CN104231962A - Bonding sheet - Google Patents
Bonding sheet Download PDFInfo
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- CN104231962A CN104231962A CN201410281410.8A CN201410281410A CN104231962A CN 104231962 A CN104231962 A CN 104231962A CN 201410281410 A CN201410281410 A CN 201410281410A CN 104231962 A CN104231962 A CN 104231962A
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Abstract
The invention provides a bonding sheet which has excellent following performance for a recess/projection when the bonding sheet is adhibited on a processed component (such as a semiconductor wafer) with the recess/projection and the component is processed, and furthermore the bonding sheet has high storage stabillity and excellent operability. The settlement solution is characterized in that: the bonding sheet of the invention is provided with an adhesive layer, a middle layer and a substrate layer successively; the storage modulus E' of the middle layer at 23 DEG C is 10MPa-50MPa. A ratio (E'(23)/E'(50)) between the storage modulus E'(23) of the middle layer at 23 DEG C and a storage modulus E'(50) at 50 DEG C is less than 5, and a ratio (E'(23)/E'(80)) between the storage modulus E'(23) of the middle layer at 23 DEG C and a storage modulus E'(80) at 80 DEG C is 90-200.
Description
Technical field
The present invention relates to adhesive sheet.
Background technology
Man-hour is added to opticses such as semiconductor device, lens etc. such as semiconductor crystal wafers, in order to protect it not damaged, adhesive sheet of fitting on these parts.Such as, in back grinding procedure, cutting action etc. when processing semiconductor wafer, laminating adhesive sheet protects pattern plane.From the view point of relative to the binding property of the irregular pattern plane of tool and the reliability of protection pattern plane, require that the adhesive sheet used like this possesses the concavo-convex tracing ability (difference of altitude tracing ability) of pattern plane.
As the adhesive sheet of difference of altitude tracing ability excellence, propose the adhesive sheet (patent documentation 1) possessing soft middle layer between base material and binder layer.But, more think lift height difference tracing ability, manufacture more soft by middle layer, then more can produce following keeping aspect or the problem of operating aspect: the end face easily producing (when such as adhesive sheet being fitted in the carrying in the operation of semiconductor crystal wafer) adhesive sheet when the unnecessary distortion of adhesive sheet, carrying is attached to processing unit (plant).
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2007-45965 publication
Summary of the invention
the problem that invention will solve
The present invention carries out to solve above-mentioned existing problem, its object is to, be provided in when fitting in tool irregular processed parts (such as semiconductor crystal wafer), when processing these parts to this concavo-convex tracing ability the excellent and adhesive sheet of keeping stability and operability excellence.
for the scheme of dealing with problems
Adhesive sheet of the present invention possesses binder layer, middle layer and substrate layer successively, storage modulus E ' (23) at 23 DEG C of this middle layer is 10MPa ~ 50MPa, storage modulus E ' (23) at 23 DEG C of this middle layer is less than 5 with the ratio (E ' (23)/E ' (50)) of the storage modulus E ' (50) at 50 DEG C, and the ratio of the storage modulus E ' (23) at 23 DEG C of this middle layer and the storage modulus E ' (80) at 80 DEG C (E ' (23)/E ' (80)) be 90 ~ 200.
In one embodiment, above-mentioned binder layer comprises polyolefin-based resins.
In one embodiment, the thickness in above-mentioned middle layer is 60 μm ~ 300 μm.
the effect of invention
According to the present invention, by possessing the middle layer with specific storage modulus, can be provided in when fitting in tool irregular processed parts (such as semiconductor crystal wafer), and the adhesive sheet of keeping property and operability excellence excellent to this concavo-convex tracing ability when processing these parts.
Accompanying drawing explanation
Fig. 1 is the constructed profile of the adhesive sheet for semiconductor wafer processing of an embodiment of the invention.
Fig. 2 is the index i.e. figure of " floating width " of the difference of altitude tracing ability that adhesive sheet of the present invention is described.
description of reference numerals
10 binder layers
20 middle layers
30 substrate layers
100 adhesive sheets
Embodiment
a. the entirety of adhesive sheet is formed
Fig. 1 is the constructed profile of the adhesive sheet of an embodiment of the invention.Adhesive sheet 100 possesses binder layer 10, middle layer 20 and substrate layer 30 successively.
The thickness of adhesive sheet of the present invention is preferably 5 μm ~ 1000 μm, is more preferably 100 μm ~ 300 μm, is particularly preferably 130 μm ~ 260 μm.
