CN104191091A - Flexible printed circuit board stack type laser welding device and method - Google Patents
Flexible printed circuit board stack type laser welding device and method Download PDFInfo
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- CN104191091A CN104191091A CN201410426107.2A CN201410426107A CN104191091A CN 104191091 A CN104191091 A CN 104191091A CN 201410426107 A CN201410426107 A CN 201410426107A CN 104191091 A CN104191091 A CN 104191091A
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- flexible pcb
- laser instrument
- battle array
- welding
- vertical folded
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- 238000003466 welding Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000005476 soldering Methods 0.000 claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 230000033001 locomotion Effects 0.000 claims abstract description 11
- 239000013078 crystal Substances 0.000 claims description 44
- 230000003028 elevating effect Effects 0.000 claims description 26
- 239000000498 cooling water Substances 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 3
- 230000007306 turnover Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 230000008595 infiltration Effects 0.000 abstract description 5
- 238000001764 infiltration Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- 230000006378 damage Effects 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 230000001174 ascending effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 11
- 230000005669 field effect Effects 0.000 description 9
- 230000005855 radiation Effects 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a flexible printed circuit board stack type laser welding device. The flexible printed circuit board stack type laser welding device comprises a vertical folded array laser, a film covering plate placed below the vertical folded array laser, a first driving mechanism which drives the vertical folded array laser to make two-dimensional motion in a plane and to make up-down movement in the vertical direction, and a second driving mechanism which drives the film covering plate to make ascending and descending movement. A groove corresponding to the welding area on a flexible printed circuit board is formed in the film covering plate, and laser emitted by the vertical folded array laser penetrates through the welding area on the flexible printed circuit board to be welded. The invention further provides a flexible printed circuit board stack type laser welding method. The vertical folded array laser is used for welding the flexible printed circuit board, instant simultaneous welding of a whole area within a short time can be achieved, and the welding work efficiency is improved. A heat affected zone to a reactor of the flexible printed circuit board stack type laser welding device is very small, harm is avoided both to a substrate and a copper clad of the flexible printed circuit board is avoided, meanwhile, the infiltration speed of soldering tin is improved, and the welding quality can be improved.
Description
Technical field
The present invention relates to electronic circuit board welding technology field, specifically a kind of flexible PCB stacking-type laser soldering device and method.
Background technology
Flexible PCB is attached to Copper Foil in flexible plastic substrates and forms, in order to possess certain flexible nature, plastic base, Copper Foil generally all does very thinly, be mainly used in the signal transmission of printhead in printer, mobile phone and other digital terminal (for example landline telephone thereof, MP4, calculator), all kinds of household electrical appliances (for example washing machine, micro-wave oven, refrigerator, smoke exhaust ventilator, intelligent electric cooker, intelligent sweeping), all kinds of Medical Instruments, Domestic use physiotherapeutic equipment, all types of industries control flow (paper money counter, door access machine) mainboard and the signal transmission of display screen etc.
For the welding of flexible PCB, traditional welding method is being used manual soldering always, or the mode of automatic soldering iron soldering (be also referred to as hot bar welding) completes, but, along with scientific and technical progress, the miniaturization increasingly of each electric appliances, microminiaturized, as mobile phone, and other digital terminal etc., therefore, wire inner used, its diameter must tend to tinyization, miniaturization, use Hot bar to weld more and more difficult flexible PCB, simultaneously, also because the heat affected area of Hot bar is excessive, the substrate that will cause flexible PCB is overheated and damage, in addition, the pressure that Hot bar produces, also will be to wire, flexible circuit board substrate, and Copper Foil on flexible base, board etc. causes mechanical failure, therefore, Hot bar can not do meticulousr welding substantially.
