CN104249523A - Composite high heat conduction metal backboard - Google Patents
Composite high heat conduction metal backboard Download PDFInfo
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- CN104249523A CN104249523A CN201310255674.1A CN201310255674A CN104249523A CN 104249523 A CN104249523 A CN 104249523A CN 201310255674 A CN201310255674 A CN 201310255674A CN 104249523 A CN104249523 A CN 104249523A
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- layer
- high heat
- heat conduction
- thermal conductive
- conductive metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The invention relates to a composite high heat conduction metal backboard, which includes an intermediate insulation layer. The upper surface and lower surface of the intermediate insulation layer are respectively coated with a high heat conduction adhesive layer, a weather resistant fluorine material layer is disposed on the top end face of the high heat conduction adhesive layer at the top, and a metal conducting layer is arranged on the bottom end face of the high heat conduction adhesive layer at the bottom. The composite high heat conduction metal backboard provided by the invention has a simple structure, and two surfaces of the intermediate insulation layer are respectively coated with the high heat conduction adhesive layer, and then the weather resistant fluorine material layer and the metal conducting layer are respectively compounded on the high heat conduction adhesive layers. Being able to simplify the packaging technology of a solar cell component, the composite high heat conduction metal backboard has high heat-conducting property, and can improve the power generation efficiency of the solar cell component and improve the reliability of the solar cell component.
Description
Technical field
The present invention relates to a kind of compound high-thermal conductive metal backboard.
Background technology
At present for the solar energy backboard of solar module encapsulation, be mainly weatherability fluorine-containing layer, weatherability insulating barrier and encapsulation articulamentum by its general configuration; Its main feature is as follows: the assembly after one, encapsulation is in actual motion, and its silicon material excites the heat energy beyond wave band to be all difficult to derive fast, causes that the generated output of assembly reduces, dependability shrink; The mode that silicon chip is welded by welding need be connected when encapsulating by two, traditional assembly, makes whole manufacturing process relative complex, and because leaving gap between silicon chip, causes effective generating area of unit package area impaired.Therefore the compound backboard of high efficiency of suitable thermal conductivity factor backboard, raising generating efficiency, simplified assembly manufacturing process is selected to become photovoltaic module problem demanding prompt solution.
Summary of the invention
For solving the problems of the technologies described above, the invention provides the compound high-thermal conductive metal backboard that a kind of structure is simple, easy to use, the generating area of solar module can be improved, strengthen the reliability of assembly.
Compound high-thermal conductive metal backboard of the present invention, comprise intermediate insulating layer, the upper surface of described intermediate insulating layer and lower surface apply high-heat-conductivity glue adhensive layer respectively, the top end face being positioned at top high-heat-conductivity glue adhensive layer arranges weatherability fluorine material layer, the bottom face being positioned at bottom high-heat-conductivity glue adhensive layer arranges metal conducting layer.
Compound high-thermal conductive metal backboard of the present invention, the thickness of described intermediate insulating layer is 10 microns-500 microns.
Compound high-thermal conductive metal backboard of the present invention, described intermediate insulating layer is selected from polyester film, nylon film, polyolefin film a kind of.
Compound high-thermal conductive metal backboard of the present invention, described high-heat-conductivity glue adhensive layer is polyurethanes glue layer or acrylic glue layer, high-heat-conductivity glue adhensive layer inside is filled with the conductive particle of 1%-60%, and conductive particle is selected from one or more in aluminium oxide, silicon nitride, ceramic.
Compound high-thermal conductive metal backboard of the present invention, described metal conducting layer is selected from the one in Copper Foil, nickel foil, aluminium foil.
Compound high-thermal conductive metal backboard of the present invention, described weatherability fluorine material layer is fluorine-contained film layer or fluoro-containing coating layer.
Compared with prior art beneficial effect of the present invention is: compound high-thermal conductive metal back board structure of the present invention is simple, two surfaces of intermediate insulating layer apply high-heat-conductivity glue adhensive layer respectively, then difference compound weatherability fluorine material layer and metal conducting layer on high-heat-conductivity glue adhensive layer, the packaging technology of solar module can be simplified, heat conductivility is high, the generating efficiency of solar module can be improved, improve the reliability of solar module.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of compound high-thermal conductive metal backboard described in the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
A kind of compound high-thermal conductive metal backboard, comprise intermediate insulating layer 1, upper surface and the lower surface of described intermediate insulating layer 1 apply high-heat-conductivity glue adhensive layer 2 respectively, the top end face being positioned at top high-heat-conductivity glue adhensive layer 2 arranges weatherability fluorine material layer 3, the bottom face being positioned at bottom high-heat-conductivity glue adhensive layer 2 arranges metal conducting layer 4.
Compound high-thermal conductive metal backboard of the present invention, the thickness of described intermediate insulating layer 1 is 10 microns-500 microns.
Compound high-thermal conductive metal backboard of the present invention, described intermediate insulating layer 1 is selected from polyester film, nylon film, polyolefin film a kind of.
