CN104249523B - A kind of compound high-thermal conductive metal backboard - Google Patents
A kind of compound high-thermal conductive metal backboard Download PDFInfo
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- CN104249523B CN104249523B CN201310255674.1A CN201310255674A CN104249523B CN 104249523 B CN104249523 B CN 104249523B CN 201310255674 A CN201310255674 A CN 201310255674A CN 104249523 B CN104249523 B CN 104249523B
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- layer
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- thermal conductive
- intermediate insulating
- conductive metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The present invention relates to a kind of compound high-thermal conductive metal backboard, including intermediate insulating layer, the upper and lower surface of described intermediate insulating layer is respectively coated with high-heat-conductivity glue adhensive layer, it is positioned on the top end face of top high-heat-conductivity glue adhensive layer and weatherability fluorine material layer is set, be positioned on the bottom face of bottom high-heat-conductivity glue adhensive layer and metal conducting layer is set.The compound high-thermal conductive metal back board structure of the present invention is simple, it is respectively coated with high-heat-conductivity glue adhensive layer on two surfaces of intermediate insulating layer, then on high-heat-conductivity glue adhensive layer, it is combined weatherability fluorine material layer and metal conducting layer respectively, the packaging technology of solar module can be simplified, heat conductivility is high, the generating efficiency of solar module can be improved, improve the reliability of solar module.
Description
Technical field
The present invention relates to a kind of compound high-thermal conductive metal backboard.
Background technology
It is currently used for the solar energy backboard of solar module encapsulation, is mainly weatherability fluorine-containing layer, weatherability insulating barrier and encapsulation articulamentum by its general configuration；Its main feature is as follows: the assembly after one, encapsulation is in actual motion, and its silicon material excites the heat energy beyond wave band to be all difficult to quickly derive, and causes the generated output of assembly to reduce, dependability shrink；Two, silicon chip need to be connected by the way of welding welds by traditional assembly when encapsulation so that whole manufacturing process is relative complex, and because leaving gap between silicon chip, the effective generating area causing unit package area is impaired.Therefore suitable heat conductivity backboard, raising generating efficiency, the compound backboard of high efficiency of simplified assembly manufacturing process is selected to become photovoltaic module problem demanding prompt solution.
Summary of the invention
For solving above-mentioned technical problem, the present invention provides a kind of simple in construction, compound high-thermal conductive metal backboard easy to use, it is possible to increase the generating area of solar module, strengthens the reliability of assembly.
The compound high-thermal conductive metal backboard of the present invention, including intermediate insulating layer, the upper and lower surface of described intermediate insulating layer is respectively coated with high-heat-conductivity glue adhensive layer, it is positioned on the top end face of top high-heat-conductivity glue adhensive layer and weatherability fluorine material layer is set, be positioned on the bottom face of bottom high-heat-conductivity glue adhensive layer and metal conducting layer is set.
The compound high-thermal conductive metal backboard of the present invention, the thickness of described intermediate insulating layer is 10 microns-500 microns.
The compound high-thermal conductive metal backboard of the present invention, described intermediate insulating layer is a kind of in mylar, nylon film, polyolefin film.
The compound high-thermal conductive metal backboard of the present invention, described high-heat-conductivity glue adhensive layer is polyurethanes glue layer or acrylic glue layer, the conductive particle of 1%-60% it is filled with, one or more in aluminium oxide, silicon nitride, ceramic of conductive particle inside high-heat-conductivity glue adhensive layer.
The compound high-thermal conductive metal backboard of the present invention, described metal conducting layer one in Copper Foil, nickel foil, aluminium foil.
The compound high-thermal conductive metal backboard of the present invention, described weatherability fluorine material layer is fluorine-contained film layer or fluoro-containing coating layer.
Compared with prior art the invention have the benefit that the compound high-thermal conductive metal back board structure of the present invention is simple, it is respectively coated with high-heat-conductivity glue adhensive layer on two surfaces of intermediate insulating layer, then on high-heat-conductivity glue adhensive layer, it is combined weatherability fluorine material layer and metal conducting layer respectively, the packaging technology of solar module can be simplified, heat conductivility is high, the generating efficiency of solar module can be improved, improve the reliability of solar module.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of compound high-thermal conductive metal backboard described in the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment, the detailed description of the invention of the present invention is described in further detail.Following example are used for illustrating the present invention, but are not limited to the scope of the present invention.
A kind of compound high-thermal conductive metal backboard, including intermediate insulating layer 1, the upper and lower surface of described intermediate insulating layer 1 is respectively coated with high-heat-conductivity glue adhensive layer 2, it is positioned on the top end face of top high-heat-conductivity glue adhensive layer 2 and weatherability fluorine material layer 3 is set, be positioned on the bottom face of bottom high-heat-conductivity glue adhensive layer 2 and metal conducting layer 4 is set.