In addition, the principle of Hot bar welding, with be heat-conduction principle, that is: the high temperature of Hot bar solder horn must pass through the welded object of close contact, and high temperature is heated to welded object in heat conducting mode, due to heat conducting principle, it is intermolecular warm-up movement collision, and heat conducting formation also must have a necessary condition, that is exactly, there is thermograde, that is: the temperature of Hot bar solder horn is necessarily higher than welded piece, and be far above welded piece, could improve like this speed of welding, so, on welded piece, can form larger heat affected area, this will be destructive.
Summary of the invention
The invention provides a kind of contactless, heat affected area is little, flexible PCB stacking-type laser soldering device and the method for gross area field-effect, harmless Welding Problems that can quick and high-quality solution flexible PCB.
A kind of flexible PCB stacking-type laser soldering device, comprise the first driving mechanism that vertically a folded gust laser instrument, a mask plate that is positioned at vertical folded gust of laser instrument below, the vertical folded gust laser plane two dimensional motion of driving and vertical direction move up and down and the second driving mechanism that drives mask plate rising and descending motion, mask plate is provided with the fluting of welding region on corresponding flexible PCB, and the welding region that the laser that vertical folded battle array laser instrument sends passes on described fluting irradiation flexible PCB welds.
Further, described the first driving mechanism comprises column and is slidably mounted on the longitudinal sliding block on column, the both sides of longitudinal sliding block are laterally provided with respectively a sideskid, the front end of each sideskid is provided with the two dimension of the folded battle array of fixed vertical laser instrument and adjusts mirror holder, and described two dimension is adjusted mirror holder and is used for driving vertical folded battle array laser instrument 1 to do two dimension adjustment.
Further, sideskid front end is fixed with half-nut slide block, and two dimension is adjusted mirror holder and is fixed on half-nut slide block, in the cavity between half-nut slide block and sideskid, is inlaid with micrometer adjusting screw, and micrometer adjusting screw is for the fine setting of vertical folded battle array laser instrument Z-direction.
Further, in the moving plate of mirror holder of two dimension adjustment mirror holder, laser instrument water-cooled block is installed, vertical folded battle array laser instrument is arranged on the front end of laser instrument water-cooled block, is provided with the turnover water channel that Cooling Water passes through in laser instrument water-cooled block.
Further, laser instrument water-cooled block is arranged on two dimension with connecting thread and adjusts in the moving plate of mirror holder of mirror holder, and connecting thread is used for realizing the angular deflection of vertical folded battle array laser instrument, and by holding screw fixing and locking.
Further, described the second driving mechanism comprises the cantilever of fixing mask plate, the cam disc that drives cantilever to rise and decline.
Further, the leaded light crystal fitting tightly is set below mask plate, the both sides of leaded light crystal are provided with the crystal clamping plate for clamping leaded light crystal, add two crystal clamping plate holding leaded light crystal and mask plate and be arranged on from bottom to up the front end below of cantilever.
Further, one end of cantilever is connected with elevating bracket, is provided with the cam that is positioned at elevating bracket below in cam disc, and cam is connected with the lifting arm of elevating bracket tail end, and rotating cam can drive elevating bracket to move up and down and then drive together lifting of cantilever.
Further, elevating bracket slides and is located at longitudinal rail, and moving up and down of elevating bracket is limited to longitudinal rail.
A kind of flexible PCB stacking-type method for laser welding, it is applied above-mentioned laser soldering device and welds, and comprises the steps:
To on flexible PCB to be welded, be placed on the fixture of mask plate below;
Regulate the second driving machine to make the leaded light crystal of mask plate below push down the non-welding portion of flexible PCB;
The laser that regulates the first driving mechanism that vertical folded battle array laser instrument is sent can pass fluting on described mask plate to irradiate the welding region on flexible PCB;
Open a vertical folded battle array laser instrument, the laser that vertical folded battle array laser instrument is sent passes successively the welding region being radiated on flexible PCB after fluting on described mask plate, leaded light crystal and welds.
Beneficial effect of the present invention:
1, the present invention adopts vertical folded battle array laser instrument to carry out the welding of flexible PCB, what apply is the principle of field-effect radiation heating, not hot bar heat conduction heating used, it forms moment field-effect in specific region, within the extremely short time, complete region-wide welding simultaneously of moment, the latter is the several times of the former efficiency, has greatly improved work efficiency.
