CN104197848B - Double-frequency differential thickness measurement method and equipment - Google Patents
Double-frequency differential thickness measurement method and equipment Download PDFInfo
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- CN104197848B CN104197848B CN201410478641.8A CN201410478641A CN104197848B CN 104197848 B CN104197848 B CN 104197848B CN 201410478641 A CN201410478641 A CN 201410478641A CN 104197848 B CN104197848 B CN 104197848B
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Abstract
The invention provides a double-frequency differential thickness measurement method and equipment and belongs to the technical field of thickness measurement. The technical problems that measured pieces are easily damaged during measurement and the like in the prior art. The thickness measurement method includes the following procedures: a, placing a reference object; b, measuring distance s1 between the upper surface of the reference object and a first measurement head; c, measuring distance s2 between the lower surface of the reference object and a second measurement head; d, computing thickness h0 of the reference object; e, placing one measured piece; f, measuring distance s3 between the upper surface of the measured piece and the first measurement head; g, measuring distance s4 between the lower surface of the measured piece and the second measurement head ; h, computing thickness hi of the measured piece. By the method and equipment, the measured pieces can be prevented from being damaged during measurement.
Description
Technical field
The invention belongs to thickness measurement technique field, it is related to a kind of differential method for measuring thickness of double frequency and equipment.
Background technology
In the precision engineering such as optics, quasiconductor, optoelectronic information field, high-precision thickness measure is particularly significant.For example,
The center thickness of lens is to determine one of important indicator of its optical property.To be finished to Precision Machining handss in semicon industry
Section, before entering polishing, needs silicon single crystal flake is sorted according to thickness error, selects the close chip of thickness as one
Individual processing batch.
Existing high accuracy thickness measurement technique, all sets up on the basis of high accuracy displacement sensor, and application is more
There are inductance sensor, magneto strictive sensor, current vortex sensor, capacitance sensor, laser sensor, Fibre Optical Sensor.Its
In, inductance sensor, magneto strictive sensor belong to contact type measurement, and gauge head may form on measured piece surface and damage, thus
Impact properties of product.
Content of the invention
First goal of the invention of the present invention is the problems referred to above existing for existing technology, provides a kind of double frequency differential
Method for measuring thickness, its technical problem to be solved is：How to avoid damaging measured piece in measurement process.
The purpose of the present invention can be realized by following technical proposal：
A kind of differential method for measuring thickness of double frequency, it includes following operation：
A, placement object of reference：By object of reference be positioned over detection first and detection head two between, adjustment detection first and detection
Two, make detection first and detection head two is respectively aligned to the upper and lower surface of this object of reference；
B, measurement object of reference upper surface s1 the distance between first with detection：The first interior laser instrument one of detection trigger makes it
Launch laser one, described laser one passes through to detect that first interior spectroscope one is dispersed into two light beams one, described light beam one is saturating
Cross object lens one to be irradiated to object of reference upper surface and reflected by object of reference upper surface, the light beam one after being reflected sequentially passes through object lens
First, spectroscope one and eyepiece one are irradiated to formation hot spot one on two quadrant light cell one, by the output of two quadrant light cell one
Signal is measured object of reference upper surface and is detected the distance between first s1；
C, measurement the distance between object of reference lower surface and detection head two s2：Laser instrument two in detection trigger two makes it
Launch laser two, the spectroscope two that described laser two passes through in detection head two is dispersed into two light beams two, and described light beam two is saturating
Cross object lens two to be irradiated to object of reference lower surface and reflected by object of reference lower surface, the light beam two after being reflected sequentially passes through object lens
2nd, spectroscope two and eyepiece two are irradiated to formation hot spot two on two quadrant light cell two, by the output of two quadrant light cell two
Signal measures object of reference lower surface and the distance between detection head two s2；
D, the thickness h 0 of calculating object of reference：It is assumed that the distance between measurement first and detection head two of detection s, then object of reference
Thickness h 0=s- (s1+s2)；
E, placement measured piece：Take off object of reference, by measured piece be positioned over detection head two and detection first between；
F, measurement measured piece upper surface s3 the distance between first with detection：The first interior laser instrument one of detection trigger makes it
Launch laser one, described laser one passes through to detect that first interior spectroscope one is dispersed into two light beams one, described light beam one is saturating
Cross object lens one to be irradiated to measured piece upper surface and reflected by measured piece upper surface, the light beam one after being reflected sequentially passes through object lens
First, spectroscope one and eyepiece one are irradiated to formation hot spot three on two quadrant light cell one, by the output of two quadrant light cell one
Signal is measured measured piece upper surface and is detected the distance between first s3；
G, measurement the distance between measured piece lower surface and detection head two s4:Laser instrument two in detection trigger two makes it
Launch laser two, the spectroscope two that described laser two passes through in detection head two is dispersed into two light beams two, and described light beam two is saturating
Cross object lens two to be irradiated to object of reference lower surface and reflected by object of reference lower surface, the light beam two after being reflected sequentially passes through object lens
2nd, spectroscope two and eyepiece two are irradiated to formation hot spot four on two quadrant light cell two, by the output of two quadrant light cell two
Signal measures measured piece lower surface and the distance between detection head two s4；
H, thickness h i of calculating measured piece：Hi=s-s3-s4=h0+ (s1+s2)-(s3+s4).
