CN104181578B - earthquake detection system and detection method - Google Patents
earthquake detection system and detection method Download PDFInfo
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- CN104181578B CN104181578B CN201310199226.4A CN201310199226A CN104181578B CN 104181578 B CN104181578 B CN 104181578B CN 201310199226 A CN201310199226 A CN 201310199226A CN 104181578 B CN104181578 B CN 104181578B
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Abstract
The invention discloses a kind of earthquake detection system, the earthquake detection system includes vibration detection module, magnetic field detection module, processing module and alarm module, the vibration detection module includes X axis vibration detection unit, Y axis vibration detection unit and Z axis vibration detection unit, and the vibration signal of X-direction, Y direction and Z-direction is detected respectively；The magnetic field detection module includes X-axis magnetic field detection unit, Y-axis magnetic field detection unit and Z axis magnetic field detection unit, and the magnetic variation signal of X-direction, Y direction and Z-direction is detected respectively；The processing module handles the vibration signal and magnetic variation signal and produces alarm signal according to the vibration signal and magnetic variation signal；The alarm module is alarmed according to the alarm signal.Compared with prior art, present invention Real-time and Dynamic Detection earthquake in terms of earth magnetism variation, vibrations variation, easily detects and accuracy of detection is high.In addition, the invention also discloses a kind of earthquake detection method.
Description
Technical field
The invention belongs to micro-nano electronic technology field, and in particular to a kind of earthquake detection system and detection method.
Background technology
With the further development of the work such as quick response after seismology and Earthquake Prediction Research and big shake, earthquake is examined
Survey work and propose more and more high requirement, but present earthquake detection equipment is not only complicated, and detection means list
First, low precision, it is impossible to which detection earthquake promptly and accurately occurs, such as Chinese patent document CN201110390546 discloses one kind
Earthquake detection method and system, the earthquake detection method and system are only capable of carrying out earthquake in terms of Tensor measuring and strain measurement two
Detection, in being a very complicated physical and chemical process, seismic process yet with earthquake, tensor and strain it is very small, because
This requires high to measurement accuracy so that the earthquake detection system can not meet existing needs in accuracy.Therefore need a kind of solution
The certainly high earthquake detection system of the accuracy of detection of above mentioned problem and detection method.
The content of the invention
It is an object of the invention to provide a kind of earthquake detection system, the earthquake detection system can make a variation from earth magnetism, and vibrations become
Different aspect carries out Real-time and Dynamic Detection, and accuracy of detection is high.
It is a further object of the present invention to provide a kind of earthquake detection method, the earthquake detection method can make a variation from earth magnetism, shake
Real-time and Dynamic Detection is carried out in terms of dynamic variation, accuracy of detection is high.
To achieve these goals, the invention provides a kind of earthquake detection system, the earthquake detection system includes vibration
Detection module, magnetic field detection module, processing module and alarm module, the vibration detection module include X axis vibration detection unit,
Y axis vibration detection unit and Z axis vibration detection unit, detect the vibration signal of X-direction, Y direction and Z-direction respectively；
The magnetic field detection module includes X-axis magnetic field detection unit, Y-axis magnetic field detection unit and Z axis magnetic field detection unit, detects respectively
The magnetic variation signal of X-direction, Y direction and Z-direction；The processing module handle the vibration signal and magnetic variation signal and according to
Alarm signal is produced according to the vibration signal and magnetic variation signal；The alarm module is alarmed according to the alarm signal.With it is existing
Technology is compared, and the present invention carries out Real-time and Dynamic Detection, easily detection and accuracy of detection by being made a variation from earth magnetism in terms of vibrations variation
It is high.
It is preferred that the vibration detection module also includes vibration detection circuit plate, the X axis vibration detection unit, Y-axis are shaken
Dynamic detection unit and Z axis vibration detection unit are respectively the vibrating sensor being installed on the vibration detection circuit plate, described
Vibrating sensor includes matrix, elastic plate, the oscillator being installed on the elastic plate and the piezoelectricity being installed on the elastic plate
Piece, the week of the elastic plate, described matrix for hollow structure and provided motion for the elastic plate along being supported in described matrix
Space, direction of the elastic plate along the vertical elastic plate is moved and drives the movement of pendulum when being given a shock, and makes institute
Piezoelectric patches is stated because deformation produces vibration signal.Compared with prior art, elastic plate of the present invention is along its axial vibration, and resonance is frequently
Rate is low, and coefficient of elasticity is small, also very sensitive to microvibration, and detection sensitivity is high and cost simple in construction is low.