Although not shown, adhesive sheet of the present invention can also possess other layer as required.Such as, adhesive sheet of the present invention can also possess for protection binder layer until for the protective layer till practical application.Adhesive sheet of the present invention can become web-like at the state last volume of protected seam protection.As protective layer, include, for example out: the plastics (such as polyethylene terephthalate (PET), polyethylene, polypropylene) film, non-woven fabrics or the paper etc. that have carried out surface-coated with strippers such as silicon series stripping agent, fluorine series stripping agent, long-chain aliphatic acrylate series stripping agents.
Adhesive sheet of the present invention, when not such as being subject to the protection of protective layer, also can carry out back side process at the outermost layer of the opposition side of binder layer.Back side processing example is carried out as used the stripper such as silicon series stripping agent, long-chain aliphatic acrylate series stripping agent.Adhesive sheet of the present invention can be rolled into web-like by carrying out back side process.
In this specification sheets, as adhesive sheet to one of index of concavo-convex tracing ability (difference of altitude tracing ability), use " floating width "." float width " and refer to as shown in Figure 2, when adhesive sheet 100 is fitted in the adherend 200 with difference of altitude x, the width a of the part that this adhesive sheet floats and do not contact with adherend 200 near this difference of altitude.It is little that this floats width, means that the difference of altitude tracing ability of adhesive sheet is excellent, can glue the concavo-convex of thing by good buried cover.When adhesive sheet of the present invention being fitted at 80 DEG C silicon semiconducting mirror wafer, to the adherend of difference of altitude 30 μm to float width more little more preferred, be preferably less than 650 μm, be more preferably less than 500 μm, be particularly preferably less than 450 μm.Adhesive sheet of the present invention need actually at the temperature (processing temperature when back grinding procedure such as during processing semiconductor wafer or cutting action about 80 DEG C) of the situation protecting adherend to float width little, the concavo-convex of thing can be glued by good buried cover.When such adhesive sheet to be added the pattern plane in man-hour for the protection of semiconductor crystal wafer; during back grinding procedure, can to semiconductor crystal wafer apply equably pressure, concavo-convexly can not the impacting the back side of semiconductor crystal wafer of pattern plane, can grinding smoothly.In addition, the breakage of semiconductor crystal wafer can be prevented.And then, can prevent from immersing grinding water between semiconductor crystal wafer and adhesive sheet.
About adhesive sheet of the present invention, using semiconducting mirror wafer (silicon system) as test board, 0.1N/20mm ~ 2.0N/20mm is preferably by the bounding force measured based on the method (laminating condition: round 1 time of 2kg roller, peeling rate: 300mm/ minute, peel angle: 180 °, mensuration temperature: 23 DEG C) of JIS Z0237 (2000), more preferably 0.15N/20mm ~ 1.5N/20mm, be more preferably 0.15N/20mm ~ 1.0N/20mm, be particularly preferably 0.25N/20mm ~ 1.0N/20mm.If such scope, then can obtain and there is abundant bounding force and the adhesive sheet with appropriate separability.Such adhesive sheet, such as when for the protection of semiconductor crystal wafer surperficial, can not be peeled off in the processing such as grinding step, cutting action overleaf, can easily peel off after processing.
b. middle layer
Storage modulus E ' (23) at 23 DEG C of above-mentioned middle layer is 10MPa ~ 50MPa, is preferably 10MPa ~ 20MPa, is more preferably 12MPa ~ 18MPa.If such scope, then can obtain the adhesive sheet of keeping stability and operability excellence.More specifically, this adhesive sheet can be prevented when keeping or the unnecessary distortion in the time of carrying.In addition, can prevent from the operation such as adhesive sheet being fitted in semiconductor crystal wafer, be attached to the unnecessary attachment such as processing unit (plant).It should be noted that, storage modulus E ' can be measured by dynamic viscoelastic spectrometry.
Storage modulus E ' (50) at 50 DEG C of above-mentioned middle layer is preferably 2MPa ~ 50MPa, is more preferably 3MPa ~ 20MPa, is particularly preferably 4.5MPa ~ 10MPa.If such scope, then can obtain keeping stability and the more excellent adhesive sheet of operability.
Storage modulus E ' (80) at 80 DEG C of above-mentioned middle layer is preferably 0.05MPa ~ 0.6MPa, is more preferably 0.07MPa ~ 0.3MPa, is particularly preferably 0.1MPa ~ 0.25MPa.If such scope, then, under needing the temperature (for example described above about 80 DEG C) of the situation protecting adherend actually, the concavo-convex of thing can be glued by good buried cover.