Its operation principle is as follows：First pass through the first and detection head two of detection measure the upper and lower surface of object of reference first with detection,
The distance between detection head two, the record now facula position on two quadrant light cell one and two quadrant light cell two, hot spot position
Put the power determining light cell two-way output signal, such as in the I quadrant in two quadrant light cell, facula area is larger, so I
Quadrant output current is more than II quadrant.Again by measured piece be put in detection first and detection head two between and object of reference identical position
Put, detect that the face that the first laser one sending is irradiated to is then the upper surface of measured piece, because measured object is existed with object of reference
Thickness difference, measured object upper surface relatively before object of reference upper surface produce displacement, the reflected beams shift, and lead to focus on
Hot spot on two quadrant light cell one produces displacement, and the two-way current signal power of light cell one output changes.Therefore, instrument
Device, after demarcating, can infer measured piece displacement according to the change of light cell output signal, in the same manner, calculates now under measured object
The distance between surface and detection head two, finally calculate thickness h i of measured piece again：Hi=h0+ (s1+s2)-(s3+s4).
In this detection process, the first and detection head two of detection all not in contact with to measured piece, thus without causing to measured piece to damage, and essence
Degree is higher.
In a kind of above-mentioned differential method for measuring thickness of double frequency, the frequency of described laser one and laser instrument two is respectively f1
With f2 and both are of different sizes.For transparent measured piece, the laser that detection head sends enters the detection of detection head two for a moment
Device, causes measurement to lose efficacy.For this reason, the detection of the present invention is first adopts the different laser instrument one of frequency and laser instrument with detection head two
Two, such as gauge head 1 laser frequency be f1, gauge head 2 laser frequency be f2, bandpass filter one is set before detection head 1 detector
The light that frequency is f1 is only made to enter detector, setting in same detection head 2 only makes the band that the light that frequency is f2 enters its detector
Pass filter two, thus, it is to avoid the interference to detection head Stimulated Light.
A kind of differential thickness measurement device of double frequency, described thickness measurement device includes pedestal, detects first and detection head two,
The first and detection head two of described detection is arranged at intervals on described pedestal and both Relative distribution, and described detection is first and detection head
It is placed with an object of reference between two；Described detection is first interior to be provided with laser instrument one, spectroscope one, object lens one, eyepiece one and two
Quadrant photo pond one, perpendicular to spectroscope one, described object lens one are arranged at described point in the Laser emission direction of described laser instrument one
The lower section of light microscopic one and be located between this spectroscope one and upper surface of object of reference, described two quadrant light cell one be located at described point
The top of light microscopic one, described eyepiece one is arranged between described two quadrant light cell one and spectroscope one；In described detection head two
It is provided with laser instrument two, spectroscope two, object lens two, eyepiece two and two quadrant light cell two, the Laser emission of described laser instrument two
Perpendicular to spectroscope two, described object lens two are arranged at the top of described spectroscope two and are located at this spectroscope two and object of reference in direction
Lower surface between, described two quadrant light cell two is located at the lower section of described spectroscope two, and described eyepiece two is arranged at described two
Between Quadrant photo pond two and spectroscope two.First pass through and detect that first and detection head two measures the upper and lower surface of object of reference and detection
The distance between first, detection head two, the record now facula position on two quadrant light cell one and two quadrant light cell two, light
Speckle position determines the power of light cell two-way output signal, and such as in the I quadrant in two quadrant light cell, facula area is larger, therefore
And I quadrant output current is more than II quadrant.Again by measured piece be put in detection first and detection head two between and object of reference identical
On position, detect that the face that the first laser one sending is irradiated to is then the upper surface of measured piece, because measured object is deposited with object of reference
In thickness difference, measured object upper surface relatively before the upper surface of object of reference produce displacement, the reflected beams shift, and lead to focus on
Hot spot on two quadrant light cell one produces displacement, and the two-way current signal power of light cell one output changes.Therefore,
Instrument, after demarcating, can be inferred measured piece displacement according to the change of light cell output signal, in the same manner, calculate now measured object
The distance between lower surface and detection head two, finally calculate thickness h i of measured piece again：Hi=h0+ (s1+s2)-(s3+s4) is i.e.
