CN104228211B - Adhesive-free polyimide copper-clad plate, and manufacturing method and application thereof - Google Patents
Adhesive-free polyimide copper-clad plate, and manufacturing method and application thereof Download PDFInfo
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- CN104228211B CN104228211B CN201410511424.4A CN201410511424A CN104228211B CN 104228211 B CN104228211 B CN 104228211B CN 201410511424 A CN201410511424 A CN 201410511424A CN 104228211 B CN104228211 B CN 104228211B
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Abstract
The invention relates to a manufacturing method of an adhesive-free polyimide copper-clad plate. The manufacturing method comprises the following steps: S1: blending short fibers or fiber powder in a DMT solution containing 12%-23% of polyamide acid according to weight percentage, and stirring and blending uniformly; S2: uniformly coating the mixture on a copper foil and heating to remove a solvent in the DMF solution, wherein the heating temperature is 150-250 DEG C; S3: continuing to heat to 300-450 DEG C to achieve imidization of the polyamide acid, forming the polyimide and firmly adhering the polyimide on the copper foil, so as to obtain the adhesive-free polyimide copper-clad plate. The fiber component is added into the polyimide, the costs for manufacturing the copper-clad plate and a circuit board are lowered, the strengths of the copper-clad plate and the circuit board are improved, the expansion and the shrinkage are small, the size is stable, and the quality stability of the copper-clad plate and the circuit board is improved. In addition, no adhesive is used, the materials used are saved, the manufacturing process is reduced, and the production cost is lowered.
Description
Technical field
The present invention relates to the improved technology of wiring board.
Background technology
Traditional wiring board, especially traditional flexible PCB, are covered using heatproof resin solder mask
Epiphragma, such as polyimide film (PI films), such high cost, then we are by substantial amounts of experiment discovery, the paper of many kinds
Scolding tin temperature, such as kraft paper etc. can be withstood, the present invention is done coverlay using paper base material and achieved successfully, uses paper substrate
Material does coverlay dimensionally stable, low cost.
Also, existing coverlay is adhered on Copper Foil by bonding agent, for bonding agent require it is higher, cost compared with
Height, processing technology is more.
The content of the invention
In order to overcome deficiency of the prior art, an object of the present invention to be to provide a kind of nothing without using bonding agent
Glue polyimide copper clad lamination manufacture method.
In order to solve above-mentioned technical problem, this comprises the steps without glue polyimide copper clad lamination manufacture method：
S1：Mix chopped fiber or fiber powder in the DMF solution containing the polyamic acid of percentage by weight 12%~23%, and stir
Mix mix homogeneously；
S2：Mixture is evenly applied on Copper Foil and is heated, 150 degrees Celsius~250 degrees Celsius of heating-up temperature is removed
The solvent gone in DMF solution；
S3：Continue to be heated to 300 degrees Celsius~450 degrees Celsius, make polyamic acid imidization, form polyimides simultaneously firmly
It is affixed on Copper Foil, is thus obtained without glue polyimide copper clad lamination.
Wherein, in S1 steps, the content of the fiber is 1%~98% percentage by weight.
Wherein, mixture is cast to by copper foil surface using the tape casting in S2 steps.
It is a further object of the present invention to provide one kind is without glue polyimide copper clad lamination, the structure for covering copper plate is succinct, without the need for making
Use bonding agent.
In order to solve above-mentioned technical problem, this programme is：It is a kind of without glue polyimide copper clad lamination, including copper foil layer and poly-
Imide layer, described polyimide layer contains the chopped fiber or fiber powder of 1%~98% percentage by weight, and polyimide layer leads to
Cross imidization technique and be directly affixed on copper foil layer surface.
Wherein, between 0.1mm~2mm, diameter is between 0.1mm~0.8mm for the staple length；The fiber powder
Particle diameter is between 0. 1mm~0.8mm.
Wherein, the fiber is glass fibre or asbestos fibre or sepiolite fibre or ceramic fibre or alumina fibre.
