CN104185371B - A kind of circuit board of LED, LED lamp panel and board production technique - Google Patents
A kind of circuit board of LED, LED lamp panel and board production technique Download PDFInfo
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- CN104185371B CN104185371B CN201410340301.9A CN201410340301A CN104185371B CN 104185371 B CN104185371 B CN 104185371B CN 201410340301 A CN201410340301 A CN 201410340301A CN 104185371 B CN104185371 B CN 104185371B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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Abstract
The invention discloses a kind of circuit board of LED, LED lamp panel and board production technique.LED lamp panel includes LED die, wafer lead and circuit board, circuit board includes mirror board, substrate and solder mask, substrate includes wafer mounting hole, mirror board is bonded in the back side of substrate, solder mask is covered in the front of substrate, the front of substrate includes aluminum conducting wire, and the outer surface of conducting wire includes blasted rough layer.Pad ultrasonic bonding in the aluminum conducting wire of wafer lead and circuit board；LED die is mounted on the mirror board in substrate wafer mounting hole.There is the rough layer that sandblasting is formed the outer surface of conducting wire of the present invention, when carrying out ultrasonic bonding with metal lead wire especially aluminum lead, the degree of fusion of lead and pad is high, and compared with the aluminium alloy pad not through blasting treatment, lead can bear higher pulling force.The acceptance rate of manufactured LED lamp panel is high, fault rate is low during use.
Description
[technical field]
The present invention relates to LED illumination, more particularly to a kind of circuit board of LED, LED lamp panel and board production technique.
[background technology]
LED is widely used as lighting source due to having the characteristics that energy-conservation, low consumption, long lifespan, and is still in
Continue in rapidly development.Common LED illumination is typically white lamp, also has part directly to use wafer enclosure.White light is present at present
The situation of descending luminance, when especially power is bigger this puzzlement can more highlight；And when electric current is increased, the heat of encapsulating material
Anti- to drop to below 10K/W, encapsulating material is typically mainly epoxy resin, after the anti-reduction of heat, from being encapsulated into dissipating for pcb board
Thermal effect can all reduce, and cause the rising of LED chip temperature, the phenomenon of luminous efficiency decline occur.Although use direct chip
Encapsulation can reach the requirement of high-power illumination light source, but also there are problems that simultaneously many, and some products are used in PCB substrate
The phenomenon of solution luminance decline is attempted as conductive and heat-conducting medium to copper grade metal material, but copper product price is continuous
Go up, form cost pressure.
In order to solve this problem, Chinese invention application (application number：CN200910137198.7) disclose a kind of new
Aluminium solid crystal board LED technology, including wafer, wafer seat, lead, wafer counter-base and substrate, substrate is the substrate of insulating materials, brilliant
First seat, wafer counter-base are directly fixed on substrate；Wafer seat and wafer counter-base are aluminum material, wafer directly with aluminum material phase
Contact；It is aluminum material to electrically connect wafer and the lead of wafer counter-base.Aluminium solid crystal board LED technology energy-conserving and environment-protective, reduce electricity
The link of plating, and reduce production process.But aluminum material welding performance is poor, the lead of aluminum and the wafer pair of aluminum
Seat when use ultrasonic bonding pulling force it is weak, the poor feasibility of the lead connection of aluminum, the acceptance rate of LED lamp panel is relatively low, use when
The failure easily occurred.In addition, the weldability of the power line pad and copper power line of circuit board aluminum is poor, although using tin cream
The welding of copper cash and aluminum pad, but the poor reliability of joint can be realized, persistent risk is larger.
[content of the invention]
The technical problem to be solved in the present invention is to provide a kind of aluminum pad and metal lead wire especially aluminum lead to weld
When can obtain higher-strength, the circuit board for the LED that the acceptance rate of manufactured LED lamp panel is high, fault rate is low.
Another technical problems to be solved of the invention are to provide a kind of aluminum pad and drawn with metal lead wire especially aluminum
Wire bonding intensity is high, and manufacturing process acceptance rate is high, fault rate low LED lamp panel when using.