Can.
In a kind of above-mentioned differential thickness measurement device of double frequency, the frequency of described laser one and laser instrument two is respectively f1
With f2 and both are of different sizes.
In a kind of above-mentioned differential thickness measurement device of double frequency, first interior being provided with of described detection only supplies frequency to be f1
The bandpass filter one that laser one passes through；It is provided with the band logical filter only supplying the laser two that frequency is f2 to pass through in described detection head two
Mating plate two.
Compared with prior art, the present invention has advantages below：
1st, first pass through that the first and detection head two of detection measures the upper and lower surface of object of reference and detection is first, between detection head two
Distance, the record now facula position on two quadrant light cell one and two quadrant light cell two, facula position determines photoelectricity
In I quadrant in the power of pond two-way output signal, such as two quadrant light cell, facula area is larger, so I quadrant output current
More than II quadrant.Again measured piece is put in that detection is first and detection head two between and on object of reference identical position, detection is first
The face that the laser one sending is irradiated to is then the upper surface of measured piece, because measured object and object of reference have thickness difference, measured object
Upper surface relatively before object of reference upper surface produce displacement, the reflected beams shift, and lead to focus on two quadrant light cell
Hot spot on one produces displacement, and the two-way current signal power of light cell one output changes.Therefore, instrument is through demarcating
Afterwards, measured piece displacement can be inferred according to the change of light cell output signal, in the same manner, calculate now measured object lower surface and detection
The distance between two, finally calculate thickness h i of measured piece again：Hi=h0+ (s1+s2)-(s3+s4).
Brief description
Fig. 1 is the structural representation of the differential thickness measurement device of this double frequency in embodiment.
Fig. 2 is the first fundamental diagram of this detection in embodiment.
Fig. 3 is the fundamental diagram of this detection head two in embodiment.
In figure, 1, object of reference；2nd, detection is first；21st, laser instrument one；22nd, spectroscope one；23rd, object lens one；24th, eyepiece one；
25th, two quadrant light cell one；3rd, detection head two；31st, laser instrument two；32nd, spectroscope two；33rd, object lens two；34th, eyepiece two；35、
Two quadrant light cell two.
Specific embodiment
The following is the specific embodiment of the present invention and combine accompanying drawing, technical scheme is further described,
But the present invention is not limited to these embodiments.
