CN104241444B - Solar battery main grid mask plate - Google Patents
Solar battery main grid mask plate Download PDFInfo
- Publication number
- CN104241444B CN104241444B CN201410334883.XA CN201410334883A CN104241444B CN 104241444 B CN104241444 B CN 104241444B CN 201410334883 A CN201410334883 A CN 201410334883A CN 104241444 B CN104241444 B CN 104241444B
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- mask
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- bar
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- 239000000463 material Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 208000005189 Embolism Diseases 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- HDERJYVLTPVNRI-UHFFFAOYSA-N ethene;ethenyl acetate Chemical compound C=C.CC(=O)OC=C HDERJYVLTPVNRI-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
A solar battery main grid mask plate is composed of bolts (200), a base plate (201), a cover plate (202) and mask strips (203). The solar battery main grid mask plate is horizontally arranged. The base plate (201) is arranged at the lower portion. The cover plate (202) is arranged on the base plate (201). The mask strips (203) are arranged inside the middle area on the cover plate (202). The number of the mask strips (203) is equal to that of main grids needed when a solar battery forms a mask. Base plate latch holes and cover plate latch holes are symmetrically distributed in the sides of the base plate (201) and the cover plate (202) in the same direction. The bolts (200) are adopted for fixing the base plate and the cover plate through the base plate latch holes and the cover plate latch holes, so that the solar battery main grid mask plate forms a hinge structure capable of being opened and closed freely.
Description
Technical field
It is more particularly to a kind of that the main grid of mask is covered to be realized to main grid area the present invention relates to a kind of equipment for preparing solar cell
Film version.
Background technology
If using spraying method cvd silicon oxide organic solution on the preceding surface of conventional solar cell, after annealing decomposing shape
Into silicon oxide film, make preceding surface that there is the structure of " silica/silicon nitride " double antireflective coatings, conversion effect can not only be improved
Rate, and the solar cell with anti-PID effects (potential induced degradation) can be prepared.But it is this
Processing method can cause solar cell main grid to be oxidized silicon parcel and cannot weld, as obstacle prepared by component.Accordingly, it would be desirable to
Enter line mask, it is to avoid main grid area cvd silicon oxide.
At present, realizing the mode of solar cell main grid mask generally has photoetching process, laser method and screen mask version mode.Its
In photolithographic process it is complicated, expensive, improve preparation difficulty, production cost and the production cycle of solar cell, and relate to
And multiple wet-chemical cleaning, cross pollution is easily caused, reduce solar cell conversion efficiency；And laser method process is due to part
High temperature causes solar cell to melt damage, improves surface recombination rate, reduces solar cell conversion efficiency.Screen mask version has to be made
With convenient, advantage simple to operate, receive much concern and favor in solar cell production process.
In solar cell production, screen mask version is using polyester net or stainless (steel) wire or composite web, stretching
It is tight on stainless steel frame or aluminium frame, then needed the mode in online coating photoresists to make according to pattern.Using
This screen mask version is when realizing mask, it is necessary to thing to be deposited could be attached into solar-cell timepiece under the conditions of certain pressure
Face, thus this screen mask version typically supported the use with printing technology.Region without coating photoresists, uses process
In, thing to be deposited from mesh seepage and is attached to solar battery surface under pressure；It is coated with the region of photoresists, mesh
Blocked by photoresists, thing to be deposited cannot be passed through, so as to realize main grid mask purpose.
