CN104236178A - Refrigerating fluid splitter and refrigeration cycle device - Google Patents
Refrigerating fluid splitter and refrigeration cycle device Download PDFInfo
- Publication number
- CN104236178A CN104236178A CN201310496953.7A CN201310496953A CN104236178A CN 104236178 A CN104236178 A CN 104236178A CN 201310496953 A CN201310496953 A CN 201310496953A CN 104236178 A CN104236178 A CN 104236178A
- Authority
- CN
- China
- Prior art keywords
- pipe arrangement
- coolant flow
- section
- flow divider
- refrigerant pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Non-Disconnectible Joints And Screw-Threaded Joints (AREA)
- Branch Pipes, Bends, And The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a refrigerating fluid splitter and a refrigeration cycle device. The purpose is that stable brazing can be carried out without blocking of a splitting pipe and insufficient soldering flux inflow, and even if the refrigerating fluid splitter is exposed in a harsh surrounding environment, unfavorable conditions of leakage of gases from a connection position and the like will not happen. The refrigerating fluid splitter has pipe insertion sections for insertion and fixing of the splitting refrigerating fluid pipes and a splitter main body equipped with a plurality of pipe insertion sections in a protruding way. The pipe insertion section has a thick wall section with a thick wall and a thin wall section with a wall being thinner than the wall of the thick wall section.
Description
Technical field
The present invention relates to coolant flow divider and refrigerating circulatory device.
Background technology
In the past, there is following technology: the upstream side of the refrigerant path of the evaporimeter in kind of refrigeration cycle arranges coolant flow divider, and made the refrigerant flow homogenising in each path of inflow evaporimeter and make evaporating temperature keep certain.The gas-liquid two-phase cold-producing medium distributed by current divider is sent to each stream of evaporimeter, but when non-uniform distribution, in the stream of a part, become by incomplete the caused liquid backflow operating condition of the evaporation of cold-producing medium, the temperature being in the aluminum fin-stock of the many streams of internal circulating load reduces lower than the aluminum fin-stock of other streams, so produce the problems such as frosting is many.Therefore, the homogenising of refrigerant branches is important.
As prior art, Fig. 5 shows the cross section of coolant flow divider.In distributor in the past, the shape of insertion section as a whole in identical wall thickness of tapped refrigerant pipe arrangement.Current divider is preheated and after making it fully preheat, utilize welding rod to implement soldering to itself and refrigerant piping, now, the wall thickness due to the insertion section of current divider is in the past uniform, so pre-heating temperature is also roughly even utilizing welding gun.Fig. 5 shows excessive pre-warmed situation, and solder 19 arrives the lower end of the connecting portion of tapped refrigerant pipe arrangement, likely closes or the refrigerant flow path of partial closure's tapped refrigerant pipe arrangement.During closed refrigerant stream, the cold-producing medium of distribution does not flow to the refrigerant piping of a part.
Fig. 6 is similarly the sectional view of coolant flow divider in the past, but shows the situation preheating deficiency contrary to the abovely.Solder 19 only in the top flowing that current divider is connected with tapped refrigerant pipe arrangement, becomes the state not arriving lower end.Under such connecting state, because the microvibration of equipment or corrosive gas are to the attack of solder, exist refrigerant loop and outer conductance lead to and refrigerant gas to the possibility of atmospheric air leakage.
[prior art document]
[patent document]
[patent document 1] Japanese Unexamined Patent Publication 5-340649 publication
As mentioned above, when being welded to connect current divider and tapped refrigerant pipe arrangement, first, add heat shunt, fully after heating, make solder flow into coupling part, but during superheated, solder exceedingly flows into the gap of pipe arrangement and current divider, stream may occur and close.On the contrary, under the state not implementing heating fully, when solder flows into coupling part, do not have enough solders to soak into current divider and tapped refrigerant pipe arrangement, exist and cause engaging insufficient problem.
Summary of the invention
The present invention makes to solve the problem, and its objective is and provides a kind of coolant flow divider and refrigerating circulatory device, can not occur shunting the blocking of pipe arrangement or the inflow of solder implement stable soldering insufficiently.