As shown in Figure 1, Figure 2, Figure 3 shows, the differential method for measuring thickness of this double frequency, it includes following operation：
A, placement object of reference 1：Object of reference 1 is positioned between detection first 2 and detection head 23, adjustment detects first 2 Hes
Detection head 23, makes detection first 2 and detection head 23 be respectively aligned to the upper and lower surface of this object of reference 1；
B, measurement object of reference 1 upper surface and the distance between detection first 2 s1：Laser instrument one in detection trigger first 2
21 make it launch laser one, and the frequency of laser one is f1, and laser one passes through to detect that the spectroscope 1 in first 2 is dispersed into two
Light beams one, light beam one is irradiated to object of reference 1 upper surface through object lens 1 and is reflected by object of reference 1 upper surface, after reflecting
Light beam one sequentially pass through object lens 1, spectroscope 1 and eyepiece 1 and be irradiated on two quadrant light cell 1 formation hot spot
One, object of reference 1 upper surface and the distance between detection first 2 s1 are measured by the output signal of two quadrant light cell 1；
C, measurement the distance between object of reference 1 lower surface and detection head 23 s2：Laser instrument two in detection trigger 23
31 make it launch laser two, and the frequency of laser two is f2, and the size of f2 is different from f1, and laser two passes through in detection head 23
Spectroscope 2 32 is dispersed into two light beams two, and light beam two is irradiated to object of reference 1 lower surface and by under object of reference 1 through object lens 2 33
Surface is reflected, and the light beam two after being reflected sequentially passes through object lens 2 33, spectroscope 2 32 and eyepiece 2 34 and is irradiated to two quadrant light
Form hot spot two on battery 2 35, object of reference 1 lower surface and detection head are measured by the output signal of two quadrant light cell 2 35
The distance between 23 s2；
D, the thickness h 0 of calculating object of reference 1：Measurement detection the distance between first 2 and detection head 23 s, the thickness of object of reference 1
Degree h0=s- (s1+s2)；
E, placement measured piece：Measured piece is put between detection head 23 and detection first 2 and object of reference identical before
On position；
F, measurement measured piece upper surface and the distance between detection first 2 s3：Laser instrument 1 in detection trigger first 2
It is made to launch laser one, laser one passes through to detect that the spectroscope 1 in first 2 is dispersed into two light beams one, light beam one passes through
Object lens 1 are irradiated to measured piece upper surface and are reflected by measured piece upper surface, and the light beam one after being reflected sequentially passes through object lens one
23rd, spectroscope 1 and eyepiece 1 are irradiated to formation hot spot three on two quadrant light cell 1, by two quadrant light cell one
25 output signal measures measured piece upper surface and the distance between detection first 2 s3；
G, measurement the distance between measured piece lower surface and detection head 23 s4:Laser instrument 2 31 in detection trigger 23
It is made to launch laser two, the spectroscope 2 32 that laser two passes through in detection head 23 is dispersed into two light beams two, and light beam two passes through
Object lens 2 33 are irradiated to measured object 1 lower surface and are reflected by measured object 1 lower surface, and the light beam two after being reflected sequentially passes through object lens
2 33, spectroscope 2 32 and eyepiece 2 34 are irradiated to formation hot spot four on two quadrant light cell 2 35, by two quadrant light cell
2 35 output signal measures object of reference 1 lower surface and the distance between detection head 23 s4；
H, thickness h i of calculating measured piece：Hi=h0+ (s1+s2)-(s3+s4).
As shown in Figure 1, Figure 2, Figure 3 shows, this thickness measurement device includes pedestal, detection first 2 and detection head 23, detection head
1 and detection head 23 be arranged at intervals on pedestal and both Relative distribution, detection first 2 and detection head 23 between be placed with one
Object of reference 1；Detect and in first 2, be provided with laser instrument 1, spectroscope 1, object lens 1, eyepiece 1 and two quadrant photoelectricity
Pond 1, the frequency of the laser one that laser instrument 1 is launched is f1, is provided with and only supplies frequency to be swashing of f1 in detection first 2
The bandpass filter one that light one passes through；The Laser emission direction of laser instrument 1 is arranged perpendicular to spectroscope 1, object lens 1
In spectroscope 1 lower section and be located between this spectroscope 1 and upper surface of object of reference 1, one 25, two quadrant light cell
In the top of spectroscope 1, eyepiece 1 is arranged between two quadrant light cell 1 and spectroscope 1；In detection head 23
It is provided with laser instrument 2 31, spectroscope 2 32, object lens 2 33, eyepiece 2 34 and two quadrant light cell 2 35, laser instrument 2 31 institute
The frequency of the laser two launched is f2, and the size of f2 is different from f1, is provided with the laser only supplying that frequency is f2 in detection head 23
The bandpass filter two that two pass through.The Laser emission direction of laser instrument 2 31 is arranged at perpendicular to spectroscope 2 32, object lens 2 33
The top of spectroscope 2 32 and be located between this spectroscope 2 32 and lower surface of object of reference 1, two quadrant light cell 2 35 is located at
The lower section of spectroscope 2 32, eyepiece 2 34 is arranged between two quadrant light cell 2 35 and spectroscope 2 32.
