CN104262762A - Rosin nozzle after circuit board molding - Google Patents
Rosin nozzle after circuit board molding Download PDFInfo
- Publication number
- CN104262762A CN104262762A CN201410591599.0A CN201410591599A CN104262762A CN 104262762 A CN104262762 A CN 104262762A CN 201410591599 A CN201410591599 A CN 201410591599A CN 104262762 A CN104262762 A CN 104262762A
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- CN
- China
- Prior art keywords
- parts
- nozzle
- rosin
- raw material
- uniformly mixed
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/068—Ultra high molecular weight polyethylene
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a rosin nozzle after circuit board molding. The rosin nozzle is prepared from the following raw materials in parts by weight: 1-2 parts of polyhydroxyalkanoate, 0.4-1 part of zinc pyrithione, 2-3 parts of calcium sulphoaluminate, 3-4 parts of magnesium fluoride, 0.5-1 part of zinc diricinoleate, 1-2 parts of ammonium zirconium hexafluoride, 0.3-1 part of butyltin mercaptide, 0.1-0.2 part of sp-80, 2-3 parts of polyisobutene, 10-15 parts of fumed silica, 0.5-1 part of poly-carbodiimide, 0.7-1 part of ammonium tri-molybdate, 0.3-1 part of 8-hydroxyquinoline, 92-100 parts of ultra-high molecular weight polyethylene, 6-7 parts of a high-resisting auxiliary and 2-3 parts of epoxy ethylhexyl stearate. The high-resisting auxiliary is prepared from esterified butyral and an emulsion adhesive, wherein the esterified butyral has good softness and flexibility, and the emulsion adhesive can promote compatibility of materials and improve melt fluidity. A methyl methacrylate-butadiene-styrene terpolymer is blended with the esterified butyral and the emulsion adhesive for modification after being softened, so that the surface resistance of a finished product is greatly improved.
Description
Technical field
The present invention relates generally to plastic applications, particularly relate to a kind of wiring board shaping after rosin nozzle.
Background technology
Nozzle is parts very crucial in the equipment such as a variety of spray, spraying, oil spout, sandblasting, spraying, play an important role, nozzle application in the industry widely, material is from stainless steel, plastics to silicon carbide, polytetrafluoroethylene, PP(engineering plastics), aluminium alloy and wolfram steel etc., range of application is generally commonly used in the industry-by-industries such as automobile, plating, surface treatment, high pressure cleaning, dedusting, cooling, desulfurization, humidification, stirring, gardens.
Summary of the invention
The object of the invention be just to provide a kind of wiring board shaping after rosin nozzle.
The present invention is achieved by the following technical solutions:
A rosin nozzle after wiring board is shaping, is characterized in that what it was made up of the raw material of following weight parts:
PHA 1-2, Zinc Pyrithione 0.4-1, calcium sulphoaluminate 2-3, magnesium fluoride 3-4, zinc ricinate 0.5-1, ammonium fluozirconate 1-2, butanethiol tin 0.3-1, sp-80 0.1-0.2, polyisobutene 2-3, gas-phase silica 10-15, polycarbodiimide 0.5-1, three ammonium molybdate 0.7-1, oxine 0.3-1, ultrahigh molecular weight polyethylene(UHMWPE) 92-100, high resistance auxiliary agent 6-7, octyl epoxy stearate 2-3;
Described high resistance auxiliary agent is made up of the raw material of following weight parts:
Neusilin 3-4, MBS terpolymer 30-40, polyvinyl butyral acetal 6-9, Sodium dodecylbenzene sulfonate 1-2, TriMethylolPropane(TMP) 0.4-1, nylon acid methyl esters 2-3, phytinic acid 0.6-1;
Polyvinyl butyral acetal is heated to 60-65 DEG C, adds nylon acid methyl esters, insulated and stirred 6-10 minute, be cooled to normal temperature, obtain esterification butyral;
Sodium dodecylbenzene sulfonate is joined in 8-10 times of water, stir, add neusilin, phytinic acid, be uniformly mixed, obtain emulsion adhesive;
Each raw material after above-mentioned process is mixed with MBS terpolymer, send into reactor, stir, dewatered drying, adds TriMethylolPropane(TMP), at pressure 1.8-1.9MPa, temperature 84-90 DEG C, be uniformly mixed 1-2 hour, cooling discharging, abrasive dust, obtains described high resistance auxiliary agent.