Specifically, the elastic plate includes relative the first elastic plate and the second elastic plate of plate face, and the piezoelectric patches is installed
In on first elastic plate, the oscillator includes the first oscillator being located between the first elastic plate and the second elastic plate, described
First oscillator is installed on the first elastic plate and/or the second elastic plate and vibrated by first elastic plate and the second elastic plate
And move.Wherein, when one end of first oscillator is installed on first elastic plate, the other end can also be installed on described
It is on second elastic plate or inconsistent or close on second elastic plate with second elastic plate（I.e. with the described second elasticity
Plate has a less distance）, the first elastic plate described in when vibrated and the second elastic plate vibrate and driven along its axis
First movement of pendulum, and in the presence of the first oscillator, not only cause the first elastic plate and the second elastic plate to produce linkage,
And the Oscillation Amplitude of the first elastic plate and the second elastic plate is added, accuracy of detection is high.Certainly, one end of first oscillator
Can also be installed on second elastic plate, the other end and first elastic plate it is inconsistent or with first elastic plate
Between there is less distance, its operation principle is similar to a upper scheme.Wherein, first oscillator can have one can also
By multiple, the center of the elastic plate can be distributed in, can also be located at the elastic arm of the elastic plate.
More specifically, the elastic plate also includes threeth elastic plate relative with the plate face of first elastic plate, it is described
Oscillator includes being located at the second oscillator between the 3rd elastic plate and the first elastic plate, and second oscillator is installed on described the
On three elastic plates and/or the first elastic plate, and by first elastic plate and the oscillating movement of the 3rd elastic plate.Wherein, it is described
When one end of second oscillator can be installed on first elastic plate, the other end of second oscillator is installed on the described 3rd
It is on elastic plate or inconsistent or close on the 3rd elastic plate with the 3rd elastic plate, when vibrated, described first
Elastic plate and the 3rd elastic plate vibrate along its axis and drive second movement of pendulum, and second oscillator is by described first
The vibration of elastic plate and the 3rd elastic plate and move, and under the influence of second oscillator produce link and be effectively increased described in it
The Oscillation Amplitude of first elastic plate and the 3rd elastic plate, accuracy of detection is high.Certainly, second oscillator can also one end be installed on
On 3rd elastic plate, the other end and first elastic plate it is inconsistent or between first elastic plate have it is smaller
Distance, its operation principle is similar to a upper scheme.
Specifically, the oscillator is located at the center of the elastic plate.Certainly, the oscillator can also be located at the elasticity
At the elastic arm of plate.
Specifically, the hollow structure is the cylindrical hole being opened in described matrix.
Specifically, the elastic plate is in flake, with least one of central active region, the circular central active region
Elastic arm and the outer supporting part around the elastic arm, between the central active region, elastic arm and outer supporting part
Have and be distributed with support bridge in certain gap, the gap to connect adjacent central active region, elastic arm and outer support
Portion, the outer supporting part of the elastic plate is installed in described matrix.More specifically, the elastic arm has several, it is adjacent
Have between elastic arm in certain gap, the gap and be distributed with support bridge to connect adjacent elastic arm.Adjacent segment
In support bridge be interspersed along the central active region.The elastic plate by metal material such as stainless steel, nonmetallic materials such as
Plastics, metal oxide such as aluminum oxide, nonmetal oxide such as silica, ceramic material or composite are constituted.
Specifically, the piezoelectric patches is formed by connecting by some strip PZT piezoelectric patches, some strip PZT piezoelectric patches edges
The center of the elastic plate radially distributes.
Specifically, described matrix is also equipped with the conductive capillary of vibrating sensor, the conductive capillary of the vibrating sensor and institute
Piezoelectric patches electrical connection is stated to export the vibration signal to the vibration detection circuit plate.The conductive capillary of the vibrating sensor will
The vibration signal is delivered on vibration detection circuit plate from vibrating sensor.
Specifically, the vibrating sensor also include screening cover, the screening cover be covered on the end of described matrix and with
The hollow structure of described matrix constitutes the accommodating cavity for installing the elastic plate.More specifically, the screening cover is included located at described
The upper screening cover of the upper end of matrix and the lower screening cover located at the lower end of described matrix, the conductive capillary of the vibrating sensor are installed
In in described matrix and through the lower screening cover.
It is preferred that the magnetic field detection module, which also includes magnetic variation, detects circuit board, the X-axis magnetic field detection unit, Y-axis magnetic
Field detection unit and Z axis magnetic field detection unit are respectively the Magnetic Sensor being installed on the magnetic variation detection circuit board, the magnetic
Sensor includes pcb board and the magnetic induction chip being installed on the pcb board, and the magnetic induction chip induced field changes to produce
Magnetisation varying signal.