Compound high-thermal conductive metal backboard of the present invention, described high-heat-conductivity glue adhensive layer 2 is polyurethanes glue layer or acrylic glue layer, high-heat-conductivity glue adhensive layer 2 inside is filled with the conductive particle of 1%-60%, and conductive particle is selected from one or more in aluminium oxide, silicon nitride, ceramic.
Compound high-thermal conductive metal backboard of the present invention, described metal conducting layer 4 is selected from the one in Copper Foil, nickel foil, aluminium foil, also can adopt other alloy-layers.
Compound high-thermal conductive metal backboard of the present invention, described weatherability fluorine material layer 3 is fluorine-contained film layer or fluoro-containing coating layer, can be that fluorine film carries out complex method and carries out, also meet other functional films of weatherability, uvioresistant demand according to product function sexual demand.
Compound high-thermal conductive metal back board structure of the present invention is simple, two surfaces of intermediate insulating layer apply high-heat-conductivity glue adhensive layer respectively, then difference compound weatherability fluorine material layer and metal conducting layer on high-heat-conductivity glue adhensive layer, the packaging technology of solar module can be simplified, heat conductivility is high, the generating efficiency of solar module can be improved, improve the reliability of solar module.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.
Claims (6)
1. a compound high-thermal conductive metal backboard, comprise intermediate insulating layer, it is characterized in that: the upper surface of described intermediate insulating layer and lower surface apply high-heat-conductivity glue adhensive layer respectively, the top end face being positioned at top high-heat-conductivity glue adhensive layer arranges weatherability fluorine material layer, the bottom face being positioned at bottom high-heat-conductivity glue adhensive layer arranges metal conducting layer.
2. compound high-thermal conductive metal backboard according to claim 1, is characterized in that: the thickness of described intermediate insulating layer is 10 microns-500 microns.
3. compound high-thermal conductive metal backboard according to claim 1, is characterized in that: described intermediate insulating layer is selected from polyester film, nylon film, polyolefin film a kind of.
4. compound high-thermal conductive metal backboard according to claim 1, it is characterized in that: described high-heat-conductivity glue adhensive layer is polyurethanes glue layer or acrylic glue layer, high-heat-conductivity glue adhensive layer inside is filled with the conductive particle of 1%-60%, and conductive particle is selected from one or more in aluminium oxide, silicon nitride, ceramic.
5. compound high-thermal conductive metal backboard according to claim 1, is characterized in that: described metal conducting layer is selected from the one in Copper Foil, nickel foil, aluminium foil.
6. compound high-thermal conductive metal backboard according to claim 1, is characterized in that: described weatherability fluorine material layer is fluorine-contained film layer or fluoro-containing coating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310255674.1A CN104249523B (en) | 2013-06-25 | 2013-06-25 | A kind of compound high-thermal conductive metal backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310255674.1A CN104249523B (en) | 2013-06-25 | 2013-06-25 | A kind of compound high-thermal conductive metal backboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104249523A true CN104249523A (en) | 2014-12-31 |
| CN104249523B CN104249523B (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310255674.1A Active CN104249523B (en) | 2013-06-25 | 2013-06-25 | A kind of compound high-thermal conductive metal backboard |
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| CN (1) | CN104249523B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024993A (en) * | 2016-07-29 | 2016-10-12 | 无锡中洁能源技术有限公司 | Production technology for high-heat-dissipation dirt-resistant solar energy backboard |
| CN106057948A (en) * | 2016-07-29 | 2016-10-26 | 无锡中洁能源技术有限公司 | Production process of multilayer solar energy backboard |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516852A (en) * | 2011-12-16 | 2012-06-27 | 新高电子材料（中山）有限公司 | Weather-resistant and high thermal conductive coating, radiating solar rear panel and efficient solar cell panel |
| JP2013026530A (en) * | 2011-07-25 | 2013-02-04 | Mitsubishi Plastics Inc | Polyester film for solar cell backside sealing material |
-
2013
- 2013-06-25 CN CN201310255674.1A patent/CN104249523B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013026530A (en) * | 2011-07-25 | 2013-02-04 | Mitsubishi Plastics Inc | Polyester film for solar cell backside sealing material |
| CN102516852A (en) * | 2011-12-16 | 2012-06-27 | 新高电子材料（中山）有限公司 | Weather-resistant and high thermal conductive coating, radiating solar rear panel and efficient solar cell panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024993A (en) * | 2016-07-29 | 2016-10-12 | 无锡中洁能源技术有限公司 | Production technology for high-heat-dissipation dirt-resistant solar energy backboard |
| CN106057948A (en) * | 2016-07-29 | 2016-10-26 | 无锡中洁能源技术有限公司 | Production process of multilayer solar energy backboard |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104249523B (en) | 2016-08-17 |
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Address after: 336000 Yichun economic and Technological Development Zone, Jiangxi, Yichun, No. 32, No. Applicant after: CROWN ADVANCED MATERIAL CO., LTD. Address before: 336000 suitable business road, Yichun economic and Technological Development Zone, Jiangxi Applicant before: Mingguan Energy (Jiangxi) Co., Ltd. |
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