CN104308312A - BGA (ball grid array) ball mounting method - Google Patents
BGA (ball grid array) ball mounting method Download PDFInfo
- Publication number
- CN104308312A CN104308312A CN201410549011.5A CN201410549011A CN104308312A CN 104308312 A CN104308312 A CN 104308312A CN 201410549011 A CN201410549011 A CN 201410549011A CN 104308312 A CN104308312 A CN 104308312A
- Authority
- CN
- China
- Prior art keywords
- chip
- ball
- net
- planting
- tin ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 50
- 239000006071 cream Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract 5
- 230000004907 flux Effects 0.000 abstract 2
- 230000001680 brushing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 208000037170 Delayed Emergence from Anesthesia Diseases 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cultivation Receptacles Or Flower-Pots, Or Pots For Seedlings (AREA)
Abstract
The invention discloses a BGA (ball grid array) ball mounting method. The method comprises the steps: (1) fixing a chip onto a ball mounting table table-board; (2) uniformly smearing flux paste on the surface of the chip; (3) arranging a ball mounting mesh enclosure on the surface of the chip; (4) pouring solder balls into a ball mounting net of a ball mounting table, and flatly laying the solder balls; (5) removing the ball mounting net when the solder balls are coated with the flux paste on the surface of the chip from a through hole in the ball mounting net; (6) heating the solder balls by utilizing a blower gun until the solder balls are molten. The BGA ball mounting method is simple in operation and capable of reducing the material waste.
Description
Technical field
The present invention relates to chip processing method, particularly, relate to a kind of BGA ball-establishing method.
Background technology
BGA (BGA Package) technology is application a kind of surface mount technology on the integrated, and this technology is for being permanently fixed the device as microprocessor and so on.BGA package can provide holds more pin than dual-in-line package or four side pin flat package, the lower surface of whole device can use as pin entirely, instead of can use around only having, shorter average conductor length can also be had around, to possess better high speed usefulness compared with the encapsulated type limited.
Summary of the invention
The object of this invention is to provide a kind of BGA ball-establishing method, this BGA ball-establishing method is simple to operate, reduces material waste.
To achieve these goals, the invention provides a kind of BGA ball-establishing method, comprising:
(1) chip is fixed to plants in table;
(2) even weld-aiding cream is brushed on the surface of the chip;
(3) be located on the surface of chip by planting net;
(4) tin ball is poured into plant planting on net and tiling of billiard table;
(5) when tin ball adheres to the weld-aiding cream of chip surface from the through hole of planting net, remove and plant net;
(6) be heated to tin ball with air pressure gun melt.
Preferably, the described step of planting in table that is fixed to by chip comprises: first use suction tin band to clean out pad, be then placed on by chip and plant on the table top of billiard table, re-use the holder of planting billiard table and be clamped by chip.
Preferably, describedly to comprise planting the step that net is located on the surface of chip: be located on the surface of the one side of planting ball needed for chip by planting net, and the distance of planting between net cover and chip is not more than the diameter of planted tin ball, make to plant on each through hole on net and chip that each plants ball position one_to_one corresponding simultaneously.
Preferably, the described step of planting also tiling on net of planting billiard table of being poured into by tin ball comprises: first select sizeable tin ball, the diameter of described through hole of planting on net is D, and the diameter of described tin ball is meet between d, D and d: d≤D < 2d; Being poured into by tin ball to plant on net and make it be laid in again plants on net, and the area of tin ball tiling is not less than the area of ball portion to be planted on chip surface.
According to technique scheme, the present invention passes through on the surface of the chip evenly brushing weld-aiding cream, be located on the surface of chip by planting net again, then tin ball is poured into toward planting in net, tin ball is fallen on chip surface sticky glutinous with weld-aiding cream by the through hole of planting on net, planting net when taking away behind the tin ball location on chip, finally using air pressure gun to the heating of tin ball, making it melt and plant ball.Can pour out planting tin ball unnecessary in net again after planting ball, using as when planting ball next time, having saved raw materials for production.
Other features and advantages of the present invention are described in detail in detailed description of the invention part subsequently.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and forms a part for description, is used from explanation the present invention, but is not construed as limiting the invention with detailed description of the invention one below.In the accompanying drawings:
Fig. 1 is the structural representation of a kind of BGA ball-establishing method of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.Should be understood that, detailed description of the invention described herein, only for instruction and explanation of the present invention, is not limited to the present invention.
See Fig. 1, the invention provides a kind of BGA ball-establishing method, comprising:
(1) chip is fixed to plants in table;
(2) even weld-aiding cream is brushed on the surface of the chip;
(3) be located on the surface of chip by planting net;
(4) tin ball is poured into plant planting on net and tiling of billiard table;
(5) when tin ball adheres to the weld-aiding cream of chip surface from the through hole of planting net, remove and plant net;
(6) be heated to tin ball with air pressure gun melt.
Pass through technique scheme, the present invention is even brushing weld-aiding cream on the surface of the chip, be located on the surface of chip by planting net again, then tin ball is poured into toward planting in net, tin ball is fallen on chip surface sticky glutinous with weld-aiding cream by the through hole of planting on net, planting net when taking away behind the tin ball location on chip, finally using air pressure gun to the heating of tin ball, making it melt and plant ball.Can pour out planting tin ball unnecessary in net again after planting ball, using as when planting ball next time, having saved raw materials for production.
