CN104329846A - Semiconductor refrigerator with optimized refrigeration efficiency - Google Patents
Semiconductor refrigerator with optimized refrigeration efficiency Download PDFInfo
- Publication number
- CN104329846A CN104329846A CN201410122774.1A CN201410122774A CN104329846A CN 104329846 A CN104329846 A CN 104329846A CN 201410122774 A CN201410122774 A CN 201410122774A CN 104329846 A CN104329846 A CN 104329846A
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- Prior art keywords
- chilling plate
- semiconductor
- semiconductor chilling
- temperature
- hot
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2700/00—Means for sensing or measuring; Sensors therefor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a semiconductor refrigerator with the optimized refrigeration efficiency. According to selection of the volume of the semiconductor refrigerator and a semiconductor chilling plate, when the highest efficiency voltage Us with the highest refrigeration efficiency supplies power to the semiconductor chilling plate, the semiconductor chilling plate can carry out refrigeration to enable the average temperature of refrigerator chambers of the semiconductor refrigerator to be within the target temperature range of 10 DEG C to 20 DEG C. The semiconductor chilling plate is selected according to the volume of the semiconductor refrigerator; the selection of specification of the semiconductor chilling plate is optimized; the semiconductor chilling plate is matched with the volume of the semiconductor refrigerator, and the defect that in the prior art, when the semiconductor chilling plate is not matched with the volume of the semiconductor refrigerator, the refrigeration amount of the semiconductor chilling plate is too much or too little, and the refrigeration efficiency of the semiconductor chilling plate is low is avoided. The refrigeration efficiency of the semiconductor refrigerator is optimized.
Description
Technical field
The present invention relates to refrigeration plant, particularly relate to the semiconductor freezer that a kind of refrigerating efficiency is optimized.
Background technology
The refrigerating efficiency of existing semiconductor freezer is lower, is mainly caused by the reason of the following aspects:
1, the target temperature that requires of semiconductor freezer is lower, and when causing semiconductor chilling plate work, the temperature difference of cold and hot end comparatively greatly, and generally higher than 30 DEG C, the excessive temperature differentials of cold and hot end reduces efficiency under the refrigeration of semiconductor chilling plate.
2, the heat radiation in semiconductor chilling plate hot junction is bad, the refrigerating capacity that semiconductor chilling plate produces cannot be dispersed in surrounding air in time, after of long duration, the temperature in semiconductor chilling plate hot junction can rise, the temperature difference that result in the cold and hot end of semiconductor chilling plate equally becomes large, reduces the refrigerating efficiency of semiconductor chilling plate.
3, the selection of semiconductor chilling plate specification is not optimum, and cause semiconductor chilling plate can not mate with semiconductor freezer, the refrigerating capacity of semiconductor chilling plate is too much or very few, result also in the refrigerating efficiency step-down of semiconductor chilling plate.
Summary of the invention
An object of the present invention is the semiconductor freezer that a kind of refrigerating efficiency will be provided to optimize, solve the problem that existing semiconductor freezer refrigerating efficiency is lower.
The present invention's further object to provide a kind of semiconductor freezer being suitable for storing drinks or cosmetics.
Especially, the invention provides the semiconductor freezer that a kind of refrigerating efficiency is optimized, wherein,
Volume and the semiconductor chilling plate of described semiconductor freezer are selected as, when the peak efficiency voltage U s the highest with refrigerating efficiency powers to described semiconductor chilling plate, described semiconductor chilling plate can carry out freezing the mean temperature of the refrigerator compartment of described semiconductor freezer is fallen in the target temperature range of 10-20 DEG C.
Alternatively, described semiconductor freezer is for storing drinks or cosmetics.
Alternatively, described semiconductor freezer comprises:
Target temperature setting unit, is configured to select target temperature in the described target temperature range of 10-20 DEG C.
Alternatively, described semiconductor freezer comprises:
Semiconductor module, described semiconductor module comprises: the described semiconductor chilling plate be secured together by fastening bolt, heat-conducting block, cold junction blower fan, cold junction fin, hot junction blower fan, hot side fin and heat-insulation layer, and described semiconductor chilling plate and described heat-conducting block are fixed in described heat-insulation layer;
Described fastening bolt is arranged with heat insulating washer, and described heat insulating washer transmits cold for stoping described fastening bolt between described semiconductor chilling plate hot junction and described semiconductor chilling plate cold junction.
