CN104233168A - 涂覆工艺及涂覆物品 - Google Patents

涂覆工艺及涂覆物品 Download PDF

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CN104233168A
CN104233168A CN201410246192.4A CN201410246192A CN104233168A CN 104233168 A CN104233168 A CN 104233168A CN 201410246192 A CN201410246192 A CN 201410246192A CN 104233168 A CN104233168 A CN 104233168A
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coating
crystalloid
coating processes
processes according
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J.L.马戈利斯
T.R.格罗斯曼
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General Electric Co
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General Electric Co
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    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
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    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
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    • C23C4/134—Plasma spraying
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/18—After-treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D25/00—Component parts, details, or accessories, not provided for in, or of interest apart from, other groups
    • F01D25/007—Preventing corrosion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D5/00—Blades; Blade-carrying members; Heating, heat-insulating, cooling or antivibration means on the blades or the members
    • F01D5/12—Blades
    • F01D5/28—Selecting particular materials; Particular measures relating thereto; Measures against erosion or corrosion
    • F01D5/284—Selection of ceramic materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D5/00—Blades; Blade-carrying members; Heating, heat-insulating, cooling or antivibration means on the blades or the members
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    • F01D5/288—Protective coatings for blades
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Abstract

公开了一种涂覆工艺及涂覆物品。涂覆工艺包括关于电感器定位物品、利用电感器加热物品，接着将涂层材料施加在物品上面来形成晶质涂层。物品的加热将物品的表面的第一温度升高至有利于晶体形成的第二温度。另一种涂覆工艺包括定位物品、将物品的表面均匀地加热至有利于晶体形成的第二温度，接着将环境阻隔涂层材料施加在物品的表面上面来形成晶质环境阻隔涂层。环境阻隔涂层的施加通过空气等离子喷涂沉积来执行。涂覆物品包括具有复杂几何形状的物品，以及施加在物品的表面上的晶质涂层。晶质涂层包括对分层的增大的阻力。