Coolant flow divider of the present invention has the pipe arrangement insertion section of inserting and fixing tapped refrigerant pipe arrangement and protrudes the shunt body being provided with multiple described pipe arrangement insertion section, wherein, described pipe arrangement insertion section has the thinner wall section that described in the thick heavy section of wall thickness and wall ratio, heavy section is thin.
The effect of invention
According to coolant flow divider of the present invention, by making wall thickness tapped refrigerant pipe arrangement being inserted a part for the pipe arrangement insertion section of current divider thinning, thermal capacity diminishes, and when the heating of current divider, intensively can heat the thin-walled portion of wishing that solder flows into.In addition, about not wishing the position flowing into solder, because wall thickness sets thick, so compared with thinner wall section, thermal capacity is large, is difficult to be heated.Therefore, it is possible to make solder only flow into intensively by the thinner wall section heated.
Accompanying drawing explanation
Fig. 1 is the sectional view of the structure of the coolant flow divider representing embodiment.
Fig. 2 A is the top view of the coolant flow divider of embodiment.
Fig. 2 B is the top view of the coolant flow divider of embodiment.
Fig. 2 C is the top view of the coolant flow divider of embodiment.
Fig. 3 is the loop diagram of the refrigerating circulatory device of the coolant flow divider that have employed embodiment.
Fig. 4 is the sectional view of the soldering of the coolant flow divider representing embodiment.
Fig. 5 represents in coolant flow divider in the past, the sectional view of the state of soldering in overheat conditions.
Fig. 6 represents in coolant flow divider in the past, the sectional view of the state of soldering under underheat state.
Detailed description of the invention
Below, based on accompanying drawing, embodiments of the present invention are described.In addition, the present invention is not limited by the embodiment of following explanation.In addition, in figures in the following, the magnitude relationship of each component parts is sometimes different from actual conditions.
Embodiment
Fig. 1 is the sectional view of the structure of the coolant flow divider representing embodiments of the present invention.In addition, Fig. 2 A ~ Fig. 2 C is the top view from the unilateral observation coolant flow divider connecting tapped refrigerant pipe arrangement.
Coolant flow divider is roughly formed by shunt body 1 with for the jet pipe 3 of the shunting homogenising making cold-producing medium.Be provided with in shunt body 1 multiple with shunting with the pipe arrangement insertion section 2 that is connected of tapped refrigerant pipe arrangement 11.Pipe arrangement insertion section 2 offers the patchhole 12 inserted for tapped refrigerant pipe arrangement 11, and is formed with erecting from shunt body 1 with convex.In addition, the cylindrical shape in pipe arrangement insertion section 2, the heavy section 7 thick by wall thickness and the thin thinner wall section 5 of wall thickness are formed.Heavy section 7 is arranged in shunt body 1 projectedly, and thinner wall section 5 is arranged with heavy section 7 with being connected.Heavy section 7 is connected by reducing diameter part 8 smoothly with thinner wall section 5.
Pipe arrangement insertion section 2 offers the opening portion 10 of tapped refrigerant pipe arrangement 11 being inserted patchhole 12, is formed with the refrigerant piping abutting part 9 abutted with the tapped refrigerant pipe arrangement 11 inserted in the bottom of patchhole 12.
The thinner wall section 5 of pipe arrangement insertion section 2 and heavy section 7 can consider the various shapes adopted such as shown in Fig. 2 A ~ Fig. 2 C.Fig. 2 A shows and the shape be arranged in shunt body 1 is protruded in 2 pipe arrangement insertion sections 2, Fig. 2 B shows the structure be arranged in shunt body 1 is protruded in 3 pipe arrangement insertion sections 2 with equilateral triangle, in addition, Fig. 2 C shows by multiple opening portion 10 with the structure of circular configuration in the thinner wall section 5 of pipe arrangement insertion section 2, the cylinder type in cylindrical hollow centered by described pipe arrangement insertion section 2.