Ball effect is planted in order to prevent the impact of other foreign material such as dust, residual block tin, preferably, chip is fixed to the step of planting in table to comprise: first use suction tin band to clean out pad, then being placed on by chip plants on the table top of billiard table, re-uses the holder of planting billiard table and is clamped by chip.Like this, the stability of more aspect subsequent operation after chip positioning.
In present embodiment, when tin ball passes through and falls on weld-aiding cream that chip surface evenly brushes from the through hole of planting net cover, should keep planting on each through hole on net and chip that each plants ball position one_to_one corresponding, such tin ball can fall the part of planting ball needed on chip, and the part bonding to other and do not need to plant ball can not be glued, affect and last plant ball effect; Therefore, comprise planting the step that net is located on the surface of chip: be located on the surface of the one side of planting ball needed for chip by planting net, and the distance of planting between net cover and chip is not more than the diameter of planted tin ball, make to plant on each through hole on net and chip that each plants ball position one_to_one corresponding simultaneously.
Above-mentioned tin ball is fallen in the process of chip surface from the through hole of planting net, and in order to avoid through hole is excessive, multiple tin ball falls from a through hole; Or through hole is too small, single tin ball cannot pass through through hole; Therefore, preferably, tin ball is poured into the step of planting also tiling on net of planting billiard table to comprise: first select sizeable tin ball, the diameter of planting the through hole on net is D, and the diameter of tin ball is meet between d, D and d: d≤D < 2d; Being poured into by tin ball to plant on net and make it be laid in again plants on net, and the area of tin ball tiling is not less than the area of ball portion to be planted on chip surface.Like this, only have single tin ball can fall chip surface by the through hole of planting on net, and chip surface and the distance of planting between net are not more than the diameter of tin ball, therefore, other tin balls just can be stoped after a tin ball falls again by same through hole.
Below the preferred embodiment of the present invention is described in detail by reference to the accompanying drawings; but; the present invention is not limited to the detail in above-mentioned embodiment; within the scope of technical conceive of the present invention; can carry out multiple simple variant to technical scheme of the present invention, these simple variant all belong to protection scope of the present invention.
It should be noted that in addition, each concrete technical characteristic described in above-mentioned detailed description of the invention, in reconcilable situation, can be combined by any suitable mode, in order to avoid unnecessary repetition, the present invention illustrates no longer separately to various possible combination.
In addition, also can be combined between various different embodiment of the present invention, as long as it is without prejudice to thought of the present invention, it should be considered as content disclosed in this invention equally.
Claims (4)
1. a BGA ball-establishing method, is characterized in that, comprising:
(1) chip is fixed to plants in table;
(2) even weld-aiding cream is brushed on the surface of the chip;
(3) be located on the surface of chip by planting net;
(4) tin ball is poured into plant planting on net and tiling of billiard table;
(5) when tin ball adheres to the weld-aiding cream of chip surface from the through hole of planting net, remove and plant net;
(6) be heated to tin ball with air pressure gun melt.
2. BGA ball-establishing method according to claim 1, it is characterized in that, the described step of planting in table that is fixed to by chip comprises: first use suction tin band to clean out pad, then being placed on by chip plants on the table top of billiard table, re-uses the holder of planting billiard table and is clamped by chip.
3. BGA ball-establishing method according to claim 1, it is characterized in that, describedly to comprise planting the step that net is located on the surface of chip: be located on the surface of the one side of planting ball needed for chip by planting net, and the distance of planting between net cover and chip is not more than the diameter of planted tin ball, make to plant on each through hole on net and chip that each plants ball position one_to_one corresponding simultaneously.
4. BGA ball-establishing method according to claim 1, it is characterized in that, the described step of planting also tiling on net of planting billiard table of being poured into by tin ball comprises: first select sizeable tin ball, the diameter of described through hole of planting on net is D, the diameter of described tin ball is meet between d, D and d: d≤D < 2d; Being poured into by tin ball to plant on net and make it be laid in again plants on net, and the area of tin ball tiling is not less than the area of ball portion to be planted on chip surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410549011.5A CN104308312A (en) | 2014-10-16 | 2014-10-16 | BGA (ball grid array) ball mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410549011.5A CN104308312A (en) | 2014-10-16 | 2014-10-16 | BGA (ball grid array) ball mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104308312A true CN104308312A (en) | 2015-01-28 |
Family
ID=52363698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410549011.5A Pending CN104308312A (en) | 2014-10-16 | 2014-10-16 | BGA (ball grid array) ball mounting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104308312A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110034031A (en) * | 2019-04-03 | 2019-07-19 | 江苏纳沛斯半导体有限公司 | A method of for reducing ball bonding jackshaft drum is planted |
-
2014
- 2014-10-16 CN CN201410549011.5A patent/CN104308312A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110034031A (en) * | 2019-04-03 | 2019-07-19 | 江苏纳沛斯半导体有限公司 | A method of for reducing ball bonding jackshaft drum is planted |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150128 |
|
| WD01 | Invention patent application deemed withdrawn after publication |