Description

涂覆工艺及涂覆物品
技术领域
本发明涉及涂覆工艺及涂覆物品。更具体地，本发明涉及晶质涂层。
背景技术
各种系统常见的恶劣操作条件可使物品的表面退化和/或破坏。环境阻隔涂层(EBC)通常沉积在物品的表面上面，以减少或消除退化和/或破坏。例如，破坏的一种形式包括陶瓷基质复合物(CMC)由于气流中的水蒸气而退化。水蒸气与碳化硅反应来形成氢氧化硅。沉积EBC的一种常见工艺为通过热喷涂，诸如空气等离子喷涂。
在常规空气等离子喷涂期间，EBC以非晶质状态沉积。在非晶质状态下，EBC的原子未以有序晶格布置。为了提高涂层的性能，非晶质结构可结晶，或通过涂覆物品的涂覆后热处理形成为晶质结构。涂层的结晶通常产生涂层的体积变化，产生可导致缺陷和/或分层的应力。物品的涂覆后热处理引起EBC材料在晶质结构形成时膨胀。EBC材料的膨胀可引起各种微观结构缺陷，诸如微裂纹、EBC从物品的分层，或它们的组合。EBC的分层引入了EBC的定位和/或物品的破坏和/或失效。
减少或消除EBC材料的膨胀期间形成的缺陷的一种方法包括将涂覆后热处理延长至大于50小时；然而，这是耗时的，并且增加了生产成本。避免EBC材料的膨胀的其它方法包括在EBC沉积之前和同时使用开箱熔炉来加热物品，以及在EBC沉积之前和同时使用电阻加热来加热物品。开箱熔炉不适于具有复杂几何形状的涂覆构件或稳健的制造工艺。电阻加热形成非均匀加热，这产生局部过热和熔化物品的区。
本领域中将合乎需要的是不遭受以上缺陷中的一个或更多个的涂覆工艺和涂覆物品。
发明内容
在一个实施例中，一种涂覆工艺包括关于电感器定位物品、利用电感器加热物品、接着将涂层材料施加在物品上面来形成晶质涂层。物品的加热将物品的表面的第一温度升高至有利于晶体形成的第二温度。
在另一个实施例中，一种涂覆工艺包括定位物品、将物品的表面均匀地加热至有利于晶体形成的第二温度，接着将环境阻隔涂层材料施加在物品的表面上面来形成晶质环境阻隔涂层。环境阻隔涂层的施加通过空气等离子喷涂沉积来执行。
在另一个实施例中，一种涂覆物品包括具有复杂几何形状的物品，以及施加在物品的表面上的晶质涂层。晶质涂层包括对分层的增大的阻力。
一种涂覆工艺，包括：关于电感器定位物品；利用电感器加热物品；接着将涂层材料施加在物品上面来形成晶质涂层；其中物品的加热将物品的表面的第一温度增大至有利于晶体形成的第二温度。
优选地，晶质涂层抵抗分层。
优选地，晶质涂层在复杂几何形状上。
优选地，涂覆工艺还包括关于电感器操纵物品。
优选地，涂覆工艺还包括关于物品操纵电感器。
优选地，晶质涂层在没有涂覆后热处理的情况下形成。
优选地，涂覆工艺还包括遍及将涂层材料施加在物品上面至少保持有利于物品中的晶体形成的第二温度。
优选地，物品包括陶瓷基质复合物。
优选地，物品包括镍合金。
优选地，涂层材料为环境阻隔涂层。
优选地，通过施加涂层材料来形成晶质涂层在没有相变的情况下发生。
优选地，通过施加涂层材料来形成晶质涂层在没有体积变化的情况下发生。
优选地，涂覆工艺还包括通过选自由热喷涂、空气等离子喷涂、高速含氧燃料喷涂、高速空气燃料喷涂、高速空气等离子喷涂和射频感生等离子构成的组的方法来沉积涂层材料。
优选地，晶质涂层包括0.5密耳至30密耳之间的涂层深度。
优选地，涂覆工艺还包括通过带涂覆来沉积涂层材料。
优选地，涂覆工艺还包括使物品与设备分开。
优选地，物品遍及涂层材料的沉积保持附接于设备。
优选地，涂覆工艺还包括对物品热处理达小于50小时。
一种涂覆工艺，包括：定位物品；将物品的表面均匀地加热至有利于晶体形成的第二温度；接着将环境阻隔涂层材料施加在物品的表面上面来形成晶质环境阻隔涂层；其中环境阻隔涂层的施加通过空气等离子喷涂沉积来执行。
一种涂覆物品，包括：具有复杂几何形状的物品；以及施加在物品的表面上的晶质涂层；其中晶质涂层包括对分层的增大的阻力。
本发明的其它特征和优点将从结合附图进行的优选实施例的以下更详细的描述为显而易见的，附图经由实例示出了本发明的原理。
附图说明
图1示出了根据本公开的实施例的涂覆工艺。
图2示出了对应于图1的涂覆工艺的截面图。
在可能的任何地方，相同的附图标记将在所有附图中用于表示相同的部件。
具体实施方式
提供了示例性的涂覆工艺及涂覆物品。本公开的实施例相比于未使用本文公开的特征中的一个或更多个的工艺和物品减少或消除了环境阻隔涂层(EBC)的分层、缩短了具有EBC的物品的生产时间、降低了具有EBC的物品的生产成本、在EBC施加期间提高了EBC的结晶度、减少了涂层缺陷、延长了涂层寿命、加强了涂层功能性，或它们的组合。
参照图1，在一个实施例中，工艺150包括关于电感器102定位(步骤115)物品101、利用电感器102加热(步骤100)物品101，接着将涂层材料104施加(步骤120)在物品101上面来形成(步骤130)相比于非晶质材料具有增加量的晶质材料的晶质涂层107。物品101的加热(步骤100)将物品101的表面105的第一温度升高至有利于晶体形成的第二温度。例如，物品101为涡轮轮叶、涡轮叶片、热气体通路构件、护罩、燃烧衬套、具有晶质涂层的构件、任何其它适合的构件，或它们的组合。物品101在工艺150的部分或所有之前与系统和/或设备分开，或遍及工艺150的部分或所有保持附接于系统和/或设备。
在一个实施例中，工艺150包括关于能够将表面105的第一温度升高至有利于晶体形成的第二温度的任何适合的能量源来定位(步骤115)物品101。适合的能量源包括但不限于红外线(IR)源、焊炬、电感器102或它们的组合。相比于其它能量源，电感器102提供了提高的加热(步骤100)速率、加强的加热(步骤100)控制、增大的对来自等离子喷涂的破坏的阻力，以及降低的成本。
对于能够将表面105的第一温度升高至有利于晶体形成的第二温度的任何适合的持续时间，加热(步骤100)在涂层材料104的施加(步骤120)之前和/或同时执行。用于在施加(步骤120)涂层材料104之前加热(步骤100)的适合的持续时间包括但不限于大约0.0001小时至大约1小时之间、大约0.005小时至大约0.95小时之间、大约0.1小时至大约0.9小时之间、大约0.1小时至大约0.5小时之间、大约0.05小时至大约0.2小时之间、大约0.05小时至大约0.15小时之间，或任何组合、子组合、范围或其子范围。
物品101的加热(步骤100)将物品101的第一温度从非晶质-晶质形成温度升高至有利于晶体形成的第二温度。表面105的第一温度的升高减小了物品101的表面105上面施加(步骤120)的涂层材料104的冷却速率。冷却速率的减小降低了玻璃转变温度(Tg)，这容许涂层104再对准到以沿所有空间方向延伸并且具有降低的能态的有顺序的图案布置的固体和晶格中。固体和晶格形成增大了晶质涂层107中形成的晶质结构的百分比。