Further technical problems to be solved of the invention are to provide a kind of and good LED lamp circuit of copper power supply wire welding
Plate and LED lamp panel
The present invention also has a technical problems to be solved to be to provide a kind of aluminum pad and aluminum lead ultrasonic bonding quality
Good board production technique.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is a kind of aluminium alloy circuit board production technology,
Comprise the following steps：
101) conducting wire is formed on aluminum foil plate；
102) blasting treatment is carried out to the conducting wire on aluminum foil plate, coarse outer surface is formed in conducting wire；103)
Solder mask is formed on the rough external surface of aluminum foil plate.
Above-described aluminium alloy circuit board production technology, described aluminum foil plate are silico-aluminum paper tinsel plates.
Above-described aluminium alloy circuit board production technology, comprises the following steps：
301) in step 101 aluminum foil plate front printing resistance to acid attack ink conductive circuit pattern, etch, move back film after formed
Described conducting wire；
302) in step 103, light sensitive anti-solder ink is printed, pad is formed after exposure, development；
303) wafer hole is opened on aluminum foil plate；Aluminum silicon alloy plate is pasted on minute surface aluminium sheet and pressed.
Above-described aluminium alloy circuit board production technology, comprises the following steps：
401) in step 101 aluminum foil plate front printing resistance to acid attack ink conductive circuit pattern, etch, move back film after formed
Described conducting wire, wafer hole is opened on aluminum foil plate；
402) after step 102, aluminum silicon alloy plate is pasted on minute surface aluminium sheet and pressed；
403) pasted in aluminum foil plate positive power supply line both positive and negative polarity pad locations with the FPC pads for being easy to soldering top layer；
404) in step 103, the reflective membrane for holding wafer hole and pad hole successfully is being pasted into aluminum foil plate and FPC pads just
Face, reflective membrane and aluminum foil plate are pressed.
A kind of circuit board of LED, including mirror board, substrate and solder mask, substrate include wafer mounting hole, and mirror board glues
Close at the back side of substrate, solder mask is covered in the front of substrate, and the front of substrate includes aluminum conducting wire, and substrate is that sial closes
Goldleaf plate；Aluminum conducting wire is the conducting wire that silico-aluminum paper tinsel plate aluminium foil is formed, and the outer surface of conducting wire is through sandblasting shape
Into roughened finish.
Above-described circuit board, solder mask are reflective membranes, and wafer hole and pad hole, reflective membrane bonding are included on reflective membrane
On substrate；The edge in reflective membrane wafer hole is extended in the wafer mounting hole of substrate, is pasted on mirror board.
Above-described circuit board, including two pieces of FPC, FPC include insulating bottom layer and are easy to the top layer of soldering, and FPC's is exhausted
Edge bottom is pasted onto the front of substrate, and solder mask is covered on FPC；Solder mask includes two power line pad holes and two power supplys
The bridging hole of wire bonding disk, FPC top layer are located at solder mask power line pad hole and bridge the lower section in hole；Solder mask is in each power supply
The bridging of wire bonding disk includes a lead pad hole near hole, and aluminum conducting wire passes through the lower section in lead pad hole.
A kind of LED lamp panel, including LED die, wafer lead and circuit board, circuit board are the circuit boards of above-mentioned LED,
Pad ultrasonic bonding in the aluminum conducting wire of wafer lead and circuit board；LED die is mounted on substrate wafer mounting hole
In mirror board on.
Above-described LED lamp panel, the solder mask of circuit board is reflective membrane, includes wafer hole and pad hole on reflective membrane,
Reflective membrane is bonded on substrate；The edge in reflective membrane wafer hole is extended in the wafer mounting hole of substrate, is pasted on mirror board；
LED die is mounted on the mirror board on reflective membrane in wafer hole.
Above-described LED lamp panel, including two aluminum bridging leads, circuit board include two pieces of FPC, and FPC includes insulation
Bottom and the top layer for being easy to soldering, FPC insulating bottom layer are pasted onto the front of substrate, and reflective membrane is covered on FPC；Reflective membrane bag
Two power line pad holes and two bridging pad holes are included, FPC top layer is located at reflective membrane power line pad hole and bridging pad
The lower section in hole；Reflective membrane includes a lead pad hole near each bridging pad hole, and aluminum conducting wire passes through lead
The lower section of pad hole；One end of aluminum bridging lead is welded with the FPC top layers below bridging pad hole, the other end and lead pad
Aluminum conducting wire welding below hole；Bridge pad hole and 4, lead pad hole hole is close to each other, one encapsulates glue point by 4
Together with individual hole and two aluminums bridging lead packages..