A preparation method for rosin nozzle after wiring board as claimed in claim 1 is shaping, is characterized in that comprising the following steps:
Sp-80 is joined in polyisobutene, add zinc ricinate, at 40-60 DEG C, be uniformly mixed 2-3 minute, add calcium sulphoaluminate, magnesium fluoride, be uniformly mixed, obtain emulsification material;
The 10-15% getting above-mentioned high-molecular polythene weight mixes with octyl epoxy stearate, polycarbodiimide, above-mentioned emulsification material is added after stirring, at 100-110 DEG C, insulation leaves standstill 1-2 hour, mixes, be stirred to normal temperature after discharging with gas-phase silica, butanethiol tin;
By each raw material after above-mentioned process with residue each raw material mix, feeding rubber mixing machine in, mixing 2-3 hour at 135-140 DEG C, is placed in injection moulding machine, be processed into described wiring board shaping after rosin nozzle.
Advantage of the present invention is:
The high resistance auxiliary agent added in the present invention: wherein esterification butyral has good flexibility and flexibility, emulsion adhesive can promote the consistency of storeroom, and improves the mobility of melt; By softening for MBS terpolymer rear and esterification butyral, emulsion adhesive blending and modifying, greatly improve the surface resistive of finished product;
Nozzle of the present invention be mainly used in wiring board in production of electronic components shaping after rosin nozzle, nozzle of the present invention and rosin adhesion, spraying rate is fast, and efficiency is high, and high thermal resistance is good, can not soften, embrittlement under suitable working temperature, long service life.
Embodiment
Embodiment 1
A rosin nozzle after wiring board is shaping, is characterized in that what it was made up of the raw material of following weight parts:
PHA 1, Zinc Pyrithione 0.4, calcium sulphoaluminate 3, magnesium fluoride 4, zinc ricinate 0.5, ammonium fluozirconate 1, butanethiol tin 0.3, sp-80 0.2, polyisobutene 3, gas-phase silica 15, polycarbodiimide 0.5, three ammonium molybdate 0.7, oxine 0.3, ultrahigh molecular weight polyethylene(UHMWPE) (molecular weight is 2,800,000) 100, high resistance auxiliary agent 6, octyl epoxy stearate 3;
Described high resistance auxiliary agent is made up of the raw material of following weight parts:
Neusilin 4, MBS terpolymer 40, polyvinyl butyral acetal 6, Sodium dodecylbenzene sulfonate 2, TriMethylolPropane(TMP) 0.4-1, nylon acid methyl esters 3, phytinic acid 0.6;
Polyvinyl butyral acetal is heated to 65 DEG C, adds nylon acid methyl esters, insulated and stirred 10 minutes, is cooled to normal temperature, obtains esterification butyral;
Sodium dodecylbenzene sulfonate is joined in 10 times of water, stir, add neusilin, phytinic acid, be uniformly mixed, obtain emulsion adhesive;
Each raw material after above-mentioned process is mixed with MBS terpolymer, send into reactor, stir, dewatered drying, adds TriMethylolPropane(TMP), at pressure 1.9MPa, temperature 90 DEG C, be uniformly mixed 2 hours, cooling discharging, abrasive dust, obtains described high resistance auxiliary agent.
A preparation method for rosin nozzle after wiring board is shaping, is characterized in that comprising the following steps:
Sp-80 is joined in polyisobutene, add zinc ricinate, at 60 DEG C, be uniformly mixed 3 minutes, add calcium sulphoaluminate, magnesium fluoride, be uniformly mixed, obtain emulsification material;
Get above-mentioned high-molecular polythene weight 15% mixes with octyl epoxy stearate, adds polycarbodiimide, above-mentioned emulsification material after stirring, and at 110 DEG C, insulation leaves standstill 2 hours, mixes, be stirred to normal temperature after discharging with gas-phase silica, butanethiol tin;
By each raw material after above-mentioned process with residue each raw material mix, feeding rubber mixing machine in, mixing 2-3 hour at 140 DEG C, is placed in injection moulding machine, be processed into described wiring board shaping after rosin nozzle.
Performance test: tensile strength 33.2MPa.
