CN104299738A - 一种新型电极电子组件及其制备方法 - Google Patents
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Abstract
本发明涉及一种新型电极电子组件及其制备方法，包括陶瓷基体、陶瓷基体下端的引脚及包封整个陶瓷基体且与引脚组连接的绝缘层，所述的引脚与电极层相连接，所述的电极层为两种或两种以上贱金属或合金的喷涂层；所述的喷涂层的浓度呈梯度分布。本发明在保证原有产品电气特性前提下，具有以下优点：1、有效降低了成本；2、避开传统丝网印刷工艺的有机溶剂挥发和热分解造成的环境污染；3、减少不同金属间接合问题，降低大电流下剥离风险，.缩短了电极制做流程，但仍保有电极与陶瓷组件的结合性与金属导线间的可焊性。
Description
技术领域
本发明涉及压敏电阻领域，尤其是一种新型电极工艺的电子组件及其制备工艺。
背景技术
压敏电阻以氧化锌粉末为主材，掺杂氧化铋，氧化锑，氧化锰等晶界元素，经干压成型后，排除有机粘结剂，再高温烧成为带有非线性特性的陶瓷电阻。
传统的压敏电阻导电电极一般采用丝网印刷工艺形成，在陶瓷芯片上附着含银60～80％的有机银浆，经过600～900℃高温烧渗后，电极层一般要求在6～15um的厚度以保证焊接工艺以及产品信赖性。采用传统丝网印刷银浆工艺存在如下缺点和不足：
1、银浆中含有大量有害物质，制造工艺会产生严重污染环境；
2、生产成本高，需要耗费大量贵重的银。一般行业内为达到压敏电阻承受较大突波电压冲击的能力，不得不采用加厚银层的方式，银层厚度一般都在15um以上！
传统丝网印刷银电极型压敏电阻缺点：
1、结合力差，银与陶瓷属不匹配结合，主要靠银浆中玻璃态物质渗透到陶瓷晶界来提高结合力；附着力不佳；
2、欧姆接触电阻大；
3、膜层不耐无铅焊料溶蚀---因为银与锡的固相溶解能力大，高温下焊锡极易溶蚀银层。在目前环保压力下，使用无铅焊锡工艺焊接生产产品，为了防止电极发生虚焊、熔银，故需要使用含银较多的3Ag焊锡，阻碍产品成本降低；同时，由于Sn-Ag高温互溶特性，造成产品长时间通电后，Ag电极被焊锡侵蚀以及电极附着力降低甚至脱离，为移动设备(如汽车)等使用此类压敏电阻产生安全隐患。
为了降低压敏电阻的制造成本，申请号为201310177249.5，发明名称为“一种电子陶瓷组件的卑金属复合电极及其制备方法”，公开了多层热喷涂贱金属的工艺，此工艺所制作压敏电阻的电极缺点是，当高放电时，电流易在界面产生高热量，在多次高电流冲击后不同金属电极界面容易分离，对产品的长期应用可靠性带来风险。
发明内容
本发明要解决的技术问题是：提出一种新型电极工艺的电子组件及其制备工艺，能够使电极层与陶瓷组件能紧密结合又能保持良好的焊接性能。
本发明所采用的技术方案为：一种新型电极电子组件，包括陶瓷基体、陶瓷基体下端的引脚及包封整个陶瓷基体且与引脚组连接的绝缘层，所述的引脚与电极层相连接，所述的电极层为两种或两种以上贱金属或合金的喷涂层；所述的喷涂层的浓度呈梯度分布。
进一步的说，本发明所述的喷涂层由锌、铜、锡、镍、铝中的两种或两种以上元素合金的贱金属组成；厚度为20～100μm。
本发明所述的喷涂层自陶瓷本体向外包括前段、中段以及后段；所述的前段为一种贱金属或合金层；后段为另一种贱金属或合金层；所述的中段为两种或两种以上贱金属或合金的混合层。所述的前段的金属浓度呈递减分布，浓度由100％至0％；所述的后段的金属浓度呈递增分布，浓度由0％至100％。
同时，本发明还提供了一种新型电极电子组件的制备方法，包括以下步骤：
1)将已预处理过的陶瓷体置入连续式电弧或火焰喷涂机的工件架中；
2)喷涂机为隧道连续式，直接喷涂陶瓷体双面，并设置多任务工位的喷头，每个喷头喷射所需材料的一种或合金，两支喷头为一组；
3)先由一支喷头完成喷射过程；在该喷头即将完成喷射之前，另一支喷头开始进行喷射，形成喷涂层；
4)将已喷涂好电极层的陶瓷体与引脚采用焊锡焊接；
5)焊接品经环氧树脂包封绝缘层，固化后测试电气特性。
步骤3)中，先喷射的喷头所喷射的金属浓度呈递减分布，浓度由100％至0％；后喷射的喷头所喷射的金属浓度呈递增分布，浓度由0％至100％；两支喷头所喷射的金属有交界面。
喷头由程控送丝电压在0-20V之间以控制喷涂出料量及喷涂时间来形成两种金属材料浓度梯度分布；涂电压为20-35V，喷涂电流为100-200A，喷涂气压为0.5Mpa；喷涂时间为4-10秒。
本发明的有益效果是：本发明在保证原有产品电气特性前提下，具有以下优点：1、有效降低了成本；2、避开传统丝网印刷工艺的有机溶剂挥发和热分解造成的环境污染；3、减少不同金属间接合问题，降低大电流下剥离风险，.缩短了电极制做流程，但仍保有电极与陶瓷组件的结合性与金属导线间的可焊性。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是本发明的优选实施例的结构示意图；
图2是本发明的工艺总流程图；
图3是本发明的电极浓度梯度喷涂示意图；
图中：1、陶瓷基体；2、引脚；3、电极层；4、绝缘层。
具体实施方式
现在结合附图和优选实施例对本发明作进一步详细的说明。这些附图均为简化的示意图，仅以示意方式说明本发明的基本结构，因此其仅显示与本发明有关的构成。
如图1所示，一种新型电极电子组件，包括陶瓷基体1和设置在陶瓷基体1下端的引脚2，引脚2与陶瓷基体1内部所设置的电极层3相连接，陶瓷基体1表面设置有绝缘层4。
