CN104226895A - Using method of release agent for copper anode plate casting - Google Patents
Using method of release agent for copper anode plate casting Download PDFInfo
- Publication number
- CN104226895A CN104226895A CN201410475140.4A CN201410475140A CN104226895A CN 104226895 A CN104226895 A CN 104226895A CN 201410475140 A CN201410475140 A CN 201410475140A CN 104226895 A CN104226895 A CN 104226895A
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- CN
- China
- Prior art keywords
- releasing agent
- copper
- copper mold
- casting
- emulsion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 113
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 101
- 239000010949 copper Substances 0.000 title claims abstract description 99
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 99
- 238000005266 casting Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000839 emulsion Substances 0.000 claims abstract description 35
- 239000010410 layer Substances 0.000 claims description 21
- 239000011241 protective layer Substances 0.000 claims description 18
- 238000005507 spraying Methods 0.000 claims description 18
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 claims description 17
- 239000007921 spray Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000003973 paint Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052810 boron oxide Inorganic materials 0.000 claims description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000292 calcium oxide Substances 0.000 claims description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 239000006082 mold release agent Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000003643 water by type Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 7
- 230000005587 bubbling Effects 0.000 description 3
- 238000000280 densification Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007970 homogeneous dispersion Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 210000004400 mucous membrane Anatomy 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Electrolytic Production Of Metals (AREA)
- Mold Materials And Core Materials (AREA)
Abstract
The invention discloses a using method of a release agent for copper anode plate casting. The using method comprises steps as follows: a release agent emulsion is prepared; the release agent emulsion is sprayed; the release agent emulsion forms a release agent protection layer; the release agent protection layer is sintered to form a release agent sintered layer; and the release agent sintered layer is separated from an anode plate. According to the method, the release agent forms the release agent sintered layer on the surface of a copper mold, conditions that the copper mold is adhered to the anode plate are reduced, pores and bubbles on the surface of the anode plate are reduced, the quality of the anode plate is improved, the copper mold is protected, and the service life of the copper mold is prolonged.
Description
Technical field
The present invention relates to the using method of Copper Anode Plate Casting releasing agent.
Background technology
In the casting cycle of existing Copper making technique anode copper, Outokumpu Rotating caster is widely used, and the mould-type that Rotating caster uses is divided into punching block and copper mold, in production process can not there is the phenomenon of positive plate sticking to mould in punching block, but punching block damages Hou Tong manufacturing enterprise cannot complete reparation and processing, other relevant enterprise processing must be arrived, incur loss through delay manufacturing schedule, increase production cost.And after copper mold damage; can be cast by manufacturing enterprise's self-organization, substantially increase produce convenient, but there is the phenomenon of sticking to mould due to copper mold and casting anode copper coin out; so when using copper mold in order to protect copper mold to reduce the generation avoiding mold sticking, must releasing agent be used.Releasing agent is generally powdery, is divided in use and directly smears dry powder and spray two kinds of modes after dry powder and water are mixed to form emulsion.The manufacturing enterprise of spraying emulsion is adopted for majority, reasonable spraying releasing agent reduces copper mold Failure Factors in positive plate casting cycle, extend the effective means in copper mold service life, owing to there is larger thermograde between copper water during casting and copper mold, thus the local melting and positive plate of copper mold is bonded together, the existence of releasing agent can optimize copper mold and positive plate departs from situation minimizing or avoids the generation of mold sticking, covering the physical specification that the smooth releasing agent of mould effectively can improve positive plate makes positive plate more smooth, can also form good separation layer between copper mold and positive plate plays heat-blocking action simultaneously, thus the failure effect reducing copper mold to reduce because temperature field raises repeatedly and cause.
Spraying and the casting quality relation of releasing agent are very large.When releasing agent sprays from injection apparatus if non-atomized or non-homogeneous dispersion, the vaporization of the fluid requirements longer time of cohesion, do not complete with regard to matched moulds when this process and by force molten metal be pressed into, will speed up the vaporization of releasing agent and form higher vapour pressure, this causes the root that foundry goods is loose often.Water based paint is very high to technological requirement.There is strict demand to mould temperature, have one " wetting temperature ".Mould temperature is lower than this limit, and coating could film forming.Composition is different, and " wetting temperature " is different.The thickness of paint film also will strictly control, and time too thick, cooling is slow, and easily form pore, cast(ing) surface also creases easily; Easily split time too thin, cast(ing) surface plays vestige.