2, radiation heating can add the specific region (welding region of flexible PCB) of heat acceptor fast, therefore, the heat affected area of acceptor is minimum, and transient heating fast, no matter be substrate to flexible PCB, still cover Copper Foil and can accomplish harmless.
3, the present invention adopts field-effect radiation mechanism, can allow rapidly the gross area of acceptor specific region be warmed up to rapidly same temperature, the thermograde forming can not produce the heating of Hot bar conduction-type time, therefore, in mechanism, do not have thermal part, also can not cause unnecessary cause thermal damage to flexible PCB, and add to the difficulties can not to infiltration link.
4, being on the scene effect radiation mechanism is in brazing process, because can allow the gross area of acceptor specific region be warmed up to rapidly same temperature, thereby can well ensure that scolding tin is from thawing-infiltration-curing process, particularly accelerate the wetting velocity of scolding tin, abundant and good infiltration is to ensure good welds necessary condition, therefore,, by the method for field-effect radiation heating, can improve welding quality.
Brief description of the drawings
Fig. 1 is the principle schematic of flexible PCB stacking-type method for laser welding of the present invention;
Fig. 2 is the side sectional view of flexible PCB stacking-type laser soldering device of the present invention;
Fig. 3 is A-A view in Fig. 2;
Fig. 4 is B-B view in Fig. 2;
Fig. 5 is the top view of flexible PCB stacking-type laser soldering device of the present invention.
In figure: 1-vertical folded battle array laser instrument, 2-mask plate, 3-flexible PCB welding assembly, 3-1-display screen, 3-2-flexible PCB, 4-1-laser instrument water-cooled block, 4-1a-turnover water channel, 4-2-two dimension is adjusted mirror holder, 4-2a-mirror holder moves plate, 4-2b-connecting thread, 4-2c-holding screw, 4-3-half-nut slide block, 4-4-micrometer adjusting screw, 4-5-regulator bolts, 4-6-spring guide, 4-7-sideskid, 4-8-longitudinal rail, 4-9-longitudinal sliding block, 4-10-cam disc, 4-10a-cam, 4-10b-control crank, 4-11-column, 4-12-spring, 4-13-elevating bracket, 4-13a-lifting arm, 4-14-cantilever, 4-15-cooling water channel, 4-16-leaded light crystal, 4-17-crystal clamping plate, 5-fixture.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the present invention, the technical scheme in the present invention is clearly and completely described.
Please refer to Fig. 1, flexible PCB stacking-type method for laser welding of the present invention is to adopt vertical folded battle array laser instrument 1 in conjunction with the use of mask plate, flexible PCB to be welded.
Described vertical folded battle array laser instrument 1 (also referred to as stacking-type laser instrument) can be regarded as by the laser matrix forming without several laser beams, this is the technical progress of Development of Laser Technology to today, the laser that it sends is no longer a fine laser beam, but the laser energy spot of whole rectangular area, this is the radiant heat field-effect of whole rectangular area by what bring acceptor.
While utilizing vertical folded battle array laser instrument 1 to carry out soldering operation to flexible PCB, general all huge thermal fields of have more than is needed whole rectangle, therefore, the present invention is provided with a mask plate 2 between vertical folded battle array laser instrument 1 and flexible PCB 3, mask plate 2 is provided with the fluting that 3-2 on corresponding flexible PCB needs territory, heated weld zone, and on mask plate 2, do not have slotted region, will cover the heating of unnecessary heat energy to the non-welding region of flexible PCB 3-2.
What the present invention adopted is the principle of field-effect radiation heating, not hot bar heat conduction heating used, therefore, to the welding of flexible PCB, can on acceptor, not produce the gradient of temperature, can be only in the gross area of specific region, to produce the same temperature with field-effect, this by well ensure scolder melting-infiltrate-curing process in, there is good infiltration link, thereby improve welding quality.