参照图2的工艺流程，以压敏电阻为例，其制作工艺包括配料，喷雾造粒，干压成型，烧成陶瓷等。
图3所示的电极层为两种金属的喷涂层；且喷涂层的浓度呈梯度分布。
将已预处理过的陶瓷体置入连续式电弧或火焰喷涂机的工件架中；
喷涂开始时，一号喷涂枪喷射一种金属材料一，该金属材料一主要使用与陶瓷体结合强度佳的金属，如镍、铝等金属，金属材料一的浓度呈递减分布，浓度由100％至0％；
在一号喷涂枪喷涂的大约0.5～1S后，即喷涂达到中间段时，二号喷涂枪开始工作，在喷涂层中加入了焊接性较好的金属材料二，如锡、锌、铜等金属一起喷涂；金属材料二的浓度呈递增分布，浓度由0％至100％；
喷涂的中间段金属材料一和金属材料二有明显的交界面；而不是现有技术中所出现的分界面。
喷涂末段将结束时主要使用为焊性佳之金属，如锡、锌、铜等金属以利后续导线焊接作业。喷涂厚度始终保持为20～100μm。
工件架通过隧道连续喷涂室，按照各工位的参数设置。喷头由程控送丝电压在0-20V之间以控制喷涂出料量及喷涂时间来形成两种金属材料浓度梯度分布；喷涂电压为20-35V，喷涂电流为100-200A，喷涂气压为0.5Mpa；喷涂时间为4-10秒。
完成电极层喷涂后，进行引脚焊接，焊锡采用锡铜合金。再包封绝缘树脂层，高温固化后，测试电气特性。
以上说明书中描述的只是本发明的具体实施方式，各种举例说明不对本发明的实质内容构成限制，所属技术领域的普通技术人员在阅读了说明书后可以对以前所述的具体实施方式做修改或变形，而不背离本发明的实质和范围。
Claims (9)
1.一种新型电极电子组件，包括陶瓷基体、陶瓷基体下端的引脚及包封整个陶瓷基体且与引脚组连接的绝缘层，所述的引脚与电极层相连接，其特征在于：所述的电极层为两种或两种以上贱金属或合金的喷涂层；所述的喷涂层的浓度呈梯度分布。
2.如权利要求1所述的一种新型电极电子组件，其特征在于：所述的喷涂层由锌、铜、锡、镍、铝中的两种或两种以上元素合金的贱金属组成；厚度为20～100μm。
3.如权利要求2所述的一种新型电极电子组件，其特征在于：所述的喷涂层自陶瓷本体向外包括前段、中段以及后段；所述的前段为一种贱金属或合金层；后段为另一种贱金属或合金层；所述的中段为两种或两种以上贱金属或合金的混合层。
4.如权利要求3所述的一种新型电极电子组件，其特征在于：所述的前段的金属浓度呈递减分布，浓度由100％至0％；所述的后段的金属浓度呈递增分布，浓度由0％至100％。
5.一种如权利要求1所述的新型电极电子组件的制备方法，其特征在于包括以下步骤：
1)将已预处理过的陶瓷体置入连续式电弧或火焰喷涂机的工件架中；
2)喷涂机为隧道连续式，直接喷涂陶瓷体双面，并设置多任务工位的喷头，每个喷头喷射所需材料的一种或合金，两支喷头为一组；
3)先由一支喷头完成喷射过程；在该喷头即将完成喷射之前，另一支喷头开始进行喷射，形成喷涂层；
4)将已喷涂好电极层的陶瓷体与引脚采用焊锡焊接；
5)焊接品经环氧树脂包封绝缘层，固化后测试电气特性。
6.如权利要求5所述的一种新型电极电子组件的制备方法，其特征在于：所述的步骤3)中，先喷射的喷头所喷射的金属浓度呈递减分布，浓度由100％至0％；后喷射的喷头所喷射的金属浓度呈递增分布，浓度由0％至100％；两支喷头所喷射的金属有交界面。
7.如权利要求5所述的一种新型电极电子组件的制备方法，其特征在于：所述的喷涂层锌、铜、锡、镍、铝中的两种或两种以上元素合金的贱金属；厚度为20～100μm。
8.如权利要求5所述的一种新型电极电子组件的制备方法，其特征在于：所述的喷涂电压为20-35V，喷涂电流为100-200A，喷涂气压为0.5Mpa；喷涂时间为4-10秒。
9.如权利要求5所述的一种新型电极电子组件的制备方法，其特征在于：所述的喷头由程控送丝电压在0-20V之间以控制喷涂出料量及喷涂时间来形成两种金属材料浓度梯度分布。
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| TW103222675U TWM497336U (zh) | 2014-09-18 | 2014-12-22 | 電極電子元件 |
| TW103144871A TWI655645B (zh) | 2014-09-18 | 2014-12-22 | Electrode electronic component and preparation method thereof |
| EP15156854.0A EP3023999B1 (en) | 2014-09-18 | 2015-02-27 | Electrode component and method for fabricating the same |
| US14/634,823 US9449742B2 (en) | 2014-09-18 | 2015-02-28 | Electrode component and method for fabricating the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104851539A (zh) * | 2015-05-27 | 2015-08-19 | 江苏世星电子科技有限公司 | 一种电子元器件导电电极及其制备方法 |