Summary of the invention
The object of the present invention is to provide a kind of using method of Copper Anode Plate Casting releasing agent, can reduce the generation of copper mold and positive plate adhesion situation, reduce pore bubbling, protection copper mold, improves anode plate quality.
The invention provides a kind of using method of Copper Anode Plate Casting releasing agent, comprise the following steps:
Prepare releasing agent emulsion;
Spray described releasing agent emulsion;
Described releasing agent emulsion forms releasing agent protective layer;
Described releasing agent protective layer sintering forms releasing agent sinter layer;
Described releasing agent sinter layer and positive plate depart from.
Preparing releasing agent emulsion step is mixed by quality liquid-solid ratio 1.8 ~ 2.2:1 with releasing agent by water, and water temperature 65 DEG C, to 85 DEG C, stirs, and maintains and stablizes stirring, prevent releasing agent from precipitating in use procedure.
Spraying described releasing agent emulsion step is, copper mold preheating on casting machine is reached 150 DEG C to 200 DEG C, then the releasing agent emulsion prepared is connected with paint finishing, open the normal production order, when the copper mold on casting machine forwards the spray station of paint finishing to, control direct spraying releasing agent emulsion by console, the amount of every block copper mold surface spraying emulsion controls at 1.95kg/m
2to 2.25kg/m
2, after spraying completes one piece of copper mold, casting machine rotates, and next block copper mold enters spray station, repeats spraying process.
Described releasing agent emulsion forms releasing agent protective layer step; to be sprayed complete after; the copper mold coating releasing agent turns to casting station through the time of 120 seconds to 150 seconds; in this this process; moisture evaporation in releasing agent emulsion; powdered mold release agents is evenly attached on described copper mold, fills up the crack that copper mold surface is tiny, forms releasing agent protective layer.
Described releasing agent protective layer sintering forms releasing agent sinter layer step; treat that disk rotational arrives cast station; console controls copper water and pours into copper mold; copper water cast temperature is 1150 DEG C to 1240 DEG C; when copper water waters on the copper mold being coated with releasing agent; releasing agent protective layer sinters, and forms fine and close smooth releasing agent sinter layer.
Described releasing agent sinter layer and positive plate depart from step, after having cast, copper mold is rotated further to mentioning positive plate station, copper water condensation becomes positive plate, with playing plate system, positive plate is taken out, the pond putting into cooling system cools, and due to the significance difference distance of the thermal coefficient of expansion of releasing agent sinter layer and copper, the sheet releasing agent sinter layer sintered into is separated with positive plate and comes off.
Copper Anode Plate Casting releasing agent described in this method is a kind of compound releasing agent, and its composition, by quality proportioning, comprises 30% ~ 70% barium sulfate, 2.5% ~ 15% boron oxide, 20% ~ 45% silica, 1% ~ 8% calcium oxide and 1% ~ 7% aluminium oxide.
Beneficial effect of the present invention is; in casting cycle, suitable release agent coating can be formed in copper mold surface by this method; this coating and copper mold adhesion-tight; not easily by copper broken off by water flush; under the effect of copper water high temperature; the sinter layer forming smooth densification can be sintered; be attached to copper mold surface, can copper mold be protected, isolation effect completely can be played between copper mold and positive plate again; positive plate and copper mold is made to be easy to be separated; reduce the generation of positive plate mucous membrane situation, protection copper mold, extend copper mold service life; reduce pore bubbling, improve positive plate type quality.
Detailed description of the invention
Hereafter in detail embodiments of the present invention will be described.It should be noted that the combination of technical characteristic or the technical characteristic described in following embodiment should not be considered to isolated, they mutually can be combined and be combined with each other thus reach better technique effect.
A kind of Copper Anode Plate Casting releasing agent occupation mode, comprises the following steps:
Prepare releasing agent emulsion.Water is mixed by quality liquid-solid ratio 1.8 ~ 2.2:1 with releasing agent, water temperature 65 DEG C to 85 DEG C, and stir, maintain in use procedure and stablize stirring, prevent releasing agent from precipitating.Releasing agent used is a kind of compound releasing agent, and its composition, by quality proportioning, comprises 30% ~ 70% barium sulfate, 2.5% ~ 15% boron oxide, 20% ~ 45% silica, 1% ~ 8% calcium oxide and 1% ~ 7% aluminium oxide.