There is the rough layer that sandblasting is formed the outer surface of conducting wire of the present invention, and sandblasting can not only remove conducting wire surface
Oxide layer, what is more important form it is coarse, hardening surface, it is clean, coarse, hardening aluminium alloy pad, with gold
When belonging to lead especially with the progress ultrasonic bonding of aluminum lead, pad can produce higher welding temperature, welding effect
Good, the degree of fusion of lead and pad is high, and compared with the aluminium alloy pad not through blasting treatment, lead can bear higher
Pulling force.The acceptance rate of manufactured LED lamp panel is high, fault rate is low during use.
[brief description of the drawings]
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description.
Fig. 1 is the structural representation of 1LED lamp plates of the embodiment of the present invention.
Fig. 2 is structural representation of the circuit board of the embodiment of the present invention 2 in procedure of processing 1.
Fig. 3 is the structural representation that FPC is posted on the circuit board of the embodiment of the present invention 2.
Fig. 4 is the structural representation of 2 reflective tunica albuginea of embodiment of the present invention drilling.
Fig. 5 is that the circuit board of the embodiment of the present invention 2 posts the structural representation after reflective tunica albuginea.
Fig. 6 is the structural representation of the circuit board of the embodiment of the present invention 2.
Fig. 7 is the structural representation of 2LED lamp plates of the embodiment of the present invention.
Fig. 8 is the partial enlarged drawing at A positions in Fig. 7.
Fig. 9 is 2FPC of embodiment of the present invention front view.
Figure 10 is B in Fig. 9 to sectional view.
Figure 11 is 3FPC of embodiment of the present invention front view.
Figure 12 is C in Figure 11 to sectional view.
Figure 13 is structural representation when reflective membrane is not pasted at 4LED lamp plate FPC of embodiment of the present invention positions.
Figure 14 is the structural representation at 4LED lamp plate FPC of embodiment of the present invention positions.
Figure 15 is the structural representation of the board power wire bonding pan portion position of the embodiment of the present invention 5.
Figure 16 is the conducting wire table that silico-aluminum paper tinsel board production technology embodiment 1-3 circuit boards of the present invention are crossed before sand-blasting machine
Face enlarged drawing.
Figure 17 is the conducting wire table that silico-aluminum paper tinsel board production technology embodiment 1-3 circuit boards of the present invention are crossed after sand-blasting machine
Face enlarged drawing.
Figure 18 is SMD bonding wire tensile test schematic diagrames.
[embodiment]
The structure of 1LED lamp plates of the embodiment of the present invention is as shown in figure 1, including LED die 3, aluminum wafer lead 4 and circuit
Plate.
Circuit board includes mirror board 1, substrate 2 and ink solder mask 5.Substrate 2 is silico-aluminum paper tinsel plate.
There is wafer mounting hole on substrate 2, mirror board 1 is bonded in the back side of substrate 2, and ink solder mask 5 is covered in substrate 2
Front.LED die 3 is mounted on the mirror board 1 in the wafer mounting hole of substrate 2.
There is the conducting wire 201 that silico-aluminum paper tinsel plate aluminium foil is formed in the front of substrate 2.The outer surface of conducting wire 201 has
The rough layer 201a that sandblasting is formed.
Aluminum wafer lead 4 carries out ultrasonic bonding with the pad in the aluminum conducting wire 201 of circuit board.
There is the rough layer 201a that sandblasting is formed the outer surface of the conducting wire 201 of the embodiment of the present invention 1, and sandblasting can not only remove
Fall the oxide layer on the surface of conducting wire 201, what is more important forms the surface of coarse hardening, clean, coarse, hardening
Aluminium alloy pad, when carrying out ultrasonic bonding with aluminum lead, pad can produce higher welding temperature, welding effect
Good, the degree of fusion of aluminum lead and pad is high, and compared with the aluminium alloy pad not through blasting treatment, aluminum lead can be held
By higher pulling force.The acceptance rate of manufactured LED lamp panel is high, fault rate is low during use.