In addition, tapped refrigerant pipe arrangement 11 generally branches into about 2 ~ 24.
On the other hand, jet pipe 3 is brazed in shunt body 1.Now, between jet pipe 3 and shunt body 1, current divider inner space 6 is formed with.In addition, on jet pipe 3, brazing has the entrance pipe arrangement 4 flowed into for cold-producing medium.
The material of shunt body 1 and jet pipe 3 can use brass, at the material of the copper coating of brass or copper, aluminium etc.In addition, tapped refrigerant pipe arrangement 11 uses copper pipe arrangement.In addition, pipe arrangement portion uses copper pipe arrangement substantially, but also can use other the metal pipe arrangement such as aluminum pipe.
In addition, in Fig. 1,2, the whole side face of pipe arrangement insertion section 2 is provided with thinner wall section 5 and heavy section 7, but also only thinner wall section can be set at the peripheral part of shunt body 1.Especially, in the current divider that porthole bridge is few, in order to make current divider miniaturized, cost being reduced, there is the situation can not guaranteeing enough sizes in the inner circumferential side of shunt body 1, so, only can implement the processing changing wall thickness on outer peripheral face.In addition, the size L of thinner wall section 5
2be configured to shunt the length between the overall L(opening portion 10 of insertion depth of pipe arrangement and refrigerant piping abutting part 9) about 50 ~ 70%.By such setting, when preheating, the thinner wall section 5 of distributor and the temperature difference of heavy section 7 can be guaranteed fully, solder can be made the most rightly to soak into.
Here, the effect of the kind of refrigeration cycle with coolant flow divider of the present invention is described.
Fig. 3 represents the loop diagram of the refrigerating circulatory device that have employed coolant flow divider of the present invention.
The gas refrigerant of HTHP of discharging from compressor 15 condensation become high pressure liquid refrigerant condenser 16.Make this high pressure liquid refrigerant puffing in expansion valve 17.The cold-producing medium of this gas-liquid two-phase state is fed into the entrance pipe arrangement 4 of coolant flow divider.The gas-liquid two-phase cold-producing medium being fed into entrance pipe arrangement 4 via jet pipe 3 and shunt body 1 current divider inner space 6 and distributed equably, flow into tapped refrigerant pipe arrangement 11, be fed into evaporimeter 18 with gas-liquid two-phase state.And, evaporate in evaporimeter 18 and the cold-producing medium of gasification is sucked by compressor 15.
Next, to by tapped refrigerant pipe arrangement 11 soldering on coolant flow divider of the present invention time operation be described.
Fig. 4 is the sectional view schematically representing the pipe arrangement insertion section 2 of brazing shunt body 1 and the situation of tapped refrigerant pipe arrangement 11.When passing through pipe arrangement insertion section 2 and the tapped refrigerant pipe arrangement 11 of brazing shunt body 1, first, heating pipe arrangement insertion section 2 by welding gun 13 and preheating fully.About pre-heating temperature is generally roughly heated to the liquidus temperature of solder and the medium temperature of solid-state temperature.After preheating fully, make welding rod 14 melting and flow into from the gap of tapped refrigerant pipe arrangement 11 and opening portion 10, implementing brazing.
In the structure of the coolant flow divider of present embodiment, flow into make solder, adopt the structure of the wall thickness only thin-walled property dimensionally making the connecting portion of shunt body 1 and tapped refrigerant pipe arrangement 11 and pipe arrangement insertion section 2, thus, even if when being heated equably by welding gun 13, thermal capacity is also different, so the pre-heating temperature of thinner wall section 5 uprises, and the pre-heating temperature step-down of heavy section 7.In general, the temperature being suitable for soldering is the scope of 730 degree ~ about 840 degree, but when the pre-heating temperature of thinner wall section 5 is preheated to about 800 degree, the temperature of heavy section 7 becomes the temperature being less than 730 degree.