Alternatively, described semiconductor freezer comprises:
Cold junction temperature sensor, is configured to the cold junction temperature detecting semiconductor chilling plate;
Hot-side temperature sensor, is configured to the hot-side temperature detecting semiconductor chilling plate;
Described semiconductor freezer is configured to, and makes the cold junction temperature of described semiconductor chilling plate and the temperature difference of hot-side temperature be not more than 20 DEG C by the rotating speed controlling described hot junction blower fan.
Alternatively, described semiconductor freezer is configured to, and makes the cold junction temperature of described semiconductor chilling plate and the temperature difference of hot-side temperature equal 20 DEG C by the rotating speed controlling described hot junction blower fan.
Alternatively, described semiconductor freezer is configured to, and makes the cold junction temperature of described semiconductor chilling plate and the temperature difference of hot-side temperature equal 13 DEG C by the rotating speed controlling described hot junction blower fan.
Alternatively, the relation that described semiconductor chilling plate is directly proportional to the volume of described semiconductor freezer according to its refrigerating capacity when the highest refrigerating efficiency is selected, so that the refrigerating capacity of described semiconductor chilling plate when the highest refrigerating efficiency can make the mean temperature of the refrigerator compartment of described semiconductor freezer fall in the described target temperature range of 10-20 DEG C.
Alternatively, the volume of described semiconductor freezer is chosen as 10L-100L.
The volume of semiconductor freezer and semiconductor chilling plate are selected as by the present invention, when the peak efficiency voltage U s the highest with refrigerating efficiency powers to semiconductor chilling plate, semiconductor chilling plate can carry out freezing to make the mean temperature of refrigerator compartment to fall in the target temperature range of 10-20 DEG C.Thus the present invention selects semiconductor chilling plate according to the volume of semiconductor freezer, optimize the selection of semiconductor chilling plate specification, the volume of semiconductor chilling plate and semiconductor freezer is matched: when the peak efficiency voltage U s the highest with refrigerating efficiency powers to semiconductor chilling plate, the refrigerating capacity of semiconductor chilling plate can make the mean temperature of refrigerator compartment fall in the target temperature range of 10-20 DEG C.When overcoming that in prior art, semiconductor chilling plate does not mate with the volume of semiconductor freezer, the refrigerating capacity of semiconductor chilling plate is too much or very fewly cause the defect that semiconductor chilling plate refrigerating efficiency is lower, optimizes the refrigerating efficiency of semiconductor freezer of the present invention.
The mean temperature of the refrigerator compartment of existing semiconductor freezer is generally between 3-10 DEG C, but such as the storage of the article such as drinks, cosmetics does not need so low temperature, in the target temperature range that the present invention makes the mean temperature of refrigerator compartment fall into 10-20 DEG C in 10-20 DEG C, the semiconductor freezer of invention is made to be applicable to store the suitable article of storage temperature in 10-20 DEG C such as drinks or cosmetics.Further, under the hot-side temperature of certain semiconductor chilling plate, the mean temperature improving refrigerator compartment can reduce the temperature difference of the cold and hot end of semiconductor chilling plate, optimizes the refrigerating efficiency of semiconductor chilling plate.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic diagram of semiconductor freezer according to an embodiment of the invention;
Fig. 2 is the schematic diagram of the module of semiconductor shown in Fig. 1;
Fig. 3 is the refrigerating capacity of semiconductor chilling plate and the example graph of voltage according to an embodiment of the invention;
Fig. 4 is the voltage of semiconductor chilling plate according to an embodiment of the invention and the example graph of refrigerating efficiency and refrigerating capacity relation;
Fig. 5 is in order to maintain target temperature after reaching target temperature, the schematic graph of a relation of the refrigerating capacity of semiconductor chilling plate and the volume of semiconductor freezer.
The Reference numeral used in accompanying drawing is as follows:
10 semiconductor modules,
20 bodies,
30 casings,
101 semiconductor chilling plates,
102 heat-conducting blocks,
103 cold junction blower fans,
104 cold junction fins,
105 hot junction blower fans,
106 hot side fin,
107 heat-insulation layers,
108 fastening bolts.
Detailed description of the invention
Fig. 1 is the schematic diagram of semiconductor freezer according to an embodiment of the invention, semiconductor module 10 is shown in Fig. 1, has also show the position relationship that the door body 20 of semiconductor freezer and casing 30 schematically show out semiconductor module 10 and door body 20 and casing 30.