Specifically, the magnetic induction chip includes anisotropic magnetoresistive AMR magnetic induction chip, giant magnetoresistance GMR magnetic induction cores
Piece, tunnel magnetoresistive TMR magnetic induction chip, Hall HALL effect magnetosensitive sense chips or huge Hall HALL effects magnetosensitive sense chip.
Specifically, the magnetic induction chip includes at least two sections magnetic susceptibility films, and magnetic susceptibility film described in two is along level or erects
Nogata is to parallel arranged and is electrically connected by the pcb board and is connected into Wheatstone bridge.
Specifically, Magnetic Sensor capillary, the Magnetic Sensor capillary and the magnetic induction chip are installed on the pcb board
Electrical connection is to export the magnetic variation signal to magnetic variation detection circuit board, and the Magnetic Sensor capillary is by the magnetic variation signal
It is delivered to from Magnetic Sensor on magnetic variation detection circuit board.
More specifically, the Magnetic Sensor also includes housing, the pcb board is installed in the housing, the magnetic sensing
Device capillary is installed on the pcb board and stretches out the housing.
It is preferred that the earthquake detection system also includes acceleration of gravity detection module, for detecting that acceleration of gravity becomes
It is different to export acceleration of gravity signal, the processing module handles the acceleration of gravity signal and according to the acceleration of gravity
Signal produces alarm signal.
It is preferred that the earthquake detection system also includes underground water radon gas detection module, for detecting that underground water radon gas contains
Quantitative change is different to export underground water radon gas signal, and the processing module handles the underground water radon gas signal and according to the underground water
Radon gas signal produces alarm signal.
It is preferred that the earthquake detection system also includes being provided with X axis vibration on detection circuit board, the detection circuit board
Magnetic field detection unit, Y axis vibration magnetic field detection unit and Z axis vibration magnetic field detection unit, X axis vibration magnetic field detection unit, Y-axis
Oscillating magnetic field detection unit and Z axis vibration magnetic field detection unit are respectively oscillating magnetic field dual sensor, and the X axis vibration magnetic
Field detection unit includes the X axis vibration detection unit and X-axis magnetic field detection unit, the Y axis vibration magnetic field detection unit bag
The Y axis vibration detection unit and Y-axis magnetic field detection unit are included, the Z axis vibration magnetic field detection unit includes the Z axis vibration
Detection unit and Z axis magnetic field detection unit；The oscillating magnetic field dual sensor includes pedestal, vibrating sensing portion, vibrating sensing
Portion's conduction capillary, magnetic detecting means and magnetic detecting means capillary, the pedestal is in hollow structure；The vibrating sensing portion includes elasticity
Plate, the piezoelectric patches and magnetic oscillator being installed on the elastic plate, the week of the elastic plate are described along being supported on the pedestal
Hollow structure provides space for the elastic plate, direction fortune of the elastic plate along vertical elastic plate when being given a shock
It is dynamic, so that the magnetic oscillator provides the magnetic field of change, the piezoelectric patches and produces vibration signal；The vibrating sensing portion conduction weldering
Pin, is installed on the pedestal and electrically connects to export the vibration signal with the piezoelectric patches；The magnetic detecting means include peace
Loaded on the pcb board on the pedestal and the magnetic induction chip being installed on the pcb board, the magnetic susceptibility side of the magnetic induction chip
To, the magnetic field generation of change that the magnetic induction chip according to magnetic oscillator produce parallel with the magnetic direction of the magnetic oscillator
Magnetic variation signal；The magnetic detecting means capillary, is installed on the pedestal and is electrically connected with the magnetic induction chip and be described to export
Magnetic variation signal.On the one hand, wherein the oscillating magnetic field dual sensor when being given a shock the elastic plate drive the magnetic to shake
Direction of the son along the vertical elastic plate is moved, and the piezoelectric patches is because deforming output voltage signal simultaneously, the magnetic induction chip
Sense heat treatment caused by magnetic oscillator motion and output difference voltage signal, two kinds of outputs can reaction environment vibration
Whether change, in generation without friction, i.e., when vibration induction portion is without output, can have output to judge environment according to magnetic induction chip
Whether magnetic field changes, and can carry out vibration detection and magnetic variation detection dual-use function, and applicability is wide, therefore this programme use can be simultaneously
Detect that the oscillating magnetic field dual sensor of vibration signal and magnetic variation signal constitutes the vibration detection module and magnetic field detection module.