By adopting such Temperature Distribution, solder can be made only to soak into thinner wall section 5 when soldering.Due to solder can be made only to soak into thinner wall section 5, the problem of solder that the superheated that can not occur to occur in current divider in the past causes blocking or the solder caused because of underheat flow into not enough problem, can stably produce.For general operator, also the operation can carrying out skilled operator's enforcement manufactures, therefore, it is possible to realize the expansion of manufacturing capacity and the reduction of manufacturing cost simultaneously, further, the refrigerant branches deviation caused by the blocking of solder and the refrigrant leakage caused by inflow deficiency can be prevented.
Below, the composition of used solder is described.
The solder connecting shunt body 1 and tapped refrigerant pipe arrangement 11 uses the material of the Zn composition containing more than 10 % by weight, thus, Cu-P-Zn layer is formed, therefore, it is possible to prevent the generation of local corrosion in the soldering boundary portion of shunt body 1 and tapped refrigerant pipe arrangement 11.When utilizing the solder not containing Zn to carry out soldering, only form Cu-P layer, the deterioration of P composition, thus, formed empty in tissue, produce corrosion.Especially, under sulfur environment, this effect is very large.Therefore, by using the solder do not affected by surrounding environment (corrosive gas), can prevent Leakage Gas in advance, food or the medicine that can prevent from being kept at refrigerator inside are impaired.In addition, Freon gas can be prevented to the discharge of air, be conducive to the environmental protection of the earth.
In addition, when adopt with the addition of the solder of Zn, generally with strong solder or silver solder for representative, but when adopting strong solder, liquidus temperature more than 900 degree, so be unsuitable for being connected with copper pipe.On the contrary, when adopting silver solder, liquidus temperature is low to 640 degree ~ about 770 degree, and impregnability is very high.Because impregnability uprises, so generally solder exceedingly flows between shunt body 1 and tapped refrigerant pipe arrangement 11, the possibility that blocking occurs is high.
Next, the degree of depth of the pipe arrangement insertion section 2 of tapped refrigerant pipe arrangement 11 being inserted shunt body 1 is described.
Ensure more than 10mm by the degree of depth L be inserted in patchhole 12 by tapped refrigerant pipe arrangement 11, the contact length L with heavy section 7 can be guaranteed
1for 4mm, with the contact length L of thinner wall section 5
2for 6mm.Such as when the tube diameter of shunting pipe arrangement is φ 6.35mm, gases at high pressure safety guarantee rule shows that the minimum insertion depth that benchmark specifies is more than 6mm, and becoming can to make solder reliably flow into the size of more than 6mm with the contact length of thinner wall section 5.By guaranteeing that enough solders flow into size in this wise, the inflow that solder can not occur is not enough, stably can produce current divider.
Next, the gap size (pipe arrangement clearance) in gap when tapped refrigerant pipe arrangement 11 being inserted patchhole 12 is described.
By making the all-round gap size (pipe arrangement clearance) of the outside wall surface of the internal face of patchhole 12 and tapped refrigerant pipe arrangement 11 be more than 0.05mm below 0.1mm, the deviation of machining accuracy can be absorbed, and guarantee soaking into of solder well.When pipe arrangement clearance is less than 0.05mm, when being inserted in patchhole 12 by tapped refrigerant pipe arrangement 11, the situation that can not be inserted into refrigerant piping abutting part 9 can be there is.In addition, minimum clearance when above-mentioned gases at high pressure safety guarantee rule shows that tapped refrigerant tube diameter is φ 6.35mm by benchmark is defined as 0.05mm, so, also can meet this benchmark.In addition, when pipe arrangement clearance is too small, between tapped refrigerant pipe arrangement 11 and patchhole 12, form part very close to each other, there is the possibility that solder does not soak into aim parameter.
