CN104241457A - Fluorescent powder coating method capable of accurately controlling coating area - Google Patents
Fluorescent powder coating method capable of accurately controlling coating area Download PDFInfo
- Publication number
- CN104241457A CN104241457A CN201310244378.1A CN201310244378A CN104241457A CN 104241457 A CN104241457 A CN 104241457A CN 201310244378 A CN201310244378 A CN 201310244378A CN 104241457 A CN104241457 A CN 104241457A
- Authority
- CN
- China
- Prior art keywords
- wafer
- baffle
- led
- baffle plate
- spraying hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 title abstract description 6
- 238000000576 coating method Methods 0.000 title abstract description 5
- 239000011248 coating agent Substances 0.000 title abstract description 3
- 239000007921 spray Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000005507 spraying Methods 0.000 claims description 74
- 241000218202 Coptis Species 0.000 claims description 34
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 26
- 238000010422 painting Methods 0.000 claims description 16
- 239000000428 dust Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 229940098458 powder spray Drugs 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 59
- 239000003292 glue Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 239000000565 sealant Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a fluorescent powder coating method capable of accurately controlling the coating area. The method is suitable for LED powder spray processes and includes the following steps that an LED substrate is fixed; a first baffle used for avoiding a gold wire and a wafer is placed; a second baffle provided with a spray hole is placed on the first baffle, the second baffle is higher than the highest points of the gold wire and the wafer, the spray hole exactly faces the LED wafer, and the size and the shape of the spray hole are matched with those of the wafer; a powder spray head is adjusted so as to exactly face the spray hole and conduct spray operation. According to the method, the wafer is arranged under the spray hole and the shape and the size of the spray hole are matched with those of the wafer located under the spray hole, so that the spray area is accurately determined through the size of the spray hole, and spray evenness is effectively controlled through the shape design of the spray hole.
Description
Technical field
The present invention relates to LED spraying technology, be specially a kind of fluorescent material painting method of accurate control coated area.
Background technology
Current white light LEDs many employings blue light wafer adds fluorescent powder packaging and forms, and fluorescent material coating mainly comprises fluorescent glue dispensing technology and fluorescent powder jet printing technology.For the product not having bowl cup to carry fluorescent glue, basic employing fluorescent powder jet printing technology, but existing fluorescent powder jet printing can cover the whole substrate of LED product.Some can adopt simple baffle plate to carry out the empty avoiding protection of gold thread and wafer, and be pressed in LED-baseplate by this baffle plate, but substrate bare area is still very large, most of substrate still can be applied by fluorescent material.And there is certain gap due to the substrate of baffle plate and LED product, form a liquid fluorescent glue and can spread capillary channel to whole substrate, make that whole substrate all exists one deck fluorescent glue, the fluorescent adhesive layer formed by capillary channel can separate the external sealant of LED product and the bonding of substrate, causes external sealant to occur the bad phenomenon such as stripping, layering.Specifically, see Fig. 1, when spraying for the product not having bowl cup to carry fluorescent glue, be generally that its whole substrate is sprayed, to ensure that LED wafer 1a is all covered by fluorescent glue 3a.And bare area is comparatively large on substrate, easily intuitively clearly observing the uniformity etc. of spraying outward appearance, spraying when spraying, accomplishing the convenient spraying effect controlling wafer 1a.But convenient control fails to realize to reach the object effectively controlled in the prior art, and realistic situation is: such large area spraying is difficult to the uniformity effectively controlling spraying, and both wastes fluorescent material, follow-up fluid sealant also can be caused to bind not enough.Then, what have considers that spraying equipment easily knocks gold thread or crushing wafer in spraying process, for the object protecting gold thread and wafer, baffle plate 2 is set near gold thread, specifically baffle plate 2 is installed with and (certainly can also be located at other local in LED-baseplate, as long as the following empty avoiding object that will set forth can be reached), baffle plate is provided with opening, opening by the gold thread in LED-baseplate and wafer 1a outside exposed; The height that this baffle plate increases the LED-baseplate part near LED wafer and gold thread is set, makes because the barrier of baffle plate forms empty avoiding gap in spraying process, empty avoiding gold thread and wafer, protect them not by contacts such as spraying equipments or knock over.The mode of baffle plate is set compared to not baffled mode, spray area reduces to some extent, but still coverage rate is larger, easily cause spraying uneven, thus affect illumination effect, and there is capillary channel between baffle plate and substrate, fluorescent glue 3a is easy to infiltration and enters, and also easily causes seal defect and affects illumination effect.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art, provide a kind of fluorescent material painting method of accurate control coated area, its structure is simple, utilizes the combination of dual-layered baffle plate, has both protected gold thread and wafer, also effectively accurately control spray area.