Fig. 1 is screen mask plate schematic diagram.As shown in figure 1, stainless (steel) wire 101 is tight on screen frame, according to figure need
Will, it would be desirable to the upper photoresists 102 of place coating of mask.When use, in the region without coating photoresists 102, wait to sink
Product thing is passed through from the porose area of stainless (steel) wire 101 and is attached to the surface of substrate 103 under pressure；It is being coated with photoresists 102
Region, thing to be deposited stopped and cannot be deposited on the surface of substrate 103 by photoresists 102.This screen mask version was being used
Cheng Zhonghui is deformed upon, and tension force is gradually reduced, so as to reduce masking effect.In order to slow down tension decay, Chinese patent
201110436112.8 make screen mask version using laser cutting.Although this improved screen mask version can effectively subtract
Few deformation, improves mask plate tension force, but the method for laser burns or machine cuts is with high costs, the mask for being processed
The pattern edge of version is coarse to be serrated, and the near zone of pattern edge becomes due to the reason that laser burns or apparatus are ground
Obtain rugged and rough or be attached with the particle being not easily cleaned, be not only unable to reach good masking effect, but also can cause too
Positive electricity pond fragment, improves manufacturing cost.
Additionally, screen mask version also has following deficiency：(1) thicknesses of layers using screen mask version preparation is too big, holds
Film layer is easily caused to absorbing incident light, suppresses the amplitude of solar cell conversion efficiency lifting, or even solar cell conversion can be reduced
Efficiency.(2) screen mask version requires that thing to be deposited has viscosity higher, if thing to be deposited is by water or organic solvent
The solution of (such as alcohol, isopropanol) preparation, because solution has very strong mobility, the solution of deposition will be towards main grid region
Flow, flood main grid, it is impossible to reach masking effect.
Accordingly, for the technical process that strong fluidity substance is deposited in solar battery surface, design, invention it is a kind of it is simple,
Main grid mask plate that is convenient, easily making is key point.
The content of the invention
The purpose of the present invention is to overcome the shortcoming of above-mentioned laser-mask, photo etched mask and screen mask version with not enough, proposition
A kind of simple structure, the solar cell main grid mask plate of cheap, easy making.Using the present invention to the main grid of solar cell
Enter line mask, do not result in pollution, without carrying out the post processing such as wet-chemical cleaning or etching to the solar cell after mask,
Implementation is succinct, convenient, process is simple.It is further an advantage of the invention that, can be to main grid during liquid deposition
Effectively protected, it is to avoid components welding problem occur, and main grid mask plate of the invention being capable of Reusability, material therefor
It is cheap and be unlikely to deform, it is ensured that the control of production cost.
To achieve the above object, the present invention uses following technical scheme.
A kind of solar cell main grid mask plate of the present invention uses the leaf hinge structure of free-open-close, by embolus, base plate, lid
Plate and mask strip are constituted, horizontal positioned.Wherein base plate is located at lower section, and cover plate is located above the base plate.Base plate and cover plate are same
The side in direction has base plate latch aperture and cover plate latch aperture, and base plate latch aperture and cover plate latch aperture are arranged symmetrically.Embolus passes through base plate
Latch aperture and the connection of cover plate latch aperture and fixed base plate and cover plate, constitute can free-open-close loose-leaf system hinge arrangement.Described mask
Bar is arranged on the zone line on the cover plate.
The base plate is made up of support plate and locating pin.Support plate upper surface forms smooth surface through polishing or polishing, is used for
Place solar cell piece, referred to as microscope carrier.Three locating pins are disposed with the microscope carrier, three locating pins are triangularly arranged.
Locating pin is higher by 80~500 microns of microscope carrier, to position solar cell piece.There is recess the centre of the support plate side, the recess
It is base plate recess.A base plate latch aperture is respectively arranged symmetrically in the both sides of base plate recess.
The making material of the base plate is the hard material for being not susceptible to deformation, can be stainless steel, or aluminium alloy, also
The rigid plastics of metallic element, such as PP materials, or PVDF material or PTFE material, or carborundum material can be free from
Material.
