CN104245537A - Method for packaging glass plate, and package - Google Patents
Method for packaging glass plate, and package Download PDFInfo
- Publication number
- CN104245537A CN104245537A CN201380019795.4A CN201380019795A CN104245537A CN 104245537 A CN104245537 A CN 104245537A CN 201380019795 A CN201380019795 A CN 201380019795A CN 104245537 A CN104245537 A CN 104245537A
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- China
- Prior art keywords
- glass board
- glass
- electronic equipment
- holding paper
- glass plate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
Abstract
The present invention pertains to a method for packaging a glass plate by alternately stacking multiple glass plates and slip sheets for a glass plate, the slip sheets being inserted between the glass plates, wherein the glass plates and the slip sheets are stacked such that the electronic device component formation surface of the glass plate and the wired surface of the slip sheet for a glass plate face one another.
Description
Technical field
The present invention relates to packing method and the packaging body of glass board.
Background technology
Such as, in the flat-panel monitor such as Liquid Crystal Display or plasma display (FPD), large-scale glass board is widely used.Multiple glass board, when keeping, carrying etc., are contained in packing container etc. with stacked state and form packaging body by large-scale glass board like this.In such packaging body, under bringing the object of damage to glass pane surface suppressing glass board to contact with each other, between each stacked glass board, insert inserting paper for glass plate (hereinafter sometimes referred to simply as " holding paper ").
Such as, as the packing method of glass board, there will be a known the glass plate packing container being used in plate receiving portion base being provided with level, and by glass board and holding paper and the packing method (patent documentation 1) of accommodating stacked with the state alternately kept flat in described plate receiving portion.And, there will be a known following packing method: the end receiving plate of mounting glass board is obliquely installed relative to the upper surface of this base by glass plate packing container on base, and then there is the back of the body receiving plate erected with the angle of 90 ~ 100 ° relative to this end receiving plate from the lower end side of this end receiving plate, use this glass plate packing container, be positioned on end receiving plate they are erected by mode alternately laminated to glass board and holding paper from back of the body receiving plate side, this glass plate laminate accommodated with the state tilted and packs (patent documentation 2).
[at first technical literature]
[patent documentation]
[patent documentation 1] Japanese Laid-Open 2007-153395 publication
[patent documentation 2] Japanese Laid-Open 2005-298062 publication
Summary of the invention
[inventing the problem that will solve]
Like this, when inserting holding paper between glass board, the situation bringing damage because of glass board contact each other to glass pane surface can be suppressed.But, there is the problem that the particles such as the paper powder come off from holding paper are attached to glass pane surface.
The packing method of patent documentation 2 is by glass board with the state tilting to erect packaging, and therefore compared with the packing method kept flat of patent documentation 1, the surface pressure acting on each glass board is little, and glass board and holding paper are difficult to excessive contiguity.Therefore, with compared with the stacked situation of the state kept flat, the granule number being attached to glass pane surface reduces.
On the other hand, the glass board being used in FPD etc. and wind glass for building etc. are different, and use for electronic equipment component forming surface (forming the faces of the functional layers such as RGB layer) requires to keep with extra high cleanliness level.Therefore, compared with the packing method of patent documentation 2, requirement can reduce the packing method of the granule number be attached in the use for electronic equipment component forming surface of glass board further.
In the present invention, its object is to provide a kind of by glass board and inserting paper for glass plate alternately laminated and pack time, the attachment quantity of the particle of the use for electronic equipment component forming surface from inserting paper for glass plate to glass board can be reduced, and can the packing method of the glass board of the use for electronic equipment component forming surface of glass board be kept with high cleanliness and use this packing method to carry out the packaging body packed.
[for solving the scheme of problem]
The packing method of glass board of the present invention is by multiple glass board and to be inserted into inserting paper for glass plate between multiple glass board described alternately laminated and pack, wherein,
Carry out stacked to make the use for electronic equipment component forming surface of the described glass board mode relative with the metal wool face of described inserting paper for glass plate.
