CN107460437A - The preparation method of metal mask plate, package assembling and OLED display screen - Google Patents
The preparation method of metal mask plate, package assembling and OLED display screen Download PDFInfo
- Publication number
- CN107460437A CN107460437A CN201710805050.0A CN201710805050A CN107460437A CN 107460437 A CN107460437 A CN 107460437A CN 201710805050 A CN201710805050 A CN 201710805050A CN 107460437 A CN107460437 A CN 107460437A
- Authority
- CN
- China
- Prior art keywords
- metal mask
- mask plate
- groove
- substrate
- interval body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention discloses the preparation method of a kind of metal mask plate, package assembling and OLED display screen, the metal mask plate is used for and substrate fitting, the substrate includes the interval body being arranged on binding face, and the binding face of the metal mask plate is provided with groove, and the groove houses the interval body.The metal mask plate of the present invention be bonded with substrates into intimate, eliminates the gap that the interval body of substrate is brought, so as to reduce the region that plated film extends out, pixel is interregional after reduction film forming interfere caused by colour mixture incidence, raising product quality.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of metal mask plate, package assembling and OLED display screen
Preparation method.
Background technology
With the rapid development of Display Technique, flat-panel monitor is widely used to every field.At present, organic electroluminescence is sent out
Optical device (Organic Light Emitting Diode, OLED) is with its self-luminous, all solid state, high-contrast, flexible etc.
Advantage, turn into most potential New Type Display Devices.
The preparation generally use vacuum vapour deposition of OLED products, plating material is heated in a vacuum, evaporated, makes what is be evaporated
Atom or atomic radical separate out on the relatively low substrate of temperature forms film, the quality of the stability of evaporation process to quality of forming film
Have a great impact.In order to realize that colorization is shown, material corresponding to red, green, blue three primary colours is deposited respectively in pixel region, leads to
Pixel region is defined frequently with mask means, i.e., one layer of very thin metal mask plate, organic material of evaporation are set above substrate
Material is deposited on substrate by the opening of mask plate, so as to define pixel region.So during evaporation, metal mask plate
Opening it is corresponding with the position of pixel region, do not allow the skew in the error range, otherwise occur two kinds of hairs
, there is mixed color phenomenon in the situation that luminescent material coincides together.Existing substrate typically all includes interval body, is refering to Fig. 1, Fig. 1
The cross-sectional view of the embodiment of substrate one, substrate 10 include interval body 101, on the one hand in encapsulation process, ensureing
Support encapsulation cover plate identical with the spacing of substrate；On the other hand the relative shifting between metal mask plate and substrate during aligning is prevented
It is dynamic to scratch substrate.The side that prior art metal mask plate is bonded with substrate is plane, due to the presence of substrate interval body, metal
There is larger gap in mask plate, and the tightness degree after being bonded directly affects what actual film forming area extended out after being bonded with substrate
Degree.Refering to Fig. 2, Fig. 2 is the cross-sectional view of the embodiment after prior art metal mask plate is bonded with substrate,
There is gap 201 in metal mask plate, when the direction of arrow X shown in Coating Materials along Fig. 2 is covered by metal after being bonded with substrate
After the opening 202 of diaphragm plate, because the presence in gap 201 causes Coating Materials to extend out to the coating film area corresponding to opening 202
Other regions, actual film-forming region 203 as shown in Figure 2, the horizontal stroke of the lateral dimension b of actual film-forming region 203 than opening 202
It is big to size a, so that pixel film forming area is extended to adjacent pixel and produces colour mixture, influence product quality.
The content of the invention
The present invention solves the technical problem of the system for providing a kind of metal mask plate, package assembling and OLED display screen
Preparation Method, the incidence of colour mixture between pixel region can be reduced, improve product quality.
In order to solve the above technical problems, first technical scheme that the present invention uses is：A kind of metal mask plate is provided, used
It is bonded in substrate, the substrate includes the interval body being arranged on binding face, and the binding face of the metal mask plate is provided with recessed
Groove, the groove house the interval body.
In order to solve the above technical problems, second technical scheme that the present invention uses is：A kind of system of package assembling is provided
Preparation Method, the package assembling is prepared using any described metal mask plate of the present invention.
In order to solve the above technical problems, the 3rd technical scheme that the present invention uses is：A kind of OLED display screen is provided
Preparation method, the OLED display screen include package assembling, described to prepare using any described metal mask plate of the present invention
Package assembling.