有利于晶体形成的第一温度为涂层材料104的施加(步骤120)形成(步骤130)晶质涂层107所处于或高于的任何适合的温度。有利于晶体形成的第一温度对于具有不同成分的涂层材料104调整，以适应非晶质-晶质形成温度中的变化。有利于晶体形成的适合温度包括但不限于大约500℃至大约1500℃之间、大约800℃至大约1200℃之间、大约800℃至大约1000℃之间、大约900℃至大约1200℃之间、大约1000℃至大约1500℃之间、至少800℃、至少1000℃或任何组合、子组合、范围或其子范围。
时间/温度关系驱使多个热-化学和/或热-物理现象发生。各个热-化学和/或热-物理现象影响如何和何时出现晶质涂层107的形成(步骤130)。在施加(步骤120)涂层材料104之前或期间升高表面105的第一温度相比于非晶质材料，增加了晶质涂层107中的晶质材料的量。在一个实施例中，晶质涂层107包括较少或没有非晶质材料。例如，将物品加热(步骤100)至1,000℃形成了晶质涂层107中的80%的晶质材料，而将物品加热(步骤100)至300℃形成仅7%的晶质材料。
在有利于晶体形成的第二温度下，施加(步骤120)涂层材料104减少了晶质涂层107中的缺陷的量，并且提高了晶质涂层107的微观结构稳定性。微观结构稳定性的提高例如通过减少或消除在导致非晶质相的非晶质-晶质形成温度下施加的涂层材料104经历的相变来对晶质涂层107延长寿命和增加功能性。
涂层材料104的施加(步骤120)通过能够涂覆表面105的任何适合的技术。表面105具有适合的几何形状，例如，复杂几何形状和/或非平面轮廓。如本文中使用的，用语"复杂几何形状"是指能够不容易或不一致地被识别或再生的形状，诸如，不是正方形、圆形或矩形。复杂几何形状的实例例如存在于叶片/轮叶的前缘上、叶片/轮叶的后缘上、叶片/轮叶的吸入侧上、叶片/轮叶的压力侧上、叶片/轮叶末端上、燕尾部上，燕尾部的天使翼上。适合的技术包括但不限于热喷涂(例如，通过热喷涂喷嘴103)、空气等离子喷涂、高速含氧燃料(HVOF)喷涂、高速空气燃料(HVAF)喷涂、高速空气等离子喷涂(HV-APS)、射频(RF)感生等离子、直接汽相沉积，或它们的组合。
在一个实施例中，工艺150包括至少遍及将涂层材料104施加(步骤120)在物品101的表面105上面保持(步骤110)有利于晶体形成的第二温度。第二温度的保持(步骤110)容许减少或消除涂覆后热处理。减少或消除涂覆后热处理提高了制造的简单性、降低了制造成本、减少或消除了分层、减少或消除了间隙形成，或它们的组合。
在一个实施例中，晶质涂层107的形成(步骤130)没有涂覆后热处理。这减少或消除了在涂覆后热处理期间经历的涂层材料104的体积膨胀。减少或消除涂层材料104的体积膨胀减少或消除了晶质涂层107从表面105的分层。例如，减小的体积膨胀水平包括但不限于达到大约0.30%、达到大约0.15%、达到大约0.06%、大约0.001%至大约0.30%之间、大约0.005%至大约0.15%之间、大约0.01%至大约0.06%之间，或任何组合、子组合、范围或其子范围。在一个实施例中，超过10密耳的晶质涂层107的分层为晶质涂层107的失效。
在一个实施例中，晶质涂层的形成(步骤130)的至少一部分包括涂覆后热处理(未示出)。涂覆后热处理为任何适合的持续时间。适合的持续时间包括但不限于大约0.5小时至大约50小时之间、大约1小时至大约50小时之间、大约5小时至大约50小时之间、大约0.5小时至大约25小时之间、大约1小时至大约25小时之间、大约0.5小时至大约15小时之间、大约0.5小时至大约10小时之间，大约1小时至大约10小时之间，大约5小时至大约50小时之间，或任何组合、子组合、范围或其子范围。
在一个实施例中，工艺150包括有利于晶体形成的第二温度的保持(步骤110)期间电感器102和/或物品101的相对操纵(未示出)。在又一个实施例中，相对操纵通过在熔炉(未示出)外侧实现，其能够用于涂覆后的热处理。相对操纵容许涂层材料104的施加(步骤120)为均匀或大致均匀的。相对操纵包括方法，诸如但不限于旋转、平移、展开、振荡、回转、翻转、自旋或它们的组合。在一个实施例中，相对操纵通过具有能够经得起有利于晶体形成的第二温度的任何适合的成分的物品执行。适合的成分包括但不限于陶瓷、陶瓷基质复合物、金属、金属合金或它们的组合。
在涂层材料104的施加(步骤120)均匀的实施例中，晶质涂层107的形成(步骤130)导致物品101的表面105上面的一致深度。晶质涂层107的一致深度为具体涂层的任何适合的深度。晶质涂层107的适合深度包括但不限于大约1密耳至大约2000密耳之间、大约1密耳至大约100密耳之间、大约10密耳至大约20密耳之间、大约20密耳至大约30密耳之间、大约30密耳至大约40密耳之间、大约40密耳至大约50密耳之间、大约20密耳至大约40密耳之间、大约0.5密耳至大约30密耳之间，或任何适合的组合、子组合、范围或其子范围。
涂层材料104为能够施加于物品101的任何适合的材料。适合材料包括但不限于热障涂层(TBC)材料、连结涂层材料、环境阻隔涂层(EBC)材料、结晶涂层材料或它们的组合。在一个实施例中，TBC材料包括但不限于氧化钇稳定的二氧化锆或氧化钇稳定的halfnate。在一个实施例中，EBC材料包括但不限于钡锶铝硅酸盐(BSAS)、多铝红柱石、氧化钇稳定的二氧化锆、镱掺杂的二氧化硅，以及它们的组合。物品101包括成分201，其为与涂层材料104相容的任何适合成分。适合的成分包括但不限于硅基陶瓷基质复合物、合金、镍基合金，或它们的组合。
在一个实施例中，工艺150包括在晶质涂层107形成(步骤130)之后冷却(步骤140)物品101。遍及物品的冷却(步骤140)，晶质涂层107保持处于晶质状态。在一个实施例中，在有利于晶体形成的第二温度的保持(步骤110)期间重复物品101的操纵和涂层材料104的施加(步骤120)形成(步骤130)多层晶质涂层107。
尽管已经参照优选实施例描述了本发明，但本领域技术人员将理解，可作出各种变化，并且等同方案可替代其元件，而不背离本发明的范围。此外，可作出许多修改，以使特定情形或材料适合于本发明的教导，而不背离其基本范围。因此，意图是本发明不限于公开为设想用于执行本发明的最佳模式的特定实施例，而是本发明将包括落入所附权利要求的范围内的所有实施例。