The structure and manufacturing process of 2LED lamp plates of the embodiment of the present invention are as shown in Fig. 2 to Figure 10：
The LED lamp panel of the embodiment of the present invention 2, including LED die 3, aluminum wafer lead 4, mirror board 1, as substrate 2
Silico-aluminum paper tinsel plate, as solder mask and reflect LED light line reflective membrane 5.
There are multiple wafer mounting holes 203 on substrate 2, mirror board 1 is bonded in the back side of substrate 2, and reflective membrane 5 is pasted onto substrate
2 front.
There is the conducting wire 201 that silico-aluminum paper tinsel plate aluminium foil is formed in the front of substrate 2.The outer surface of conducting wire 201 has
The rough layer that sandblasting is formed.
Aluminum wafer lead 4 carries out ultrasonic bonding with the pad in the aluminum conducting wire 201 of circuit board.
Include the pad hole 502 of multiple wafer holes 501 and multiple positive and negative pads on reflective membrane 5, reflective membrane 5 is bonded in substrate
On 2；The edge in reflective membrane wafer hole 501 is extended in the wafer mounting hole 203 of substrate 2, is pasted on mirror board 1；LED die
3 are mounted on the mirror board 1 on reflective membrane 5 in wafer hole 501 and substrate wafer mounting hole 203.
For the ease of circumscripted power line, circuit board also includes one piece of FPC 6, and (when drill-through string holes 205, FPC 6 is divided into
Two pieces), FPC 6 includes insulating bottom layer 601, adhesive-layer 602, copper foil layer 603 and Gold plated Layer 604, FPC 6 insulating bottom layer 601
The front of substrate 2 is pasted onto by adhesive-layer 602, reflective membrane 5 is pasted onto on FPC 6.Reflective membrane 5 has two power line pad holes
503 and two bridging pad holes 504, FPC 6 Gold plated Layer 604 be located at the power line pad hole 503 of reflective membrane 5 and bridge pad hole
504 lower section；Reflective membrane 5 has a lead pad hole 505, aluminum conducting wire 201 near each bridging pad hole 504
By the lower section in lead pad hole 505；The Gold plated Layers of FPC 6 of one end of aluminum bridging lead 7 and the lower section of bridging pad hole 504
The pad solder that the aluminum conducting wire 201 of 604 welding, the other end and the lower section of lead pad hole 505 is formed.
The manufacturing process of 2LED lamp plates of the embodiment of the present invention is as follows：
1) conducting wire formed on alusil alloy paper tinsel plate required for circuit design, is being needed to weld as in circuit design
Connect the position drilling of wafer；The alusil alloy paper tinsel plate surface of conducting wire is being formed, is doing a blasting treatment；It will do at sandblasting
The alusil alloy paper tinsel plate of reason, is fitted in specular aluminium, as shown in Fig. 2；
2) the FPC pads that a surface gold-plating is pasted in power line both positive and negative polarity pad locations are as shown in Figure 3；
3) wafer hole and both positive and negative polarity pad hole are bored on reflective tunica albuginea, as shown in Figure 4；
4) hole-drilled reflective tunica albuginea is bonded on the alloy foil plate for posting FPC pads, as shown in Figure 5；
5) drill screw holes 10 and cable-through hole 11, mill out the profile of required product, circuit board are made, as shown in Figure 6；
6) LED die is mounted on circuit boards, welds aluminum wafer lead with supersonic welder and aluminum bridges lead, most
LED lamp panel is made in sealing afterwards, as shown in Figure 7 and Figure 8.
The embodiment of the present invention 2 is easy to the pad of soldering using FPC, is easy to the user of no device for ultrasonic welding to use tin
Weld power line and FPC pad solder, and the good reliability of power supply wire bonding.
As is illustrated by figs. 11 and 12, FPC 6 is overall structure to 3LED lamp plates of embodiment of the present invention FPC structure, when drill-through
During string holes, FPC 6 is divided into two pieces.FPC 6 includes insulating bottom layer 601, adhesive-layer 602 and copper foil layer 603；Copper foil layer 603 is made
It is easy to the top layer of soldering, one end and power line soldering for FPC, the other end passes through ultrasonic bonding with aluminum bridging lead.FPC is just
The metal of other just solderings, such as nickel coating or silver coating can also be used in the top layer of soldering.