Storage modulus E ' (23) at 23 DEG C of above-mentioned middle layer is less than 5 with the ratio ((E ' (23)/E ' (50)) of the storage modulus E ' (50) at 50 DEG C, be preferably less than 4, be more preferably less than 3.5.If such scope, then can obtain the adhesive sheet of keeping stability and operability excellence.More specifically, adhesive sheet of the present invention storage modulus in the middle layer of (room temperature ~ about 50 DEG C) when keeping or under requiring the envrionment temperature of the situation of operability is controlled, thus there is the flexibility of appropriateness, therefore, it is possible to when preventing keeping or carrying time the unnecessary unfavorable condition such as distortion, unnecessary attachment of adhesive sheet.The lower limit of E ' (23)/E ' (50) is generally more than 2.
Storage modulus E ' (23) at 23 DEG C of above-mentioned middle layer is 90 ~ 200 with the ratio (E ' (23)/E ' (80)) of the storage modulus E ' (80) at 80 DEG C, is preferably 110 ~ 150.If such scope, then can obtain the adhesive sheet of the difference of altitude tracing ability taken into account operability and added man-hour.
The thickness in above-mentioned middle layer is preferably 60 μm ~ 300 μm, is more preferably 80 μm ~ 250 μm, is particularly preferably 90 μm ~ 200 μm.If such scope, then can obtain the adhesive sheet of the difference of altitude tracing ability taken into account operability and added man-hour.
As the material forming above-mentioned middle layer, as long as the storage modulus E ' meeting above-mentioned scope then can adopt material suitable arbitrarily.As forming the material in middle layer, preferably using can the resin of extrusion molding, more preferably uses and can carry out the resin of coextrusion shaping with the resin forming binder layer and the resin forming substrate layer.As the concrete example of the resin in formation middle layer, ethylene-vinyl acetate copolymer can be listed, ethylene methyl methacrylate multipolymer, polyester based resin (polyethylene terephthalate, PEN, polybutylene terephthalate, PBN etc.), polyolefin-based resins (polyethylene, polypropylene, ethylene-propylene copolymer etc.), polyvinyl alcohol, polyvinylidene dichloride, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate (PVA), polymeric amide, polyimide, cellulose family, fluorine resin, polyethers, polystyrene resin (polystyrene etc.), polycarbonate, polyethersulfone etc.These resins can be used alone, or are used in combination of two or more.
From the view point of resin structure, as the resin forming middle layer, preferably use multipolymer.By to form multipolymer structural unit kind and adjust containing proportional, the storage modulus E ' (23) in middle layer, storage modulus E ' (50) and storage modulus E ' (80) can be controlled.
In one embodiment, as the resin forming middle layer, preferably use ethylene methyl methacrylate multipolymer.When using ethylene methyl methacrylate multipolymer, the structural unit being stemmed from ethene by adjustment is proportional with containing of the structural unit stemming from methyl methacrylate, the storage modulus E ' (23) in middle layer, storage modulus E ' (50) and storage modulus E ' (80) can be controlled, the structural unit stemming from methyl methacrylate is more, then storage modulus E ' becomes lower.In ethylene methyl methacrylate multipolymer stem from the structural unit of methyl methacrylate containing proportional preferably more than 15 % by weight, be more preferably 20 % by weight ~ 30 % by weight, be particularly preferably 25 % by weight ~ 30 % by weight.
In other embodiments, as the resin forming middle layer, preferably ethylene-vinyl acetate copolymer is used.When using ethylene-vinyl acetate copolymer, the structural unit being stemmed from ethene by adjustment is proportional with containing of the structural unit stemming from vinyl acetate, the storage modulus E ' (23) in middle layer, storage modulus E ' (50) and storage modulus E ' (80) can be controlled, the structural unit stemming from vinyl acetate is more, then storage modulus E ' becomes lower.In ethylene-vinyl acetate copolymer stem from the structural unit of vinyl acetate containing proportional be preferably 15 % by weight ~ 50 % by weight, be more preferably 25 % by weight ~ 35 % by weight.
The resin forming above-mentioned middle layer 190 DEG C, melt flow rate (MFR) under 2.16kgf is preferably 2g/10 minute ~ 20g/10 minute, be more preferably 5g/10 minute ~ 15g/10 minute, be particularly preferably 7g/10 minute ~ 15g/10 minute.If such scope, being then shaped by coextrusion can without the poorly formed middle layer of processing.Melt flow rate (MFR) can by measuring based on the method for JIS K7210.