Infiltration in brazing process is commonly called as climbs tin, the scolder namely melting can spread out fast and launch, the pad that is covered with whole needs welding (needs the Copper Foil of tin sticky, the surface of copper coin), heat conduction soldering, due to the existence of thermograde, the wetting property of scolder is must be affected, in order to reduce the impact on soldering of thermograde, generally, hot bar adopts the method that improves temperature to improve the speed that infiltrates link more, this is by the excessive temperature that the causes hot bar solder horn non-welding region of flexible PCB of can burning, cause flexible PCB to damage, reduce the temperature of hot bar solder horn, can affect welding quality, this need to find an equalization point.And stack laser weld of the present invention, what adopt is the radiation heating with field-effect, can specific region gross area be heated to same temperature in moment, never has the generation of thermograde.
The present invention has utilized the performance of stacking-type laser instrument, applied in the meticulous welding of flexible PCB, this will change the general modfel of meticulous welding, changes hot conduction-type welding into radiant heating type welding that is:, the latter is by the several times that are the former efficiency, and welding quality has good guarantee.
Please also refer to Fig. 2, flexible PCB stacking-type laser soldering device of the present invention comprises the first driving mechanism that the vertical folded battle array laser instrument 1 plane two dimensional motion of mask plate 2, the driving of vertically folding a battle array laser instrument 1, be positioned at vertical folded gust laser instrument 1 below and vertical direction move up and down and driving mask plate 2 rises and the second driving mechanism of descending motion.
Described mask plate 2 is one and is with slotted sheet metal, the leaded light crystal 4-16 (as shown in Figure 4) fitting tightly is set below mask plate 2, the effect of leaded light crystal 4-16 has two, one, allow laser can penetrate down irradiation acceptor, its two, can suppress the non-welding portion of welding portion, ensure that the position of welding is reliable.The both sides of leaded light crystal 4-16 are provided with for clamping leaded light crystal 4-16 crystal clamping plate 4-17.
Incorporated by reference to reference to figure 3, described the first driving mechanism comprises column 4-11 and is slidably mounted on the longitudinal sliding block 4-9 on column 4-11, the both sides of longitudinal sliding block 4-9 are laterally provided with respectively a sideskid 4-7, the front end of each sideskid 4-7 is provided with the two dimension of the folded battle array of fixed vertical laser instrument 1 and adjusts mirror holder 4-2, described two dimension is adjusted mirror holder 4-2 and is used for driving a vertically folded battle array laser instrument 1 to do two dimension adjustment, and guarantee laser can accurately be aimed at welding region.
Because longitudinal sliding block 4-9 is fixed on column 4-11, in can be on a large scale, carry out the coarse adjustment of vertical folded battle array laser instrument 1Z to (namely above-below direction), coarse adjustment is herein the reserved Z-direction adjustment of differing heights in order to adapt to different workpieces (comprising corresponding fixture).Preferably, sideskid 4-7 front end is fixed with half-nut slide block 4-3, two dimension is adjusted mirror holder 4-2 and is fixed on half-nut slide block 4-3, in cavity between half-nut slide block 4-3 and sideskid 4-7, be inlaid with micrometer adjusting screw 4-4, micrometer adjusting screw 4-4 is the fine setting to (namely above-below direction) for vertical folded battle array laser instrument 1Z.
Preferably, in the moving plate 4-2a of mirror holder of two dimension adjustment mirror holder 4-2, laser instrument water-cooled block 4-1 is installed, vertical folded battle array laser instrument 1 is arranged on the front end of laser instrument water-cooled block 4-1.
Please refer to Fig. 5, in an embodiment, laser instrument water-cooled block 4-1 is arranged on two dimension with connecting thread 4-2b and adjusts in the moving plate 4-2a of mirror holder of mirror holder 4-2 therein.The angular deflection of vertical folded battle array laser instrument 1, realizes deflection by the connecting thread 4-2b being adjusted by two dimension on mirror holder 4-2, and by holding screw 4-2c fixing and locking.Two dimension is adjusted the adjustment of mirror holder 4-2, will directly drive two dimension to adjust the adjustment of mirror holder 4-2, will directly drive vertical folded battle array laser instrument 1 to do the inching that two dimension swings.