As shown in Figure 2, in the present embodiment, semiconductor module 10 comprises the semiconductor chilling plate 101, heat-conducting block 102, cold junction blower fan 103, cold junction fin 104, hot junction blower fan 105, hot side fin 106 and the heat-insulation layer 107 that are secured together by fastening bolt 108.As can be seen from Figure 2, semiconductor chilling plate 101 and heat-conducting block 102 are fixed in heat-insulation layer 107.Further, the heat transfer contact face of semiconductor chilling plate 101 and heat-conducting block 102 and cold junction fin 104 is all coated with heat-conducting silicone grease, heat-conducting block 102 and the heat transfer contact face of cold junction fin 104 are also coated with heat-conducting silicone grease, heat-conducting silicone grease is for strengthening heat transfer.Fastening bolt 108 is arranged with heat insulating washer (not shown), heat insulating washer transmits cold for stoping fastening bolt 108 between the hot junction and cold junction of semiconductor chilling plate 101, thus can improve the refrigerating efficiency of semiconductor chilling plate 101.
Hot junction blower fan 105 and hot side fin 106 all play thermolysis, and wherein, the rotating speed of hot junction blower fan 105 can control, and the heat radiation in rotating speed higher semiconductor chilling plate 101 hot junction is better, and the temperature in semiconductor chilling plate 101 hot junction reduces faster.In one embodiment, semiconductor freezer comprises not shown cold junction temperature sensor and hot-side temperature sensor.Wherein, cold junction temperature sensor is configured to the cold junction temperature detecting semiconductor chilling plate, and hot-side temperature sensor is configured to the hot-side temperature detecting semiconductor chilling plate.Semiconductor freezer can control the hot-side temperature of semiconductor chilling plate 101 by the rotating speed controlling hot junction blower fan, thus the temperature difference controlling semiconductor chilling plate 101 cold junction temperature and hot-side temperature realizes the control to semiconductor chilling plate 101 refrigerating efficiency.Such as, the cold junction temperature of semiconductor chilling plate and the temperature difference of hot-side temperature can be made to be not more than 20 DEG C.Inventor finds, for specific semiconductor chilling plate, under certain input power, the refrigerating efficiency of this semiconductor chilling plate depends on the cold junction of semiconductor chilling plate and the temperature difference in hot junction, the temperature difference is less, and the refrigerating efficiency of semiconductor chilling plate is larger, and the cold of generation is also larger.Target temperature is limited in the scope of 10-20 DEG C by the present invention.The cold junction of semiconductor chilling plate can be made to be in relatively high temperature when the hot-side temperature of semiconductor chilling plate is constant, thus the temperature difference in the cold junction of semiconductor chilling plate and hot junction diminish, and improves the refrigerating efficiency of semiconductor chilling plate.
Semiconductor freezer in Fig. 1 and Fig. 2 embodiment also comprises not shown master control borad, and master control borad is configured to power to described semiconductor chilling plate with the peak efficiency voltage U s that refrigerating efficiency is the highest.Now, semiconductor chilling plate can carry out freezing to make the mean temperature of the refrigerator compartment of semiconductor freezer to fall in the target temperature range of 10-20 DEG C.Semiconductor freezer of the present invention is applicable to the product storing the applicable storage in 10-20 DEG C of target temperature range such as drinks or cosmetics.And in this specific objective temperature range, the refrigerating efficiency that semiconductor chilling plate plays is higher than the refrigerating efficiency of existing compressor type refrigerator.
Semiconductor freezer in Fig. 1 and Fig. 2 embodiment also comprises not shown compartment temperature sensor and target temperature setting unit.Wherein, compartment temperature sensor is configured to detect the mean temperature of refrigerator compartment, target temperature setting unit be configured to can only in the target temperature range of 10-20 DEG C select target temperature.