The present invention is achieved in that a kind of fluorescent material painting method of accurate control coated area, comprises the following steps:
Fixed L ED substrate;
Place the first baffle plate being used for empty avoiding gold thread and wafer;
The second baffle being provided with spraying hole is placed on described first baffle plate, and make the height of described second baffle higher than the peak of gold thread and wafer, allow described spraying hole just to LED wafer, the described size and shape in spraying hole and the size and shape of wafer match;
Adjustment dust nozzle, allows dust nozzle just spray spraying hole.
The fluorescent material painting method of a kind of accurate control coated area provided by the invention, for the product not having bowl cup to carry fluorescent glue, adopt dual-layered baffle plate structure, and spraying hole is set, make spraying hole just to wafer to be sprayed, like this, while not damaging gold thread and wafer, accurately fluorescent glue spraying can be carried out by accurate spraying hole area.Specifically, the present invention places the first baffle plate before spraying, for empty avoiding gold thread and wafer.Because add the height that the first baffle plate is equivalent to the LED-baseplate part increased near gold thread, make because of the height of the first baffle plate and obstruct in spraying process, gold thread is not easily contacted or knocks over by spraying equipment etc. with wafer.Then on the first baffle plate, place second baffle, the first baffle plate supports second baffle, utilizes the empty avoiding object of the first baffle plate, forms the space can placing wafer between them.Height and the position of the first baffle plate and second baffle can be adjusted as the case may be, wafer is made to be located at immediately below spraying hole, the spraying shape in hole and size and immediately below wafer match, size thus by spraying hole accurately defines spray area, effectively controls spray uniformity by the profile design spraying hole.
Accompanying drawing explanation
Fig. 1 is the spraying effect figure that prior art contains baffle plate;
Fig. 2 is the spraying effect figure that the embodiment of the present invention provides;
Fig. 3 is the spray equipment figure that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The fluorescent material painting method of a kind of accurate control coated area that the embodiment of the present invention provides, comprises the following steps:
Fixed L ED substrate, completes the location of LED-baseplate;
Place the first baffle plate being used for empty avoiding gold thread and wafer, outside gold thread and wafer are exposed to, reached the object of protection gold thread and wafer by the height of the first baffle plate;
The second baffle being provided with spraying hole is placed on described first baffle plate, the height of described second baffle is higher than the peak of gold thread and wafer, like this, second baffle can be supported by the first baffle plate, location comparison is precisely stablized, and second baffle can not with gold thread and contact wafers, avoid gold thread or wafer damaging repercussions;
The effective area of spraying is wafer, and allow described spraying hole just to LED wafer, the described size and shape in spraying hole and the size and shape of wafer match.Spray hole accurately by the size of second baffle and can control spray area accurately and efficiently, spray the shape in hole and highly determine spray uniformity;
Adjustment dust nozzle, allows dust nozzle just spray spraying hole.Such could with spraying hole mating reaction, fluorescent material is accurately sprayed to target area.
Be described in detail below in conjunction with the fluorescent material painting method of accompanying drawing to a kind of accurate control coated area of the present invention.
See Fig. 2 and Fig. 3, the embodiment of the present invention provides the fluorescent material painting method accurately controlling coated area, comprises the following steps:
Fixed L ED substrate 5;
Place the first baffle plate 8 being used for empty avoiding gold thread 4 and wafer 1;
From the effect in spraying hole, it is through hole.On described first baffle plate, place the second baffle 7 being provided with spraying hole, second baffle 7 is supported.Simultaneously the height of described second baffle 7 is higher than the peak of gold thread 4 and wafer 1.Allow described spraying hole 6 just to LED wafer; the described size and shape in spraying hole 6 and the size and shape of wafer match, and object is to both protect gold thread and wafer, ensureing spraying effect again; according to existing wafer shape, the shape in spraying hole can be circle, square etc.
Adjustment dust nozzle, allows dust nozzle just spray spraying hole, could precisely be sprayed on wafer like this.
Furtherly, embodiment provided by the invention adopts dual-layered baffle plate structure in spraying process, and spraying hole is set, the described size and shape in spraying hole 6 and the size and shape of wafer match, spraying hole is made just to wafer to be sprayed during spraying, like this, while not damaging gold thread and wafer, accurately fluorescent glue 3 can be carried out by accurate spraying hole area to spray.