Above-mentioned middle layer can also comprise other composition in the scope not damaging effect of the present invention.As this other composition, include, for example out antioxidant, UV light absorber, photostabilizer, heat-resisting stabilizing agent, static inhibitor etc.The kind of other composition and consumption suitably can be selected according to object.
c. binder layer
Above-mentioned binder layer comprises resin of binding property suitable arbitrarily.As above-mentioned resin of binding property, include, for example out the thermoplastic resins such as polyolefin-based resins, acrylic resin, phenylethylene resin series.Preferred use polyolefin-based resins.If use thermoplastic polyolefin-based resins, then can carry out coextrusion shaping with the resin forming above-mentioned middle layer with the resin forming aftermentioned substrate layer, the adhesive sheet of adhesiveness between layers excellence can be obtained.In addition, to be combined with the binder layer be made up of polyolefin-based resins by the middle layer of the storage modulus by as above operation adjustment, can realize the preferred flexibility of adhesive sheet entirety, its result, difference of altitude tracing ability significantly improves.
As the concrete example of polyolefin-based resins, ethylene copolymer, the polyolefin modified polymkeric substance etc. such as Low Density Polyethylene, ultra-low density polyethylene, amorphousness polypropylene-based resin (such as amorphousness propylene-(1-butylene) multipolymer, amorphousness propylene-ethylene copolymers etc.), ionomer resin, ethylene-vinyl acetate copolymer, ethene-(methyl) acrylic copolymer, ethene-(methyl) Acrylic Ester-Maleic Anhydride, ethylene-methyl methacrylate glycidyl ester copolymer can be listed.Wherein, amorphousness polypropylene-based resin is preferably.It should be noted that, in this manual, " amorphousness " refers to the character without the such sharp melting point of crystalline.
Above-mentioned resin of binding property 230 DEG C, melt flow rate (MFR) under 2.16kgf is preferably 1g/10 minute ~ 50g/10 minute, be more preferably 5g/10 minute ~ 30g/10 minute, be particularly preferably 5g/10 minute ~ 20g/10 minute.
Above-mentioned amorphousness polypropylene-based resin preferably can obtain by using metallocene catalyst propylene and the alkene except propylene to be carried out being polymerized.As the alkene except propylene, preferably 1-butylene, ethene etc. can be listed.The amorphousness polypropylene-based resin that use metallocene catalyst carries out being polymerized and obtains shows narrow molecular weight distribution.Specifically, the molecular weight distribution (Mw/Mn) of above-mentioned amorphousness polypropylene-based resin is less than 2.5, is preferably 1.0 ~ 2.3, is more preferably 1.0 ~ 2.1.Because the low molecular weight compositions in the amorphousness polypropylene-based resin of sharp molecular weight distribution is few, when therefore using such amorphousness polypropylene-based resin, the adhesive sheet that can prevent adherend from being polluted because of oozing out of low molecular weight compositions can be obtained.
In above-mentioned amorphousness polypropylene-based resin stem from the structural unit of propylene containing proportional be preferably 70 % by mole ~ 99 % by mole, be more preferably 75 % by mole ~ 99 % by mole, be particularly preferably 78 % by mole ~ 99 % by mole.
In above-mentioned amorphousness polypropylene-based resin stem from the structural unit of the alkene except propylene containing proportional be preferably 1 % by mole ~ 30 % by mole, be more preferably 1 % by mole ~ 12 % by mole.If such scope, then can obtain the adhesive sheet of the balancing good of toughness and flexibility, difference of altitude tracing ability excellence.
Above-mentioned amorphousness polypropylene-based resin can be segmented copolymer, also can be random copolymers.
The weight-average molecular weight (Mw) of above-mentioned amorphousness polypropylene-based resin is 100, more than 000, is preferably 100,000 ~ 500,000, is more preferably 100,000 ~ 300,000.If the weight-average molecular weight (Mw) of amorphousness polypropylene-based resin is such scope, then (Mw is 100 with common polystyrene thermoplastic resin, acrylic acid series thermoplastic resin, less than 000) compare low molecular weight compositions few, the adhesive sheet that can prevent adherend from polluting can be obtained.
The scope that above-mentioned amorphousness polypropylene-based resin is not damaging effect of the present invention can also comprise the structural unit stemming from other monomer.As other monomer, include, for example out the alpha-olefins such as 1-amylene, 1-hexene, 1-octene, 1-decene, 4-methyl-1-pentene, 3-Methyl-1-pentene.
Preferably, above-mentioned binder layer also comprises non-adhesive resin.By containing resin of binding property and non-adhesive resin, and adjust these resins kind and containing proportional, the bounding force of above-mentioned adhesive sheet can be controlled.