Spraying releasing agent emulsion.Copper mold preheating on Rotating caster is reached 150 DEG C to 200 DEG C, then the releasing agent emulsion prepared is connected with paint finishing, open the normal production order, when the copper mold on Rotating caster forwards the spray station of paint finishing to, controlled directly to carry out spraying releasing agent emulsion by console, the amount of every block copper mold surface spraying emulsion controls at 1.95kg/m
2to 2.25kg/m
2, when spraying completes one piece of copper mold, Rotating caster rotates, and next block copper mold enters spray station, repeats spraying process.
Releasing agent emulsion forms releasing agent protective layer.After Rotating caster has sprayed, the copper mold coating releasing agent rotates through the time of 120 ~ 150 seconds and enters casting station.In this process, the moisture evaporation in releasing agent emulsion, powdered mold release agents is evenly attached on copper mold, fills up in the crack that copper mold surface is tiny, forms releasing agent protective layer.
Releasing agent protective layer sintering forms releasing agent sinter layer.After the copper mold having sprayed releasing agent emulsion enters casting station; console controls copper water and pours into copper mold; the cast temperature of copper water is 1150 DEG C to 1240 DEG C; when copper water waters on the copper mold being coated with releasing agent; releasing agent protective layer sinters, and forms the sheet sinter layer of smooth densification, and this sinter layer is present between copper water and copper mold; play insulation blocking copper mold, prevent positive plate and copper mold from gluing glutinous effect.
Releasing agent sinter layer and positive plate depart from.After completing casting cycle, copper mold then rotates, copper water cooling, and when copper mold forwards the station of mentioning positive plate to, copper water condensation becomes copper coin, being taken out by positive plate, due to the existence of releasing agent, having avoided mold sticking during plate with playing plate system from copper mold.After playing plate, releasing agent part is attached on copper mold, and part is attached on copper anode plate.After having completed plate, pond positive plate being put into cooling system cools, and this process is due to the significance difference distance of the thermal coefficient of expansion of releasing agent and copper, and the sheet releasing agent sinter layer sintered into is separated with copper anode plate and comes off.
The present invention can form suitable release agent coating on copper mold surface by above method in casting cycle, this coating and copper mold adhesion-tight, not easily by copper broken off by water flush, under the effect of copper water high temperature, the sinter layer forming smooth densification can be sintered, be attached to copper mold surface, copper mold can be protected, isolation effect completely can be played again between copper mold and positive plate, positive plate and copper mold is made to be easy to be separated, reduce the generation of copper mold and positive plate adhesion situation, protection copper mold, extend copper mold service life, reduce positive plate pore bubbling simultaneously, improve positive plate type quality.
Although give some embodiments of the present invention, it will be understood by those of skill in the art that without departing from the spirit of the invention herein, can change embodiment herein.Above-mentioned embodiment is exemplary, should using embodiment herein as the restriction of interest field of the present invention.
Claims (7)
1. a using method for Copper Anode Plate Casting releasing agent, is characterized in that, comprises the following steps:
Prepare releasing agent emulsion;
Spray described releasing agent emulsion;
Described releasing agent emulsion forms releasing agent protective layer;
Described releasing agent protective layer sintering forms releasing agent sinter layer;
Described releasing agent sinter layer and positive plate depart from.
2. Copper Anode Plate Casting releasing agent using method as claimed in claim 1, it is characterized in that: described releasing agent emulsion step of preparing is mixed by quality liquid-solid ratio 1.8 ~ 2.2:1 with releasing agent by water, water temperature 65 DEG C to 85 DEG C, stir, maintain in use procedure and stablize stirring.
3. Copper Anode Plate Casting releasing agent using method as claimed in claim 1, it is characterized in that: described spraying releasing agent emulsion step is, copper mold preheating on casting machine is reached 150 DEG C to 200 DEG C, then the described releasing agent emulsion prepared is connected with paint finishing, open the normal production order, when on described casting machine, copper mold forwards the spray station of described paint finishing to, control releasing agent emulsion described in direct spraying by console, described in every block copper mold surface spraying, the amount of releasing agent emulsion is 1.95kg/m
2to 2.25kg/m
2, after spraying completes, described casting machine rotates, and next block copper mold enters spray station, repeats spraying process.