Further, when multiple wafer being sprayed, multiple LED-baseplate 5 is fixed on same LED microscope carrier simultaneously, and offers multiple described spraying hole 6 corresponding with the wafer in each LED-baseplate respectively at described second baffle.Preferred magnetic LED microscope carrier fixes LED-baseplate 5, because LED-baseplate 5 is generally metal material, can be adsorbed by magnetic material, guarantee to fix, also ensure that easy to use.
Same, the locate mode of described first baffle plate and second baffle 7 is preferably, pilot pin established by described magnetic LED microscope carrier, described first baffle plate 8 and second baffle 7 are metallic plate, first baffle plate and second baffle are offered location hole respectively that match with described pilot pin, location hole can be set at the periphery of the first baffle plate 8 and second baffle 7, the first baffle plate and second baffle is located by described pilot pin and location hole, like this, first baffle plate and second baffle can be fixed on LED microscope carrier by magnetic, structure is simple, and do not need other equipment for fixing, handled easily.
Particularly; before fixed L ED substrate 5; comprise the step of preparation first baffle plate and second baffle: on the first baffle plate, establish opening; opening is greater than wafer and the area coverage of gold thread in LED-baseplate; gold thread and wafer can not be contacted like this and outside they being exposed to; locate spraying for second baffle 7, play empty avoiding protective effect simultaneously.The thickness of the first baffle plate 8 is determined for the height of wafer and position, reaches set point and is as the criterion, prevent gold thread and wafer from striking the beam with the peak of gold thread 4 and wafer 1 to the distance of second baffle 7; On described second baffle, offer according to the size of wafer, shape and position the spraying hole matched with it, with this strictly control spray area and wafer by spray effect.According to existing LED wafer specification, second baffle and the uniform baffle plate of the first baffle plate preferred thickness, second baffle thickness can be 0.1-0.3mm, and the first baffle plate is 0.2-0.6mm.
Preferably, the shape in described spraying hole is identical with the shape on the surface to be sprayed of described wafer (namely identical with the shape of wafer orthographic drawing in the horizontal plane, in other words conj.or perhaps when spraying hole and wafer just to and from directly over spray time, the shape of the part wafer surface directly sprayed), and the area in described spraying hole is more than or equal to described surface area to be sprayed; When described spraying hole is just to described wafer, described spraying hole inward flange is equal with the level interval between described marginal surface to be sprayed and be less than or equal to 0.2mm, and preferred distance is 0.1-0.2mm.So accurately control spray area, ensure that wafer surface is all evenly coated with and be covered with fluorescent material, and substrate covered by fluorescent material without other regions except wafer, is conducive to sealant sealing, also ensure that product illumination effect and outward appearance good.
Particularly, before spraying, fluorescent material, toluene and silica gel are uniformly mixed into fluorescent glue 3, fluorescent glue is loaded duster, according to the actual conditions of producing, fluorescent glue composition and ratio can be adjusted.
During spraying, the peak of preferred gold thread and wafer is 0.1-0.5mm to the distance of described second baffle.Fluorescent material sprays into by spraying hole, and from top to bottom speed increases gradually, if LED wafer is from spraying pitch-row from too large, then the spraying rate of fluorescent material can be too large, causes surface and side spray to spray uneven or fluorescent material splash in LED-baseplate thus.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. accurately control a fluorescent material painting method for coated area, it is characterized in that, comprise the following steps:
Fixed L ED substrate;
Place the first baffle plate being used for empty avoiding gold thread and wafer;
The second baffle being provided with spraying hole is placed on described first baffle plate, and make the height of described second baffle higher than the peak of gold thread and wafer, allow described spraying hole just to LED wafer, the described size and shape in spraying hole and the size and shape of wafer match;
Adjustment dust nozzle, allows dust nozzle just spray spraying hole.
2. the fluorescent material painting method accurately controlling coated area as claimed in claim 1, it is characterized in that, when multiple wafer being sprayed simultaneously, multiple LED-baseplate is fixed on same LED microscope carrier, and offers multiple described spraying hole corresponding with the wafer in each LED-baseplate respectively at described second baffle.
3. the fluorescent material painting method accurately controlling coated area as claimed in claim 1 or 2, it is characterized in that, the fixed form of described LED-baseplate is LED-baseplate is placed in magnetic LED microscope carrier.
4. the fluorescent material painting method accurately controlling coated area as claimed in claim 3, it is characterized in that, the locate mode of described first baffle plate and second baffle is, pilot pin established by described magnetic LED microscope carrier, described first baffle plate and second baffle are metallic plate, first baffle plate and second baffle are offered location hole respectively that match with described pilot pin, locates the first baffle plate and second baffle by described pilot pin and location hole.