Cooling water is flowed through the turnover water channel 4-1a by laser instrument water-cooled block 4-1 vertically to fold a battle array laser instrument 1, thereby lowers the temperature to the vertical gust laser instrument 1 of folding.Laser water-cooled block 4-1 except bear the machinery of vertical folded battle array laser instrument 1 fixing, also play the effect of an apparatus insulator, because system also must ensure vertical folded battle array laser instrument 1 and body insulation simultaneously outside need to fixing to vertical folded battle array laser instrument 1 machinery.
Please also refer to Fig. 2, described the second driving mechanism comprises the cantilever 4-14 of fixing mask plate 2, the cam disc 4-10 that drives cantilever 4-14 to rise and decline, and adds two crystal clamping plate 4-17 that hold leaded light crystal 4-16 and mask plate 2 and be arranged on from bottom to up the front end below of cantilever 4-14.One end of cantilever 4-14 is connected with elevating bracket 4-13, in cam disc 4-10, be provided with the cam 4-10a that is positioned at elevating bracket 4-13 below, cam 4-10a is connected with the lifting arm 4-13a of elevating bracket 4-13 tail end, and rotating cam 4-10a can drive elevating bracket 4-13 to move up and down and then drive together lifting of cantilever 4-14.Concrete, described cam 4-10a can be by the control crank 4-10b driven rotary that is arranged on cam 4-10a below, control crank 4-10b is to lift or to put down elevating bracket 4-13 by the result of cam 4-10a rotation, and it is because cam is being lifted the lifting arm 4-13a on elevating bracket 4-13 that cam 4-10a lifts or put down elevating bracket 4-13.
The crystal clamping plate 4-17 of leaded light crystal 4-16 both sides, together be fixed on together with leaded light crystal 4-16, mask plate 2 below the front end of cantilever 4-14, so, elevating bracket 4-13 is in the time moving up and down, to together drive cantilever 4-14, leaded light crystal 4-16, crystal clamping plate 4-17, mask plate 2 to move up and down together, this action will make leaded light crystal 4-16 push down the non-welding region of flexible PCB, implement laser weld, after having welded, lift control crank 4-10b, namely lift leaded light crystal 4-16, now, just can take and lay workpiece.
Preferably, elevating bracket 4-13 slides and is located at longitudinal rail 4-8, and moving up and down of elevating bracket 4-13 is to be limited to longitudinal rail 4-8, and therefore, elevating bracket 4-13 can only do accurate longitudinal sliding motion.Longitudinal rail 4-8 has ensured the accuracy of cantilever 4-14 in the time doing Z-direction lifting, has namely ensured the accuracy that leaded light crystal 4-16 moves up and down,
The object of cantilever 4-14 rise and fall is to make leaded light crystal 4-16 push down and decontrol the non-welding portion of flexible PCB, to implement the fixing needs of welding.
The top of elevating bracket 4-13 is provided with the regulator bolts 4-5 being connected with regulator bolts 4-5, and leaded light crystal 4-16 is applied by spring 4-12 the pressure of flexible PCB, and its pressure large young pathbreaker regulated by regulator bolts 4-5.
The middle-end of cantilever 4-14 is provided with cooling water channel 4-15, takes away the unnecessary heat energy producing in laser beam welding by cooling water, thus protection leaded light crystal 4-16 and mask plate 2.
Two vertical folded battle array laser instruments 1 are used in the present invention, this is because vertical folded battle array laser instrument 1 rectangular light spot in fact out segments, formed by the hot spot of many strips, the gap location of bar shaped laser spot, to have energy blind spot, so, two vertical folded battle array laser instruments 1 are set and carry out the stack of hot spot, the gap that strip light spots is alternately made in the adjustment that utilizes two dimension to adjust mirror holder 4-2 up, just can ensure the energy uniformity of whole large rectangular light spot.
