CN1042464A - Coating or adhesive circuit board manufacturing with conduction - Google Patents
Coating or adhesive circuit board manufacturing with conduction Download PDFInfo
- Publication number
- CN1042464A CN1042464A CN 89102491 CN89102491A CN1042464A CN 1042464 A CN1042464 A CN 1042464A CN 89102491 CN89102491 CN 89102491 CN 89102491 A CN89102491 A CN 89102491A CN 1042464 A CN1042464 A CN 1042464A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printing
- coating
- make
- electric elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The present invention relates to a kind of electrically-conducting paint that utilizes, make wiring board with the method for printing or brushing, with electrically-conducting adhesive that electric elements are in the circuit board bonding again, form the method for circuit board at last.
Adopt this method, can remove the complicated production process of available circuit plate from, more easily, promptly once finish wiring board and make with printing process; Also can on support plate, once finish the making of circuit board with method of printing, can finish the making of multilayer circuit board equally.
Description
The present invention relates to a kind of manufacture method of improved circuit board, particularly a kind of with electrically-conducting paint brushing or printing with make the method for circuit board with the bonding electric elements of electroconductive binder.
The hard printed substrate that uses in the existing electric elements, corrosion copper film layer or realize on copper clad plate entirely with the part metal cladding.And components and parts are fixed on the circuit board, be to adopt the ashbury metal weldering to apply basically, or use other metal welding to finish.Such making sheet process has several procedures: promptly want clear plate, printing mask, burn into to clean, put in order, so process is numerous and diverse, also must expend the weldering application precious metal of a great deal of, and be equipped with special-purpose machinery, as crest welder.In when operation, components and parts Chang Yin is under the high temperature and is damaged.
Task of the present invention is the manufacture method that a kind of improved circuit board will be provided, and it can be realized the wiring board making and fix all kinds of components and parts on this wiring board with electrically-conducting paint and electroconductive binder easily.And guaranteeing under the condition of component quality, fixed the circuit board of electronic devices and components with the quick production of method of printing, reach and reduce cost, improve the purpose of work efficiency.And then adopt method of printing repeatedly printing on support plate, form multilayer circuit board, to reach the characteristics of suitably dwindling the electrical equipment volume.
Task of the present invention is finished as follows:
In mask-making technology, earlier with all kinds of dielectric panels (as plastic plate, poly (methyl methacrylate) plate, glass plate, insulation board.) dust removal, tie.With the pattern of the printed substrate that designs, make the negative norm plate then.Carry electrically-conducting paint adopting on the sheet material face of insulating sheet material as support plate with hairbrush with this negative norm plate is topped again, on the support plate face, once brush, behind drying or the airing, remove unnecessary coating slag, on the position that needs punch, punch.The components and parts that need join are set on the relevant position of wiring board, are bonded on this wiring board with electroconductive binder, treat the adhesive drying after, can use.Multiple circuit negative norm plate can also be printed on the support plate with method of printing, form multilayer circuit board; If the function of components and parts can be made multilayer circuit board on mixing automatically when printing.
The present invention is described in further detail below in conjunction with embodiment.
Embodiment 1:
Get a suitable insulation board dust removal, tie, the negative norm plate that will make according to the pattern of the printed substrate that designs, topped on support plate, carry electrically-conducting paint with hairbrush, on support plate, once brush, after the drying, remove unnecessary coating slag, on the position of needs punching, punch.On the assigned position of wiring board, put the components and parts that need configuration, with electroconductive binder that components and parts and printed substrate are bonding then, after drying, can use.
Embodiment 2:
On computers by a software, the electric appliance circuits of needs is designed, and it is stand-by to deposit.Come conductive coating spray with special ink-jet printer, make by the good line map spray of Computer Design on support plate.Behind airing, promptly be the wiring board finished product.The electric elements that will dispose are promptly finished the manufacturing process of whole circuit boards with the electroconductive binder bonding in the circuit board again.
Embodiment 3:
The mechanism of setting up with special-purpose computer is equipped with printed substrate figure; Scribe element with this figure again and stay a forme, this stays a forme all kinds of special-purpose electric elements of making can be located on printed substrate, so the electric elements that printed wire negative norm plate and element stayed a printing forme and make are distributed on the special printing machine that can go up electric elements automatically, then can make the circuit board of charged device element by one-step print.
Claims (2)
1, a kind of with the electrically-conducting paint brushing or with the manufacture method of the circuit board that makes behind the bonding electric elements of electroconductive binder, it is characterized in that the coating that conducts electricity and adhesive admix electric conducting material and make in coating and adhesive, make the figure of conducting wire then with brushing or printing process, the bonding again electric elements of going up then form circuit board.
2, according to the manufacture method of the circuit board of claim 1, it is characterized in that available method of printing with electric elements and the electric wiring one-step print of having finalized the design on the hard support plate; Also can repeatedly print different line patterns on a support plate, then form multilayer circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89102491 CN1042464A (en) | 1989-12-08 | 1989-12-08 | Coating or adhesive circuit board manufacturing with conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89102491 CN1042464A (en) | 1989-12-08 | 1989-12-08 | Coating or adhesive circuit board manufacturing with conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1042464A true CN1042464A (en) | 1990-05-23 |
Family
ID=4854763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89102491 Pending CN1042464A (en) | 1989-12-08 | 1989-12-08 | Coating or adhesive circuit board manufacturing with conduction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1042464A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365653C (en) * | 2002-07-03 | 2008-01-30 | 德国捷德有限公司 | Method for the production of electrically-conducting connections on chipcards |
| CN101778538B (en) * | 2006-06-02 | 2013-04-17 | 刘扬名 | Device system for producing nano spraying circuit boards |
-
1989
- 1989-12-08 CN CN 89102491 patent/CN1042464A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365653C (en) * | 2002-07-03 | 2008-01-30 | 德国捷德有限公司 | Method for the production of electrically-conducting connections on chipcards |
| CN101778538B (en) * | 2006-06-02 | 2013-04-17 | 刘扬名 | Device system for producing nano spraying circuit boards |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |