CN104241745A - Micro-strip filter - Google Patents
Micro-strip filter Download PDFInfo
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- CN104241745A CN104241745A CN201410453000.7A CN201410453000A CN104241745A CN 104241745 A CN104241745 A CN 104241745A CN 201410453000 A CN201410453000 A CN 201410453000A CN 104241745 A CN104241745 A CN 104241745A
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- filter
- microstrip
- dielectric layer
- capacity cell
- inductance element
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Abstract
The invention discloses a micro-strip filter. The micro-strip filter solves the technical problem that in the prior art, a micro-strip filter is large in size. The micro-strip filter comprises a substrate, a filtering unit and a micro-strip line, wherein the filtering unit is embedded into the substrate and comprises an inductance element and a capacitance element, and the micro-strip line is connected with the inductance element and the capacitance element.
Description
Technical field
The present invention relates to semiconductor applications, particularly relate to a kind of microstrip filter.
Background technology
Along with the scarcity of radio spectrum resources, open up the important goal that new frequency band becomes communication planning.2002, FCC (FCC) authorized ultra broadband (Ultra-Wideband Bandpass, UWB) frequency range, and radio ultra wide band system and the communication technology become study hotspot rapidly.UWB frequency range is defined as 3.1 ~ 10.6GHz by FCC, and relative bandwidth can reach 110%, and ultra-wide band filter, as one of the core component of radio ultra wide band system, plays very important role, has been a great concern equally.
The passband of microstrip filter is wider, more can meet the requirement of ultrabroad band design of filter, but, microstrip filter is subject to material restriction, volume is larger or long, be generally used for now the hard-core situation of volume, if in order to the volume reducing microstrip filter, can only pass through the very thin mode of microstrip design, but it is enough little that existing technique cannot meet microstrip line, only can not produce larger change to the volume of microstrip filter to the mode that micro belt line width reduces, therefore microstrip filter volume of the prior art is larger.
Summary of the invention
The embodiment of the present application, by providing a kind of microstrip filter, solves the technical problem that in prior art, microstrip filter volume is larger.
Filter in the embodiment of the present invention, comprising:
One substrate;
Filter unit, imbed in described substrate, described filter unit comprises inductance element and capacity cell, and connects the microstrip line of described inductance element and described capacity cell.
Preferably, described filter unit comprises:
Multiple filtering subelement;
Described microstrip line, also for connecting described multiple filtering subelement.
Preferably, described capacity cell is specially:
Laminated body, capacitor, described laminated body, capacitor comprises M dielectric layer, and a described M dielectric layer is in parallel by the metal level between two layers of dielectric layer, and wherein, the dielectric constant of described dielectric layer is greater than a threshold value, M be more than or equal to 1 positive integer.
Preferably, described inductance element is specially: magnetic core wire-wound inductor, or labeling inductance.
Preferably, the material of described microstrip line is left-handed materials.
Technical scheme in the embodiment of the present invention, at least has following technique effect:
Owing to have employed a substrate, the inductance element that filter unit is comprised, capacity cell, and the microstrip line connecting inductance element and capacity cell is imbedded in substrate, thus do not need to be arranged on surface, thus the volume of microstripline filter can be reduced.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
Fig. 1 is the structural representation of the microstrip filter in the embodiment of the present invention;
Fig. 2 A is the end view of the laminated body, capacitor in the embodiment of the present invention;
Fig. 2 B is the vertical view of the laminated body, capacitor in the embodiment of the present invention;
Fig. 3 is the structural representation of the filtering subelement in the embodiment of the present invention;
Fig. 4 is the schematic diagram of the multiple filtering subelement cascade in the embodiment of the present invention.
Embodiment
The embodiment of the present invention, by providing a kind of microstrip filter method, solves the technical problem that in prior art, microstrip filter volume is larger.
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Shown in figure 1, the microstrip filter in the embodiment of the present invention comprises:
One substrate 10 and filter unit 20, filter unit 20 is imbedded in substrate 10, and filter unit 20 comprises inductance element 201 and capacity cell 202, and connects the microstrip line 30 of inductance element 201 and capacity cell 202.
In specific implementation process, inductance element 201 is specially magnetic core wire-wound inductor, or labeling inductance, produces larger inductance value to realize less space.
In specific implementation process, capacity cell 202 is specially laminated body, capacitor, laminated body, capacitor comprises M dielectric layer, M dielectric layer is in parallel by the metal level between two layers of dielectric layer, concrete, the metal level between two layers of dielectric layer can be by showing that at each dielectric layer plating thin metal layer is formed.The end view of the laminated body, capacitor formed by M dielectric layer is with reference to shown in figure 2A, and the vertical view referring again to the laminated body, capacitor shown in Fig. 2 B is visible, and the laminated body, capacitor of formation comprises left through hole and right through hole, for being connected with microstrip line 30.Concrete, because the filter unit 20 in the embodiment of the present invention is by imbedding the mode of substrate 10, therefore combine with reference to shown in figure 3, left through hole is used for the bottom pad in substrate 10 to import to top layer microstrip line 301, right through hole is used for being connected with microstrip line 302, to be connected to inductance element 201.Wherein, the dielectric constant of the dielectric layer of laminated body, capacitor is greater than a threshold value, M be more than or equal to 1 positive integer.
Specifically, dielectric layer is that high-k is directly proportional to the thickness of dielectric layer, namely dielectric constant is larger, corresponding dielectric layer is thinner, therefore the dielectric layer in the laminated body, capacitor in the embodiment of the present invention selects dielectric constant to be greater than the dielectric layer of a threshold value, and the laminated body, capacitor that can realize superposing achieves larger capacitance in very little area or space.And in specific implementation process, superpose the quantity of dielectric layer and the capacitance of the dielectric constant of every one dielectric layer required for the capacity cell 202 in actual microstripline filter select, and the quantity of dielectric layer and to select dielectric layer dawn known to those skilled in the art of which kind of dielectric constant, succinct in order to specification, is not described in detail in this.
Preferably, the material of microstrip line is left-handed materials, and left-handed materials is a kind of dielectric constant and magnetic permeability is the material of negative value simultaneously.Electromagnetic wave is when it is propagated, and wave vector k, relation between electric field E and magnetic field H meet Left Hand Rule, are therefore referred to as " left-handed materials ".It has unusual physical property such as negative phase velocity, negative index, ideal image, inverse Doppler frequency displacement, unusual Cerenkov radiation etc.
After the structure describing each element in filter unit 20, the filtering subelement formed based on each element of foregoing description is with reference to shown in figure 3, one end of microstrip line 301 is connected with the left through hole of capacity cell 202, and one end of microstrip line 302 is connected with the right through hole of capacity cell 202.Concrete, filter unit 20 can be a filtering subelement or multiple filtering subelement.If in specific implementation process, filter unit 20 is formed by multiple filtering subelement cascade as shown in Figure 3.Such as with reference to shown in figure 4, filter unit 20 is formed by the filtering subelement cascade in 3 Fig. 3, then the other end of microstrip line 301 is connected with the inductance element 201 of a upper filtering subelement, and the other end of microstrip line 302 is connected with the left through hole of next capacity cell 202.
In specific implementation process, other electronic components can also be comprised between multiple filtering subelement, such as, resistive element, also can give the filtering subelement shown in Fig. 3 and carry out other forms of cascade system with other electronic components, by selecting the number of cascade filtering subelement, the microstrip filter in the embodiment of the present invention has the effect that the logical band width of band regulates arbitrarily.
Technical scheme in the embodiment of the present invention, at least has following technique effect:
Owing to have employed a substrate, the inductance element that filter unit is comprised, capacity cell, and the microstrip line connecting inductance element and capacity cell is imbedded in substrate, thus do not need to be arranged on surface, thus the volume of microstripline filter can be reduced.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (5)
1. a microstrip filter, is characterized in that, comprising:
One substrate;
Filter unit, imbed in described substrate, described filter unit comprises inductance element and capacity cell, and connects the microstrip line of described inductance element and described capacity cell.
2. microstrip filter as claimed in claim 1, it is characterized in that, described filter unit comprises:
Multiple filtering subelement;
Described microstrip line, also for connecting described multiple filtering subelement.
