CN104289628A

CN104289628A - Electronic element wire forming device

Info

Publication number: CN104289628A
Application number: CN201310304903.4A
Authority: CN
Inventors: 贾奎
Original assignee: Xingqin Electronic (yichang) Co Ltd
Current assignee: Xingqin Electronic (yichang) Co Ltd
Priority date: 2013-07-19
Filing date: 2013-07-19
Publication date: 2015-01-21
Anticipated expiration: 2033-07-19
Also published as: CN104289628B

Abstract

An electronic element wire forming device comprises a conveying belt. A plurality of wires are perpendicular to the conveying belt and are fixed to the conveying belt. A forming die is arranged on one sides of the free ends of the wires. The forming die comprises a first outer die, a second outer die and a core die, wherein limiting parts and bent parts are formed on the wires through the first outer die, the second outer die and the core die. By means of the specially-made die, the wire forming action of an electronic element can be finished in the conveying process of the line production, the inserting depth of the electronic element can be effectively limited through protruding parts arranged on the wires, and therefore the automatic production of working procedures before wave soldering can be finished easily. Due to the fact that the special die is adopted, different kinds of forming dies can be replaced according to customer requirements, the requirement for producing different bent formed products on the same production line can be met without replacing a line, replacing is convenient, timely switching is achieved, and the production line adjustment time is shortened.

Description

Electronic component lead forming device

Technical field

The present invention relates to the production line field, particularly a kind of electronic component lead forming device of the processing of a kind of electronic component.

Background technology

With the electronic component of wire pin, such as the product such as resistance, electric capacity in use, is to be inserted by wire in pcb board hole to cross wave-soldering.Wire is in the past pin product, may because pin paint length is difficult to control after causing plate after insertion, affect welding effect, or the depth difference because inserting, the product height after welding is caused to differ, can not effectively management and control finished product welding after height, whole height is assembled to client and impacts.And during plate welding, also will cut unnecessary conductor length, efficiency is lower, man-hour, waste was large.

Summary of the invention

Technical problem to be solved by this invention is to provide a kind of electronic component lead forming device, can automatically shaping kink and lug boss on wire, with the degree of depth of spacing insertion.

For solving the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of electronic component lead forming device, comprises conveyer belt, and multiple wire is vertical with conveyer belt and be fixed on the conveyor belt, is provided with mould in wire free ends side;

Described mould comprises the first external mold, the second external mold and core for forming limiting section and kink on wire.

The first described external mold and the second external mold are provided with external mold concave part, and core relevant position is provided with core lug boss;

First external mold and the second external mold are provided with external mold kink, and core relevant position is provided with core chamfered section.

Described core is fixedly connected with base, the first external mold and the second external mold with between base can the mode of horizontal displacement be flexibly connected.

Described core with between base can the mode of vertical displacement be flexibly connected, the first external mold and the second external mold with between base can the mode of horizontal displacement be flexibly connected.

A kind of electronic component lead forming device provided by the invention, by adopting special mould, the action shaping to the wire of electronic component is completed in the process that continuous productive process transmits, the lug boss that wire is arranged effectively can limit the insertion depth of electronic component, thus the automated production of operation before being beneficial to wave-soldering.Owing to have employed special mould, according to customer demand, various different mould can be changed, thus reach and can accomplish that same production line produces the demand of different bending forming product without thread-changing. and change convenient, can switch in time, shorten production line regulation time.

Accompanying drawing explanation

Below in conjunction with drawings and Examples, the invention will be further described:

Fig. 1 is overall structure schematic perspective view of the present invention.For ease of observing, mould is placed on from wire larger distance.

Fig. 2 is the main TV structure schematic diagram of the shaping front and back of wire of the present invention.

Fig. 3 is the main TV structure schematic diagram of the shaping front and back of wire of the another kind of structure of the present invention.

Fig. 4 is the main TV structure schematic diagram of the shaping front and back of wire of the another kind of structure of the present invention.

Fig. 5 is the main TV structure schematic diagram of the shaping front and back of wire of the another kind of structure of the present invention.

Fig. 6 be in Fig. 5 wire shaping after side-looking structural representation.