As above-mentioned non-adhesive resin, if with the Combination of above-mentioned resin of binding property well and do not show binding property, then can use the resin be applicable to arbitrarily.
As above-mentioned non-adhesive resin, include, for example out ethylene-vinyl acetate copolymer, ethylene methyl methacrylate multipolymer, polyester based resin (polyethylene terephthalate, PEN, polybutylene terephthalate, PBN etc.), polyolefin-based resins (polyethylene, polypropylene, ethylene-propylene copolymer etc.), polyvinyl alcohol, polyvinylidene dichloride, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate (PVA), polymeric amide, polyimide, cellulose family, fluorine resin, polyethers, polystyrene resin (polystyrene etc.), polycarbonate, polyethersulfone etc.Wherein, be preferably polypropylene-based resin, be more preferably crystalline polypropylene system resin.
Above-mentioned non-adhesive resin 230 DEG C, melt flow rate (MFR) under 2.16kgf is preferably 1g/10 minute ~ 50g/10 minute, be more preferably 5g/10 minute ~ 30g/10 minute, be particularly preferably 5g/10 minute ~ 20g/10 minute.
Above-mentioned polypropylene-based resin can be homopolymer, also can be the structural unit that the stems from propylene multipolymer as main structure unit.This copolymers stem from as comprised ethene, 1-amylene, 1-hexene, 1-octene, 1-decene, 4-methyl-1-pentene, alpha-olefin etc. can with the structural unit of the monomer of copolymerization of propylene.Above-mentioned polypropylene-based resin preferably obtains by using metallocene catalyst to carry out being polymerized in the same manner as above-mentioned amorphousness polypropylene-based resin.
The blending ratio of above-mentioned resin of binding property and non-adhesive resin can make blending ratio suitable arbitrarily according to the bounding force expected.Such as, the proportional total weight relative to resin of binding property and non-adhesive resin that contains of non-adhesive resin is preferably less than 70 % by weight, is more preferably less than 50 % by weight, is particularly preferably 18 % by weight ~ 30 % by weight.More specifically, when combinationally using amorphousness polypropylene-based resin and crystalline polypropylene system resin, proportional about containing of crystalline polypropylene system resin, preferably, relative to the total weight of above-mentioned amorphousness polypropylene-based resin and this crystalline polypropylene system resin, be preferably less than 50 % by weight, be more preferably 15 % by weight ~ 40 % by weight, be particularly preferably 18 % by weight ~ 30 % by weight.
Above-mentioned binder layer can also comprise other composition in the scope not damaging effect of the present invention.As this other composition, include, for example out antioxidant, UV light absorber, photostabilizer, heat-resisting stabilizing agent, static inhibitor etc.The kind of other composition and consumption suitably can be selected according to object.
The thickness of above-mentioned binder layer is preferably 5 μm ~ 30 μm, is more preferably 10 μm ~ 20 μm.
Storage modulus E ' at 23 DEG C of above-mentioned binder layer is preferably 0.5 × 10
6pa ~ 1.0 × 10
8pa, is more preferably 0.8 × 10
6pa ~ 3.0 × 10
7pa.If the scope that the storage modulus of above-mentioned binder layer is such, then can obtain and can have the abundant bounding force of the irregular adherend of effects on surface tool and the adhesive sheet of appropriate separability concurrently.In addition, the adhesive sheet possessing the binder layer with this storage modulus, when for semiconductor crystal wafer processing purposes, can contribute to the grinding precision realizing the excellence in the back grinding procedure of wafer.
In above-mentioned binder layer, product and the elasticity number of the storage modulus E ' of the binder layer at the thickness of binder layer and 70 DEG C are preferably below 0.7N/mm, are more preferably 0.01N/mm ~ 0.7N/mm, are particularly preferably 0.01N/mm ~ 0.25N/mm.If the scope that the elasticity number of above-mentioned binder layer is such, then, under needing the temperature of the situation protecting adherend actually, the concavo-convex of thing can be glued by good buried cover.
d. substrate layer
Above-mentioned substrate layer can be made up of resin suitable arbitrarily.As forming the resin of substrate layer, preferably using can the resin of extrusion molding, more preferably uses and can carry out the resin of coextrusion shaping with the resin forming binder layer and the resin forming middle layer.As the concrete example of the resin of formation substrate layer, ethylene-vinyl acetate copolymer can be listed, ethylene methyl methacrylate multipolymer, polyester based resin (polyethylene terephthalate, PEN, polybutylene terephthalate, PBN etc.), polyolefin-based resins (polyethylene, polypropylene, ethylene-propylene copolymer etc.), polyvinyl alcohol, polyvinylidene dichloride, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate (PVA), polymeric amide, polyimide, cellulose family, fluorine resin, polyethers, polystyrene resin (polystyrene etc.), polycarbonate, polyethersulfone etc.