In addition, in the packing method of glass board of the present invention, preferably, to the described glass board of more than 3 respective between insert each described inserting paper for glass plate, the direction in the metal wool face of inserting paper for glass plate described in multiple is all towards equidirectional.
In addition, in the packing method of glass board of the present invention, preferably, described glass board is the glass board manufactured by float glass process, and described use for electronic equipment component forming surface is abrasive surface.
In addition, packaging body of the present invention has glass plate packing container and is positioned in the glass plate laminate on described glass plate packing container, wherein,
Described glass plate laminate by multiple glass board and the inserting paper for glass plate that is inserted between multiple glass board alternately laminated, and the use for electronic equipment component forming surface of described glass board is relative with the metal wool face of described inserting paper for glass plate.
[invention effect]
According to the packing method of glass board of the present invention, by glass board and inserting paper for glass plate alternately laminated and when packing, the attachment quantity of the particle of the use for electronic equipment component forming surface from inserting paper for glass plate to glass board can be reduced, the use for electronic equipment component forming surface of glass board can be kept with high cleanliness.
In addition, packaging body of the present invention is by glass board and the alternately laminated glass plate laminate of inserting paper for glass plate, reduce the attachment quantity of the particle of the use for electronic equipment component forming surface from inserting paper for glass plate to glass board, the use for electronic equipment component forming surface of glass board is kept with high cleanliness.
Accompanying drawing explanation
Fig. 1 is the front view of the brief configuration representing the glass plate packing container that can use in the packing method of glass board of the present invention.
Fig. 2 is the lateral plan of the glass plate packing container of Fig. 1.
Fig. 3 represents to utilize the glass plate packing container of Fig. 1 by the lateral plan of the packaging body of glass plate packing.
Fig. 4 is the figure comprising the structure of the duplexer of glass board and holding paper that embodiment is described.
Fig. 5 is the coordinate diagram of the measurement result of the granule number of representation case 1 ~ 3.
Detailed description of the invention
The packing method of glass board of the present invention is the method for packing glass board as described below, this glass board be by the flat-panel monitor such as Liquid Crystal Display or plasma display (FPD), used for solar batteries, illumination, thin-film secondary battery with or the glass board etc. of semiconductor wafer that is formed with circuit on the surface glass board that is formed with use for electronic equipment component (functional element) on one face and uses.As described use for electronic equipment component, such as, thin film transistor (TFT) can be enumerated, comprise the colour filter etc. of RGB layer.In the present invention, the face of the side of the formation use for electronic equipment component of glass board is called use for electronic equipment component forming surface.And, glass board is called opposing face with the face of use for electronic equipment component forming surface opposition side.
In the packing method of glass board of the present invention, by multiple glass board and to be inserted into holding paper between multiple glass board described alternately laminated and form glass plate laminate, this glass plate laminate be contained in glass plate packing container etc. and pack.Holding paper causes damage and is inserted between glass board in order to avoid glass board contacts with each other, thus, the stay in grade of glass board, and handling efficiency improves.
The packing method of glass board of the present invention by glass board and holding paper stacked time, make the use for electronic equipment component forming surface of glass board relative with the metal wool face of holding paper.That is, in glass plate laminate, the use for electronic equipment component forming surface of glass board is contacted with the metal wool face of holding paper.Thereby, it is possible to reduce the number of the particle of the paper powder being attached to the use for electronic equipment component forming surface of glass board from holding paper etc.
The metal wool face of holding paper is in the copy paper of holding paper manufactures, the face connected with metal wool when liquid holding paper is dewatered by metal wool.And, holding paper is called felt face with the face of opposition side, metal wool face.
Present inventors etc. consider the different of the face of the holding paper that basis contacts with the use for electronic equipment component forming surface of glass board and there is the different possibility of the granule number be attached in the use for electronic equipment component forming surface of glass board, have studied the granule number of situation and the situation that metal wool face is contacted with the use for electronic equipment component forming surface of glass board that felt face is contacted with the use for electronic equipment component forming surface of glass board in detail.Consequently, distinguish when the mode connected with the use for electronic equipment component forming surface of glass board with the metal wool face of holding paper is carried out stacked, compared with the situation that the mode connected with the felt face of holding paper and the use for electronic equipment component forming surface of glass board is stacked, the granule number be attached in the use for electronic equipment component forming surface of glass board reduces.
In the packing method of glass board in the past, between being inserted by holding paper during multiple glass board stacked, the direction of holding paper is any, makes the use for electronic equipment component forming surface of glass board connect with the felt face of holding paper or connect with metal wool face.Therefore, consider in the use for electronic equipment component forming surface of the glass board especially contacted in the felt face of holding paper, more particle can be adhered to from holding paper.
Relative to this, in the packing method of glass board of the present invention, the face of the holding paper contacted with the use for electronic equipment component forming surface of glass board is unified into the metal wool face that particle is difficult to adhere to, reducing the granule number be attached to from holding paper when packing the use for electronic equipment component forming surface of glass board thus, use for electronic equipment component forming surface can be kept in high cleanliness ground.It should be noted that, in packing method of the present invention, on the opposing face of glass board, compared with use for electronic equipment component forming surface, be attached with more particle from the felt face of holding paper.But, although opposing face is provided with Polarizer etc., do not form use for electronic equipment component, therefore no problem in practical.
The large-scale glass board that the packing method of glass board of the present invention uses for FPD etc. is effective especially.Specifically, large-scale glass board weight, the surface pressure acting on each glass board when stacked uprises, and therefore glass board and holding paper more easily touch, and the possibility being attached with more particle in use for electronic equipment component forming surface is high.Packing method of the present invention so large-scale glass board stacked in also can reduce the granule number be attached in use for electronic equipment component forming surface, therefore very useful.
As the concrete example of the size of large-scale glass board, such as, can enumerate thickness of slab is 0.1mm ~ 3.0mm, and the length on length and width 1 limit is separately the glass board etc. of 1500mm ~ 3500mm.
As glass board, in the glass board manufactured with float glass process, use for electronic equipment component forming surface is preferably abrasive surface.The surface of a side of the grinding apparatus of rotation and/or revolution to the glass board being configured as tabular by float glass process from melten glass is utilized to grind, by the small concavo-convex or removing that rises and falls on this surface, be formed as the lamellar of the thickness of the regulation of the flatness met required by the glass board of use for electronic equipment thus.As the method for grinding the use for electronic equipment component forming surface of glass board, the Ginding process that No. 2004-122351, preferred Japanese Laid-Open or No. 2011/052529th, International Publication are recorded etc. employ the grinding that cerium oxide or colloidal state silicon are the slurry of abrasive particle.
It should be noted that, glass board also can be the glass board manufactured by other the method such as method of fusion.
The known holding paper that holding paper can utilize the mechanical pulps such as semichemical wood pulp, groundwood pulp (GP), thermomechanical paper pulp (TMP, BCTMP), fine grinding paper pulp (RGP) such as the chemical pulps such as kraft pulp (KP), sulfite pulp (SP), soda pulp (AP), semichemical wood pulp (SCP), chemical fine grinding paper pulp (CGP), is made up of various raw material be raw material the non-wood-fiber paper pulp, synthetic paper-pulp etc. such as Chu Shu, Edgeworthia chrysantha, fiber crops, gombo hemp.And holding paper also can with these compound for raw material, can also with the material containing cellulose etc. for raw material.
In addition, these raw material can be waste paper, and also can be body paper slurry, can also be the compound that waste paper and body paper are starched.Wherein, preferred body paper slurry.