5. the fluorescent material painting method accurately controlling coated area as claimed in claim 1, it is characterized in that, before fixed L ED substrate, prepare the first baffle plate and second baffle: on the first baffle plate, establish opening, opening is greater than wafer and the area coverage of gold thread in LED-baseplate, the thickness of the first baffle plate is determined for the height of wafer and position, reaches set point be as the criterion with the peak of gold thread and wafer to the distance of second baffle; On described second baffle, the spraying hole matched with it is offered according to the size of wafer, shape and position.
6. the fluorescent material painting method of the accurate control coated area as described in claim 1 or 2 or 5, it is characterized in that, the shape in described spraying hole is identical with the shape on the surface to be sprayed of described wafer, and the area in described spraying hole is more than or equal to described surface area to be sprayed; When described spraying hole is just to described wafer, described spraying hole inward flange is equal with the level interval between described marginal surface to be sprayed and be less than or equal to 0.2mm.
7. the fluorescent material painting method accurately controlling coated area as claimed in claim 6, it is characterized in that, the level interval between described spraying hole inward flange and described marginal surface to be sprayed is 0.1-0.2mm.
8. the as claimed in claim 1 fluorescent material painting method accurately controlling coated area, is characterized in that, during spraying, the peak of gold thread and wafer is 0.1-0.5mm to the distance of described second baffle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310244378.1A CN104241457B (en) | 2013-06-19 | 2013-06-19 | A kind of fluorescent material painting method of accurate control coated area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310244378.1A CN104241457B (en) | 2013-06-19 | 2013-06-19 | A kind of fluorescent material painting method of accurate control coated area |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104241457A true CN104241457A (en) | 2014-12-24 |
| CN104241457B CN104241457B (en) | 2017-10-31 |
Family
ID=52229194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310244378.1A Expired - Fee Related CN104241457B (en) | 2013-06-19 | 2013-06-19 | A kind of fluorescent material painting method of accurate control coated area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104241457B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108886889A (en) * | 2016-04-11 | 2018-11-23 | 松下知识产权经营株式会社 | Electronic component mounting apparatus and distributor |
| CN109473533A (en) * | 2018-11-30 | 2019-03-15 | 江苏欧密格光电科技股份有限公司 | A kind of LED support structure and LED packaging technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071832A (en) * | 2007-05-18 | 2007-11-14 | 厦门大学 | Method for coating fluorescent powder for high-power white light-emitting diode |
| CN102120213A (en) * | 2011-01-10 | 2011-07-13 | 惠州市华阳多媒体电子有限公司 | LED fluorescent powder spraying process |
| CN202290496U (en) * | 2011-11-01 | 2012-07-04 | 厦门煜明光电有限公司 | Spraying equipment for light-emitting diode (LED) packaging |
| JP2012186319A (en) * | 2011-03-07 | 2012-09-27 | Konica Minolta Advanced Layers Inc | Light-emitting device manufacturing method |
| JP2012195522A (en) * | 2011-03-18 | 2012-10-11 | Konica Minolta Advanced Layers Inc | Manufacturing method of light-emitting device |
-
2013
- 2013-06-19 CN CN201310244378.1A patent/CN104241457B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071832A (en) * | 2007-05-18 | 2007-11-14 | 厦门大学 | Method for coating fluorescent powder for high-power white light-emitting diode |
| CN102120213A (en) * | 2011-01-10 | 2011-07-13 | 惠州市华阳多媒体电子有限公司 | LED fluorescent powder spraying process |
| JP2012186319A (en) * | 2011-03-07 | 2012-09-27 | Konica Minolta Advanced Layers Inc | Light-emitting device manufacturing method |
| JP2012195522A (en) * | 2011-03-18 | 2012-10-11 | Konica Minolta Advanced Layers Inc | Manufacturing method of light-emitting device |
| CN202290496U (en) * | 2011-11-01 | 2012-07-04 | 厦门煜明光电有限公司 | Spraying equipment for light-emitting diode (LED) packaging |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108886889A (en) * | 2016-04-11 | 2018-11-23 | 松下知识产权经营株式会社 | Electronic component mounting apparatus and distributor |
| US10653051B2 (en) | 2016-04-11 | 2020-05-12 | Panasonic Intellectual Property Management Co., Ltd. | Electronic component mounting device and dispenser |
| CN108886889B (en) * | 2016-04-11 | 2021-02-09 | 松下知识产权经营株式会社 | Electronic component mounting device and dispenser |
| CN109473533A (en) * | 2018-11-30 | 2019-03-15 | 江苏欧密格光电科技股份有限公司 | A kind of LED support structure and LED packaging technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104241457B (en) | 2017-10-31 |
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Granted publication date: 20171031 Termination date: 20180619 |