The cover plate is made up of top cover and cover plate mask layer, and the zone line of top cover is the top cover middle opening of square aperture
In area, the connection strap for having the rectangle strip of parallel arrangement in top cover middle opening area, the length of the connection strap and the top cover
Between open region length it is identical.The quantity of connection strap is identical with the solar cell main grid quantity for realizing mask is needed, and connection strap is
Bar is covered in solar cell main grid mask plate mask strip.Square open area periphery is configured with " L " shape in the middle of the top cover
The cap recess of structure, the width of cap recess is more than 10mm.The side of top cover is the semi-cylindrical hill with certain radian
Top cover plush copper, be arranged symmetrically two cover plate latch aperture in top cover plush copper both sides.It is described on the top cover plush copper insertion support plate
Base plate indent, the base plate latch aperture that both sides are arranged symmetrically overlaps with the center line of cover plate latch aperture, and the embolus insertion is arranged symmetrically
Base plate latch aperture and cover plate latch aperture, fixed base plate and cover plate, constitute can free-open-close leaf hinge structure.
The making material of the top cover is the hard material for being not susceptible to deformation, can select stainless steel, also be can select
Aluminum alloy material, also can select the rigid plastics without any metallic element, such as PP materials, or PVDF material or PTFE materials
Material.
Described cover plate mask layer is fixed and is pasted onto on the cap recess of top cover, and cap recess is L-shaped.The cover plate mask
The zone line of layer is also a hatch frame, and the area in cover plate mask layer middle opening area is than needing to realize the solar cell of mask
Area is slightly larger：Major more than the 1mm of length and width；The area of open area is more smaller than the area in top cover middle opening area：Length and width is each small
More than 1mm, to realize the good mask to main grid.There is the rectangle strip of parallel arrangement in the cover plate mask layer middle opening area
Connection strap, the length of the connection strap is identical with the length in cover plate mask layer middle opening area.The centre of the cover plate mask layer
Connection strap quantity and the solar cell of open area need the main grid quantity for realizing mask identical.The cover plate mask layer middle opening
The end at area connection strap two ends gradually broadens, triangular in shape, to improve the pulling force that connection strap can bear, reduces and even avoids shape
Become, bar is covered under solar cell main grid mask plate mask strip.The position of the connection strap in cover plate mask layer middle opening area and top
The position correspondence of the connection strap in lid middle opening area, after cover plate mask layer is pasted onto the cap recess area, cover plate mask layer
The connection strap in middle opening area is just overlap with the connection strap in top cover middle opening area.Cover plate mask layer selects soft-touch, easily
Made in the material of laminating, such as ethene-vinyl acetate EVA material.
The mask strip of solar cell main grid mask plate of the present invention covered from above bar and under cover bar and constitute, wherein under cover bar and be located at and cover
The lower section of film bar, is the connection strap in middle opening area on the cover plate mask layer.On to cover bar opened in the middle of the top cover on top cover
The connection strap of mouth region, in the top of mask strip.The width of bar is covered under described than needing the solar cell main grid of mask wide, is above covered
It is wide bar to be covered under bar ratio.In order to strengthen the effect of main grid mask plate, also for covering bar under protection, can it is upper cover bar and under cover bar between
Bar is covered during insertion is one or more, it is identical that its width at least covers bar with, but no more than above covering bar width.
The invention has the advantages that：
(1) present invention realizes mask suitable for solar cell research, preparation process in solar battery surface deposition solution,
Preventing solar module encapsulation main grid cannot weld；
(2) decoration structure features simple design of the present invention, it is cheap to prepare material price, simple to operate, is easily controlled, and need not carry out volume
Outer wet-cleaning, not only avoids possible pollution, and avoids using noxious material, it is ensured that effectively reduced while personal safety
Production cost；
(3) present invention is easy to use, it is easy to Industry Promotion.