The operation principle of the present invention is as follows：First pass through and detect that first and detection head two measures the upper and lower surface of object of reference and inspection
The distance between gauge head one, detection head two, the record now facula position on two quadrant light cell one and two quadrant light cell two,
Facula position determines the power of light cell two-way output signal, and such as in the I quadrant in two quadrant light cell, facula area is larger,
So I quadrant output current is more than II quadrant.Again measured piece is put in detection first identical with object of reference between detection head two
Position on, detect that the face that is irradiated to of the first laser one sending is then the upper surface of measured piece, because of measured object and object of reference
There is thickness difference, measured object upper surface relatively before object of reference upper surface produce displacement, the reflected beams shift, and lead to gather
Burnt hot spot on two quadrant light cell one produces displacement, and the two-way current signal power of light cell one output changes.Cause
This, instrument, after demarcating, can be inferred measured piece displacement according to the change of light cell output signal, in the same manner, calculate and now join
According to the distance between thing lower surface and detection head two, finally calculate thickness h i of measured piece again：Hi=h0+ (s1+s2)-(s3+
S4).
The measuring method that the present invention provides and equipment, it is adaptable to all kinds of transparent or opaque material, can be widely used for optics
The measurement of lens center thickness, quartz or optical window, monocrystal silicon or the polysilicon chip such as sapphire, high-quality dynamo sheet,
The high accuracy of the objects such as lithium battery pole plate, thickness on-line measurement.
It is below specifically several application implementations of the present invention：
Ith, detect first laser frequency 532nm, detection head dual-laser device frequency 785nm, for optical lens center thickness
Degree measurement.Success replaces conventional contact metering system, it is to avoid the damage to lens for the contact in measurement process, by accuracy of detection
Bring up to ± 0.1 μm by ± 3 μm, improve stability, the reliability of Automatic survey degree and measurement result, instead of 3～5
Name workman.
IIth, detect first laser frequency 532nm, detection head dual-laser device frequency 785nm, for high-quality rotor
Stalloy thickness monitor.Success replaces conventional contact metering system, and accuracy of detection is brought up to ± 0.1 μm by ± 3 μm, reduces
Workman's amount of labour, improves rotor stalloy integral thickness control accuracy, so that motor quality and homogeneity of product is obtained greatly
Width improves.
IIIth, detect first laser frequency 532nm, detection head dual-laser device frequency 785nm, after quartz wafer section
Thickness sorting.Success replaces traditional tapered roller sorting mode, sharpness of separation is brought up to ± 0.5 μm by ± 5 μm, meets existing
The production requirement of foundry skill, improves lapping efficiency and the product quality of quartz wafer.
Specific embodiment described herein is only explanation for example to present invention spirit.The affiliated technology of the present invention is led
The technical staff in domain can be made various modifications or supplement or replaced using similar mode to described specific embodiment
Generation, but the spirit without departing from the present invention or surmount scope defined in appended claims.
Claims (2)
1. the differential method for measuring thickness of a kind of double frequency, it includes following operation：
A, placement object of reference：By object of reference be positioned over detection first and detection head two between, the adjustment first and detection head two of detection,
Make the first upper and lower surface being respectively aligned to this object of reference with detection head two of detection；
B, measurement object of reference upper surface s1 the distance between first with detection：The first interior laser instrument one of detection trigger makes it launch
Go out laser one, described laser one passes through to detect that first interior spectroscope one is dispersed into two light beams one, described light beam one passes through thing
Mirror one is irradiated to object of reference upper surface and is reflected by object of reference upper surface, and the light beam one after being reflected sequentially passes through object lens one, divides
Light microscopic one and eyepiece one are irradiated to formation hot spot one on two quadrant light cell one, are surveyed by the output signal of two quadrant light cell one
Go out object of reference upper surface and detect the distance between first s1；
C, measurement the distance between object of reference lower surface and detection head two s2：Laser instrument two in detection trigger two makes it launch
Go out laser two, the spectroscope two that described laser two passes through in detection head two is dispersed into two light beams two, and described light beam two passes through thing
Mirror two is irradiated to object of reference lower surface and is reflected by object of reference lower surface, and the light beam two after being reflected sequentially passes through object lens two, divides
Light microscopic two and eyepiece two are irradiated to formation hot spot two on two quadrant light cell two, are surveyed by the output signal of two quadrant light cell two