Preferably, as the resin forming above-mentioned substrate layer, use the resin of excellent heat resistance.Such as, as the resin forming substrate layer, use fusing point is the resin of more than 100 DEG C.The fusing point forming the resin of substrate layer is preferably 100 DEG C ~ 150 DEG C, is more preferably 110 DEG C ~ 140 DEG C.Even if the substrate layer be made up of the resin of the fusing point with such scope at high temperature also can play the function as supporter fully.In addition; if the fusing point forming the resin of substrate layer is above-mentioned scope; under then needing the temperature (for example described above about 80 DEG C) of the situation protecting adherend actually, can obtain and can glue the concavo-convex of thing and the adhesive sheet of the function in middle layer can not be suppressed by better buried cover.
The resin forming above-mentioned substrate layer 230 DEG C, melt flow rate (MFR) under 2.16kgf is preferably 1g/10 minute ~ 50g/10 minute, be more preferably 5g/10 minute ~ 30g/10 minute, be particularly preferably 5g/10 minute ~ 25g/10 minute.
Above-mentioned substrate layer can also comprise other composition in the scope not damaging effect of the present invention.As this other composition, include, for example out antioxidant, UV light absorber, photostabilizer, heat-resisting stabilizing agent, static inhibitor etc.The kind of other composition and consumption suitably can be selected according to object.
The thickness of above-mentioned substrate layer is preferably 10 μm ~ 200 μm, is more preferably 20 μm ~ 150 μm.Adhesive sheet of the present invention can control bounding force by the thickness of adjustment substrate layer, if reduce the thickness of substrate layer, bounding force dies down, if increase thickness, and bounding force grow.
Storage modulus E ' at 23 DEG C of above-mentioned substrate layer is preferably 300MPa ~ 1500MPa, is more preferably 500MPa ~ 1000MPa.The substrate layer that storage modulus is such scope if possess, then can realize the preferred flexibility of adhesive sheet entirety, its result, difference of altitude tracing ability improves significantly.
e. the manufacture method of adhesive sheet
The formation material of each layer (such as binder layer, middle layer, substrate layer) forming adhesive sheet is preferably carried out coextrusion shaping and manufactures by adhesive sheet of the present invention.Be shaped by coextrusion, the good adhesive sheet of adhesiveness between layers can be manufactured with few process number and not with an organic solvent.
In above-mentioned coextrusion is shaped, the formation material forming each layer of adhesive sheet can use the material being carried out with any appropriate means by the composition of each layer being obtained by mixing.As binder layer formation material and when using two or more resins, preferably this resin melting is mixed.As the blending means of two or more resins forming binder layer, include, for example out: supply to forcing machine by resin granular material each other with the material that pellet state is blended from single hopper, and carry out the method that mixes when melt extruding shaping; Resin granular material is supplied to forcing machine with elevating hopper from 2 with controlling flow respectively, and carries out the method that mixes when melt extruding shaping; Make the resin granular material masterbatch that prior mixing roll etc. is blended each other, be supplied to forcing machine from single hopper, and carry out the method etc. that mixes when melt extruding shaping.
As the concrete grammar that above-mentioned coextrusion is shaped, include, for example out: respectively to the formation material supplying each layer for forming adhesive sheet in the multiple forcing machines being linked with mould, extrude after melting, utilize touch roll moulding method to draw, thus be configured as the method for duplexer.
The forming temperature that above-mentioned coextrusion is shaped is preferably 160 DEG C ~ 220 DEG C, is more preferably 170 DEG C ~ 200 DEG C.If such scope, then shape stability is excellent.
The film speed that above-mentioned coextrusion is shaped is preferably 3m/ minute ~ 30m/ minute.
The temperature of the touch roll that above-mentioned coextrusion is shaped is preferably 15 DEG C ~ 80 DEG C.
Embodiment
Below, illustrate the present invention by embodiment, but the present invention is not limited to these embodiments.It should be noted that, part represents weight part.
