CN104226895B - A kind of using method of Copper Anode Plate Casting releasing agent - Google Patents
A kind of using method of Copper Anode Plate Casting releasing agent Download PDFInfo
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- CN104226895B CN104226895B CN201410475140.4A CN201410475140A CN104226895B CN 104226895 B CN104226895 B CN 104226895B CN 201410475140 A CN201410475140 A CN 201410475140A CN 104226895 B CN104226895 B CN 104226895B
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Abstract
The invention discloses the using method of a kind of Copper Anode Plate Casting releasing agent, comprise the following steps: prepare releasing agent emulsion；Spraying releasing agent emulsion；Releasing agent emulsion forms releasing agent protective layer；Releasing agent protective layer sintering forms releasing agent sinter layer；Releasing agent sinter layer departs from positive plate.Releasing agent can be made on copper mold surface to form one layer of releasing agent sinter layer by this method, reduce the generation of copper mold and positive plate adhesion situation, reduce positive plate plate face pore bubbling, improve anode plate quality, protect copper mold, extend its service life.
Description
Technical field
The present invention relates to the using method of Copper Anode Plate Casting releasing agent.
Background technology
In the casting cycle of existing Copper making technique anode copper, Outokumpu Rotating caster is
Through being widely used, and the mould-type that Rotating caster uses is divided into punching block and copper mold, produces
During punching block the phenomenon of positive plate sticking to mould will not occur, but punching block damage Hou Tong manufacturing enterprise without
Method completes to repair and processing, it is necessary to the relevant enterprise to other is processed, and is delayed manufacturing schedule, increases
Add production cost.And after copper mold damages, can be cast by manufacturing enterprise's self-organization, significantly carry
High produce convenient, but owing to copper mold and casting anode copper coin out exist showing of sticking to mould
As, so avoid the generation of mold sticking to protect copper mold to reduce when using copper mold, it is necessary to
Use releasing agent.Releasing agent is usually powdery, is divided in use and directly smears dry powder and will do
Powder and water spray two ways after being mixed to form emulsion.Spraying emulsion is used for majority
Manufacturing enterprise, rationally spraying releasing agent be reduce in positive plate casting cycle copper mold inefficacy because of
Element, extends the effective means in copper mold service life, owing to existing between copper water and copper mold during casting
Bigger thermograde, so that copper mold is local melting and positive plate is bonded together, releasing agent
Existence can optimize copper mold and positive plate and depart from situation the generation of mold sticking is reduced or avoided,
Cover the smooth releasing agent of mould to be effectively improved the physical specification of positive plate and make positive plate the most flat
Whole, can also form good sealing coat between copper mold and positive plate plays heat-blocking action simultaneously,
Thus reduce copper mold and repeatedly raise the failure effect reduced and cause due to temperature field.
The spraying of releasing agent is the biggest with casting quality relation.Releasing agent when injection apparatus sprays such as
Fruit is non-atomized or non-homogeneous dispersion, the vaporization of the fluid requirements longer time of cohesion, when
This process be not fully complete with regard to matched moulds and by force by molten metal be pressed into, by accelerate releasing agent vaporization and
Forming higher vapour pressure, this causes the root that foundry goods is loose often.Water based paint is to technique
Require the highest.Mould temperature there is is strict demand, has one " wetting temperature ".Mould temperature limits less than this,
Coating could film forming.Composition is different, and " wetting temperature " is different.The thickness of paint film also wants tight
Lattice control, and time the thickest, cooling is slow, easily forms pore, and cast(ing) surface also creases easily；Time the thinnest
Easily splitting, cast(ing) surface plays vestige.
Summary of the invention
It is an object of the invention to provide the using method of a kind of Copper Anode Plate Casting releasing agent,
The generation of copper mold and positive plate adhesion situation can be reduced, reduce pore bubbling, protect copper mold,
Improve anode plate quality.
The present invention provides the using method of a kind of Copper Anode Plate Casting releasing agent, including following step
Rapid:
Prepare releasing agent emulsion；
Spray described releasing agent emulsion；
Described releasing agent emulsion forms releasing agent protective layer；
Described releasing agent protective layer sintering forms releasing agent sinter layer；
Described releasing agent sinter layer departs from positive plate.
Preparing releasing agent emulsion step is, by water with releasing agent by quality liquid-solid ratio 1.8～2.2:
1 mixing, water temperature 65 DEG C to 85 DEG C, stirs, maintains and stably stir shape during use
State, prevents releasing agent from precipitating.
Spraying described releasing agent emulsion step is, is preheated by the copper mold on casting machine and reaches 150
DEG C to 200 DEG C, then the releasing agent emulsion prepared is connected with paint finishing, is just opening
The often production order, when the copper mold on casting machine forwards the spray station of paint finishing to, by controlling
Platform controls direct spraying releasing agent emulsion, and the amount of every block of copper mold surface spraying emulsion controls
1.95kg/m2To 2.25kg/m2, after spraying completes one piece of copper mold, casting machine rotates, next
Block copper mold enters spray station, repeats spraying process.
Described releasing agent emulsion formed releasing agent protective layer step be, to be sprayed complete after, spray
The copper mold being coated with releasing agent turns to, through the time of 120 seconds to 150 seconds, station of casting, this this
During, the moisture evaporation in releasing agent emulsion, powdered mold release agents is uniformly attached to described copper
On mould, fill up the crack that copper mold surface is tiny, form releasing agent protective layer.
It is to treat that disk rotational arrives that described releasing agent protective layer sintering forms releasing agent sinter layer step
Reaching cast station, control station controls copper water and pours into copper mold, copper water cast temperature be 1150 DEG C extremely
1240 DEG C, Dang Tongshui is poured onto when being coated with on the copper mold of releasing agent, and releasing agent protective layer burns
Knot, forms fine and close smooth releasing agent sinter layer.
Described releasing agent sinter layer and positive plate depart from step, and after having cast, copper mold continues
Turning to mention positive plate station, copper water solidifies out into positive plate, has used plate system by positive plate
Take out, put in the pond of cooling system and cool down, due to the thermal expansion of releasing agent sinter layer Yu copper
The significance difference of coefficient away from, the lamellar releasing agent sinter layer sintered into separates with positive plate and comes off.
Copper Anode Plate Casting releasing agent described in this method is a kind of compound releasing agent, and its composition is pressed
Quality proportioning meter, including 30%～70% barium sulfate, 2.5%～15% boron oxide, 20%～45% 2
Silicon oxide, 1%～8% calcium oxide and 1%～7% aluminium oxide.
The beneficial effects of the present invention is, by this method can in casting cycle copper mold surface
Form suitable release agent coating, this coating and copper mold adhesion-tight, be difficult to by copper broken off by water flush,
Under the effect of copper water high temperature, the sinter layer forming smooth densification can be sintered, be attached to copper mold table
Face, can protect copper mold, can play again isolation effect completely, make between copper mold and positive plate
Positive plate is easily isolated with copper mold, reduces the generation of positive plate mucosa situation, protects copper mold, prolongs
Long copper mold service life, reduce pore bubbling, improve positive plate type quality.
Detailed description of the invention
Embodiments of the present invention are discussed in detail below.It should be noted that, following embodiment party
Technical characteristic described in formula or the combination of technical characteristic are not construed as isolating, it
Can be mutually combined and be combined with each other thus reached superior technique effect.
A kind of Copper Anode Plate Casting releasing agent occupation mode, comprises the following steps:
Prepare releasing agent emulsion.Water is mixed by quality liquid-solid ratio 1.8～2.2:1 with releasing agent
Close, water temperature 65 DEG C to 85 DEG C, and stir, maintain during use and stablize stirring,
Prevent releasing agent from precipitating.Releasing agent used is a kind of compound releasing agent, and its composition is by quality proportioning
Meter, including 30%～70% barium sulfate, 2.5%～15% boron oxide, 20%～45% silicon dioxide,
1%～8% calcium oxide and 1%～7% aluminium oxide.
Spraying releasing agent emulsion.Copper mold on Rotating caster is preheated and reaches 150 DEG C to 200
DEG C, then the releasing agent emulsion prepared is connected with paint finishing, opens and normally produce order
Sequence, when the copper mold on Rotating caster forwards the spray station of paint finishing to, by control station control
System directly carries out spraying releasing agent emulsion, and the amount of every block of copper mold surface spraying emulsion controls
1.95kg/m2To 2.25kg/m2, when spraying completes one piece of copper mold, Rotating caster rotates,
Next block copper mold enters spray station, repeats spraying process.
Releasing agent emulsion forms releasing agent protective layer.After Rotating caster has sprayed, spraying
The copper mold of releasing agent is rotated into, through time of 120～150 seconds, station of casting.This mistake
Cheng Zhong, the moisture evaporation in releasing agent emulsion, powdered mold release agents is uniformly attached on copper mold,
Fill up in the crack that copper mold surface is tiny, form releasing agent protective layer.
Releasing agent protective layer sintering forms releasing agent sinter layer.When having sprayed releasing agent emulsion
After copper mold enters casting station, control station controls copper water and pours into copper mold, and the cast temperature of copper water is
1150 DEG C to 1240 DEG C, Dang Tongshui is poured onto when being coated with on the copper mold of releasing agent, and releasing agent is protected
Sheath sinters, and forms the lamellar sinter layer of smooth densification, this sinter layer be present in copper water and
Between copper mold, play insulation blocking copper mold, prevent positive plate and copper mold from gluing glutinous effect.
Releasing agent sinter layer departs from positive plate.After completing casting cycle, copper mold then rotates,
Copper water cooling, when copper mold forwards the station mentioning positive plate to, copper water is frozen into copper coin, uses
Positive plate is taken out from copper mold by plate system, due to the existence of releasing agent, it is to avoid when playing plate
Mold sticking.After playing plate, releasing agent part is attached on copper mold, and part is attached to copper anode plate
On.After having completed plate, positive plate is put in the pond of cooling system cool down, this process due to
The significance difference of the thermal coefficient of expansion of releasing agent and copper away from, the lamellar releasing agent sinter layer sintered into
Copper anode plate separates and comes off.
The present invention can form suitable taking off by above method in casting cycle on copper mold surface
Mould agent coating, this coating and copper mold adhesion-tight, be difficult to by copper broken off by water flush, at copper water high temperature
Under effect, the sinter layer forming smooth densification can be sintered, be attached to copper mold surface, can protect
Copper mold, can play again isolation effect completely between copper mold and positive plate, make positive plate and copper mold
It is easily isolated, reduces the generation of copper mold and positive plate adhesion situation, protect copper mold, extend copper mold
In service life, reduce positive plate pore bubbling simultaneously, improve positive plate type quality.
Although have been presented for some embodiments of the present invention herein, but the technology of this area
Personnel should be appreciated that without departing from the spirit of the invention, can be to embodiment party herein
Formula is changed.Above-mentioned embodiment is exemplary, should not make with embodiments described herein
Restriction for interest field of the present invention.
Claims (6)
1. the using method of a Copper Anode Plate Casting releasing agent, it is characterised in that include with
Lower step:
Prepare releasing agent emulsion；
Spray described releasing agent emulsion；
Described releasing agent emulsion forms releasing agent protective layer；
Described releasing agent protective layer sintering forms releasing agent sinter layer；
Described releasing agent sinter layer departs from positive plate；
Described Copper Anode Plate Casting releasing agent is a kind of compound releasing agent, and its composition is by mass
Including 30%～70% barium sulfate, 2.5%～15% boron oxide, 20%～45% silicon dioxide,
1%～8% calcium oxide and 1%～7% aluminium oxide.
2. Copper Anode Plate Casting releasing agent using method as claimed in claim 1, its feature
It is: described releasing agent emulsion step of preparing is, by water with releasing agent by quality liquid-solid ratio
1.8～2.2:1 mixing, water temperature 65 DEG C, to 85 DEG C, stirs, and remains steady during use
Determine stirring.
3. Copper Anode Plate Casting releasing agent using method as claimed in claim 1, its feature
It is: described spraying releasing agent emulsion step is, the copper mold on casting machine is preheated and reaches
150 DEG C to 200 DEG C, then the described releasing agent emulsion prepared is connected with paint finishing,
Open the normal production order, when on described casting machine, copper mold forwards the spraying work of described paint finishing to
During position, control station control releasing agent emulsion described in direct spraying, every piece of copper mold surface spraying
The amount of described releasing agent emulsion is 1.95kg/m2To 2.25kg/m2, after spraying completes, institute
Stating casting machine to rotate, next block copper mold enters spray station, repeats spraying process.
4. Copper Anode Plate Casting releasing agent using method as claimed in claim 1, its feature
Be: described releasing agent emulsion formed releasing agent protective layer step be, to be sprayed complete after,
The copper mold coating described releasing agent emulsion turned to station of casting through 120 seconds to 150 seconds,
During this this, the moisture evaporation in described releasing agent emulsion, powdered mold release agents is uniformly adhered to
On described copper mold, fill up the crack that copper mold surface is tiny, form described releasing agent protective layer.
5. Copper Anode Plate Casting releasing agent using method as claimed in claim 1, its feature
It is: described releasing agent protective layer sintering forms releasing agent sinter layer step and is, institute to be sprayed
State releasing agent emulsion, and the copper mold forming described releasing agent protective layer arrives casting station, control
Platform processed controls copper water and pours into described copper mold, and described copper water cast temperature is 1150 DEG C to 1240 DEG C,
When described copper water is poured onto and is coated with on the copper mold of described releasing agent protective layer, described releasing agent is protected
Sheath sinters, and forms described releasing agent sinter layer.
6. Copper Anode Plate Casting releasing agent using method as claimed in claim 1, its feature
It is: described releasing agent sinter layer and positive plate depart from step and be, after casting completes, described
Copper mold is rotated further to mentioning positive plate station, and copper water solidifies out into positive plate, has used plate system
Positive plate is taken out, puts in the pond of cooling system and cool down, described releasing agent sinter layer and sun
Pole plate separates and comes off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410475140.4A CN104226895B (en) | 2014-09-17 | 2014-09-17 | A kind of using method of Copper Anode Plate Casting releasing agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410475140.4A CN104226895B (en) | 2014-09-17 | 2014-09-17 | A kind of using method of Copper Anode Plate Casting releasing agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104226895A CN104226895A (en) | 2014-12-24 |
| CN104226895B true CN104226895B (en) | 2016-08-24 |
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| CN201410475140.4A Active CN104226895B (en) | 2014-09-17 | 2014-09-17 | A kind of using method of Copper Anode Plate Casting releasing agent |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106513567A (en) * | 2016-10-10 | 2017-03-22 | 佛山市高明区明城镇新能源新材料产业技术创新中心 | Novel environment-friendly casting coating and preparation method and using method thereof |
| CN108356215B (en) * | 2018-04-11 | 2019-12-03 | 昆明理工大学 | A kind of Copper Anode Plate Casting release agent application method |
| CN108941445B (en) * | 2018-07-31 | 2020-12-18 | 铜陵旭时新材料科技有限公司 | Application method of release agent for disc casting machine |
| CN110093628B (en) * | 2019-04-30 | 2021-06-08 | 云南铜业股份有限公司西南铜业分公司 | Copper electrolytic refining method for generating core-shell structure copper anode mud |
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