The size of holding paper is preferably large than glass board.That is, by glass board and holding paper alternately laminated time, preferred holding paper exposes from glass board.Thus, glass board contact each other can stably be suppressed when packing.Therefore, it is possible to the use for electronic equipment component forming surface of more stably cover glass plate.And, under the state pressed the part exposed of holding paper, glass board can be made to be separated from this holding paper, therefore open operation and become easy.
The smoothness (JIS P 8119 (1976)) in the metal wool face of holding paper is preferably less than 20 seconds, is more preferably less than 18 seconds.Thus, the area of contact in the use for electronic equipment component forming surface of glass board and the metal wool face of holding paper reduces, and the resinous principle in holding paper is difficult to be transferred in the use for electronic equipment component forming surface of glass board.Therefore, it is possible to suppress to produce paper flesh texture, burn, stained etc. in use for electronic equipment component forming surface, can keep with higher cleanliness level.
The smoothness (JIS P 8119 (1976)) in the felt face of holding paper is same with metal wool face, from suppressing to produce paper flesh texture, burn, the aspect such as stained at the opposing face of glass board, be preferably less than 20 seconds, be more preferably less than 18 seconds.
The resinous principle (JIS P 8205 (1976)) of holding paper is preferably below 0.1 quality %, is more preferably below 0.05 quality %.If below the described higher limit of the resinous principle of holding paper, be then attached to the granule number of glass pane surface less from holding paper, easily keep the quality of glass board.
Such holding paper can utilize the paper method processed of known holding paper to manufacture substantially.
Just be not particularly limited as long as the use for electronic equipment component forming surface of the glass board of glass plate laminate is relative with the metal wool face of holding paper with the use for electronic equipment component forming surface of the direction glass board in the metal wool face of holding paper.In the present invention, the glass board more than 3 respective between when inserting holding paper respectively, when namely inserting the holding paper of more than 2, preferably make the metal wool face of these holding papers all towards same direction.That is, for make use for electronic equipment component forming surface all become the stacked glass board of the mode of equidirectional, preferably to make metal wool face insert whole holding papers towards the mode of whole use for electronic equipment component forming surfaces respectively.
Such as, when glass board is kept flat, preferably to make the use for electronic equipment component forming surface of glass board all downwards and all mode is upwards stacked in the metal wool face of the holding paper inserted, or to make the use for electronic equipment component forming surface of glass board all upwards and all downward mode in the metal wool face of the holding paper inserted is stacked.And, when such longitudinal of packaging body described later, preferably to make the use for electronic equipment component forming surface of glass board all towards back of the body receiving plate side and the mode of opposition side of the metal wool face of the holding paper inserted all towards back of the body receiving plate is stacked, or to make the use for electronic equipment component forming surface of glass board all towards the opposition side of back of the body receiving plate and the mode of the metal wool face of the holding paper inserted all towards back of the body receiving plate side is stacked.
Below, as an example of the packing method of glass board of the present invention, glass plate packing is formed the packing method of packaging body 1 by instruction diagram 1 and Fig. 2 illustrative use glass plate packing container 100.
The glass plate packing container 100 of present embodiment has: base 10; Receiving plate 12 at the bottom of flat 2 that arrange base 10 surface thereof 5 ° ~ 25 °; From 4 vertical sheets 14 of the column that the lower end side of end receiving plate 12 erects with the angle of 90 ° ~ 100 ° relative to end receiving plate 12; 1 flat back of the body receiving plate 16 of end receiving plate 12 side is arranged in the mode supported by these 4 vertical sheets 14; In the side (right side of Fig. 2) contrary with back of the body receiving plate 16 of each vertical sheet 14 from vertical 4 pillars 18 arranged with erecting of base 10; Be set up in the reinforcement 20 of each vertical sheet 14 and pillar 18.