[embodiment 1]
Material is formed as binder layer, employ following mixture: amorphousness propylene-(1-butylene) multipolymer (the Sumitomo Chemical Co's system obtained as being undertaken being polymerized by metallocene catalyst of resin of binding property, trade(brand)name " TAFCELENE H5002 ", stem from the structural unit 10 % by mole of the structural unit 90 % by mole of propylene/stem from 1-butylene, Mw=230, 000, Mw/Mn=1.8) 80 parts with Propylene-ethylene random copolymer (Japan Polypropylene Corp.'s system obtained as being undertaken being polymerized by metallocene catalyst of non-adhesive resin, trade(brand)name " WINTEC WFX4 ", stem from the structural unit 4 % by mole of the structural unit 96 % by mole of propylene/stem from ethene, fusing point: 125 DEG C, softening temperature 115 DEG C) mixture of 20 parts.Amorphousness propylene-(1-butylene) multipolymer carries out with the following method with the profit that mixes of propylene-ethylene copolymers: supply to forcing machine by resin granular material each other with the material that pellet state is blended from single hopper, and carries out the method that mixes when melt extruding shaping.
Form material as middle layer, employ ethylene methyl methacrylate multipolymer (EMMA) (Sumitomo Chemical Co's system, trade(brand)name " ACRYFT WK307 ", stem from the structural unit of ethene: the structural unit 75 % by weight, stemming from methyl methacrylate: 25 % by weight)).
Form material as substrate layer, employ and undertaken being polymerized by metallocene catalyst and the polypropylene-ethylene copolymer (Japan Polypropylene Corp.'s system, trade(brand)name " WINTEC WSX02 ", fusing point: 125 DEG C) that obtains.
Above-mentioned tackiness agent is formed material, middle layer forms material and substrate layer formation material carries out T die melt coextrusion (extrusion temperature: 180 DEG C, film speed: 5m/ minute), by the resin of molten state and PET isolated body (the Teijin DuPont Films Japan Limited system being coated with Si passed into touch roll forming section (touch roll temperature: 50 DEG C), trade(brand)name " TETORON FILM G2 ") stacked after, cool, thus obtain adhesive sheet (substrate layer (thickness: 30 μm)/middle layer (thickness: 90 μm)/binder layer (thickness: 10 μm)/protective layer (thickness: 50 μm).
[embodiment 2 ~ 4, comparative example 1 ~ 6]
Except as shown in table 1 like that to the formation resin of binder layer, the thickness of binder layer with form except the resin in middle layer and the thickness of each layer sets, operate similarly to Example 1, obtain adhesive sheet.
It should be noted that, noting at foot of the resin recorded in table 1.
(resin of binding property)
" H6822S ": the resin compound (Sumitomo Chemical Co's system, trade(brand)name " TAFCELENE H6822S ") comprising propylene-(1-butylene) multipolymer, styrenic, ethylene-based polymer and butadiene-based polymkeric substance
(non-adhesive resin)
" FLX80E4 ": alfon (Sumitomo Chemical Co's system, trade(brand)name " FLX80E4 ")
" XM7070 ": alhpa olefin elastomerics (Mitsui Chemicals, Inc's system, trade(brand)name " TAFMER XM7070 ")
" BL3450 ": alhpa olefin elastomerics (Mitsui Chemicals, Inc's system, trade(brand)name " TAFMER BL3450 ")
" A4070S ": alhpa olefin elastomerics (Mitsui Chemicals, Inc's system, trade(brand)name " TAFMER A4070S ")
(forming the resin in middle layer)
" V523 ": ethylene-vinyl acetate copolymer (Du Pont-Mitsui Polychemicals Co., Ltd. system, trade(brand)name " EVAFLEX V523 ", stems from the structural unit of ethene: the structural unit 67 % by weight, stemming from vinyl acetate: 33 % by weight)
" EV250 ": ethylene-vinyl acetate copolymer (Du Pont-Mitsui Polychemicals Co., Ltd. system, trade(brand)name " EVAFLEX EV250 ", stems from the structural unit of ethene: the structural unit 72 % by weight, stemming from vinyl acetate: 28 % by weight)
" P1007 ": ethylene-vinyl acetate copolymer (Du Pont-Mitsui Polychemicals Co., Ltd. system, trade(brand)name " EVAFLEX ", stems from the structural unit of ethene: the structural unit 90 % by weight, stemming from vinyl acetate: 10 % by weight)
" VISTAMAXX6202 ": low-crystalline polypropylene (Exxon Mobil Corp. system, trade(brand)name " VISTAMAXX6202 "
(forming the resin of substrate layer)
" WSX02 ": undertaken being polymerized by metallocene catalyst and the Propylene-ethylene random copolymer (Japan Polypropylene Corp.'s system, trade(brand)name " WINTEC WSX02 ") obtained
[evaluation]
By the adhesive sheet that obtains in embodiment and comparative example for following evaluation.Result is shown in table 1.It should be noted that, the storage modulus in middle layer uses Measurement of Dynamic Viscoelasticity device (Rheometric Scientific, Inc. system, trade(brand)name " ARES "), with the storage modulus at the frequency measurement 23 DEG C, 50 DEG C and 80 DEG C of 1Hz.