Brief description of the drawings
Fig. 1 is conventional screen mask plate schematic diagram；
Fig. 2 is solar cell main grid mask plate front view of the present invention；
Fig. 3 is solar cell main grid mask plate left view of the present invention；
Fig. 4 is the base plate front view of solar cell main grid mask plate of the present invention；
Fig. 5 is the base plate left view of solar cell main grid mask plate of the present invention；
Fig. 6 is the cover plate front view of solar cell main grid mask plate of the present invention；
Fig. 7 is the top cover front view of solar cell main grid mask plate upper cover plate of the present invention；
Fig. 8 is the top cover A1-A1 ' sectional views of solar cell main grid mask plate upper cover plate of the present invention；
Fig. 9 is the top cover A2-A2 ' sectional views of solar cell main grid mask plate upper cover plate of the present invention；
Figure 10 is the top cover left view of solar cell main grid mask plate cover plate of the present invention；
Figure 11 is solar cell main grid mask plate cover plate A0-A0 ' sectional views of the present invention；
Figure 12 is the cover plate mask layer figure of solar cell main grid mask plate of the present invention；
Figure 13 is the mask strip front view of solar cell main grid mask plate of the present invention；
Figure 14 is the mask strip side view of solar cell main grid mask plate of the present invention；
Figure 15 is containing the mask strip side view that bar is covered on solar cell main grid mask plate of the present invention.
Specific embodiment
The present invention is further illustrated below in conjunction with the drawings and the specific embodiments.
Fig. 2, Fig. 3 show solar cell main grid mask plate of the present invention.The main grid mask plate of solar cell of the present invention is by bolt
Son 200, base plate 201, cover plate 202 and mask strip 203 are constituted.The solar cell main grid mask plate is pacified in horizontal positioned mode
Dress.Described base plate 201 is arranged below, and cover plate 202 is placed on above base plate 201, and embolus 200 is by base plate 201 and cover plate 202
Connection and fixed, constitute can free-open-close loose-leaf system hinge arrangement.The mask strip 203 is arranged on the cover plate 202
In zone line, quantity and the solar cell of the mask strip 203 need the main grid quantity for realizing mask identical.Fig. 2, Fig. 3 institute
The embodiment shown is for realizing three 156 × 156mm of main grid2The main grid mask of crystal-silicon solar cell, shown mask strip quantity
It is 3.
Fig. 4, Fig. 5 show described base plate 201.Described base plate 201 is made up of support plate 1-001 and locating pin 1-002.
The base plate 201 is allowed to based on support plate 1-001, the upper surface of support plate 1-001 by the way of polishing or fine polishing
Form surfacing and smooth microscope carrier 1-101.There is a base plate recess 1-102 centre of support plate 1-001 sides；It is recessed in base plate
The both sides of mouth 1-102 have been arranged symmetrically two base plate latch aperture 1-103.
Described locating pin 1-002 has three, triangular in shape to be distributed on described microscope carrier 1-101.Locating pin 1-002
For being accurately positioned to solar cell piece.Locating pin 1-002 is higher by the plane certain distance of microscope carrier 1-101.In order that positioning
While nail is realized being accurately positioned solar cell piece, it is ensured that the good masking effect of main grid mask plate, and mask is not resulted in
Version is damaged or substrate is damaged, and locating pin 1-002 is higher by 80~500 microns of microscope carrier 1-101 planes.
Fig. 6 show the cover plate 202 of solar cell main grid mask plate of the present invention.Cover plate 202 is covered by top cover 2-001 and cover plate
Film layer 2-002 is constituted, based on top cover 2-001.As shown in fig. 7, the zone line of top cover 2-001 is square aperture 2-101,
It is top cover middle opening area.Parallel arrangement has rectangle strip connection strap 3-001, the connection on top cover middle opening area 2-101
The length of bar is identical with the length of the top cover middle opening area 2-101, and quantity and the solar cell of connection strap 3-001 need to cover
The main grid quantity of film is identical, and the present embodiment is 3.The surrounding of top cover middle opening area 2-101 is provided with the groove 2- of L-shaped
102, it is top cover center recessed area.Fig. 8 show the A1-A1 ' schematic cross-sections of Fig. 7, and the A2-A2 ' that Fig. 9 is shown in Fig. 7 cuts
Face schematic diagram.There is the top cover plush copper 2-103 of an arc side of the top cover 2-001, as shown in Figure 10.In the top cover plush copper
The both sides of 2-103 are symmetrical arranged two cover plate latch aperture 2-104.Top cover plush copper 2-103 and base plate during installation on top cover 2-001
Base plate recess 1-102 correspondences on 201 are placed, and top cover plush copper 2-103 is placed in base plate recess 1-102 so that top cover plush copper
The center line of the cover plate latch aperture 2-104 of 2-103 both sides is mutual with the base plate latch aperture 1-103 center lines of base plate recess 1-102 both sides
Overlap, embolus 200 inserts the cover plate latch aperture 2-104 and base plate latch aperture 1-103 on both sides, the fixation base plate 201 and cover plate 202.