In the packing method of glass board 32 using glass plate packing container 100, as shown in Figure 3, on the end receiving plate 12 of glass plate packing container 100, with the use for electronic equipment component forming surface 32a of glass board 32 towards back of the body receiving plate 16 side mode by multiple glass board 32 and the inserting paper for glass plate larger than glass board 32 34 (following, be only called " holding paper 34 ") alternately erect stacked, load as glass plate laminate 30.Now, metal wool face 34a towards the side (left side of Fig. 3) contrary with back of the body receiving plate 16, makes the use for electronic equipment component forming surface 32a of glass board 32 relative with the metal wool face 34a of holding paper 34, makes them contact by holding paper 34.
Each glass board 32 of glass plate laminate 30 connects because of deadweight with at the glass board 32 carrying on the back receiving plate 16 side adjacent, therefore can not produce gap between each glass board 32.
Glass plate laminate 30 utilization be positioned on the end receiving plate 12 of glass plate packing container 100 is located at the pressing member (not shown) of glass plate packing container 100 etc. and is pressed from the opposition side (left side of Fig. 3) and side (left and right sides of Fig. 1) of carrying on the back receiving plate 16 and fix.
Glass board 32 and the stacked of holding paper 34 preferably carry out in clean room.Thereby, it is possible to suppress the dust etc. be attached with on the use for electronic equipment component forming surface 32a of glass board 32 in atmosphere.
Such as, in clean room, the glass board 32 upwards kept flat by use for electronic equipment component forming surface 32a loads holding paper 34 in the mode making metal wool face 34a connect with use for electronic equipment component forming surface 32a.Then, utilize robot etc. that glass board 32 and holding paper 34 are adsorbed and lifted from holding paper 34, be positioned on end receiving plate 12 towards the mode of back of the body receiving plate 16 side to make the use for electronic equipment component forming surface 32a of glass board 32.Can by alternately laminated to glass board 32 and holding paper 34 by repeatedly carrying out.
Holding paper 34 is larger than glass board 32, in glass plate laminate 30, becomes the state that holding paper 34 exposes from the upside of glass board 32.When opening, the part exposed of the upper end side of holding paper 34 being pressed, glass board 32 being separated from this holding paper 34, and glass board 32 and holding paper 34 are taken out successively.
In addition, in packing method of the present invention, also can be that holding paper 34 exposes from the side side of stacked glass board 32.In this case, by the holding paper 34 that exposes from side side along the lateral margin bending of glass board 32, pack in the mode of the side of stacked coated glass sheets 32, thus also can the side of cover glass plate 32 by holding paper 34.In order to reduce the granule number on the side being attached to glass board 32, the face of the holding paper 34 covered the side of glass board 32 is preferably metal wool face 34a.
By packing method described above, the packaging body 1 that there is glass plate packing container 100 and be positioned in the glass plate laminate 30 on glass plate packing container 100 can be obtained.
According to the packing method of glass board of the present invention described above, by glass board and holding paper alternately laminated and when packing, the number of the particle being attached to the use for electronic equipment component forming surface of glass board from holding paper can be reduced, the cleanliness level of the use for electronic equipment component forming surface of glass board can be kept higher.
In addition, as the situation of glass plate packing container 100 as described in employing, glass board is carried out stacked method with the state tilted and kept flat by glass board compared with stacked situation, and the surface pressure acted on each glass board reduces, and is difficult to glass board and holding paper are excessively touched.Therefore, in the use for electronic equipment component forming surface being more difficult at particle to be attached to glass board from holding paper preferably.
It should be noted that, the packing method of glass board of the present invention can be that multiple glass board are kept flat stacked method.And, packaging body of the present invention is not defined as above-mentioned packaging body 1 yet, also can be, such as, if stacked in the mode that the use for electronic equipment component forming surface of glass board is relative with the metal wool face of holding paper, then be used in the glass plate packing container of plate receiving portion base being provided with level, in described plate receiving portion, glass board and holding paper is stacked and form packaging body with the state alternately kept flat.
Embodiment
Below, describe the present invention in detail by embodiment, but the present invention is not by the restriction of following record.