| EP2980806A1 (en) * | 2014-07-31 | 2016-02-03 | Thinking Electronic Industrial Co., Ltd. | Electrode component with pretreated layers |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104299738B (zh) * | 2014-09-18 | 2017-10-10 | 兴勤（常州）电子有限公司 | 一种电极电子组件及其制备方法 |
| JP2019009361A (ja) * | 2017-06-27 | 2019-01-17 | 株式会社村田製作所 | セラミック電子部品及びその実装構造 |
| CN109545489B (zh) * | 2018-12-05 | 2021-01-29 | 衡阳市智科电气有限公司 | 一种电阻片镀铝设备 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4538347A (en) * | 1984-06-18 | 1985-09-03 | Gte Laboratories Incorporated | Method for making a varistor package |
| EP1227308A1 (en) * | 2001-01-26 | 2002-07-31 | Cornerstone Sensors, Inc. | Thermistor and method of manufacture |
| CN102140616A (zh) * | 2011-01-26 | 2011-08-03 | 沈阳工业大学 | 制备金属-陶瓷复合材料涂层和梯度结构涂层的方法 |
| CN102800475A (zh) * | 2012-08-03 | 2012-11-28 | 广东风华高新科技股份有限公司 | 真空溅射多层金属电极圆片瓷介电容器及其制备方法 |
| CN203617055U (zh) * | 2013-09-17 | 2014-05-28 | 昆山萬豐電子有限公司 | 一种复合电极结构的氧化锌压敏电阻器 |
| CN203794799U (zh) * | 2014-02-20 | 2014-08-27 | 隆科电子(惠阳)有限公司 | 一种电子陶瓷元件的卑金属复合电极的流水线制备装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2418460A (en) * | 1943-12-31 | 1947-04-08 | Bell Telephone Labor Inc | Resistor |
| US2418461A (en) * | 1943-12-31 | 1947-04-08 | Bell Telephone Labor Inc | Resistor |
| US2679568A (en) * | 1950-11-07 | 1954-05-25 | Gen Motors Corp | Ceramic contact resistor composition |
| US2786925A (en) * | 1952-12-31 | 1957-03-26 | Sprague Electric Co | Metal film resistor |
| US3023390A (en) * | 1960-03-17 | 1962-02-27 | Westinghouse Electric Corp | Applying electrodes to ceramic members |
| US3691656A (en) * | 1966-03-30 | 1972-09-19 | Mitsuaka Mochizuki | Method of making a joint |
| GB1486945A (en) * | 1974-10-11 | 1977-09-28 | Matsushita Electric Ind Co Ltd | Electric resistance devices |
| JPS5922385B2 (ja) * | 1980-04-25 | 1984-05-26 | 日産自動車株式会社 | セラミツク基板のスル−ホ−ル充填用導電体ペ−スト |
| JPS61288401A (ja) * | 1985-06-14 | 1986-12-18 | 株式会社村田製作所 | 薄膜抵抗体 |
| US7098163B2 (en) * | 1998-08-27 | 2006-08-29 | Cabot Corporation | Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells |
| DE10009598A1 (de) * | 2000-02-29 | 2001-09-06 | Bosch Gmbh Robert | Verfahren und Vorrichtung zur Abscheidung einer Beschichtung auf einem Substrat durch Versprühen einer Flüssigkeit |
| TW200847193A (en) * | 2007-05-29 | 2008-12-01 | Suzhou Sinotronix Electronics Co Ltd | A well-safe and nonflammable voltage-sensitive resistor and its fabrication method |