In figure: paper tape 1, wire 2, limiting section 3, kink 4, mould 5, base 51, the first external mold 52, second external mold 53, external mold concave part 54, core lug boss 55, core chamfered section 56, external mold kink 57, core 58.

Detailed description of the invention

As in Fig. 1 ~ 2, a kind of electronic component lead forming device, comprises conveyer belt, and multiple wire 2 is vertical with conveyer belt and be fixed on the conveyor belt, is provided with mould 5 in wire 2 free end side; Conveyer belt in this example is paper tape 1, preferably ox-hide paper tape, and each wire 2 is woven or is bonded on paper tape 1.

Described mould 5 comprises the first external mold 52, second external mold 53 and core 58 for forming limiting section 3 and kink 4 on wire 2.By the mould 5 arranged, limiting section 3 and kink 4 can be formed at the free end of wire 2, kink 4 wherein for being welded to connect with other elements such as semiconductor chip, limiting section 3 for limiting the insertion depth of wire 2 on pcb board, to adapt to the needs of automated production.The limiting section 3 adopted in this example is protruding shape.

As in Fig. 1, the first described external mold 52 and the second external mold 53 are provided with external mold concave part 54, and core 58 relevant position is provided with core lug boss 55; The pressing of structure thus, forms the limiting section 3 on wire 2.

As in Fig. 1, the first external mold 52 and the second external mold 53 are provided with external mold kink 57, and core 58 relevant position is provided with core chamfered section 56.The pressing of structure thus, forms the kink 4 on wire 2.

It should be noted that, adopt the mould 5 of other shapes, also the spacing shape of other shapes can be generated, it such as, is the limiting section 3 of outwardly convex in Fig. 2, also can be inwardly protruded limiting section 3 as shown in Figure 3, even limiting section 3 and kink 4 also can be link together as shown in Figure 4, or the position of limiting section is for the bending to drawing inward-outward direction is as shown in Fig. 5,6.

As in Fig. 1, described core 58 is fixedly connected with base 51, the first external mold 52 and the second external mold 53 with between base 51 can the mode of horizontal displacement be flexibly connected.The motion mode of this structure is, base is at elevating mechanism, not shown, such as, rise under the promotion of pneumatic linear actuator or cam mechanism, make wire 2 at the first external mold 52, between core 58 and the second external mold 53, now the first external mold 52 and the second external mold 53 are in horizontal displacement mechanism, such as, under the promotion of pneumatic linear actuator or cam mechanism, moved by core 58 liang of side direction by-levels, thus on wire 2, form limiting section 3 and kink 4.

As in Fig. 1, in another kind of optional structure, described core 58 with between base 51 can the mode of vertical displacement be flexibly connected, the first external mold 52 and the second external mold 53 with between base 51 can the mode of horizontal displacement be flexibly connected.Structure thus, base 51 is equivalent to the guide rail guiding core 58, first external mold 52 and the second external mold 53 to run, three, at drive unit, in wire 2 place's pressing under the pneumatic linear actuator of illustrating as front or the driving of cam mechanism, thus forms limiting section 3 and kink 4 on wire 2.

Claims

1. an electronic component lead forming device, comprises conveyer belt, and multiple wire (2) is vertical with conveyer belt and be fixed on the conveyor belt, it is characterized in that: be provided with mould (5) in wire (2) free end side;

Described mould (5) comprises the first external mold (52), the second external mold (53) and core (58) for forming limiting section (3) and kink (4) on wire (2).

2. a kind of electronic component lead forming device according to claim 1, is characterized in that: described the first external mold (52) and the second external mold (53) are provided with external mold concave part (54), and core (58) relevant position is provided with core lug boss (55);

First external mold (52) and the second external mold (53) are provided with external mold kink (57), and core (58) relevant position is provided with core chamfered section (56).

3. a kind of electronic component lead forming device according to claim 2, it is characterized in that: described core (58) is fixedly connected with base (51), the first external mold (52) and between the second external mold (53) with base (51) can the mode of horizontal displacement be flexibly connected.

4. a kind of electronic component lead forming device according to claim 2, it is characterized in that: described core (58) with between base (51) can the mode of vertical displacement be flexibly connected, the first external mold (52) and between the second external mold (53) with base (51) can the mode of horizontal displacement be flexibly connected.