CN104302104A - 组合电路板 - Google Patents
组合电路板 Download PDFInfo
- Publication number
- CN104302104A CN104302104A CN201410514333.6A CN201410514333A CN104302104A CN 104302104 A CN104302104 A CN 104302104A CN 201410514333 A CN201410514333 A CN 201410514333A CN 104302104 A CN104302104 A CN 104302104A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- group
- circuit plate
- convex pin
- combination circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010276 construction Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000003780 insertion Methods 0.000 abstract 4
- 230000037431 insertion Effects 0.000 abstract 4
- 239000000178 monomer Substances 0.000 description 24
- 238000009434 installation Methods 0.000 description 4
- 230000001154 acute effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410514333.6A CN104302104B (zh) | 2014-09-29 | 2014-09-29 | 组合电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410514333.6A CN104302104B (zh) | 2014-09-29 | 2014-09-29 | 组合电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104302104A true CN104302104A (zh) | 2015-01-21 |
CN104302104B CN104302104B (zh) | 2018-01-12 |
Family
ID=52321600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410514333.6A Active CN104302104B (zh) | 2014-09-29 | 2014-09-29 | 组合电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104302104B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020053726A1 (en) * | 2000-11-09 | 2002-05-09 | Kazuyuki Mikubo | Semiconductor device attaining both high speed processing and sufficient cooling capacity |
CN101368711A (zh) * | 2007-08-13 | 2009-02-18 | 富士迈半导体精密工业(上海)有限公司 | 电路板单元、电路板及照明装置 |
CN202353929U (zh) * | 2011-12-05 | 2012-07-25 | 深圳市三德冠精密电路科技有限公司 | 一种柔性电路板 |
CN103517539A (zh) * | 2012-06-15 | 2014-01-15 | 繆莉敏 | 一种带有组合连接单元的pcb板 |
CN203675441U (zh) * | 2014-02-17 | 2014-06-25 | 温州瑞豪电子有限公司 | 拼装式线路板 |
-
2014
- 2014-09-29 CN CN201410514333.6A patent/CN104302104B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020053726A1 (en) * | 2000-11-09 | 2002-05-09 | Kazuyuki Mikubo | Semiconductor device attaining both high speed processing and sufficient cooling capacity |
CN101368711A (zh) * | 2007-08-13 | 2009-02-18 | 富士迈半导体精密工业(上海)有限公司 | 电路板单元、电路板及照明装置 |
CN202353929U (zh) * | 2011-12-05 | 2012-07-25 | 深圳市三德冠精密电路科技有限公司 | 一种柔性电路板 |
CN103517539A (zh) * | 2012-06-15 | 2014-01-15 | 繆莉敏 | 一种带有组合连接单元的pcb板 |
CN203675441U (zh) * | 2014-02-17 | 2014-06-25 | 温州瑞豪电子有限公司 | 拼装式线路板 |
Also Published As
Publication number | Publication date |
---|---|
CN104302104B (zh) | 2018-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171212 Address after: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Longsheng Gold Dragon Road community e-commerce incubator exhibition Tao Commercial Plaza E block 706 Applicant after: Shenzhen step Technology Transfer Center Co., Ltd. Address before: 516000 Guangdong city of Huizhou province Boluo county Luo Yang Commercial Street No. 2 Applicant before: He Shufang |
|
CB03 | Change of inventor or designer information |
Inventor after: Lu Jingtian Inventor before: He Shufang |
|
CB03 | Change of inventor or designer information | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171214 Address after: 528000 Foshan, Foshan, Guangdong, Shunde District, llliu Street office, Xin'an Village Committee Industrial District, one of the No. two, one of the No. 1, No. 3 Applicant after: Guangdong wisdom Intelligent Technology Co., Ltd. Address before: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Longsheng Gold Dragon Road community e-commerce incubator exhibition Tao Commercial Plaza E block 706 Applicant before: Shenzhen step Technology Transfer Center Co., Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Combined circuit board Effective date of registration: 20211228 Granted publication date: 20180112 Pledgee: China Co. truction Bank Corp Foshan branch Pledgor: GUANGDONG MEZIC TECH CO.,LTD. Registration number: Y2021980016674 |