Input power due to semiconductor freezer is generally controlled by the voltage of input, and the voltage of input and the relation of refrigerating capacity are hereafter discussed.Fig. 3 is the refrigerating capacity of a semiconductor chilling plate and the example graph of voltage, there is shown the curved line relation that voltage, cold, the temperature difference are corresponding.The temperature difference herein refers to the temperature difference of the cold and hot end of semiconductor chilling plate 101, the relation of voltage and cold when curve a represents the temperature difference 15 DEG C, the relation of voltage and cold when curve b represents the temperature difference 20 DEG C, the relation of voltage and cold when curve c represents the temperature difference 25 DEG C, the relation of voltage and cold when curve d represents the temperature difference 30 DEG C, voltage when straight line e refrigerating capacity is maximum, Qc1 > Qc2 > Qc3 > Qc4.As can be seen from the figure, voltage one timing, the temperature difference is less, and cold is larger.Efficiency due to semiconductor chilling plate 101 equals refrigerating capacity divided by power, therefore can extrapolate, and voltage one timing, the temperature difference is less, and refrigerating capacity is larger, and efficiency is higher.The temperature difference of the cold and hot end of existing semiconductor chilling plate is about 20 DEG C time, and refrigerating efficiency is probably equal with the refrigerating efficiency of compressor type refrigerator, and when the temperature difference is greater than 20 DEG C, refrigerating efficiency is by the refrigerating efficiency lower than compressor type refrigerator.When the temperature difference is less than 20 DEG C, refrigerating efficiency is by the refrigerating efficiency higher than compressor type refrigerator.The target temperature setting unit of the present invention's just semiconductor freezer is mixed with select target temperature in the target temperature range of 10-20 DEG C, and therefore the target temperature of semiconductor freezer is restricted to the scope of 10-20 DEG C.The cold junction of semiconductor chilling plate can be made to be in relatively high temperature when the hot-side temperature of semiconductor chilling plate 101 is constant, thus reduce the cold junction of semiconductor chilling plate and the temperature in hot junction, improve the refrigerating efficiency of semiconductor chilling plate.
Fig. 4 is the supply voltage of a semiconductor chilling plate according to an embodiment of the invention and the example graph of refrigerating efficiency and refrigerating capacity relation.As seen from Figure 4, have the highest refrigerating efficiency Ps when the operating voltage of semiconductor chilling plate 101 is positioned at Us, its refrigerating capacity is Qcs, not corresponding generation maximum cooling capacity when semiconductor visual cooling piece 101 is operated in its maximum refrigerating efficiency.The refrigerating capacity when the highest refrigerating efficiency of different semiconductor chilling plate and the volume of semiconductor freezer proportional.When the volume for specific semiconductor freezer selects semiconductor chilling plate, the volume of the refrigerating capacity of the semiconductor chilling plate that the present invention selects when the highest refrigerating efficiency and this specific semiconductor freezer is proportional.When the operating voltage of semiconductor chilling plate 101 is positioned at Um, there is maximum refrigerating capacity Qcm, its refrigerating efficiency be Pm, Um be equivalent to refrigerating capacity that the straight line e in Fig. 3 represents maximum time voltage.In the semiconductor freezer that refrigerating efficiency of the present invention is optimized, to make the highest peak efficiency voltage U s of the refrigerating efficiency of semiconductor chilling plate 101 power to semiconductor chilling plate 101, the mean temperature of refrigerator compartment is fallen in target temperature range.The present invention powers to semiconductor chilling plate 101 with peak efficiency voltage U s, further increases the refrigerating efficiency of semiconductor chilling plate 101.
Get back to the semiconductor freezer in Fig. 1 and Fig. 2 embodiment, semiconductor freezer applied environment temperature is higher than 32 DEG C (operating ambient temperature that current common semiconductor refrigeration product is suitable for is not general not higher than 32 DEG C), and target temperature is between 10-20 DEG C.Assuming that under 32 DEG C of environment temperatures, target temperature is 15 DEG C, then the temperature of the cold junction of semiconductor chilling plate needs not higher than 15 DEG C, be assumed to 14 DEG C, the temperature in the hot junction of semiconductor chilling plate is understood higher than environment temperature because needs dispel the heat in environment, and when hot-side heat dissipation is effective, the temperature in hot junction can be accomplished only higher than environment temperature 1-2 DEG C, be assumed to 34 DEG C, then the temperature difference of the cold and hot end of semiconductor chilling plate is 34-14=20 DEG C at this moment.When the temperature difference of 20 DEG C, the refrigerating efficiency of semiconductor chilling plate and the refrigerating efficiency of compressor type refrigerator are roughly the same, and refrigerating efficiency is about 1.5, but higher than the refrigerating efficiency of conventional semiconductors refrigerator a lot.Assuming that under 32 DEG C of environment temperatures, target temperature is 15 DEG C, then the temperature of the cold junction of semiconductor chilling plate needs not higher than 15 DEG C, be assumed to 14 DEG C, the temperature in the hot junction of semiconductor chilling plate is understood higher than environment temperature because needs dispel the heat in environment, and when hot-side heat dissipation is effective, the temperature in hot junction can be accomplished only higher than environment temperature 1-2 DEG C, be assumed to 27 DEG C, then the temperature difference of the cold and hot end of semiconductor chilling plate is 27-14=13 DEG C at this moment.When the temperature difference of 13 DEG C, the refrigerating efficiency of semiconductor chilling plate is about 2.2.As shown in Figure 3, when target temperature constant (15 DEG C), and when environment temperature drops to 25 DEG C by 32 DEG C, the temperature difference of the cold and hot end of semiconductor chilling plate will become less, now when voltage is constant, the refrigerating capacity of semiconductor chilling plate 101 will become greatly, and refrigerating efficiency will become higher.