[example 1]
In clean room, as shown in Figure 4, aluminium sheet 210 (long 500mm × wide 400mm × thickness of slab 10mm) is provided with the resin sheet (PORON (registered trade mark (RTM)), Co., Ltd. Rogers aboveground (ROGERS INOAC) system) of thickness 3mm as damper element 212.
And, on this damper element 212, the breadboard 214 (glass board (Asahi Glass Co., Ltd AN100) of non-determination object with the glass board same shape of determination object is set.Long 470mm × wide 370mm × thickness 0.7mm), on this breadboard 214, by glass board 218 (the Asahi Glass Co., Ltd AN100 of 20 holding papers 216 (the holding paper D (long 500mm × wide 400mm) of 10 references and the holding paper A (long 500mm × wide 400mm) of 10 evaluation objects) with 20 determination objects.Long 470mm × wide 370mm × thickness 0.7mm) mode that contacts with described breadboard 214 with holding paper 216 is alternately laminated.
Holding paper 216 is all downward with the stacked use for electronic equipment component forming surface (abrasive surface) of glass board 218 that makes of glass board 218, and the face of the holding paper 216 connected with this use for electronic equipment component forming surface from lower according to following order.It should be noted that, (1) represents first holding paper risen from below, below equally.
(1) the felt face of holding paper D.
(2) the metal wool face of holding paper D.
(3) the felt face of holding paper A.
(4) the metal wool face of holding paper A.
(5) ~ (8), (9) ~ (12), (13) ~ (16) and (17) ~ (20) are respectively the order identical with (1) ~ (4).
And, the glass board 218 of the top arranges holding paper A as simulation holding paper 220, this holding paper A arranges the breadboard 222 identical with described breadboard 214, forms glass plate laminate 201.
Then, the breadboard 222 of glass plate laminate 201 is provided with the resin sheet (PORON (registered trade mark (RTM)), Co., Ltd. Rogers aboveground (ROGERS INOAC) system) of thickness 3mm as damper element 224.
In the bottom of constant temperature and humidity cabinet, lay 3 by overlapping for the resin sheet (PORON (registered trade mark (RTM)), Co., Ltd. Rogers aboveground (ROGERS INOAC) system) of thickness 1mm, and lay the resin sheet (PORON (registered trade mark (RTM)), Co., Ltd. Rogers aboveground (ROGERS INOAC) system) of thickness 5mm thereon.Then, the mode that the duplexer be made up of aluminium sheet 210/ damper element 212/ glass plate laminate 201/ damper element 224 obtained by described laminating method becomes below with aluminium sheet 210 arranges, on the damper element 224 of this duplexer and then arrange aluminium sheet (long 500mm × wide 400mm × thickness 10mm) by this resin sheet.Then, the aluminium sheet on described duplexer is arranged the weight of 35.8kg, left standstill 24 hours with temperature 40 DEG C, humidity 25%.
Then, described duplexer is decomposed and takes out glass plate laminate 201, utilized cleaning machine the to clean surface of each glass board 218 of 20.Cleaning makes the two sides of water spray and glass board 218 collide, and carries out, then carried out drying by air blowing under the condition of High Pressure Pure Water water spray (5 seconds), pure water super sonic water spray (10 seconds), High Pressure Pure Water water spray (5 seconds).After cleaning, by granule number measuring machine (FPD foreign body detecting device HS-730, east beautiful engineering (Toray Engineering) Inc.), determine the granule number that the size be attached in the use for electronic equipment component forming surface of each glass board 218 is more than 1 μm, the aviation value having calculated the granule number of the use for electronic equipment component forming surface contacted with the felt face of commercially available holding paper A respectively and the aviation value of the granule number of use for electronic equipment component forming surface contacted with the metal wool face of holding paper A.