The structure at 4LED lamp plate FPC of embodiment of the present invention positions as shown in Figure 13 and Figure 14, as different from Example 2,
Totally 4 holes are close together for two bridging pad holes 503 and two lead pad holes 504, and one encapsulates the can of glue point 12 by 4
Individual hole and two aluminums bridging leads 7 are packaged together, the step of simplifying encapsulation.
The structure of the board power wire bonding pan portion position of the embodiment of the present invention 5 is as shown in figure 15, as different from Example 4,
Circuit board includes two pieces of sheet metals 13 for being used as power line pad, and sheet metal 13 includes conducting resinl bottom 1302 and copper sheet layer
1301, copper sheet layer 1301, which has, is easy to the plating top layer 1301a of soldering, plating top layer 1301a can be Gold plated Layer, silver coating or
Nickel coating, copper sheet layer 1301 can also be without plating, because copper sheet layer surface inherently has the attribute for being easy to soldering, simply
Copper easily aoxidizes relative to noble metal.
Sheet metal 13 is pasted onto the front of substrate, and the reflective membrane 5 as solder mask is pasted onto the front of substrate 2, is covered in
The top of conductive metal sheet 13.Reflective membrane 5 has two power line pad holes 503, and two pieces of sheet metals 13 are located at two power supplys respectively
The lower section of wire bonding disk hole 503.The copper sheet layer 1301 of two pieces of sheet metals 13 is conductive with positive aluminum respectively by conducting resinl bottom 1302
Circuit 211a, negative aluminum conducting wire 201b are bonded and electrically connected, and are solved aluminum conducting wire and are not easy to copper power line tin
The difficulty of weldering.
Silico-aluminum paper tinsel board production technology embodiment 1
Plate face forms conducting wire, after blasting treatment, coating welding resisting layer, bores the hole for welding wafer again, step is as follows：
1) the alusil alloy paper tinsel plate for choosing thick 0.1mm (10 μm of 40 μm/insulating barrier of aluminium, 50 μm/glue) is cut into the chi of needs
It is very little；
2) conductive circuit pattern of resistance to acid attack ink is directly printed after plate face cleaning, in an oven 70 DEG C of baking 30min；
3) etch, move back the conducting wire formed required for circuit design after film；
4) on off test is done, nothing opens short circuit phenomenon, coincident circuit design requirement；
5) the alusil alloy paper tinsel plate surface of conducting wire is being formed, is doing a blasting treatment；Sandblasting parameter is：
Sand-blasting machine：JYN1121 (Ju Yongneng Science and Technology Ltd.s of Shenzhen)
Blasting pressure：1.0-1.5KG/CM2
Sandblasting speed：1.5M-2.0M/MIN
Sand grains physical index：
6) it will do on the alusil alloy paper tinsel plate of blasting treatment, and printed the white light sensitive anti-solder ink of one layer of about 15 μ m-thick；
75 DEG C of baking 40min in an oven；
7) solder pad for exposing, being formed after development required for circuit design, and 160 DEG C of baking 60min in an oven；
8) on off test, no obstructed phenomenon of via, coincident circuit design requirement are done；
9) position for welding wafer is being needed to drill by circuit design；
10) release liners of silico-aluminum paper tinsel back are torn, aluminum silicon alloy plate is pasted on minute surface aluminium sheet, with manual pressure
Machine is pressed 20 seconds with 180 DEG C；
11) pressed on traditional pressing machine, aluminum silicon alloy plate and minute surface aluminium sheet are compacted；Pressing parameter is：
Pressure：100KG/CM2
Temperature：180℃
Hot pressing time：60min
It is cold-pressed the time：30min
12) foundation product graphic documentation, the profile of required product is milled out on plate-milling machine；
13) voltage-withstand test, thermal shock test and high/low temperature test are done.