The beneficial effects of the invention are as follows：The present invention designs groove in the binding face of metal mask plate, when substrate and metal are covered
After diaphragm plate contact fitting completely, the groove of metal mask plate houses the interval body of substrate, is pasted with eliminating substrate with metal mask plate
Caused gap during conjunction.Metal mask plate of the present invention is bonded with substrates into intimate, effectively eliminates the gap that interval body is brought,
So as to reduce the region that plated film extends out, reduce after film forming that pixel is interregional and interfere caused by colour mixture incidence, improve
Product quality.
Brief description of the drawings
Fig. 1 is the cross-sectional view of the embodiment of prior art substrate one；
Fig. 2 is the cross-sectional view of the embodiment after prior art metal mask plate is bonded with substrate；
Fig. 3 is the cross-sectional view of the embodiment of metal mask plate one of the present invention；
Fig. 4 is the cross-sectional view of the embodiment after metal mask plate of the present invention is bonded with substrate.
Embodiment
The present invention provides the preparation method of a kind of metal mask plate, package assembling and OLED display screen, to make the present invention's
Purpose, technical scheme and technique effect definitely, it is clear, the present invention is described in more detail below, it should be understood that herein
Described specific implementation regulations are only used for explaining the present invention, are not intended to limit the present invention.
The present invention provides a kind of metal mask plate, and the metal mask plate includes mask pattern and is arranged on the recessed of binding face
Groove.In a wherein embodiment, the metal mask plate is used to be bonded with substrate, in vacuum vapour deposition as underlay substrate
Mask plate.Wherein, mask pattern is used for the pixel region for defining substrate, specifically, the organic material evaporated in vacuum vapour deposition
Material is deposited on substrate by the mask pattern of mask plate, so as to define pixel region.In general, substrate includes being arranged on patch
Interval body on conjunction face, wherein it can also be cylinder that the interval body, which can be spherosome,.
For the mask plate of clear explanation present embodiment, illustrated so that the interval body of substrate is cylinder as an example.Ginseng
Fig. 3 is read, Fig. 3 is the cross-sectional view of the embodiment of metal mask plate one of the present invention.In the present embodiment, metal mask
Plate 30 includes groove 301 and mask pattern 302, and groove 301 is arranged on binding face.Wherein, groove 301 and mask pattern 302
Number and location can be designed according to actual conditions, be not specifically limited herein.The metal mask plate 30 is made in vacuum vapour deposition
For the mask plate of substrate, for being bonded with substrate, the pixel region of substrate is defined by the mask pattern 302 of metal mask plate 30
Domain.Mask pattern 30 can be circular, polygon or other irregular shapes, can be designed according to actual conditions, do not done herein
It is specific to limit.
With reference to Fig. 1 and Fig. 3, substrate 10 includes the interval body 101 being arranged on binding face, wherein, substrate 10 includes TFT
(Thin Film Transistor, thin film transistor (TFT)) substrate, is not specifically limited herein.Wherein, groove 301 is covered positioned at metal
The binding face of diaphragm plate 30, when the pixel region of substrate is defined using vacuum vapour deposition, metal mask plate 30 passes through binding face and base
The contact fitting of plate 10.After metal mask plate 30 contacts fitting completely with substrate 10, the groove 301 of metal mask plate 30 houses base
The interval body 101 of plate 10, to eliminate caused gap when substrate 10 is bonded with metal mask plate 30, make metal mask plate 30
Mask pattern 302 is brought into close contact with substrate 10, so as to effectively prevent the plating material evaporated during evaporation from passing through metal mask plate
30 caused interstitial diffusions when being bonded with substrate 10 are to other regions.
In order to more intuitively illustrate by way of metal mask plate defines the pixel region of substrate, it is refering to Fig. 4, Fig. 4
Metal mask plate of the present invention be bonded with substrate after an embodiment cross-sectional view.The metal mask of present embodiment
Plate is bonded with substrates into intimate, and when defining pixel region using vapour deposition method, the plating material of evaporation passes through figure along the signified directions of arrow Y
The opening that mask pattern 401 shown in 4 is formed is deposited on the position of mask pattern 401, so as to form pixel region, such as Fig. 4 institutes
The actual film-forming region 402 shown.Here, it should be noted that specific restriction, arrow Y institutes are not done in the direction of plating material deposition
The direction of finger is one of embodiment.The lateral dimension of actual film-forming region 402 and the horizontal chi of mask pattern 401
Very little size is almost the same, can reduce the region that plated film extends out to greatest extent, reduces the interregional phase of pixel after film forming
The mutually incidence of colour mixture caused by interference, improves product quality.