In addition, deduct the aviation value of the granule number that the use for electronic equipment component forming surface for each glass board before stacked determines from each aviation value described, calculated the granule number that holding paper causes.Then, calculate the granule number after with the subtraction of the use for electronic equipment component forming surface contacted with the felt face of holding paper A for " 1 " and normalization time the use for electronic equipment component forming surface contacted with the metal wool face of holding paper A subtraction after granule number and evaluate.
[example 2]
Except the holding paper A of determination object is changed to except commercially available holding paper B, the granule number of the use for electronic equipment component forming surface contacted with the metal wool face of holding paper B by same method evaluation.
[example 3]
Except being changed to except commercially available holding paper C by the holding paper A of determination object, have rated the granule number of the use for electronic equipment component forming surface contacted with the metal wool face of holding paper C in the same way.
About example 1 ~ 3, when confirming the measurement result of the granule number of the glass board contacted with the holding paper D of each reference, error is fully little.The evaluation result of example 1 ~ 3 as shown in Figure 5.
Holding paper A ~ C be all metal wool face than felt face to be attached to the granule number of the use for electronic equipment component forming surface of glass board from holding paper few.
In detail and describe the present invention with reference to specific embodiment, but do not depart from the scope of the present invention and spirit and the situation of various correction or change of can applying is self-evident to those skilled in the art.
The Japan patent application 2012-092122 that the application filed an application based on April 13rd, 2012, and its content is incorporated herein as reference.
[label declaration]
1 packaging body, 10 bases, 12 end receiving plates, 14 vertical sheets, 16 back of the body receiving plates, 18 pillars, 20 reinforcements, 30 glass plate laminates, 32 glass board, 32a use for electronic equipment component forming surface, 34 inserting paper for glass plate, 34a metal wool face, 100 glass plate packing containers.
Claims (4)
1. a packing method for glass board, by multiple glass board with to be inserted into inserting paper for glass plate between multiple glass board described alternately laminated and pack, wherein,
Carry out stacked to make the use for electronic equipment component forming surface of the described glass board mode relative with the metal wool face of described inserting paper for glass plate.
2. the packing method of glass board according to claim 1, wherein,
To the described glass board of more than 3 separately between insert each described inserting paper for glass plate,
The direction in the metal wool face of inserting paper for glass plate described in multiple is all towards equidirectional.
3. the packing method of glass board according to claim 1 and 2, wherein,
Described glass board is the glass board manufactured by float glass process, and described use for electronic equipment component forming surface is abrasive surface.
4. a packaging body, has glass plate packing container and is positioned in the glass plate laminate on described glass plate packing container, wherein,
Described glass plate laminate by multiple glass board and the inserting paper for glass plate that is inserted between multiple glass board described alternately laminated, and the use for electronic equipment component forming surface of described glass board is relative with the metal wool face of described inserting paper for glass plate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-092122 | 2012-04-13 | ||
| JP2012092122 | 2012-04-13 | ||
| PCT/JP2013/060691 WO2013154089A1 (en) | 2012-04-13 | 2013-04-09 | Method for packaging glass plate, and package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104245537A true CN104245537A (en) | 2014-12-24 |
Family
ID=49327652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380019795.4A Pending CN104245537A (en) | 2012-04-13 | 2013-04-09 | Method for packaging glass plate, and package |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2013154089A1 (en) |
| KR (1) | KR20140145112A (en) |
| CN (1) | CN104245537A (en) |
| TW (1) | TW201402426A (en) |
| WO (1) | WO2013154089A1 (en) |
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| CN107107568A (en) * | 2014-12-26 | 2017-08-29 | 旭硝子株式会社 | Glass laminate, the manufacture method of electronic device, the manufacture method of glass laminate, glass plate packing body |
| CN107499946A (en) * | 2017-09-26 | 2017-12-22 | 浙江德立自动化装备股份有限公司 | Glass stacking automates paper paving machine |
| CN109188649A (en) * | 2018-09-19 | 2019-01-11 | 珠海达理宇航科技有限公司 | A kind of protective device of polygon bucket and space telescope eyeglass |
| CN112046101A (en) * | 2019-06-06 | 2020-12-08 | Ａｇｃ株式会社 | Laminated substrate and package |
| CN114229227A (en) * | 2022-01-21 | 2022-03-25 | 青岛融合光电科技有限公司 | Long-distance conveying device for carrier plate glass and packaging method for reducing breakage of carrier plate glass |
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| WO2015178383A1 (en) * | 2014-05-19 | 2015-11-26 | 旭硝子株式会社 | Cleaning device and cleaning method for cleaning slip sheet for glass plate, glass plate laminate, glass plate packaging, manufacturing method of slip sheet for glass plate, and slip sheet for glass plate |
| JP2018167839A (en) * | 2015-09-02 | 2018-11-01 | Ａｇｃ株式会社 | Protected lamination of light-guiding glass plate, method to take out glass plate from lamination and method to produce light-guiding glass plate |
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| JPH04139455A (en) * | 1990-10-01 | 1992-05-13 | Canon Inc | Electrophotographic transfer paper and production thereof |
| US8821970B2 (en) * | 2009-05-22 | 2014-09-02 | Corning Incorporated | Slip agent for protecting glass |
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- 2013-04-09 CN CN201380019795.4A patent/CN104245537A/en active Pending
- 2013-04-09 JP JP2014510168A patent/JPWO2013154089A1/en active Pending
- 2013-04-09 WO PCT/JP2013/060691 patent/WO2013154089A1/en active Application Filing
- 2013-04-09 KR KR1020147020516A patent/KR20140145112A/en not_active Application Discontinuation
- 2013-04-12 TW TW102113147A patent/TW201402426A/en unknown
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| JP2007070752A (en) * | 2005-09-06 | 2007-03-22 | Oji Paper Co Ltd | Slip sheet for glass sheet and method for pulp for slip sheet for glass sheet |
| JP2008297661A (en) * | 2007-05-31 | 2008-12-11 | Asahi Glass Co Ltd | Method for quality control of paper, and method for producing interleaf paper for storage and/or transportation of glass substrate for flat panel display |
| CN101687690A (en) * | 2007-07-11 | 2010-03-31 | 旭硝子株式会社 | Inserting paper for glass plate and glass plate laminate |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107107568A (en) * | 2014-12-26 | 2017-08-29 | 旭硝子株式会社 | Glass laminate, the manufacture method of electronic device, the manufacture method of glass laminate, glass plate packing body |
| TWI696556B (en) * | 2014-12-26 | 2020-06-21 | 日商Ａｇｃ股份有限公司 | Glass laminate, method for manufacturing electronic components, method for manufacturing glass laminate, glass plate package |
| CN115447223A (en) * | 2014-12-26 | 2022-12-09 | Ａｇｃ株式会社 | Glass laminate, method for manufacturing electronic device, method for manufacturing glass laminate, and glass plate package |
| CN107499946A (en) * | 2017-09-26 | 2017-12-22 | 浙江德立自动化装备股份有限公司 | Glass stacking automates paper paving machine |
| CN109188649A (en) * | 2018-09-19 | 2019-01-11 | 珠海达理宇航科技有限公司 | A kind of protective device of polygon bucket and space telescope eyeglass |
| CN112046101A (en) * | 2019-06-06 | 2020-12-08 | Ａｇｃ株式会社 | Laminated substrate and package |
| CN114229227A (en) * | 2022-01-21 | 2022-03-25 | 青岛融合光电科技有限公司 | Long-distance conveying device for carrier plate glass and packaging method for reducing breakage of carrier plate glass |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013154089A1 (en) | 2013-10-17 |
| JPWO2013154089A1 (en) | 2015-12-17 |
| TW201402426A (en) | 2014-01-16 |
| KR20140145112A (en) | 2014-12-22 |
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Application publication date: 20141224 |