When clearance size is more than 0.1mm, there is possibility tapped refrigerant pipe arrangement 11 vertically can not being inserted shunt body 1.When vertically not inserting tapped refrigerant pipe arrangement 11, the pipe arrangement clearance of patchhole 12 and tapped refrigerant pipe arrangement 11 produces narrow and wide deviation.In the position that pipe arrangement clearance is wide, do not flow into enough solders, rosin joint (bubble) easily occurs.In the position that pipe arrangement clearance is narrow, solder can not be made to be impregnated into insertion depth as target.By guaranteeing suitable pipe arrangement clearance, the operation that general operator also can carry out skilled operator's enforcement manufactures, so the increase of manufacturing capacity and the reduction of manufacturing cost can be realized simultaneously, further, can prevent from blocking the refrigerant branches deviation caused and the refrigrant leakage caused by the inflow deficiency of solder by solder.
In addition, in recent years, in order to pursue energy-conservation, prevent depletion of the ozone layer and prevent global warming, tend to adopt R410A, R404A, R32, CO
2highdensity cold-producing medium like this.Therefore, high-pressure, low pressure are higher than HCFC cold-producing medium in the past, so the raising of soldering precision brings large impact to preventing Leakage Gas.The present invention, by the change of the wall thickness shape of the insertion depth of rational refrigerant piping, pipe arrangement clearance and pipe arrangement insertion section, even if be not skilled operator, also can implement stable soldering, bring the raising of production capacity and the reduction of manufacturing cost.
The explanation of Reference numeral
1 shunt body, 2 pipe arrangement insertion sections, 3 jet pipes, 4 entrance pipe arrangements, 5 thinner wall section, 6 current divider inner spaces, 7 heavy sections, 8 reducing diameter parts, 9 refrigerant piping abutting parts, 10 opening portions, 11 tapped refrigerant pipe arrangements, 12 patchholes, 13 welding guns, 14 welding rods, 15 compressors, 16 condensers, 17 expansion valves, 18 evaporimeters, 19 solders.
Claims (10)
1. a coolant flow divider, has: inserted by tapped refrigerant pipe arrangement and fix the pipe arrangement insertion section of tapped refrigerant pipe arrangement; Protrude the shunt body being provided with multiple described pipe arrangement insertion section, it is characterized in that,
Described pipe arrangement insertion section has the thinner wall section that described in the thick heavy section of wall thickness and wall ratio, heavy section is thin.
2. coolant flow divider as claimed in claim 1, is characterized in that, described heavy section protrudes and is arranged in described shunt body, and described thinner wall section is arranged with described heavy section with being connected.
3. coolant flow divider as claimed in claim 1, it is characterized in that, described thinner wall section becomes drum.
4. coolant flow divider as claimed in claim 2, it is characterized in that, described thinner wall section becomes drum.
5. the coolant flow divider according to any one of Claims 1 to 4, is characterized in that,
Described pipe arrangement insertion section has the patchhole inserting described tapped refrigerant pipe arrangement, one end of described patchhole has opening portion, and the other end is formed with the refrigerant piping abutting part abutted with the tapped refrigerant pipe arrangement inserted, and the length of described opening portion and described refrigerant piping abutting part is more than 10mm.
6. the coolant flow divider according to any one of Claims 1 to 4, is characterized in that,
Described pipe arrangement insertion section has the patchhole inserting described tapped refrigerant pipe arrangement, one end of described patchhole has opening portion, and the other end is formed with the refrigerant piping abutting part abutted with the tapped refrigerant pipe arrangement inserted, at refrigerant piping on the direction that described patchhole inserts, the length of described thinner wall section, relative to the length between described opening portion and described refrigerant piping abutting part, is less than more than 50% 70%.
7. the coolant flow divider according to any one of Claims 1 to 4, is characterized in that, the solder connecting described shunt body and described tapped refrigerant pipe arrangement contains the Zn of more than 10 % by weight.
8. the coolant flow divider according to any one of Claims 1 to 4, is characterized in that, the gap size between the internal face of described pipe arrangement insertion section and the outside wall surface of described tapped refrigerant pipe arrangement is more than 0.05mm, below 0.1mm.
9. a refrigerating circulatory device, is characterized in that, the coolant flow divider according to any one of described Claims 1 to 4 is configured in the upstream of the evaporimeter in refrigerant flow path.