Figure 11 is A0-A0 ' schematic cross-sections in Fig. 6.As shown in figure 11, cover plate mask layer 2-002 is fixed and is pasted onto top cover
The top cover center recessed area 2-102 of the L-shaped of 2-001.As shown in figure 12, the middle opening area 2- of the cover plate mask layer 2-002
Connection strap 3-002 is distributed with 201, connection strap is rectangular bar, is arranged in parallel in cover plate mask layer middle opening area 2-201,
The length of the connection strap is identical with the length of cover plate mask layer middle opening area 2-201；The quantity of connection strap is needed with solar cell
Realize that the main grid quantity of mask is identical, the main grid quantity of the present embodiment is 3.Connection strap 3-002 is opened in the middle of cover plate mask layer
The distributing position of mouth region domain 2-201 is corresponding with the position of the connection strap 3-001 of top cover open central region 2-101 so that cover plate
The connection strap 3-002 of mask layer 2-002 and the overlapped placements of connection strap 3-001 of top cover.Opened in the middle of its cover plate mask layer
The connection strap 3-002 of mouth region is located at lower section, and the connection strap 3-001 in top cover middle opening area is above.The cover plate mask layer
Two ends at the connection strap 3-002 two ends in middle opening area gradually broaden, and triangle are formed, to further enhance cover plate
The maximum pull that mask layer middle opening area connection strap 3-002 can bear, reduces deformation degree.The cover plate mask layer 2-
002 making material should select the glued membrane with good fit performance, and what is selected in the present embodiment is ethene-vinyl acetate
(EVA)。
Solar cell main grid mask plate mask strip 203 of the present invention covered from above bar 3-001 and under cover bar 3-002 and constitute.As schemed
Shown in 13 and Figure 14, under cover the connection strap that bar 3-002 is the cover plate mask layer middle opening area 2-201, under cover bar 3-002's
The equal length of length and cover plate mask layer middle opening area 2-201；On to cover bar 3-001 be the top cover middle opening area 2-
101 connection strap, above covers the length of bar 3-001 and the equal length of top cover middle opening area 2-101.Under cover the width of bar 3-002
Degree 0.2~5mm bigger than the width of solar cell main grid, above covers bar 3-001 and relatively covers bar 3-002 1mm at least wide down.Mask strip 203
Quantity need that the main grid quantity for realizing mask is identical with solar cell, the present embodiment is 3.In order to further enhance solar cell
The using effect of main grid mask plate, can it is upper cover bar 3-001 and under cover bar 3-002 between insertion 1 or more than 1 in cover bar
3-003, as shown in figure 15.It is the plastic strip with certain toughness that bar 3-003 is covered in described, and the present embodiment is PVC plastic material strip.
In cover the width of bar at least to cover bar 3-002 with identical, or that bar 3-002 is covered than under is wide.In cover the Breadth Maximum of bar 3-003 not
More than the width for above covering bar 3-001.
When using, solar cell main grid mask plate horizontal positioned of the invention is installed, base plate 201 is under, and cover plate 202
Upper, the leaf hinge result of free-open-close is capable of in formation.Cover plate 202 is opened, then by 156 × 156mm2Crystalline silicon three is led
Grid solar cell piece is placed on the microscope carrier 1-101 of support plate 1-001, three positioning arranged by triangularity on base plate 201
Nail 1-002 is accurately positioned to solar cell piece, then gets togather cover plate 202.Now the solar cell main grid mask plate is covered
Film bar 203 is just covered on three main grids for being positioned solar cell, is realized to three maskings of main grid of solar cell, is covered
Lid, and other regions on solar cell piece surface are then completely exposed.Just liquid deposition can be carried out after cover plate 202 is covered.Now
Because solar cell main grid is covered by mask strip 203, solution mass cannot be deposited on main grid, so as to realize to solar cell master
The mask effect of gate region.