Wherein, the fiber is cellulose fibre or animal hair fiber.
Additionally, the present invention also provides a kind of above-mentioned application without glue polyimide copper clad lamination, specifically, this is without glue polyamides
Imines copper-clad plate is applied in wiring board, and the wiring board is one-sided circuit board either double-sided wiring board or multilamellar dual platen.
The present invention reduces the cost for making copper-clad plate and wiring board by adding fibre composition in pi,
The intensity of copper-clad plate and wiring board is improve, harmomegathus is little, dimensionally stable, improve the steady quality of copper-clad plate and wiring board
Property.Also, without using bonding agent, materials are saved, reduce manufacturing process, reduce production cost.
Specific embodiment
In order to allow those skilled in the art to more fully understand technical scheme, with reference to embodiment to this
It is bright to be further elaborated.
One kind comprises the steps without glue polyimide copper clad lamination manufacture method：
S1：In the DMF containing the polyamic acid of percentage by weight 18%（Dimethylformamide）Mix chopped fiber or fibre in solution
Dimension powder, and be uniformly mixed；
S2：Mixture is adopted into the tape casting（The method is prior art, be will not be described here）Uniformly prolong and flow in 35Um copper
On paper tinsel and heated, 200 degrees Celsius of heating-up temperature, removed the solvent in DMF solution；
S3：Continue to be heated to 350 degrees Celsius, make polyamic acid imidization, form polyimides and be firmly affixed on Copper Foil,
Thus it is obtained without glue polyimide copper clad lamination.
Wherein, in S1 steps, the content of the fiber is 20% percentage by weight.
In the above-mentioned methods, without the need for adding bonding agent, the mode that manufacturing process needs glue bonding with tradition is convenient,
Reduce manufacturing process.
By including copper foil layer and polyimide layer, polyimides without glue polyimide copper clad lamination obtained in said method
Chopped fiber of the layer containing 1%~98% percentage by weight or fiber powder, polyimide layer is directly affixed on copper by imidization technique
Layers of foil surface.Wherein, the staple length can be between 0.1mm~2mm, and diameter can be between 0.1mm~0.8mm；It is described
Fiber powder particle diameter can be between 0. 1mm~0.8mm.Copper-clad plate under the version in pi by adding fiber
Composition, reduces the cost of making, improves copper-clad plate intensity, and harmomegathus is little, dimensionally stable, improves copper-clad plate steady quality
Property.
For the concrete selection of fiber, what the present embodiment was selected is inorganic material fiber, naturally it is also possible to for glass fibre
Or asbestos fibre or sepiolite fibre or ceramic fibre or alumina fibre or organic material fiber or cellulose fibre or animal
Hair fiber.
The copper-clad plate of said structure, in can be applicable to wiring board, forms and has the wiring board without glue polyimide copper clad lamination,
The wiring board is one-sided circuit board either double-sided wiring board or multilamellar dual platen.
In the above-described embodiments, for the content of polyamic acid can be any value between 12%~23%, such as 12% or 23%,
Heating-up temperature in S2 steps can be any value between 150 degrees Celsius~250 degrees Celsius, such as 150 degrees Celsius or 250 degrees Celsius
Can be any value between 300 degrees Celsius~450 degrees Celsius Deng, the heating-up temperature in S3 steps, such as 300 degrees Celsius or 450 Celsius
Degree etc., the content of fiber can be any value between 1%~98%, such as 1% or 30% or 50% or 80% or 98%, above-mentioned parameter
Selection can reach identical technique effect, and here is not repeated one by one.
The above is the better embodiment of the present invention, and any pro forma restriction is not made to the present invention.Need
Bright, in the case of without departing substantially from spirit of the invention and its essence, those of ordinary skill in the art work as can be according to the present invention
Various corresponding changes and deformation are made, but these changes and deformation should all belong to the protection model of appended claims of the invention
Enclose.