10. refrigerating circulatory device as claimed in claim 9, is characterized in that, cold-producing medium adopts R410A, CO
2, in R404A, R32 1.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-125794 | 2013-06-14 | ||
| JP2013125794A JP6132674B2 (en) | 2013-06-14 | 2013-06-14 | Refrigerant shunt and refrigeration cycle apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104236178A true CN104236178A (en) | 2014-12-24 |
| CN104236178B CN104236178B (en) | 2016-09-14 |
Family
ID=52224759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310496953.7A Active CN104236178B (en) | 2013-06-14 | 2013-10-22 | Coolant flow divider and refrigerating circulatory device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6132674B2 (en) |
| CN (1) | CN104236178B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111656109B (en) * | 2018-01-31 | 2021-06-22 | 大金工业株式会社 | Refrigerant flow divider and air conditioner |
| CN113227679A (en) * | 2019-01-10 | 2021-08-06 | 三菱电机株式会社 | Heat exchanger and refrigeration cycle device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016111089A1 (en) * | 2015-01-07 | 2016-07-14 | 三菱電機株式会社 | Method for manufacturing refrigerant distributor, apparatus for manufacturing refrigerant distributor, refrigerant distributor, heat exchanger, and air conditioning apparatus |
| CN106016853A (en) * | 2016-06-17 | 2016-10-12 | 安徽天祥空调科技有限公司 | Parallel flow evaporator distribution pipe uniform in distribution and forming process of distribution pipe |
| WO2019021457A1 (en) * | 2017-07-28 | 2019-01-31 | 三菱電機株式会社 | Refrigerant distributor and heat pump device having said refrigerant distributor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10185363A (en) * | 1996-12-25 | 1998-07-14 | Mitsubishi Heavy Ind Ltd | Refrigerant distributor for refrigerating cycle |
| JP2006112668A (en) * | 2004-10-12 | 2006-04-27 | Fujitsu General Ltd | Outdoor unit for multi-chamber type air conditioner |
| JP2010133644A (en) * | 2008-12-04 | 2010-06-17 | Hitachi Appliances Inc | Distributor |
| CN101893355A (en) * | 2009-05-20 | 2010-11-24 | 三洋电机株式会社 | Coolant flow divider |
| CN202613854U (en) * | 2012-06-15 | 2012-12-19 | 珠海格力电器股份有限公司 | Liquid cyclone, heat exchanger including liquid cyclone and air conditioner including liquid cyclone |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5920610Y2 (en) * | 1980-09-20 | 1984-06-15 | ダイキン工業株式会社 | Refrigeration equipment flow divider |
| JPS582544Y2 (en) * | 1981-03-26 | 1983-01-17 | 臼井国際産業株式会社 | Connection end fitting for soldering with metal pipe end |
| JPS5881067U (en) * | 1981-11-26 | 1983-06-01 | 株式会社ボッシュオートモーティブ システム | brazed joint |
| JPS6349458U (en) * | 1986-09-18 | 1988-04-04 | ||
| JPS6433479A (en) * | 1987-07-28 | 1989-02-03 | Fuji Heavy Ind Ltd | Flow diverter for refrigerator |
| JP2501912Y2 (en) * | 1990-10-15 | 1996-06-19 | 三菱電機株式会社 | Refrigerant distributor |
| JP3355084B2 (en) * | 1996-03-29 | 2002-12-09 | 三菱アルミニウム株式会社 | Heat exchanger with excellent brazing properties |
| JPH11125379A (en) * | 1997-10-20 | 1999-05-11 | Mitsubishi Electric Corp | Air conditioner |
| JP2007032921A (en) * | 2005-07-26 | 2007-02-08 | Kakinuma Kinzoku Seiki Kk | Flow divider and its manufacturing method |
| JP4812805B2 (en) * | 2008-05-21 | 2011-11-09 | 三菱電機株式会社 | Refrigeration cycle equipment |
| KR101547353B1 (en) * | 2008-11-10 | 2015-08-25 | 엘지전자 주식회사 | Distributor and refrigerant circulation system comprising the same |