Claims (9)
1. a kind of solar cell main grid mask plate, it is characterised in that by embolus (200), base plate (201), cover plate (202) and mask
Bar (203) is constituted, horizontal positioned；Described base plate (201) is arranged below, and cover plate (202) is placed on base plate (201) above；
There are base plate latch aperture (1-103) and cover plate latch aperture (2-104), base plate door bolt in base plate (201) and cover plate (202) equidirectional side respectively
Hole (1-103) and cover plate latch aperture (2-104) are arranged symmetrically；Embolus (200) is by base plate latch aperture (1-103) and cover plate latch aperture (2-
104) connect and fixed base plate (201) and cover plate (202), be configured to the loose-leaf system hinge arrangement of free-open-close；The mask
Bar (203) is arranged in the zone line on the cover plate (202), and quantity and the solar cell of the mask strip (203) need
Realize that the main grid quantity of mask is identical；
The base plate (201) is made up of support plate (1-001) and locating pin (1-002)；The upper surface of the support plate (1-001) is load
Platform (1-101), the upper surface of support plate (1-001) is allowed to form surfacing and smooth microscope carrier by the way of fine polishing
(1-101)；
Described cover plate (202) is made up of top cover (2-001) and cover plate mask layer (2-002)；The zone line of top cover (2-001)
It is square top cover middle opening area (2-101), top cover middle opening area (2-101) surrounding is provided with the top cover middle concave of L-shaped
Groove area (2-102)；Cover plate mask layer (2-002) is pasted with the top cover center recessed area (2-102) of L-shaped.
2. solar cell main grid mask plate according to claim 1, it is characterised in that described support plate (1-001) side
The both sides that there is a base plate recess (1-102), base plate recess (1-102) centre have been arranged symmetrically two base plate latch aperture (1-103)；
Locating pin (1-002) described in three is triangular in shape to be distributed on described microscope carrier (1-101)；It is right that locating pin (1-002) is used for
The positioning of solar cell piece；Locating pin (1-002) is higher by the plane of microscope carrier (1-101).
3. solar cell main grid mask plate according to claim 1, it is characterised in that described cover plate (202) is in top cover
Between be arranged with connection strap (3-001) in parallel on open region (2-101), in the middle of the length and the top cover of the connection strap (3-001)
The equal length of open region (2-101)；The quantity of the connection strap is identical with the main grid quantity that solar cell needs mask；The top
Covering the side of (2-001) has the top cover plush copper (2-103) of an arc；It is symmetrical arranged in the both sides of the top cover plush copper (2-103)
Two cover plate latch aperture (2-104), top cover plush copper (2-103) during installation on top cover (2-001) is recessed with base plate on base plate (201)
Mouth (1-102) correspondence is placed, and top cover plush copper (2-103) is placed in base plate recess (1-102) so that top cover plush copper (2-103)
The center line weight of the center line of the cover plate latch aperture (2-104) of both sides and the base plate latch aperture (1-103) of base plate recess (1-102) both sides
Close, embolus (200) inserts the cover plate latch aperture (2-104) and base plate latch aperture (1-103) on both sides, the fixation base plate (201) and lid
Plate (202)；
Parallel arrangement has connection strap (3-002), the connection in the middle opening area (2-201) of the cover plate mask layer (2-002)
The length of bar (3-002) is identical with the length of the cover plate mask layer middle opening area (2-201), the quantity of the connection strap with too
Positive electricity pond needs the main grid quantity for realizing mask identical；The distribution position of the connection strap (3-002) in cover plate mask layer middle opening area
Put corresponding with the position of the connection strap (3-001) of top cover open central region (2-101) so that cover plate mask layer (2-002)
Connection strap (3-001) overlapped placement of connection strap (3-002) and top cover；The connection in its cover plate mask layer middle opening area
Bar (3-002) is located at lower section, and the connection strap (3-001) in top cover middle opening area is above；Opened in the middle of the cover plate mask layer
Two ends of the connection strap (3-002) of mouth region gradually broaden, and triangle are formed, to strengthen cover plate mask layer middle opening area
The pulling force that connection strap (3-002) is born, reduces deformation degree.