Go out object of reference lower surface and the distance between detection head two s2；
D, the thickness h 0 of calculating object of reference：It is assumed that the distance between measurement first and detection head two of detection s, the then thickness of object of reference
H0=s- (s1+s2)；
E, placement measured piece：Take off object of reference, by measured piece be positioned over detection head two and detection first between；
F, measurement measured piece upper surface s3 the distance between first with detection：The first interior laser instrument one of detection trigger makes it launch
Go out laser one, described laser one passes through to detect that first interior spectroscope one is dispersed into two light beams one, described light beam one passes through thing
Mirror one is irradiated to measured piece upper surface and is reflected by measured piece upper surface, and the light beam one after being reflected sequentially passes through object lens one, divides
Light microscopic one and eyepiece one are irradiated to formation hot spot three on two quadrant light cell one, are surveyed by the output signal of two quadrant light cell one
Go out measured piece upper surface and detect the distance between first s3；
G, measurement the distance between measured piece lower surface and detection head two s4:Laser instrument two in detection trigger two makes it launch
Go out laser two, the spectroscope two that described laser two passes through in detection head two is dispersed into two light beams two, and described light beam two passes through thing
Mirror two is irradiated to object of reference lower surface and is reflected by object of reference lower surface, and the light beam two after being reflected sequentially passes through object lens two, divides
Light microscopic two and eyepiece two are irradiated to formation hot spot four on two quadrant light cell two, are surveyed by the output signal of two quadrant light cell two
Go out measured piece lower surface and the distance between detection head two s4；
H, thickness h i of calculating measured piece：Hi=s-s3-s4=h0+ (s1+s2)-(s3+s4)；Described laser instrument one and laser instrument
Two frequency is respectively f1 and f2 and both are of different sizes；Described detection first interior be provided with only supply frequency be f1 laser one lead to
The bandpass filter one crossed；It is provided with the bandpass filter two only supplying the laser two that frequency is f2 to pass through in described detection head two.
2. the differential thickness measurement device of a kind of double frequency, described thickness measurement device includes pedestal, detects first and detection head two, institute
State the first and detection head two of detection to be arranged at intervals on described pedestal and both Relative distribution, described detection is first and detection head two
Between be placed with an object of reference；Described detection first interior be provided with laser instrument one, spectroscope one, object lens one, eyepiece one and two as
Limit light cell one, perpendicular to spectroscope one, described object lens one are arranged at described light splitting in the Laser emission direction of described laser instrument one
The lower section of mirror one and be located between this spectroscope one and upper surface of object of reference, described two quadrant light cell one be located at described light splitting
The top of mirror one, described eyepiece one is arranged between described two quadrant light cell one and spectroscope one；Set in described detection head two
It is equipped with laser instrument two, spectroscope two, object lens two, eyepiece two and two quadrant light cell two, the Laser emission side of described laser instrument two
To perpendicular to spectroscope two, described object lens two are arranged at the top of described spectroscope two and are located at this spectroscope two and object of reference
Between lower surface, described two quadrant light cell two be located at described spectroscope two lower section, described eyepiece two be arranged at described two as
Between limit light cell two and spectroscope two；The frequency of described laser instrument one and laser instrument two is respectively f1 and f2 and both sizes not
With；
Described detection is first interior to be provided with the bandpass filter one that passes through of laser one only supplying that frequency is f1；In described detection head two
It is provided with the bandpass filter two only supplying the laser two that frequency is f2 to pass through.
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| CN106556348A (en) * | 2015-09-24 | 2017-04-05 | 上海思信科学仪器有限公司 | Sapphire thickness measurement equipment |
| CN105572072A (en) * | 2015-12-21 | 2016-05-11 | 中国科学院长春光学精密机械与物理研究所 | Transparent optical material group refractive index measuring device and method |
| CN108572368A (en) * | 2017-03-07 | 2018-09-25 | 台濠科技股份有限公司 | The method for measuring wafer thickness with infrared ray |
| CN110631465B (en) * | 2019-09-16 | 2021-04-16 | 太原理工大学 | Ash deposition and slagging on-line monitoring device and method based on capacitance principle differential measurement |
| CN111426293A (en) * | 2020-03-18 | 2020-07-17 | 漳州捷龙自动化技术有限公司 | Thickness measuring method |
| JP7098211B1 (en) * | 2021-02-26 | 2022-07-11 | 国立大学法人 名古屋工業大学 | Laser machining equipment, thickness detection method and thickness detection equipment |
| CN114518072B (en) * | 2022-02-22 | 2023-08-29 | 江苏铁锚玻璃股份有限公司 | Device applied to thickness detection of transparent piece and application method thereof |
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