In the present embodiment, in order to ensure that the groove 301 of metal mask plate 30 can house the interval body of substrate 10
101, the size of groove 301 is bigger than the size of interval body 101.In a wherein embodiment, meeting the chi of groove 301
On the premise of the very little size than interval body 101 is big, the size of groove 301 must be controlled in certain range of tolerable variance, so as to keep away
Exempt to occur interval body 101 and the movement of relative position is done in groove 301 so that mask pattern 302 and substrate produce deviation when aligning
Situation.It is preferred that when interval body 101 is embedded into groove 30 just, can effectively eliminate between interval body 101 brings
Gap, so as to reduce the region that plated film extends out to greatest extent.In a specific embodiment, in order that interval body 101 is more
Quickly and easily it is embedded into groove 301, while makes the insertion combination of groove 301 of interval body 101 closer, the chi of groove 301
The size of very little interval body 101 is big 3 μm -5 μm.The size of groove 301 can design as the case may be, not do specific limit herein
It is fixed.
In other embodiments, to be multiple, position is evenly arranged number of recesses, and the quantity of interval body and position with it is recessed
The quantity of groove and position correspond, so that it is guaranteed that more solid and reliable fitting.Alternatively, the groove of metal mask plate can be with
It can also be blind hole for through hole, can as the case may be design, be not specifically limited herein.
With continued reference to Fig. 3 and Fig. 1, in present embodiment, lead to overetched technology on the binding face of metal mask plate 30
Prepare the one-to-one groove 301 of interval body 101 with substrate 10.By the shape of exposure imaging technical definition groove 301 and
Position, then groove 301 is formed by etching technique.In a wherein embodiment, groove is prepared by dry etching technology
301, it is the materials such as free radical using gas molecule or its caused ion specifically, to passing through exposure on metal mask plate 30
The material covered on the groove 301 of photodevelopment technical definition carries out physically hitting sputter to remove the material of required etching part
Material.In another embodiment, groove 301 is prepared by wet etch techniques, specifically, using chemical solution, via chemistry
Reaction reaches the purpose of etching.Generally in wet etching reaction, the chemical solution of most-often used acid etching, such as hydrofluoric acid or nitre
Acid；Alkaline solution can also be used.It is generally desirable to specific etchant is selected according to the material of metal mask plate 30,
It is not specifically limited herein.
Prior art is different from, present embodiment designs groove in the binding face of metal mask plate, when substrate and metal are covered
After diaphragm plate contact fitting completely, the groove of metal mask plate houses the interval body of substrate, is pasted with eliminating substrate with metal mask plate
Caused gap during conjunction.Present embodiment metal mask plate is bonded with substrates into intimate, effectively eliminates what interval body was brought
Gap, so as to reduce the region that plated film extends out, reduce after film forming that pixel is interregional and interfere caused by colour mixture incidence,
Improve product quality.
In another particular embodiment of the invention, the substrate prepared using the metal mask plate of any of the above-described embodiment is led to
Cross encapsulation technology and form package assembling, such as increase packaging plastic and cap packaging technology flow, so as to which substrate be fixed
Sealing, plays a part of protective substrate.
Prior art is different from, present embodiment designs groove in the binding face of metal mask plate, when substrate and metal are covered
After diaphragm plate contact fitting completely, the groove of metal mask plate houses the interval body of substrate, is pasted with eliminating substrate with metal mask plate
Caused gap during conjunction.The metal mask plate of present embodiment is bonded with substrates into intimate, is effectively eliminated interval body and is brought
Gap, so as to reduce the region that plated film extends out, reduce after film forming that pixel is interregional and interfere caused by colour mixture generation
Rate, improve product quality.
In another specific embodiment, OLED display screen includes package assembling, can use any of the above-described implementation
The metal mask plate of mode prepares the package assembling.The different pixel regions of the OLED display screen prepared using preceding method
The situation that colour mixture occurs in domain is seldom, and display color is more homogeneous.In actual applications, the OLED display screen of present embodiment is often made
For the display screen of intelligent television, smart mobile phone and tablet personal computer.
Prior art is different from, is mixed between the pixel region of the OLED display screen prepared by the preparation method of present embodiment
The incidence of color is smaller, and the display color of display screen is more homogeneous, improves product quality.
Embodiments of the present invention are the foregoing is only, not thereby limit the scope of patent protection of the present invention, every profit
The equivalent structure or equivalent flow conversion made with description of the invention and accompanying drawing content, or directly or indirectly it is used in other phases
The technical field of pass, is included within the scope of the present invention.