4. Copper Anode Plate Casting releasing agent using method as claimed in claim 1; it is characterized in that: described releasing agent emulsion forms releasing agent protective layer step and is; to be sprayed complete after; the copper mold coating described releasing agent emulsion turned to casting station through 120 seconds to 150 seconds; in this this process, the moisture evaporation in described releasing agent emulsion, powdered mold release agents is evenly attached on described copper mold; fill up the crack that copper mold surface is tiny, form described releasing agent protective layer.
5. Copper Anode Plate Casting releasing agent using method as claimed in claim 1; it is characterized in that: described releasing agent protective layer sintering forms releasing agent sinter layer step and is; described releasing agent emulsion to be sprayed; and the copper mold forming described releasing agent protective layer arrives casting station; console controls copper water and pours into described copper mold; described copper water cast temperature is 1150 DEG C to 1240 DEG C; when described copper water waters on the copper mold being coated with described releasing agent protective layer; described releasing agent protective layer sinters, and forms described releasing agent sinter layer.
6. Copper Anode Plate Casting releasing agent using method as claimed in claim 1, it is characterized in that: described releasing agent sinter layer and positive plate depart from step and be, after casting completes, described copper mold is rotated further to mentioning positive plate station, copper water condensation becomes positive plate, taken out by positive plate with playing plate system, the pond putting into cooling system cools, and described releasing agent sinter layer is separated with positive plate and comes off.
7. Copper Anode Plate Casting releasing agent using method as claimed in claim 1, it is characterized in that: described Copper Anode Plate Casting releasing agent is a kind of compound releasing agent, its composition comprises 30% ~ 70% barium sulfate, 2.5% ~ 15% boron oxide, 20% ~ 45% silica, 1% ~ 8% calcium oxide and 1% ~ 7% aluminium oxide by mass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410475140.4A CN104226895B (en) | 2014-09-17 | 2014-09-17 | A kind of using method of Copper Anode Plate Casting releasing agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410475140.4A CN104226895B (en) | 2014-09-17 | 2014-09-17 | A kind of using method of Copper Anode Plate Casting releasing agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104226895A true CN104226895A (en) | 2014-12-24 |
| CN104226895B CN104226895B (en) | 2016-08-24 |
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|---|---|---|---|
| CN201410475140.4A Active CN104226895B (en) | 2014-09-17 | 2014-09-17 | A kind of using method of Copper Anode Plate Casting releasing agent |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106513567A (en) * | 2016-10-10 | 2017-03-22 | 佛山市高明区明城镇新能源新材料产业技术创新中心 | Novel environment-friendly casting coating and preparation method and using method thereof |
| CN108356215A (en) * | 2018-04-11 | 2018-08-03 | 昆明理工大学 | A kind of Copper Anode Plate Casting releasing agent application method |
| CN108941445A (en) * | 2018-07-31 | 2018-12-07 | 铜陵旭时新材料科技有限公司 | A kind of application method of Rotating caster release agent |
| CN110093628A (en) * | 2019-04-30 | 2019-08-06 | 云南铜业股份有限公司西南铜业分公司 | A kind of copper electrolyzing refining method generating core-shell structure copper anode mud |
-
2014
- 2014-09-17 CN CN201410475140.4A patent/CN104226895B/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106513567A (en) * | 2016-10-10 | 2017-03-22 | 佛山市高明区明城镇新能源新材料产业技术创新中心 | Novel environment-friendly casting coating and preparation method and using method thereof |
| CN108356215A (en) * | 2018-04-11 | 2018-08-03 | 昆明理工大学 | A kind of Copper Anode Plate Casting releasing agent application method |
| CN108356215B (en) * | 2018-04-11 | 2019-12-03 | 昆明理工大学 | A kind of Copper Anode Plate Casting release agent application method |
| CN108941445A (en) * | 2018-07-31 | 2018-12-07 | 铜陵旭时新材料科技有限公司 | A kind of application method of Rotating caster release agent |
| CN108941445B (en) * | 2018-07-31 | 2020-12-18 | 铜陵旭时新材料科技有限公司 | Application method of release agent for disc casting machine |
| CN110093628A (en) * | 2019-04-30 | 2019-08-06 | 云南铜业股份有限公司西南铜业分公司 | A kind of copper electrolyzing refining method generating core-shell structure copper anode mud |
| CN110093628B (en) * | 2019-04-30 | 2021-06-08 | 云南铜业股份有限公司西南铜业分公司 | Copper electrolytic refining method for generating core-shell structure copper anode mud |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104226895B (en) | 2016-08-24 |
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