Claims (10)

1. 一种涂覆工艺，包括：
关于电感器定位物品；
利用所述电感器加热所述物品；接着
将涂层材料施加在所述物品上面来形成晶质涂层；
其中所述物品的加热将所述物品的表面的第一温度增大至有利于晶体形成的第二温度。
2. 根据权利要求1所述的涂覆工艺，其特征在于，所述晶质涂层抵抗分层。
3. 根据权利要求1所述的涂覆工艺，其特征在于，所述晶质涂层在复杂几何形状上。
4. 根据权利要求1所述的涂覆工艺，其特征在于，还包括关于所述电感器操纵所述物品。
5. 根据权利要求1所述的涂覆工艺，其特征在于，还包括关于所述物品操纵所述电感器。
6. 根据权利要求1所述的涂覆工艺，其特征在于，所述晶质涂层在没有涂覆后热处理的情况下形成。
7. 根据权利要求1所述的涂覆工艺，其特征在于，还包括遍及将所述涂层材料施加在所述物品上面至少保持有利于所述物品中的晶体形成的所述第二温度。
8. 根据权利要求1所述的涂覆工艺，其特征在于，所述物品包括陶瓷基质复合物。
9. 根据权利要求1所述的涂覆工艺，其特征在于，所述物品包括镍合金。
10. 根据权利要求1所述的涂覆工艺，其特征在于，所述涂层材料为环境阻隔涂层。
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Application publication date: 20141224