Claims (10)
1. a kind of metal mask plate, for being bonded with substrate, the substrate includes the interval body being arranged on binding face, its feature
It is, the binding face of the metal mask plate is provided with groove, and the groove houses the interval body.
2. metal mask plate according to claim 1, it is characterised in that chi of the size of the groove than the interval body
It is very little big.
3. metal mask plate according to claim 1, it is characterised in that chi of the size of the groove than the interval body
It is very little big 3 μm -5 μm.
4. metal mask plate according to claim 1, it is characterised in that the quantity of the groove and position and the interval
The quantity of body and position correspond.
5. metal mask plate according to claim 1, it is characterised in that the groove is through hole.
6. metal mask plate according to claim 1, it is characterised in that the groove is blind hole.
7. metal mask plate according to claim 1, it is characterised in that the groove is prepared by etching technique.
8. metal mask plate according to claim 7, it is characterised in that the etching technique includes dry ecthing and wet corrosion
Carve.
A kind of 9. preparation method of package assembling, it is characterised in that using any described metal mask plates of claim 1-8 come
Prepare the package assembling.
10. a kind of preparation method of OLED display screen, it is characterised in that the OLED display screen includes package assembling, using power
Profit requires any described metal mask plates of 1-8 to prepare the package assembling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710805050.0A CN107460437A (en) | 2017-09-08 | 2017-09-08 | The preparation method of metal mask plate, package assembling and OLED display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710805050.0A CN107460437A (en) | 2017-09-08 | 2017-09-08 | The preparation method of metal mask plate, package assembling and OLED display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107460437A true CN107460437A (en) | 2017-12-12 |
Family
ID=60552068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710805050.0A Pending CN107460437A (en) | 2017-09-08 | 2017-09-08 | The preparation method of metal mask plate, package assembling and OLED display screen |
Country Status (1)
| Country | Link |
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| CN (1) | CN107460437A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107904554A (en) * | 2018-01-02 | 2018-04-13 | 京东方科技集团股份有限公司 | Mask plate and its manufacture method, mask assembly and evaporation coating device |
| CN108866479A (en) * | 2018-07-25 | 2018-11-23 | 京东方科技集团股份有限公司 | Mask plate and mask assembly |
| CN110911466A (en) * | 2019-11-29 | 2020-03-24 | 京东方科技集团股份有限公司 | Substrate and preparation method thereof, preparation method of mother board, mask and evaporation device |
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| US20020025406A1 (en) * | 2000-08-25 | 2002-02-28 | Nec Corporation | Metal mask structure and method for maufacturing thereof |
| CN202658217U (en) * | 2012-04-19 | 2013-01-09 | 彩虹（佛山）平板显示有限公司 | Mask plate for OLED (Organic Light Emitting Diode) evaporation |
| JP2014148758A (en) * | 2013-01-11 | 2014-08-21 | Dainippon Printing Co Ltd | Metal mask and metal mask manufacturing method |
| CN105714249A (en) * | 2016-04-19 | 2016-06-29 | 上海和辉光电有限公司 | Mask plate, evaporation device and evaporation method |
| CN106328831A (en) * | 2016-10-14 | 2017-01-11 | 京东方科技集团股份有限公司 | Laminating board, display panel, preparing method and display device thereof |
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2017
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020025406A1 (en) * | 2000-08-25 | 2002-02-28 | Nec Corporation | Metal mask structure and method for maufacturing thereof |
| CN202658217U (en) * | 2012-04-19 | 2013-01-09 | 彩虹（佛山）平板显示有限公司 | Mask plate for OLED (Organic Light Emitting Diode) evaporation |
| JP2014148758A (en) * | 2013-01-11 | 2014-08-21 | Dainippon Printing Co Ltd | Metal mask and metal mask manufacturing method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107904554A (en) * | 2018-01-02 | 2018-04-13 | 京东方科技集团股份有限公司 | Mask plate and its manufacture method, mask assembly and evaporation coating device |
| CN108866479A (en) * | 2018-07-25 | 2018-11-23 | 京东方科技集团股份有限公司 | Mask plate and mask assembly |
| CN110911466A (en) * | 2019-11-29 | 2020-03-24 | 京东方科技集团股份有限公司 | Substrate and preparation method thereof, preparation method of mother board, mask and evaporation device |
| US11462492B2 (en) | 2019-11-29 | 2022-10-04 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Substrate and method of manufacturing the same, method of manufacturing motherboard, mask and evaporation device |
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