| CN102353187B (en) * | 2011-08-05 | 2013-06-19 | 温岭市恒发空调部件有限公司 | Reflecting refrigerant flow divider |
| JP2013185775A (en) * | 2012-03-08 | 2013-09-19 | Fuji Electric Co Ltd | Distributor |
-
2013
- 2013-06-14 JP JP2013125794A patent/JP6132674B2/en active Active
- 2013-10-22 CN CN201310496953.7A patent/CN104236178B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10185363A (en) * | 1996-12-25 | 1998-07-14 | Mitsubishi Heavy Ind Ltd | Refrigerant distributor for refrigerating cycle |
| JP2006112668A (en) * | 2004-10-12 | 2006-04-27 | Fujitsu General Ltd | Outdoor unit for multi-chamber type air conditioner |
| JP2010133644A (en) * | 2008-12-04 | 2010-06-17 | Hitachi Appliances Inc | Distributor |
| CN101893355A (en) * | 2009-05-20 | 2010-11-24 | 三洋电机株式会社 | Coolant flow divider |
| CN202613854U (en) * | 2012-06-15 | 2012-12-19 | 珠海格力电器股份有限公司 | Liquid cyclone, heat exchanger including liquid cyclone and air conditioner including liquid cyclone |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111656109B (en) * | 2018-01-31 | 2021-06-22 | 大金工业株式会社 | Refrigerant flow divider and air conditioner |
| CN113227679A (en) * | 2019-01-10 | 2021-08-06 | 三菱电机株式会社 | Heat exchanger and refrigeration cycle device |
| CN113227679B (en) * | 2019-01-10 | 2022-08-26 | 三菱电机株式会社 | Heat exchanger and refrigeration cycle device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104236178B (en) | 2016-09-14 |
| JP2015001335A (en) | 2015-01-05 |
| JP6132674B2 (en) | 2017-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104236178A (en) | Refrigerating fluid splitter and refrigeration cycle device | |
| CA2632725C (en) | Evaporator for use in a heat transfer system | |
| JP6387029B2 (en) | Four-way valve and refrigeration cycle apparatus provided with the same | |
| JP2008014629A (en) | Internal heat exchanger | |
| CN104704311A (en) | Double-tube heat exchanger and refrigerating cycle device | |
| WO2016002088A1 (en) | Coolant distributor and heat pump device comprising coolant distributor | |
| US20160245563A1 (en) | Accumulator, air-conditioning apparatus and method for manufacturing accumulator | |
| US10514210B2 (en) | Fin-tube heat exchanger | |
| KR20150004177A (en) | Shell and tube type heat exchanger and Manufacturing method of the same | |
| JP6075958B2 (en) | Stainless steel pipe brazing method | |
| JP2006003071A (en) | Heat exchanger | |
| CN205102463U (en) | Heat exchanger and air conditioner device | |
| KR101514977B1 (en) | Brazing low use condenser header for join-pipe of manufacture method | |
| JP7165398B2 (en) | Blockage prevention mechanism of capillary tube in refrigeration cycle | |
| US20060119101A1 (en) | Pipe having enlarged and reduced diameters, and ejector using thereof | |
| JP6426644B2 (en) | Sliding type switching valve and refrigeration cycle system | |
| JP7460881B2 (en) | Plate type refrigerant piping and refrigeration equipment | |
| JP2007078252A (en) | Heat exchanger | |
| JP2013221697A (en) | Refrigerator | |
| KR200391919Y1 (en) | Condenser for Chiller | |
| JP7436789B2 (en) | Plate type refrigerant piping and refrigeration equipment | |
| KR100710849B1 (en) | Method and apparatus for connecting capillary tube | |
| KR101452272B1 (en) | Aluminium condenser header for join-pipe of manufacture method | |
| JP2016090205A (en) | Flow divider and air conditioner equipped therewith | |
| KR100465688B1 (en) | Pipe fix structure of cooling apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |