CN104219897A - Circuit board solder paste brushing device - Google Patents
Circuit board solder paste brushing device Download PDFInfo
- Publication number
- CN104219897A CN104219897A CN201310219491.4A CN201310219491A CN104219897A CN 104219897 A CN104219897 A CN 104219897A CN 201310219491 A CN201310219491 A CN 201310219491A CN 104219897 A CN104219897 A CN 104219897A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- tin cream
- solder paste
- brush
- brushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention relates to a circuit board solder paste brushing device. The device is characterized by comprising a solder paste tank with the cavity; the solder paste tank is provided with a press head in a matched manner; the bottom of the solder paste tank is provided with a plurality of through holes, and paths formed by the through holes correspond to the brushed positions of a circuit board. The device is simple in structure; compared with the traditional manual solder paste brushing manner, the device has the advantages that since the manners of entirely pressing and brushing through the press head are adopted, the working efficiency is improved greatly, the solder paste brushed on the circuit board is even, efficiency is high, and the quality is fine.
Description
Technical field
The present invention relates to circuit board process equipment field, particularly relate to the brush tin cream equipment of circuit board.
Background technology
In the manufacturing process of circuit board, brush tin cream is absolutely necessary technique, and traditional brush tin cream technique is that circuit board is positioned on table top by workman, then brushes tin cream along specific path.Need when the shortcoming of this mode is manual brushing tin cream repeatedly to brush, the tin cream of brushing is uneven, and inefficiency.
Summary of the invention
Above-mentioned shortcoming during the manual brush tin cream of the applicant for traditional circuit-board, provides a kind of brush tin cream device of circuit board, it has, and structure is simple, speed is fast and the uniform feature of tin cream of brushing.
The technical solution adopted in the present invention is as follows:
A brush tin cream device for circuit board, is characterized in that: comprise the tin cream case with inner chamber, adapting device pressure head in described tin cream case, and the bottom of described tin cream case arranges multiple through hole, and the path that described through hole is formed is corresponding by brush portion position with circuit board.
Further technical scheme is:
The bottom of described tin cream case arranges groove, and described through hole is placed in described groove.
Beneficial effect of the present invention is as follows:
Structure of the present invention is simple, more traditional manual brush tin cream mode, and owing to adopting the form of pressure head entirety pressure brush, substantially increase operating efficiency, and the tin cream of institute's brush portion position of circuit board is even, it has, and efficiency is high, the measured feature of matter.
Accompanying drawing explanation
Fig. 1 is perspective view of the present invention.
Fig. 2 is exploded perspective structural representation of the present invention.
Fig. 3 is the A place partial enlarged drawing of Fig. 2.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described.
See Fig. 1, Fig. 2 and Fig. 3, the present invention includes the tin cream case 1 with inner chamber 13, adapting device pressure head 2 in described tin cream case 1, the bottom of described tin cream case 1 arranges multiple through hole 11, the path that described through hole 11 is formed is corresponding by brush portion position 31 with circuit board 3, the bottom of described tin cream case 1 arranges groove 12, and described through hole 11 is placed in described groove 12.
When the present invention works, tin cream is placed in tin cream case 1, circuit board 3 is placed in after immediately below tin cream case 1, tin cream case 1 compresses circuit board 3 under the effect of drive unit (not shown), pressure head 2 presses down simultaneously, tin cream in tin cream case 1 by the through hole 11 in groove 12 flow into circuit board 3 by brush portion position 31, thus once complete the brush coating process of tin cream.
More than describing is explanation of the invention, and be not the restriction to invention, limited range of the present invention is see claim, and when without prejudice to spirit of the present invention, the present invention can do any type of amendment.
Claims (2)
1. a brush tin cream device for circuit board, it is characterized in that: comprise the tin cream case with inner chamber, adapting device pressure head in described tin cream case, the bottom of described tin cream case arranges multiple through hole, and the path that described through hole is formed is corresponding by brush portion position with circuit board.
2. the brush tin cream device of circuit board as claimed in claim 1, is characterized in that: the bottom of described tin cream case arranges groove, and described through hole is placed in described groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310219491.4A CN104219897A (en) | 2013-06-04 | 2013-06-04 | Circuit board solder paste brushing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310219491.4A CN104219897A (en) | 2013-06-04 | 2013-06-04 | Circuit board solder paste brushing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104219897A true CN104219897A (en) | 2014-12-17 |
Family
ID=52100911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310219491.4A Pending CN104219897A (en) | 2013-06-04 | 2013-06-04 | Circuit board solder paste brushing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104219897A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889375A (en) * | 2017-11-17 | 2018-04-06 | 普尔思（苏州）无线通讯产品有限公司 | A kind of device for concave surface print solder paste |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3509627A1 (en) * | 1985-03-16 | 1986-09-18 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Device for making through-contact in the case of holes in thick-film circuit boards |
| CN102365910A (en) * | 2009-03-24 | 2012-02-29 | 千住金属工业株式会社 | Localized jet soldering device and partial jet soldering method |
| CN103118501A (en) * | 2011-11-16 | 2013-05-22 | 西安中科麦特电子技术设备有限公司 | Wave crest nozzle installation structure |
| CN203313532U (en) * | 2013-06-04 | 2013-11-27 | 苏州市狮威电子有限公司 | Circuit board solder paste brushing apparatus |
-
2013
- 2013-06-04 CN CN201310219491.4A patent/CN104219897A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3509627A1 (en) * | 1985-03-16 | 1986-09-18 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Device for making through-contact in the case of holes in thick-film circuit boards |
| CN102365910A (en) * | 2009-03-24 | 2012-02-29 | 千住金属工业株式会社 | Localized jet soldering device and partial jet soldering method |
| CN103118501A (en) * | 2011-11-16 | 2013-05-22 | 西安中科麦特电子技术设备有限公司 | Wave crest nozzle installation structure |
| CN203313532U (en) * | 2013-06-04 | 2013-11-27 | 苏州市狮威电子有限公司 | Circuit board solder paste brushing apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889375A (en) * | 2017-11-17 | 2018-04-06 | 普尔思（苏州）无线通讯产品有限公司 | A kind of device for concave surface print solder paste |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141217 |