3. microstrip filter as claimed in claim 1 or 2, it is characterized in that, described capacity cell is specially:
Laminated body, capacitor, described laminated body, capacitor comprises M dielectric layer, and a described M dielectric layer is in parallel by the metal level between two-layer described dielectric layer, and wherein, the dielectric constant of described dielectric layer is greater than a threshold value, M be more than or equal to 1 positive integer.
4. microstrip filter as claimed in claim 1 or 2, it is characterized in that, described inductance element is specially: magnetic core wire-wound inductor, or labeling inductance.
5. microstrip filter as claimed in claim 1 or 2, it is characterized in that, the material of described microstrip line is left-handed materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410453000.7A CN104241745B (en) | 2014-09-05 | 2014-09-05 | A kind of microstrip filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410453000.7A CN104241745B (en) | 2014-09-05 | 2014-09-05 | A kind of microstrip filter |
Publications (2)
| Publication Number | Publication Date |
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| CN104241745A true CN104241745A (en) | 2014-12-24 |
| CN104241745B CN104241745B (en) | 2017-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410453000.7A Active CN104241745B (en) | 2014-09-05 | 2014-09-05 | A kind of microstrip filter |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000939A1 (en) * | 2016-06-30 | 2018-01-04 | 深圳市九洲电器有限公司 | Filter and electronic device |
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| CN1874053A (en) * | 2006-06-08 | 2006-12-06 | 上海交通大学 | Miniaturized band-pass filter with harmonic suppression for loading fan-shaped offset of microstrip |
| CN101246983A (en) * | 2008-03-17 | 2008-08-20 | 南京大学 | Ultra-wideband filter based on simplified left hand transmission line structure |
| CN101582329A (en) * | 2008-05-14 | 2009-11-18 | 株式会社村田制作所 | Ceramic electronic component, method of manufacturing the same and collective component |
| CN101615712A (en) * | 2009-07-31 | 2009-12-30 | 深圳先进技术研究院 | Resonator and band pass filter |
| CN101978800A (en) * | 2008-03-24 | 2011-02-16 | 日本特殊陶业株式会社 | Component-incorporating wiring board |
| US20150042415A1 (en) * | 2013-08-08 | 2015-02-12 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer Electronic Structures with Embedded Filters |
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| CN1465077A (en) * | 2001-04-27 | 2003-12-31 | 松下电器产业株式会社 | Production method for solid electrolytic capacitor |
| CN1748448A (en) * | 2003-03-28 | 2006-03-15 | Tdk株式会社 | Multilayer substrate and method for producing same |
| CN1874053A (en) * | 2006-06-08 | 2006-12-06 | 上海交通大学 | Miniaturized band-pass filter with harmonic suppression for loading fan-shaped offset of microstrip |
| CN101246983A (en) * | 2008-03-17 | 2008-08-20 | 南京大学 | Ultra-wideband filter based on simplified left hand transmission line structure |
| CN101978800A (en) * | 2008-03-24 | 2011-02-16 | 日本特殊陶业株式会社 | Component-incorporating wiring board |
| CN101582329A (en) * | 2008-05-14 | 2009-11-18 | 株式会社村田制作所 | Ceramic electronic component, method of manufacturing the same and collective component |
| CN101615712A (en) * | 2009-07-31 | 2009-12-30 | 深圳先进技术研究院 | Resonator and band pass filter |
| US20150042415A1 (en) * | 2013-08-08 | 2015-02-12 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer Electronic Structures with Embedded Filters |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000939A1 (en) * | 2016-06-30 | 2018-01-04 | 深圳市九洲电器有限公司 | Filter and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104241745B (en) | 2017-12-01 |
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Effective date of registration: 20190430 Address after: 214135 China Sensor Network International Innovation Park D1, 200 Linghu Avenue, Wuxi New District, Jiangsu Province Patentee after: National Center for Advanced Packaging Co., Ltd. Address before: No. 3, North Tu Cheng West Road, Chaoyang District, Beijing Co-patentee before: National Center for Advanced Packaging Co., Ltd. Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |
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