Fig. 5 is after reaching target temperature, in order to the schematic graph of a relation of the refrigerating capacity (hereinafter referred to as maintaining cold) with the volume of semiconductor freezer that maintain target temperature semiconductor chilling plate.In the embodiment shown in fig. 5, the volume selecting semiconductor freezer is 10L, 50L and 100L, and corresponding maintenance cold is respectively 2W, 10W, 20W.Because required maintenance cold is not only relevant with the volume of semiconductor freezer, also relevant with factors such as the mean temperatures of the thickness of the cabinet insulation layer of semiconductor freezer, environment temperature, refrigerator compartment, therefore, the volume of several groups of semiconductor freezers provided in figure is that other influences factor is all consistent with the prerequisite of the corresponding relation maintaining cold, be specially environment temperature 25 DEG C, the mean temperature of refrigerator compartment 10 DEG C, target temperature 10 DEG C, cabinet insulation layer thickness 50mm.As shown in Figure 5, the corresponding relation maintaining the volume of cold and semiconductor freezer is linear relationship substantially, and the volume of semiconductor freezer is larger, and the refrigerating capacity maintaining the semiconductor chilling plate of target temperature is larger.The volume of semiconductor freezer is larger, and the leaking heat of casing is larger, now in order to keep target temperature, maintains cold also larger.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (9)
1. a semiconductor freezer for refrigerating efficiency optimization, wherein,
Volume and the semiconductor chilling plate of described semiconductor freezer are selected as, when the peak efficiency voltage U s the highest with refrigerating efficiency powers to described semiconductor chilling plate, described semiconductor chilling plate can carry out freezing the mean temperature of the refrigerator compartment of described semiconductor freezer is fallen in the target temperature range of 10-20 DEG C.
2. semiconductor freezer according to claim 1, wherein,
Described semiconductor freezer is for storing drinks or cosmetics.
3. semiconductor freezer according to claim 1, comprising:
Target temperature setting unit, is configured to select target temperature in the described target temperature range of 10-20 DEG C.
4. semiconductor freezer according to claim 1, comprising:
Semiconductor module, described semiconductor module comprises: the described semiconductor chilling plate be secured together by fastening bolt, heat-conducting block, cold junction blower fan, cold junction fin, hot junction blower fan, hot side fin and heat-insulation layer, and described semiconductor chilling plate and described heat-conducting block are fixed in described heat-insulation layer;
Described fastening bolt is arranged with heat insulating washer, and described heat insulating washer transmits cold for stoping described fastening bolt between described semiconductor chilling plate hot junction and described semiconductor chilling plate cold junction.
5. semiconductor freezer according to claim 4, comprising:
Cold junction temperature sensor, is configured to the cold junction temperature detecting semiconductor chilling plate;
Hot-side temperature sensor, is configured to the hot-side temperature detecting semiconductor chilling plate;
Described semiconductor freezer is configured to, and makes the cold junction temperature of described semiconductor chilling plate and the temperature difference of hot-side temperature be not more than 20 DEG C by the rotating speed controlling described hot junction blower fan.
6. semiconductor freezer according to claim 5, wherein:
Described semiconductor freezer is configured to, and makes the cold junction temperature of described semiconductor chilling plate and the temperature difference of hot-side temperature equal 20 DEG C by the rotating speed controlling described hot junction blower fan.