4. solar cell main grid mask plate according to claim 3, it is characterised in that opened in the middle of described cover plate mask layer
The length of mouth region (2-201) and each more than 1mm long and roomy than solar cell piece wide, and than the top cover middle opening area (2-
101) length and small at least 1mm wide.
5. solar cell main grid mask plate according to claim 3, it is characterised in that the cover plate mask layer middle opening
The connection strap (3-002) in area (2-201) covers bar under being, on the connection strap (3-001) of the top cover middle opening area (2-101) is
Cover bar；Under cover the width 0.2~5mm bigger than the width of solar cell main grid of bar (3-002), above cover bar (3-001) and relatively cover bar down
(3-002) 1mm at least wide；On cover bar (3-001) and under cover bar (3-002) constitute mask strip (203), the number of mask strip (203)
Amount needs the main grid quantity for realizing mask identical with solar cell.
6. solar cell main grid mask plate according to claim 5, it is characterised in that cover on described bar (3-001) with
Under cover insert between bar (3-002) in cover bar (3-003)；Bar (3-002) is covered under the width ratio that bar (3-003) is covered in described wide,
In cover the width of bar (3-003) and be no more than and above cover the width of bar (3-001).
7. solar cell main grid mask plate according to claim 6, it is characterised in that the system of bar (3-003) is covered in described
It is plastics as material.
8. solar cell main grid mask plate according to claim 3, it is characterised in that described top cover (2-001) is not from
Rust steel matter or aluminum alloy material or the rigid plastics without metallic element make；Cover plate mask layer (2-002) uses second
Alkene-vinyl acetate makes.
9. solar cell main grid mask plate according to claim 1, it is characterised in that described base plate (201) is from stainless
Steel matter or aluminum alloy material or the rigid plastics without metallic element make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410334883.XA CN104241444B (en) | 2014-07-15 | 2014-07-15 | Solar battery main grid mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410334883.XA CN104241444B (en) | 2014-07-15 | 2014-07-15 | Solar battery main grid mask plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104241444A CN104241444A (en) | 2014-12-24 |
| CN104241444B true CN104241444B (en) | 2017-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410334883.XA Expired - Fee Related CN104241444B (en) | 2014-07-15 | 2014-07-15 | Solar battery main grid mask plate |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101740487B1 (en) * | 2015-10-20 | 2017-05-29 | 삼성디스플레이 주식회사 | Mask tension welding device for thin film deposition |
| CN107785460A (en) * | 2017-11-23 | 2018-03-09 | 青海黄河上游水电开发有限责任公司光伏产业技术分公司 | A kind of mask plate for being used to prepare the heterojunction amorphous silicon layer of HIBC batteries |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102242336A (en) * | 2011-06-24 | 2011-11-16 | 清华大学 | Film preparation method for reducing stress of hard film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201864769U (en) * | 2010-04-19 | 2011-06-15 | 潘宇强 | Metal mask plate structure for evaporating color of organic light emitting diode (OLED) display panel |
| CN102251212A (en) * | 2011-06-13 | 2011-11-23 | 中国科学院长春光学精密机械与物理研究所 | High-power semiconductor laser array mask device |
| US8367556B1 (en) * | 2011-12-01 | 2013-02-05 | International Business Machines Corporation | Use of an organic planarizing mask for cutting a plurality of gate lines |
| CN103219430B (en) * | 2013-05-06 | 2015-09-23 | 天威新能源控股有限公司 | A kind of segmented mask pattern prepares SE battery methods |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102242336A (en) * | 2011-06-24 | 2011-11-16 | 清华大学 | Film preparation method for reducing stress of hard film |
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