CN104263083A - Manufacturing process of electrically conductive printing ink for printed board - Google Patents
Manufacturing process of electrically conductive printing ink for printed board Download PDFInfo
- Publication number
- CN104263083A CN104263083A CN201410535429.0A CN201410535429A CN104263083A CN 104263083 A CN104263083 A CN 104263083A CN 201410535429 A CN201410535429 A CN 201410535429A CN 104263083 A CN104263083 A CN 104263083A
- Authority
- CN
- China
- Prior art keywords
- electrically conductive
- manufacturing process
- printed board
- conductive ink
- printing ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
Abstract
The invention discloses a manufacturing process of electrically conductive printing ink for a printed board. The process comprises steps as follows: 1) before screen printing, fully stirring a carbon paste printing material and fully mixing components; 2) performing cleaning treatment on the surface of a base board by using three-dimensional high-pressure cleaning; 3) performing screen printing, standing for 10 min, and performing pre-drying; 4) curing a screen-printed lead and controlling the melting temperature within 110 DEG C. According to the manufacturing process of the electrically conductive printing ink for the printed board, the lead edge is well coated, and problems that pinholes and skip printing exist on a coating are solved.
Description
Technical field
The present invention relates to a kind of manufacturing process manufacturing electrically conductive ink in printed board process.
Background technology
Electrically conductive ink is a kind of functional print material, be different from the operational characteristic of other ink, its maximum difference is containing very a high proportion of metal paste in component, play electric action, slurry in printed board has carbon to starch, copper slurry and silver slurry, electrically conductive ink is mainly used in the button of single double-clad board, bridging conductor, perforation, the repairing of breach broken string and the making of flexible printed board wire pattern, copper conductor is replaced with electrically conductive ink, wire mark forms circuit at insulator surface, during existing conductive ink process solidification, temperature of fusion controls at 120-150 DEG C, time is 30-40 minute, easily at wire edge dew copper, rete there is the problem such as pin hole and skip printing.
Summary of the invention
Goal of the invention: the invention solves the problems referred to above, provides a kind of wire edge covering property good, and solves the manufacturing process of printed board electrically conductive ink rete having pin hole and skip printing problem.
Technical scheme: the manufacturing process of a kind of printed board electrically conductive ink of the present invention, comprises the following steps:
(1) before wire mark, carbon slurry print material is fully stirred, fully mixes between component;
(2) three-dimensional high pressure cleaning is utilized to carry out clean to substrate surface;
(3) wire mark, leaves standstill 10 minutes, carries out preliminary drying;
(4) solidified by the wire of wire mark, temperature of fusion controls at 110 DEG C.
Particularly, in described step (4), set time is 20 minutes.
Particularly, in described step (1), carbon slurry main component is black carbon black.
Beneficial effect: the present invention compared with prior art, its advantage is to shorten set time, reduce solidification value, coordinate three-dimensional high pressure cleaning, effectively can remove the impurity of metallic surface, after hardening, make the wire edge covering property of wire mark good, solve problem rete having pin hole and skip printing, flex resistance is good.
Embodiment
Below in conjunction with embodiment, illustrate the present invention further.
A manufacturing process for printed board electrically conductive ink, comprises the following steps:
(1) before wire mark, carbon slurry print material is fully stirred, fully mixes between component;
(2) three-dimensional high pressure cleaning is utilized to carry out clean to substrate surface;
(3) wire mark, leaves standstill 10 minutes, carries out preliminary drying;
(4) solidified by the wire of wire mark, temperature of fusion controls at 110 DEG C.
First, before wire mark, fully stirred by carbon slurry print material, fully mix between component, to guarantee that component is even, the main component of carbon slurry is black carbon black, easily produces precipitation during storage;
Secondly carry out clean to substrate surface, wipe oil, guarantee that surface clean is without dust, utilize omnidirectional three-dimensional crossing net trellis to gather the high-pressure cleaning system of cleaning, flushing pressure is large, and the top hole pressure of high-pressure pump, up to 60-80MPa, cleans up thoroughly.
Start wire mark, add less or do not add thinner as far as possible during wire mark, leave standstill 10 minutes, carry out preliminary drying;
Finally solidified by the wire of wire mark, make temperature keep 110-120 DEG C during solidification, set time is 20 minutes as far as possible.
Present invention reduces set time, reduce solidification value, coordinate three-dimensional high pressure cleaning, effectively can remove the impurity of metallic surface, after hardening, make the wire edge covering property of wire mark good, solve problem rete having pin hole and skip printing, flex resistance is good.
Claims (3)
1. a manufacturing process for printed board electrically conductive ink, comprises the following steps:
(1) before wire mark, carbon slurry print material is fully stirred, fully mixes between component;
(2) three-dimensional high pressure cleaning is utilized to carry out clean to substrate surface;
(3) wire mark, leaves standstill 10 minutes, carries out preliminary drying;
(4) solidified by the wire of wire mark, temperature of fusion controls at 110 DEG C.