7. semiconductor freezer according to claim 5, wherein:
Described semiconductor freezer is configured to, and makes the cold junction temperature of described semiconductor chilling plate and the temperature difference of hot-side temperature equal 13 DEG C by the rotating speed controlling described hot junction blower fan.
8. semiconductor freezer according to claim 1, wherein:
The relation that described semiconductor chilling plate is directly proportional to the volume of described semiconductor freezer according to its refrigerating capacity when the highest refrigerating efficiency is selected, so that the refrigerating capacity of described semiconductor chilling plate when the highest refrigerating efficiency can make the mean temperature of the refrigerator compartment of described semiconductor freezer fall in the described target temperature range of 10-20 DEG C.
9. semiconductor freezer according to claim 1, wherein:
The volume of described semiconductor freezer is chosen as 10L-100L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410122774.1A CN104329846A (en) | 2014-03-28 | 2014-03-28 | Semiconductor refrigerator with optimized refrigeration efficiency |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410122774.1A CN104329846A (en) | 2014-03-28 | 2014-03-28 | Semiconductor refrigerator with optimized refrigeration efficiency |
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| CN104329846A true CN104329846A (en) | 2015-02-04 |
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| CN201410122774.1A Pending CN104329846A (en) | 2014-03-28 | 2014-03-28 | Semiconductor refrigerator with optimized refrigeration efficiency |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524631A (en) * | 2016-12-20 | 2017-03-22 | 浙江聚珖科技股份有限公司 | Combined semiconductor refrigeration refrigerator |
| CN111397268A (en) * | 2019-11-21 | 2020-07-10 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration cabinet for cosmetics |
| CN114251868A (en) * | 2020-09-25 | 2022-03-29 | 青岛海尔特种电冰柜有限公司 | Fault maintenance method of semiconductor refrigeration device |
| CN114294856A (en) * | 2021-12-13 | 2022-04-08 | 迈克医疗电子有限公司 | Method, device, medium, equipment and instrument for improving Peltier refrigeration efficiency |
| CN114739076A (en) * | 2021-01-07 | 2022-07-12 | 贵州海尔电器有限公司 | Semiconductor refrigeration equipment and control method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2091435U (en) * | 1991-06-11 | 1991-12-25 | 北京汇理自动化技术联合公司 | Two-temp. semiconductor refrigerator for automobile |
| CN101131270A (en) * | 2007-09-26 | 2008-02-27 | 施军达 | Semiconductor temperature and moisture control device |
| CN201812855U (en) * | 2010-09-10 | 2011-04-27 | 陈小刚 | Thermal serial combination type semiconductor refrigerator |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2091435U (en) * | 1991-06-11 | 1991-12-25 | 北京汇理自动化技术联合公司 | Two-temp. semiconductor refrigerator for automobile |
| CN101131270A (en) * | 2007-09-26 | 2008-02-27 | 施军达 | Semiconductor temperature and moisture control device |
| CN201812855U (en) * | 2010-09-10 | 2011-04-27 | 陈小刚 | Thermal serial combination type semiconductor refrigerator |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524631A (en) * | 2016-12-20 | 2017-03-22 | 浙江聚珖科技股份有限公司 | Combined semiconductor refrigeration refrigerator |
| CN111397268A (en) * | 2019-11-21 | 2020-07-10 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration cabinet for cosmetics |
| CN111397268B (en) * | 2019-11-21 | 2022-01-11 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration cabinet for cosmetics |
| CN114251868A (en) * | 2020-09-25 | 2022-03-29 | 青岛海尔特种电冰柜有限公司 | Fault maintenance method of semiconductor refrigeration device |
| CN114739076A (en) * | 2021-01-07 | 2022-07-12 | 贵州海尔电器有限公司 | Semiconductor refrigeration equipment and control method thereof |
| CN114739076B (en) * | 2021-01-07 | 2023-07-14 | 贵州海尔电器有限公司 | Semiconductor refrigeration equipment and control method thereof |
| CN114294856A (en) * | 2021-12-13 | 2022-04-08 | 迈克医疗电子有限公司 | Method, device, medium, equipment and instrument for improving Peltier refrigeration efficiency |
| CN114294856B (en) * | 2021-12-13 | 2023-08-25 | 迈克医疗电子有限公司 | Method, device, medium, equipment and instrument for improving Peltier refrigeration efficiency |
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Application publication date: 20150204 |