Silico-aluminum paper tinsel board production technology embodiment 2
Alusil alloy paper tinsel board production technology, using elder generation in plate face image transferring conductive line pattern, then bore welding wafer
Hole, then etch, move back film, be finally bonded gold plated pads, and reflective tunica albuginea, drill screw holes and cable-through hole again after pressing, step is such as
Under：
1) alusil alloy paper tinsel plate and thick anti-of 0.1mm of thick 0.1mm (10 μm of 40 μm/insulating barrier of aluminium, 50 μm/glue) are chosen
Light tunica albuginea, it is cut into the size of needs；
2) conductive circuit pattern of resistance to acid attack ink is directly printed after plate face cleaning, in an oven 70 DEG C of baking 30min；
3) position for welding wafer is being needed to drill by circuit design；Simultaneously by the reflective tunica albuginea cut by circuit
Wafer and the drilling of both positive and negative polarity pad locations are welded needed for design；
4) etch, move back the conducting wire formed required for circuit design after film；
5) on off test is done, nothing opens short circuit phenomenon, 100% coincident circuit design requirement；
6) the alusil alloy paper tinsel plate surface of conducting wire is being formed, is doing a blasting treatment；Sandblasting parameter is：
Sand-blasting machine：JYN1121 (Ju Yongneng Science and Technology Ltd.s of Shenzhen)
Blasting pressure：1.0-1.5KG/CM2
Sandblasting speed：1.5M-2.0M/MIN
Sand grains physical index：
7) the alusil alloy paper tinsel plate of blasting treatment will be done, was fitted on minute surface aluminium sheet, was pressed 10 seconds on handpress
(160 DEG C),
8) paste the gold-plated FPC pads of one side in power line both positive and negative polarity pad locations (FPC another sides are printed on conducting resinl)；
9) a hole-drilled reflective tunica albuginea is bonded on the alloy foil plate for post FPC gold plated pads again, with manual pressure
Machine is pressed 10 seconds with 160 DEG C；
10) pressed on traditional pressing machine, alusil alloy paper tinsel plate and reflective tunica albuginea are compacted with minute surface aluminium sheet；
Pressing parameter is：
Pressure：100KG/CM2
Temperature：180℃
Hot pressing time：60min
It is cold-pressed the time：30min
11) foundation product graphic documentation, the profile of required product is milled out on plate-milling machine；
12) voltage-withstand test, thermal shock test and high/low temperature test are done.
Silico-aluminum paper tinsel board production technology embodiment 3
Alusil alloy paper tinsel board production technology, using elder generation in plate face image transferring conductive line pattern, then bore welding wafer
Hole, then etch, move back film, be finally bonded copper bond pad, and reflective tunica albuginea, drill screw holes and cable-through hole again after pressing, step is such as
Under：
1) choose thick 0.1mm (10 μm of 40 μm/insulating barrier of aluminium, 50 μm/glue) alusil alloy paper tinsel plate and 0.1mm it is reflective
Tunica albuginea, it is cut into the size of needs；
2) conductive circuit pattern of resistance to acid attack ink is directly printed after plate face cleaning, in an oven 70 DEG C of baking 30min；
3) position for welding wafer is being needed to drill by circuit design；Simultaneously by the reflective tunica albuginea cut by circuit
Wafer and the drilling of both positive and negative polarity pad locations are welded needed for design；
4) etch, move back the conducting wire formed required for circuit design after film；
5) on off test is done, nothing opens short circuit phenomenon, 100% coincident circuit design requirement；
6) the alusil alloy paper tinsel plate surface of conducting wire is being formed, is doing a blasting treatment；Sandblasting parameter is：
Sand-blasting machine：JYN1121 (Ju Yongneng Science and Technology Ltd.s of Shenzhen)
Blasting pressure：1.0-1.5KG/CM2
Sandblasting speed：1.5M-2.0M/MIN
Sand grains physical index：
7) the alusil alloy paper tinsel plate of blasting treatment will be done, was fitted on minute surface aluminium sheet, was pressed 10 seconds on handpress
(160 DEG C),
8) respectively paste a copper FPC pad in both positive and negative polarity pad locations (another side of FPC pads is printed on conducting resinl)；
9) a hole-drilled reflective tunica albuginea is bonded on the alloy foil plate for posting copper FPC pads again, with manual pressure
Machine is pressed 10 seconds with 160 DEG C；
10) pressed on traditional pressing machine, alusil alloy paper tinsel plate and reflective tunica albuginea are compacted with minute surface aluminium sheet；
Pressing parameter is：
Pressure：100KG/CM2
Temperature：180℃
Hot pressing time：60min
It is cold-pressed the time：30min
11) foundation product graphic documentation, the profile of required product is milled out on plate-milling machine；
12) voltage-withstand test, thermal shock test and high/low temperature test are done.
