | 熱電変換モジュール |
JPH0992890A (ja) * | 1995-09-25 | 1997-04-04 | Matsushita Electric Works Ltd | 熱電気変換装置 |
US20050016183A1 (en) * | 2003-07-25 | 2005-01-27 | Kabushiki Kaisha Toshiba | Thermoelectric device |
CN102439743A (zh) * | 2009-03-09 | 2012-05-02 | 住友化学株式会社 | 热电转换模块 |
Also Published As
Publication number | Publication date |
---|---|
CN104335373B (zh) | 2018-04-03 |
WO2013182441A2 (de) | 2013-12-12 |
WO2013182441A3 (de) | 2014-09-12 |
US20150114440A1 (en) | 2015-04-30 |
KR101657391B1 (ko) | 2016-09-19 |
RU2014154138A (ru) | 2016-08-10 |
EP2859598B1 (de) | 2018-03-21 |
RU2630540C2 (ru) | 2017-09-11 |
JP6173445B2 (ja) | 2017-08-02 |
KR20150013326A (ko) | 2015-02-04 |
IN2014DN09760A (zh) | 2015-07-31 |
EP2859598A2 (de) | 2015-04-15 |
DE102012104927A1 (de) | 2013-12-12 |
JP2015524171A (ja) | 2015-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: German Lohmar Patentee after: Mainland Yimi Tech Co.,Ltd. Address before: German Lohmar Patentee before: EMITEC GESELLSCHAFT FuR EMISSIONSTECHNOLOGIE MBH |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230926 Address after: Regensburg, Germany Patentee after: WeiPai Technology Co.,Ltd. Address before: Hannover Patentee before: CONTINENTAL AUTOMOTIVE GmbH Effective date of registration: 20230926 Address after: Hannover Patentee after: CONTINENTAL AUTOMOTIVE GmbH Address before: German Lohmar Patentee before: Mainland Yimi Tech Co.,Ltd. |
|
TR01 | Transfer of patent right |