CN104202924B - 对含氰酸酯树脂复合材料的电路板装置进行插接的系统 - Google Patents
对含氰酸酯树脂复合材料的电路板装置进行插接的系统 Download PDFInfo
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- CN104202924B CN104202924B CN201410467603.2A CN201410467603A CN104202924B CN 104202924 B CN104202924 B CN 104202924B CN 201410467603 A CN201410467603 A CN 201410467603A CN 104202924 B CN104202924 B CN 104202924B
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- 238000011161 development Methods 0.000 claims description 24
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CN201410467603.2A CN104202924B (zh) | 2014-09-15 | 2014-09-15 | 对含氰酸酯树脂复合材料的电路板装置进行插接的系统 |
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CN104202924B true CN104202924B (zh) | 2016-03-30 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000165034A (ja) * | 1998-11-26 | 2000-06-16 | Asahi Optical Co Ltd | フレキシブルプリント配線板及びその接続方法 |
US6774483B2 (en) * | 2002-04-16 | 2004-08-10 | Infineon Technologies Ag | Semiconductor assembly with a semiconductor module |
CN201000986Y (zh) * | 2006-07-07 | 2008-01-02 | 中国科学院长春光学精密机械与物理研究所 | 一种可供普通硬盘多次插拔的转接插件 |
CN201417837Y (zh) * | 2009-06-22 | 2010-03-03 | 乔讯电子(上海)有限公司 | 卡缘连接器 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000165034A (ja) * | 1998-11-26 | 2000-06-16 | Asahi Optical Co Ltd | フレキシブルプリント配線板及びその接続方法 |
US6774483B2 (en) * | 2002-04-16 | 2004-08-10 | Infineon Technologies Ag | Semiconductor assembly with a semiconductor module |
CN201000986Y (zh) * | 2006-07-07 | 2008-01-02 | 中国科学院长春光学精密机械与物理研究所 | 一种可供普通硬盘多次插拔的转接插件 |
CN201417837Y (zh) * | 2009-06-22 | 2010-03-03 | 乔讯电子(上海)有限公司 | 卡缘连接器 |
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Effective date of registration: 20161128 Address after: The way Washington 425500 Yongzhou city in Hunan province Jiang Hua Yao Autonomous County Tuojiang town (Tuojiang Town People's government hospital) Patentee after: Jiang Hua Yao Autonomous County Jinniu Development Construction Group Co. Ltd. Address before: 317599 Taizhou City, Wenling Province, Taiping Street, the village of Victoria Street, No. three, building 2, No. 13, No. Patentee before: WENLING RENQUAN MACHINERY EQUIPMENT CO., LTD. |
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