Claims (2)
1. wiring board shaping after a rosin nozzle, it is characterized in that what it was made up of the raw material of following weight parts:
PHA 1-2, Zinc Pyrithione 0.4-1, calcium sulphoaluminate 2-3, magnesium fluoride 3-4, zinc ricinate 0.5-1, ammonium fluozirconate 1-2, butanethiol tin 0.3-1, sp-80 0.1-0.2, polyisobutene 2-3, gas-phase silica 10-15, polycarbodiimide 0.5-1, three ammonium molybdate 0.7-1, oxine 0.3-1, ultrahigh molecular weight polyethylene(UHMWPE) 92-100, high resistance auxiliary agent 6-7, octyl epoxy stearate 2-3;
Described high resistance auxiliary agent is made up of the raw material of following weight parts:
Neusilin 3-4, MBS terpolymer 30-40, polyvinyl butyral acetal 6-9, Sodium dodecylbenzene sulfonate 1-2, TriMethylolPropane(TMP) 0.4-1, nylon acid methyl esters 2-3, phytinic acid 0.6-1;
Polyvinyl butyral acetal is heated to 60-65 DEG C, adds nylon acid methyl esters, insulated and stirred 6-10 minute, be cooled to normal temperature, obtain esterification butyral;
Sodium dodecylbenzene sulfonate is joined in 8-10 times of water, stir, add neusilin, phytinic acid, be uniformly mixed, obtain emulsion adhesive;
Each raw material after above-mentioned process is mixed with MBS terpolymer, send into reactor, stir, dewatered drying, adds TriMethylolPropane(TMP), at pressure 1.8-1.9MPa, temperature 84-90 DEG C, be uniformly mixed 1-2 hour, cooling discharging, abrasive dust, obtains described high resistance auxiliary agent.
2. wiring board as claimed in claim 1 shaping after the preparation method of rosin nozzle, it is characterized in that comprising the following steps:
Sp-80 is joined in polyisobutene, add zinc ricinate, at 40-60 DEG C, be uniformly mixed 2-3 minute, add calcium sulphoaluminate, magnesium fluoride, be uniformly mixed, obtain emulsification material;
The 10-15% getting above-mentioned high-molecular polythene weight mixes with octyl epoxy stearate, polycarbodiimide, above-mentioned emulsification material is added after stirring, at 100-110 DEG C, insulation leaves standstill 1-2 hour, mixes, be stirred to normal temperature after discharging with gas-phase silica, butanethiol tin;
By each raw material after above-mentioned process with residue each raw material mix, feeding rubber mixing machine in, mixing 2-3 hour at 135-140 DEG C, is placed in injection moulding machine, be processed into described wiring board shaping after rosin nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410591599.0A CN104262762A (en) | 2014-10-29 | 2014-10-29 | Rosin nozzle after circuit board molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410591599.0A CN104262762A (en) | 2014-10-29 | 2014-10-29 | Rosin nozzle after circuit board molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104262762A true CN104262762A (en) | 2015-01-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410591599.0A Pending CN104262762A (en) | 2014-10-29 | 2014-10-29 | Rosin nozzle after circuit board molding |
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| Country | Link |
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| CN (1) | CN104262762A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104774376A (en) * | 2015-03-26 | 2015-07-15 | 安徽海纳川塑业科技有限公司 | Halogen-free fire-retardation polypropylene composite material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101020768A (en) * | 2007-03-16 | 2007-08-22 | 王好占 | Pipe material modified with ultrahigh molecular weight polyethylene and its prepn |
| CN101116850A (en) * | 2007-09-07 | 2008-02-06 | 镇江金波机电管材厂 | Ultrahigh molecular weight polyethylene whirlpool flow pattern nozzle |
| JP2008162241A (en) * | 2007-01-05 | 2008-07-17 | Kinmo Ryo | Method of molding sand blasting machine jet nozzle |
| CN102574168A (en) * | 2009-08-11 | 2012-07-11 | 葛兰素史密斯克莱有限责任公司 | Vapor sheath for liquid dispensing nozzle |
-
2014
- 2014-10-29 CN CN201410591599.0A patent/CN104262762A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008162241A (en) * | 2007-01-05 | 2008-07-17 | Kinmo Ryo | Method of molding sand blasting machine jet nozzle |
| CN101020768A (en) * | 2007-03-16 | 2007-08-22 | 王好占 | Pipe material modified with ultrahigh molecular weight polyethylene and its prepn |
| CN101116850A (en) * | 2007-09-07 | 2008-02-06 | 镇江金波机电管材厂 | Ultrahigh molecular weight polyethylene whirlpool flow pattern nozzle |
| CN102574168A (en) * | 2009-08-11 | 2012-07-11 | 葛兰素史密斯克莱有限责任公司 | Vapor sheath for liquid dispensing nozzle |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104774376A (en) * | 2015-03-26 | 2015-07-15 | 安徽海纳川塑业科技有限公司 | Halogen-free fire-retardation polypropylene composite material |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150107 |
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| RJ01 | Rejection of invention patent application after publication |