| CN102503580A (zh) * | 2011-10-21 | 2012-06-20 | 浙江大学 | 热敏陶瓷溅射膜电极的制备方法 |
| CN103247362B (zh) * | 2013-04-17 | 2016-02-03 | 隆科电子(惠阳)有限公司 | 一种电子陶瓷元件的卑金属复合电极及其制备方法 |
| CN103400675B (zh) * | 2013-07-11 | 2016-05-11 | 苏州求是真空电子有限公司 | 氧化锌压敏电阻器及其制备方法 |
| CN104143400B (zh) * | 2014-07-31 | 2017-05-31 | 兴勤（常州）电子有限公司 | 一种电极电子组件的制备方法 |
| CN104299738B (zh) * | 2014-09-18 | 2017-10-10 | 兴勤（常州）电子有限公司 | 一种电极电子组件及其制备方法 |
-
2014
- 2014-09-18 CN CN201410479427.4A patent/CN104299738B/zh active Active
- 2014-12-22 TW TW103222675U patent/TWM497336U/zh not_active IP Right Cessation
- 2014-12-22 TW TW103144871A patent/TWI655645B/zh active
-
2015
- 2015-02-27 EP EP15156854.0A patent/EP3023999B1/en active Active
- 2015-02-28 US US14/634,823 patent/US9449742B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4538347A (en) * | 1984-06-18 | 1985-09-03 | Gte Laboratories Incorporated | Method for making a varistor package |
| EP1227308A1 (en) * | 2001-01-26 | 2002-07-31 | Cornerstone Sensors, Inc. | Thermistor and method of manufacture |
| CN102140616A (zh) * | 2011-01-26 | 2011-08-03 | 沈阳工业大学 | 制备金属-陶瓷复合材料涂层和梯度结构涂层的方法 |
| CN102800475A (zh) * | 2012-08-03 | 2012-11-28 | 广东风华高新科技股份有限公司 | 真空溅射多层金属电极圆片瓷介电容器及其制备方法 |
| CN203617055U (zh) * | 2013-09-17 | 2014-05-28 | 昆山萬豐電子有限公司 | 一种复合电极结构的氧化锌压敏电阻器 |
| CN203794799U (zh) * | 2014-02-20 | 2014-08-27 | 隆科电子(惠阳)有限公司 | 一种电子陶瓷元件的卑金属复合电极的流水线制备装置 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2980806A1 (en) * | 2014-07-31 | 2016-02-03 | Thinking Electronic Industrial Co., Ltd. | Electrode component with pretreated layers |
| US9583239B2 (en) | 2014-07-31 | 2017-02-28 | Thinking Electronic Industrial Co., Ltd. | Electrode component with electrode layers formed on intermediate layers |
| CN104851539A (zh) * | 2015-05-27 | 2015-08-19 | 江苏世星电子科技有限公司 | 一种电子元器件导电电极及其制备方法 |
Also Published As
| Publication number | Publication date |
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| TWM497336U (zh) | 2015-03-11 |
| US9449742B2 (en) | 2016-09-20 |
| US20160086699A1 (en) | 2016-03-24 |
| EP3023999A1 (en) | 2016-05-25 |
| EP3023999B1 (en) | 2017-05-31 |
| CN104299738B (zh) | 2017-10-10 |
| TW201612924A (en) | 2016-04-01 |
| TWI655645B (zh) | 2019-04-01 |
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