As shown in FIG. 16 and 17, the aluminum alloy surface through blasting treatment, oxide layer can be not only removed, it is even more important
It is the surface for foring coarse hardening.Clean, coarse, hardening aluminium alloy pad is carrying out ultrasonic bonding with aluminum lead
When, pad can produce higher welding temperature, and welding effect is good, and the degree of fusion of aluminum lead and pad is high, with not passing through
The aluminium alloy pad of blasting treatment is compared, and aluminum lead can bear higher pulling force.
Table 1 be the embodiment of the present invention 1 through the aluminium alloy pad of blasting treatment with being born after aluminum lead ultrasonic bonding
Tensile test and aluminium alloy pad of the prior art without blasting treatment and the drawing born after aluminum lead ultrasonic bonding
The contrast table of power test：
| Numbering | The welding pulling force (g) of the non-sandblasting of pad | Welding pulling force (g) of the pad Jing Guo sandblasting |
| 1 | 10 | 13 |
| 2 | 12 | 15 |
| 3 | 10 | 13 |
| 4 | 9 | 14 |
| 5 | 10.5 | 14 |
| 6 | 10 | 13 |
| 7 | 10 | 13 |
| 8 | 9 | 15 |
| 9 | 12 | 15 |
| 10 | 10 | 14 |
The SMD bonding wire pull force test method that pulling force data is obtained in upper table is as follows：
1. prepare bonding wire product to place below microscope；
2. the pointer of tensiometer as shown in figure 18, is transferred into 0 scale, and drag hook is placed at bank C points, is pulled upwardly to line
It is disconnected, pulling force numerical value when read line is disconnected；
3. the disconnected position of observation line is simultaneously recorded in pulling force record sheet.
Line footpath is that 1.0mil aluminum steel pulling force have to be larger than 8g；1.25mil aluminum steel pulling force have to be larger than 10g. and break
Point is necessary for B, C,；If it is a little A to break, E does not receive then.
The line footpath of aluminum steel is 1.25mil, aluminium alloy pad of the prior art without blasting treatment and aluminum lead in table 1
The pulling force born after ultrasonic bonding can not meet test request, the aluminium alloy pad through blasting treatment and aluminum lead ultrasound
The pulling force that wave soldering is born after connecing all meets test request.
Above example of the present invention has following beneficial effect：
1) copper is substituted with aluminium alloy, by the pedestal direct conduction of aluminum alloy material, reduces the cost of product, can drop
Low 80 percent Master Cost；
2) silico-aluminum paper tinsel plate and blasting craft are taken, improves aluminum alloy surface characteristic, adds aluminum alloy surface knot
Conjunction ability is effectively improved the solderability of product；
3) surface treatment reduces electronickelling gold link, reduces pollution, has saved the energy, and saves substantial amounts of processing
Process.
Claims (6)
1. a kind of aluminium alloy circuit board production technology, it is characterised in that comprise the following steps：
101) aluminum foil plate front printing resistance to acid attack ink conductive circuit pattern, etch, move back film after form conducting wire, in aluminium
Wafer hole is opened on paper tinsel plate；
102) blasting treatment is carried out to aluminium foil plate surface, coarse outer surface is formed in aluminum foil plate and conducting wire above；Then,
Aluminum silicon alloy plate is pasted on minute surface aluminium sheet and pressed；
103) pasted in aluminum foil plate positive power supply line both positive and negative polarity pad locations with the FPC pads for being easy to soldering top layer；
104) solder mask is formed on the rough external surface of aluminum foil plate, the reflective membrane for holding wafer hole and pad hole successfully is pasted into aluminium foil
The front of plate and FPC pads, reflective membrane and aluminum foil plate are pressed.
2. aluminium alloy circuit board production technology according to claim 1, it is characterised in that described aluminum foil plate is that sial closes
Goldleaf plate.