(1) operability
The fault being attached to device by whether there is this adhesive sheet during the circuit that adhesive sheet passed into grinding back surface glue tape adhesive machine (Dong Jing machine Co., Ltd. DR-3000III) at 23 DEG C evaluates operability.
(2) difference of altitude tracing ability (projection buries the property covered)
Use grinding back surface glue tape adhesive machine (Dong Jing machine Co., Ltd. DR-3000III), when adhesive sheet transporting velocity 10mm/ second, laminating pressurization 0.20MPa condition under, to semiconductor crystal wafer (being formed with 4 inches of silicon mirror wafers of the projection at height 30 μm, 15 μm/interval) adhesive sheet of fitting.After laminating, the semiconductor crystal wafer of subsidiary adhesive sheet is placed in the environment of 80 DEG C, whether is fitted with adhesive sheet with the space that opticmicroscope (250 times) is observed between projection-projection, thus evaluate difference of altitude tracing ability.In table 1, the situation this space being fitted with adhesive sheet is designated as zero, be not fitted with the situation of adhesive sheet is designated as ×.
In addition, use semiconductor crystal wafer (being formed with 4 inches of silicon mirror wafers of the projection at height 50 μm, 50 μm/interval) as adherend, carry out same evaluation with above-mentioned.
[table 1]
utilizability in industry
Adhesive sheet of the present invention such as can compatibly for the protection etc. of semiconductor crystal wafer.
Claims (3)
1. an adhesive sheet, it possesses binder layer, middle layer and substrate layer successively,
Storage modulus E ' (23) at 23 DEG C of this middle layer is 10MPa ~ 50MPa,
Storage modulus E ' (23) at 23 DEG C of this middle layer is less than 5 with the ratio of storage modulus E ' (50) at 50 DEG C and E ' (23)/E ' (50),
Storage modulus E ' (23) at 23 DEG C of this middle layer is 90 ~ 200 with the ratio of storage modulus E ' (80) at 80 DEG C and E ' (23)/E ' (80).
2. adhesive sheet according to claim 1, wherein, described binder layer comprises polyolefin-based resins.
3. adhesive sheet according to claim 1 and 2, wherein, the thickness in described middle layer is 60 μm ~ 300 μm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-130481 | 2013-06-21 | ||
| JP2013130481A JP6159163B2 (en) | 2013-06-21 | 2013-06-21 | Adhesive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104231962A true CN104231962A (en) | 2014-12-24 |
Family
ID=52220891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410281410.8A Pending CN104231962A (en) | 2013-06-21 | 2014-06-20 | Bonding sheet |
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| Country | Link |
|---|---|
| JP (1) | JP6159163B2 (en) |
| CN (1) | CN104231962A (en) |
| TW (1) | TW201500513A (en) |
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| CN109891253A (en) * | 2016-10-27 | 2019-06-14 | 三井化学东赛璐株式会社 | The manufacturing method of electronic device, electronic device manufacture adherence film and apparatus for electronic device test |
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| CN109937245A (en) * | 2016-11-17 | 2019-06-25 | 琳得科株式会社 | Semiconductor machining bonding sheet |
| CN110172308A (en) * | 2016-11-21 | 2019-08-27 | 日东电工株式会社 | Bonding sheet |
| WO2018219129A1 (en) * | 2017-06-01 | 2018-12-06 | 京东方科技集团股份有限公司 | Adhesive film and preparation method therefor, flexible display module |
| CN110819249A (en) * | 2018-08-07 | 2020-02-21 | 日东电工株式会社 | Back grinding belt |
| CN110819249B (en) * | 2018-08-07 | 2024-03-01 | 日东电工株式会社 | Back grinding belt |
| CN112055736A (en) * | 2019-04-08 | 2020-12-08 | 古河电气工业株式会社 | Adhesive tape for electronic component and method for processing electronic component |
| CN112055736B (en) * | 2019-04-08 | 2022-05-27 | 古河电气工业株式会社 | Adhesive tape for electronic component and method for processing electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015004003A (en) | 2015-01-08 |
| TW201500513A (en) | 2015-01-01 |
| JP6159163B2 (en) | 2017-07-05 |
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