The present invention also provides a kind of flexible PCB stacking-type method for laser welding, applies above-mentioned laser soldering device and welds, and comprises the steps:
(1) 3-2 on flexible PCB to be welded is placed on the fixture 5 of mask plate 2 belows.
(2) regulate the second driving machine to make the leaded light crystal 4-16 of mask plate 2 belows push down the non-welding portion of flexible PCB 3-2.Concrete, rotatable cam 4-10a drives elevating bracket 4-13 to move up and down and then drive together lifting of cantilever 4-14, due to the crystal clamping plate 4-17 of leaded light crystal 4-16 both sides, together be fixed on together with leaded light crystal 4-16, mask plate 2 below the front end of cantilever 4-14, elevating bracket 4-13 is in the time moving up and down like this, to together drive cantilever 4-14, leaded light crystal 4-16, crystal clamping plate 4-17, mask plate 2 to move up and down together, this action will make leaded light crystal 4-16 push down the non-welding region of flexible PCB.
(3) laser that regulates the first driving mechanism that vertical folded battle array laser instrument 1 is sent can pass fluting on described mask plate 2 to irradiate the welding region of 3-2 on flexible PCB.Concrete, can be by regulating the position of longitudinal sliding block 4-9 on column 4-11, realize vertical folded battle array laser instrument 1Z coarse adjustment on a large scale to (namely above-below direction).Then, can realize the fine setting of vertical folded battle array laser instrument 1Z to (namely above-below direction) by micrometer adjusting screw 4-4.The connecting thread 4-2b that turn two dimension is adjusted on mirror holder 4-2 realizes deflection, directly drives vertical folded battle array laser instrument 1 to do the inching that two dimension swings, and by holding screw 4-2c fixing and locking.
(4) open a vertical folded battle array laser instrument 1, the laser that vertical folded battle array laser instrument 1 is sent passes successively and is radiated at the welding region of 3-2 on flexible PCB after fluting on described mask plate 2, leaded light crystal 4-16 and welds.
Be understandable that, can also comprise the cooling water conveying of opening laser instrument water-cooled block 4-1, to realize the object of lowering the temperature to vertical folded battle array laser instrument 1.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, any belong to those skilled in the art the present invention disclose technical scope in; the variation that can expect easily or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of claim.
Claims (10)
1. a flexible PCB stacking-type laser soldering device, it is characterized in that: comprise vertical folded battle array laser instrument (1), be positioned at the mask plate (2) of vertical folded battle array laser instrument (1) below, drive the first driving mechanism that in vertical folded battle array laser instrument (1) plane, two dimensional motion and vertical direction move up and down and drive mask plate (2) to rise and the second driving mechanism of descending motion, mask plate (2) is provided with the fluting of (3-2) welding region on corresponding flexible PCB, the welding region that the laser that vertical folded battle array laser instrument (1) sends passes (3-2) on described fluting irradiation flexible PCB welds.
2. flexible PCB stacking-type laser soldering device as claimed in claim 1, it is characterized in that: described the first driving mechanism comprises column (4-11) and is slidably mounted on the longitudinal sliding block (4-9) on column (4-11), the both sides of longitudinal sliding block (4-9) are laterally provided with respectively a sideskid (4-7), the front end of each sideskid (4-7) is provided with the two dimension of fixed vertical folded battle array laser instrument (1) and adjusts mirror holder (4-2), and described two dimension is adjusted mirror holder (4-2) for driving vertical folded battle array laser instrument 1 to do two dimension adjustment.
3. flexible PCB stacking-type laser soldering device as claimed in claim 2, it is characterized in that: sideskid (4-7) front end is fixed with half-nut slide block (4-3), two dimension is adjusted mirror holder (4-2) and is fixed on half-nut slide block (4-3), in cavity between half-nut slide block (4-3) and sideskid (4-7), be inlaid with micrometer adjusting screw (4-4), micrometer adjusting screw (4-4) is for the fine setting of vertical folded battle array laser instrument (1) Z-direction.