3. a kind of circuit board of LED, including mirror board, substrate, solder mask and two pieces of FPC, substrate include wafer mounting hole, mirror
Panel is bonded in the back side of substrate, and solder mask is covered in the front of substrate, and the front of substrate includes aluminum conducting wire, its feature
It is, substrate is silico-aluminum paper tinsel plate, and aluminum conducting wire is the conducting wire that silico-aluminum paper tinsel plate aluminium foil is formed, conducting wire
Outer surface through sandblasting formed roughened finish；FPC includes insulating bottom layer and is easy to the top layer of soldering, and FPC insulating bottom layer is pasted
In the front of substrate, solder mask is covered on FPC；Solder mask include two power line pad holes and two power line pads across
Hole is connect, FPC top layer is located at solder mask power line pad hole and bridges the lower section in hole；Solder mask bridges in each power line pad
Include a lead pad hole near hole, aluminum conducting wire passes through the lower section in lead pad hole.
4. circuit board according to claim 3, it is characterised in that solder mask is reflective membrane, includes wafer hole on reflective membrane
And pad hole, reflective membrane are bonded on substrate；The edge in reflective membrane wafer hole is extended in the wafer mounting hole of substrate, is pasted
On mirror board.
5. a kind of LED lamp panel, including LED die, wafer lead and circuit board, it is characterised in that draw including two aluminum bridgings
Line, circuit board are the circuit boards of the LED described in claim 3, including two pieces of FPC；Wafer lead, lead with the aluminum of circuit board
Pad ultrasonic bonding in electric line；LED die is mounted on the mirror board in substrate wafer mounting hole；FPC includes insulation
Bottom and the top layer for being easy to soldering, FPC insulating bottom layer are pasted onto the front of substrate, and reflective membrane is covered on FPC；Reflective membrane bag
Two power line pad holes and two bridging pad holes are included, FPC top layer is located at reflective membrane power line pad hole and bridging pad
The lower section in hole；Reflective membrane includes a lead pad hole near each bridging pad hole, and aluminum conducting wire passes through lead
The lower section of pad hole；One end of aluminum bridging lead is welded with the FPC top layers below bridging pad hole, the other end and lead pad
Aluminum conducting wire welding below hole；Bridge pad hole and 4, lead pad hole hole is close to each other, one encapsulates glue point by 4
Together with individual hole and two aluminums bridging lead packages.
6. LED lamp panel according to claim 5, it is characterised in that the solder mask of circuit board is reflective membrane, is wrapped on reflective membrane
Wafer hole and pad hole are included, reflective membrane is bonded on substrate；The edge in reflective membrane wafer hole extends to the wafer mounting hole of substrate
It is interior, paste on mirror board；LED die is mounted on the mirror board on reflective membrane in wafer hole.
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| CN201410340301.9A CN104185371B (en) | 2014-07-17 | 2014-07-17 | A kind of circuit board of LED, LED lamp panel and board production technique |
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| CN104185371B true CN104185371B (en) | 2017-12-08 |
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| CN114980507B (en) * | 2022-02-15 | 2024-05-10 | 赛尔富电子有限公司 | Circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202282908U (en) * | 2011-11-09 | 2012-06-20 | 东莞市新东方光电技术有限公司 | Backlight FPC (flexible printed circuit) structure |
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| JP4098406B2 (en) * | 1998-06-26 | 2008-06-11 | カルソニックカンセイ株式会社 | Filler neck mounting structure to heat exchanger tank |
| CN101594747A (en) * | 1998-07-08 | 2009-12-02 | 伊比登株式会社 | Printed circuit board and manufacturing methods |
| CN102130268A (en) * | 2010-01-19 | 2011-07-20 | 富士迈半导体精密工业（上海）有限公司 | Solid-state light-emitting component and light source module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202282908U (en) * | 2011-11-09 | 2012-06-20 | 东莞市新东方光电技术有限公司 | Backlight FPC (flexible printed circuit) structure |
Non-Patent Citations (2)
| Title |
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| Influence of sonotrode texture on the performance of an ultrasonic consolidation machine and the interfacial bond strength;Dezhi Li et al;《Journal of Materials Processing Technology》;20090228;第209卷(第04期);第10页第8-14行 * |
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