2. the manufacturing process of a kind of printed board electrically conductive ink according to claim 1, is characterized in that: in described step (4), set time is 20 minutes.
3. the manufacturing process of a kind of printed board electrically conductive ink according to claim 1, is characterized in that: in described step (1), carbon slurry main component is black carbon black.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410535429.0A CN104263083A (en) | 2014-10-13 | 2014-10-13 | Manufacturing process of electrically conductive printing ink for printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410535429.0A CN104263083A (en) | 2014-10-13 | 2014-10-13 | Manufacturing process of electrically conductive printing ink for printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104263083A true CN104263083A (en) | 2015-01-07 |
Family
ID=52154674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410535429.0A Pending CN104263083A (en) | 2014-10-13 | 2014-10-13 | Manufacturing process of electrically conductive printing ink for printed board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104263083A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1284460A (en) * | 2000-08-09 | 2001-02-21 | 李树 | High pressure jet washing equipment for tank truck |
CN101686602A (en) * | 2008-09-23 | 2010-03-31 | 上海山崎电路板有限公司 | PCB carbon film production technology with low resistance value linear change rate |
CN201906730U (en) * | 2010-12-27 | 2011-07-27 | 土明林 | Oil drum washing device |
CN202185421U (en) * | 2011-07-26 | 2012-04-11 | 北京德高洁清洁设备有限公司 | Automatic cleaning and drying system for bell jars of polycrystalline silicon reduction furnace and hydrogenation furnace |
CN103586240A (en) * | 2013-10-25 | 2014-02-19 | 合肥通用机械研究院 | Omni-directional adjustable high-pressure rotary jetting cleaning device |
-
2014
- 2014-10-13 CN CN201410535429.0A patent/CN104263083A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1284460A (en) * | 2000-08-09 | 2001-02-21 | 李树 | High pressure jet washing equipment for tank truck |
CN101686602A (en) * | 2008-09-23 | 2010-03-31 | 上海山崎电路板有限公司 | PCB carbon film production technology with low resistance value linear change rate |
CN201906730U (en) * | 2010-12-27 | 2011-07-27 | 土明林 | Oil drum washing device |
CN202185421U (en) * | 2011-07-26 | 2012-04-11 | 北京德高洁清洁设备有限公司 | Automatic cleaning and drying system for bell jars of polycrystalline silicon reduction furnace and hydrogenation furnace |
CN103586240A (en) * | 2013-10-25 | 2014-02-19 | 合肥通用机械研究院 | Omni-directional adjustable high-pressure rotary jetting cleaning device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4431543B2 (en) | Wiring board manufacturing method using Ag-Pd alloy nanoparticles | |
EP2911160B1 (en) | Electroconductive paste | |
CN107493662B (en) | Method for manufacturing carbon oil with low resistance value and thickness of more than or equal to 25um on printed circuit board | |
CN102883544B (en) | Prevent via hole from falling the method for oil during wiring board lead-free tin spray | |
KR20130009592A (en) | Dendritic copper powder | |
CN101547568A (en) | Method for printing black soldermask on PCB board | |
CN103237421A (en) | PCB (printed circuit board) segmentation golden finger preparation method | |
CN105696037A (en) | Electroplating method for workpiece and electroplating protective glue | |
CN204168608U (en) | A kind of circuit board efficient quality guaranteeing printing ladder steel mesh | |
CN107027240A (en) | A kind of high resistance carbon film wiring board and its manufacture method | |
CN109496079A (en) | A kind of superelevation resistance carbon PCB circuit board and its disposable printing process | |
CN104883825A (en) | Method for making solder mask layer on circuit board | |
JP2006303368A (en) | Manufacturing method of circuit board | |
CN106783554A (en) | The preparation method and electronic component of a kind of electronic component electrode | |
JP2015023187A (en) | Wiring board and method of manufacturing wiring board | |
CN101916635A (en) | Manufacturing method of patch concave electrode network resistor and product thereof | |
CN105142353A (en) | Selective electroless gold plating process for printed circuit boards | |
CN104955283A (en) | Circuit board tin spraying process | |
CN104263083A (en) | Manufacturing process of electrically conductive printing ink for printed board | |
JP5544323B2 (en) | Copper wiring forming method and wiring board manufacturing method | |
CN104425054B (en) | Conductive paste and the base material with conducting film | |
CN103996433B (en) | A kind of phosphorous copper alloy circuit board conductive silver paste and preparation method thereof | |
CN107087351A (en) | Printed circuit board (PCB), the manufacture method of printed circuit board (PCB) and electronic product | |
JP2013510948A (en) | Method for preventing or reducing silver ion migration in the crossover region of a membrane touch switch | |
CN101945543B (en) | Method for repairing open circuit of thick copper lead wire and repairing structure thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150107 |