Claims (5)
1. one kind is without glue polyimide copper clad lamination manufacture method, it is characterised in that comprise the steps：
S1：Mix chopped fiber or fiber powder in the DMF solution containing the polyamic acid of percentage by weight 12%~23%, and stir mixed
Close uniform；
S2：Mixture is evenly applied on Copper Foil and is heated, 150 degrees Celsius~250 degrees Celsius of heating-up temperature is removed
Solvent in DMF solution；
S3：Continue to be heated to 300 degrees Celsius~450 degrees Celsius, make polyamic acid imidization, form polyimides and be firmly affixed on
On Copper Foil, thus it is obtained without glue polyimide copper clad lamination；
In S1 steps, the content of the fiber is 1%~98% percentage by weight；
Mixture is cast to by copper foil surface using the tape casting in S2 steps.
2. one kind is without glue polyimide copper clad lamination, including copper foil layer and polyimide layer, it is characterised in that described polyamides is sub-
Amine layer contains the chopped fiber or fiber powder of 1%~98% percentage by weight, and polyimide layer is directly affixed on by imidization technique
Copper Foil layer surface；
Between 0.1mm~2mm, diameter is between 0.1mm~0.8mm for the staple length；The fiber powder particle diameter is 0.
Between 1mm~0.8mm.
3. it is according to claim 2 without glue polyimide copper clad lamination, it is characterised in that the fiber is glass fibre or stone
Cotton fiber or sepiolite fibre or ceramic fibre or alumina fibre.
4. according to claim 2 without glue polyimide copper clad lamination, it is characterised in that the fiber be cellulose fibre or
Animal hair fiber.
5. the application without glue polyimide copper clad lamination described in a kind of claim 2, it is characterised in that this is without glue coated polyimide
Copper coin is applied in wiring board, and the wiring board is one-sided circuit board either double-sided wiring board or multilamellar dual platen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410511424.4A CN104228211B (en) | 2014-09-29 | 2014-09-29 | Adhesive-free polyimide copper-clad plate, and manufacturing method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410511424.4A CN104228211B (en) | 2014-09-29 | 2014-09-29 | Adhesive-free polyimide copper-clad plate, and manufacturing method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104228211A CN104228211A (en) | 2014-12-24 |
| CN104228211B true CN104228211B (en) | 2017-05-17 |
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| CN201410511424.4A Active CN104228211B (en) | 2014-09-29 | 2014-09-29 | Adhesive-free polyimide copper-clad plate, and manufacturing method and application thereof |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106675027A (en) * | 2016-12-31 | 2017-05-17 | 铜陵华科电子材料有限公司 | Formula for high-TG polyimide copper-clad plate curing agent material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101322448A (en) * | 2005-10-14 | 2008-12-10 | 宇部兴产株式会社 | Process for producing metal wiring board |
| CN101648449A (en) * | 2008-08-16 | 2010-02-17 | 比亚迪股份有限公司 | Metal laminated plate and preparation method thereof |
| CN102304228A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Polyamic acid, two-layer flexible copper clad laminate prepared from same, and manufacturing method for two-layer flexible copper clad laminate |
| CN102673047A (en) * | 2012-05-28 | 2012-09-19 | 珠海亚泰电子科技有限公司 | Fabricating method of thermal conducting halogen-free binderless copper clad foil |
-
2014
- 2014-09-29 CN CN201410511424.4A patent/CN104228211B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101322448A (en) * | 2005-10-14 | 2008-12-10 | 宇部兴产株式会社 | Process for producing metal wiring board |
| CN101648449A (en) * | 2008-08-16 | 2010-02-17 | 比亚迪股份有限公司 | Metal laminated plate and preparation method thereof |
| CN102304228A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Polyamic acid, two-layer flexible copper clad laminate prepared from same, and manufacturing method for two-layer flexible copper clad laminate |
| CN102673047A (en) * | 2012-05-28 | 2012-09-19 | 珠海亚泰电子科技有限公司 | Fabricating method of thermal conducting halogen-free binderless copper clad foil |
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| Publication number | Publication date |
|---|---|
| CN104228211A (en) | 2014-12-24 |
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