The compound high-thermal conductive metal backboard of the present invention, the thickness of described intermediate insulating layer 1 is 10 microns-500 microns.
The compound high-thermal conductive metal backboard of the present invention, described intermediate insulating layer 1 is a kind of in mylar, nylon film, polyolefin film.
The compound high-thermal conductive metal backboard of the present invention, described high-heat-conductivity glue adhensive layer 2 is polyurethanes glue layer or acrylic glue layer, the internal conductive particle being filled with 1%-60% of high-heat-conductivity glue adhensive layer 2, one or more in aluminium oxide, silicon nitride, ceramic of conductive particle.
The compound high-thermal conductive metal backboard of the present invention, the described metal conducting layer 4 one in Copper Foil, nickel foil, aluminium foil, it is possible to use other alloy-layers.
The compound high-thermal conductive metal backboard of the present invention, described weatherability fluorine material layer 3 is fluorine-contained film layer or fluoro-containing coating layer, can be that fluorine film carries out complex method and carries out, also meet other functional films of weatherability, uvioresistant demand according to product function sexual demand.
The compound high-thermal conductive metal back board structure of the present invention is simple, it is respectively coated with high-heat-conductivity glue adhensive layer on two surfaces of intermediate insulating layer, then on high-heat-conductivity glue adhensive layer, it is combined weatherability fluorine material layer and metal conducting layer respectively, the packaging technology of solar module can be simplified, heat conductivility is high, the generating efficiency of solar module can be improved, improve the reliability of solar module.
The above is only the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, on the premise of without departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be regarded as protection scope of the present invention.
Claims (2)
1. a compound high-thermal conductive metal backboard, including intermediate insulating layer, it is characterised in that: the upper and lower surface of described intermediate insulating layer
It is respectively coated with high-heat-conductivity glue adhensive layer, is positioned on the top end face of top high-heat-conductivity glue adhensive layer and weatherability fluorine material layer is set, be positioned at the high heat conduction in bottom
On the bottom face of adhesive layer, metal conducting layer is set；The thickness of described intermediate insulating layer is 10 microns-500 microns, and described intermediate insulating layer selects
One in autopolyester thin film, nylon film, polyolefin film；Described high-heat-conductivity glue adhensive layer is polyurethanes glue layer or acrylic glue layer,
Be filled with the conductive particle of 1%-60% inside high-heat-conductivity glue adhensive layer, conductive particle one in aluminium oxide, silicon nitride, the ceramic or
Several；Described metal conducting layer one in Copper Foil, nickel foil, aluminium foil, alloy.
Compound high-thermal conductive metal backboard the most according to claim 1, it is characterised in that: described weatherability fluorine material layer is fluorine-contained film layer
Or fluoro-containing coating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310255674.1A CN104249523B (en) | 2013-06-25 | 2013-06-25 | A kind of compound high-thermal conductive metal backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310255674.1A CN104249523B (en) | 2013-06-25 | 2013-06-25 | A kind of compound high-thermal conductive metal backboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104249523A CN104249523A (en) | 2014-12-31 |
| CN104249523B true CN104249523B (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310255674.1A Active CN104249523B (en) | 2013-06-25 | 2013-06-25 | A kind of compound high-thermal conductive metal backboard |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024993A (en) * | 2016-07-29 | 2016-10-12 | 无锡中洁能源技术有限公司 | Production technology for high-heat-dissipation dirt-resistant solar energy backboard |
| CN106057948A (en) * | 2016-07-29 | 2016-10-26 | 无锡中洁能源技术有限公司 | Production process of multilayer solar energy backboard |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516852A (en) * | 2011-12-16 | 2012-06-27 | 新高电子材料（中山）有限公司 | Weather-resistant and high thermal conductive coating, radiating solar rear panel and efficient solar cell panel |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5686691B2 (en) * | 2011-07-25 | 2015-03-18 | 三菱樹脂株式会社 | Polyester film for solar cell backside sealing material |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516852A (en) * | 2011-12-16 | 2012-06-27 | 新高电子材料（中山）有限公司 | Weather-resistant and high thermal conductive coating, radiating solar rear panel and efficient solar cell panel |
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| Publication number | Publication date |
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| CN104249523A (en) | 2014-12-31 |
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Address after: 336000 Yichun economic and Technological Development Zone, Jiangxi, Yichun, No. 32, No. Applicant after: CROWN ADVANCED MATERIAL CO., LTD. Address before: 336000 suitable business road, Yichun economic and Technological Development Zone, Jiangxi Applicant before: Mingguan Energy (Jiangxi) Co., Ltd. |
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