4. flexible PCB stacking-type laser soldering device as claimed in claim 2, it is characterized in that: in the moving plate (4-2a) of mirror holder of two dimension adjustment mirror holder (4-2), laser instrument water-cooled block (4-1) is installed, vertical folded battle array laser instrument (1) is arranged on the front end of laser instrument water-cooled block (4-1), is provided with the turnover water channel (4-1a) that Cooling Water passes through in laser instrument water-cooled block (4-1).
5. flexible PCB stacking-type laser soldering device as claimed in claim 4, it is characterized in that: laser instrument water-cooled block (4-1) connecting thread (4-2b) is arranged on two dimension and adjusts in the moving plate (4-2a) of mirror holder of mirror holder (4-2), connecting thread (4-2b) is vertically folded a gust angular deflection for laser instrument (1) for realizing, and by holding screw (4-2c) fixing and locking.
6. the flexible PCB stacking-type laser soldering device as described in claim as arbitrary in claim 1-5, is characterized in that: described the second driving mechanism comprises the cantilever (4-14) of fixing mask plate (2), the cam disc (4-10) that drives cantilever (4-14) to rise and decline.
7. flexible PCB stacking-type laser soldering device as claimed in claim 6, it is characterized in that: the leaded light crystal (4-16) fitting tightly is set below mask plate (2), the both sides of leaded light crystal (4-16) are provided with the crystal clamping plate (4-17) for clamping leaded light crystal (4-16), add two crystal clamping plate (4-17) of holding leaded light crystal (4-17) and mask plate (2) and be arranged on from bottom to up the front end below of cantilever (4-14).
8. flexible PCB stacking-type laser soldering device as claimed in claim 6, it is characterized in that: one end of cantilever (4-14) is connected with elevating bracket (4-13), in cam disc (4-10), be provided with the cam (4-10a) that is positioned at elevating bracket (4-13) below, cam (4-10a) is connected with the lifting arm (4-13a) of elevating bracket (4-13) tail end, and rotating cam (4-10a) can drive elevating bracket (4-13) to move up and down and then drive together lifting of cantilever (4-14).
9. flexible PCB stacking-type laser soldering device as claimed in claim 8, it is characterized in that: elevating bracket (4-13) slides and is located at longitudinal rail (4-8), and moving up and down of elevating bracket (4-13) is limited to longitudinal rail (4-8).
10. a flexible PCB stacking-type method for laser welding, is characterized in that: in application rights requirement 1-9, described in any one, laser soldering device welds, and comprises the steps:
(1) (3-2) on flexible PCB to be welded is placed on the fixture (5) of mask plate (2) below;
(2) regulate the second driving machine to make the leaded light crystal (4-16) of mask plate (2) below push down the non-welding portion of flexible PCB (3-2);
(3) laser that regulates the first driving mechanism that vertical folded battle array laser instrument (1) is sent can pass fluting on described mask plate (2) to irradiate the welding region of (3-2) on flexible PCB;
(4) open a vertical folded battle array laser instrument (1), the laser that vertical folded battle array laser instrument (1) is sent passes successively the welding region that is radiated at (3-2) on flexible PCB after fluting on described mask plate (2), leaded light crystal (4-16) and welds.
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Denomination of invention: Flexible circuit board stack type laser welding device and method Effective date of registration: 20200918 Granted publication date: 20151111 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: WUHAN ROCLASER AUTOMATION EQUIPMENT Co.,Ltd. Registration number: Y2020420000063 |
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Denomination of invention: Stack type laser welding device and method for flexible circuit board Effective date of registration: 20220927 Granted publication date: 20151111 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: WUHAN ROCLASER AUTOMATION EQUIPMENT CO.,LTD. Registration number: Y2022420000326 |
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