Furthermore compared with prior art, elastic plate of the present invention is along its axial vibration, and resonant frequency is low, and coefficient of elasticity is small, to small
Vibration is also very sensitive, and detection sensitivity is high and cost simple in construction is low.
Wherein, the magnetic oscillator is located at the center of the elastic plate.
Wherein, the elastic plate is relative with the pcb board position lays, and further increases magnetic induction core on the pcb board
The sensitivity of piece induced field change.Wherein, the hollow structure is the cylindrical hole being opened on the pedestal, the elastic plate
At the one end open for being installed on the cylindrical hole, the pcb board is installed at another end opening of the cylindrical hole, structure letter
Singly, it is easy to assembling.Wherein, the magnetic oscillator includes connector and an at least magnet piece, and the connector is connected to the bullet
Between property plate and magnet piece so that the size of the magnet piece is not limited by elastic plate size.
Wherein, the elastic plate is in flake, at least one bullet with central active region, around the central active region
Property arm and around the elastic arm outer supporting part, have between the central active region, elastic arm and outer supporting part
Support bridge is distributed with certain gap, the gap to connect adjacent central active region, elastic arm and outer supporting part,
The outer supporting part of the elastic plate is installed on the pedestal.Specifically, the elastic arm has several, adjacent elastic arm
Between have in certain gap, the gap and be distributed with support bridge to connect adjacent elastic arm.Specifically, adjacent segment
In support bridge be interspersed along the central active region.Specifically, the interior edge of the piezoelectric patches is located in the elastic plate
Heart behaviour area, the outer of the piezoelectric patches is located at the outer supporting part of the elastic plate.The elastic plate is by metal material if not
Become rusty steel, nonmetallic materials such as plastics, metal oxide such as aluminum oxide, nonmetal oxide such as silica, ceramic material or multiple
Condensation material is constituted.
Wherein, the piezoelectric patches is formed by connecting by some strip PZT piezoelectric patches, and some strip PZT piezoelectric patches are along institute
The center for stating elastic plate radially distributes.
Wherein, the oscillating magnetic field dual sensor also includes the matrix on the pedestal upper surface, described matrix
The conducting wire for the conductive capillary electrical connection of the piezoelectric patches and vibrating sensing portion is provided with, and described matrix is printed circuit
Plate, the elastic plate is pasted or screw thread is installed on the printed circuit board (PCB).Certainly, described matrix can also be metallic matrix,
Now, the elastic plate is elastic metal sheet or condensate flexible board, and the elastic plate laser welding is in described matrix.
Wherein, the oscillating magnetic field dual sensor also includes screening cover, and the screening cover is covered on the end of the pedestal
Portion is simultaneously coated on outside the magnetic detecting means and vibrating sensing portion.
Wherein, the magnetic induction chip include anisotropic magnetoresistive AMR magnetic induction chip, giant magnetoresistance GMR magnetic induction chip,
Tunnel magnetoresistive TMR magnetic induction chip, Hall HALL effect magnetosensitive sense chips or huge Hall HALL effects magnetosensitive sense chip.
Wherein, the magnetic induction portion includes at least two sections magnetic susceptibility films, and magnetic susceptibility film edge is horizontally or vertically square described in two
It is electrically connected to parallel arranged and by the pcb board and is connected into Wheatstone bridge.
Present invention also offers a kind of earthquake detection method, including：（1）Detect X-axis at a certain test point, Y-axis, Z axis
Vibration signal and magnetic variation signal on three directions；（2）Handle the vibration signal and magnetic variation signal and according to the vibration letter
Number and magnetic variation signal produce alarm signal；（3）According to alarm signal alarm.Compared with prior art, the present invention by from
Earth magnetism is made a variation, and Real-time and Dynamic Detection is carried out in terms of shaking variation, easily detection and accuracy of detection height.
It is preferred that the step（1）Also include：Detect the acceleration of gravity signal at the test point, the step（2）
Also include：Alarm signal is produced according to the acceleration of gravity signal.
It is preferred that the step（1）Also include：Detect the underground water radon gas signal at the test point, the step（2）
Also include：Alarm signal is produced according to the underground water radon gas signal.
Brief description of the drawings
Fig. 1 is the structured flowchart of earthquake detection system described in first embodiment of the invention.
Fig. 2 is the schematic perspective view of vibration detection module of the present invention in Fig. 1.
Fig. 3 is the perspective exploded view of vibrating sensor of the present invention in Fig. 2.
Fig. 4 is the sectional view of vibrating sensor of the present invention in Fig. 2.
Fig. 5 is the schematic perspective view of elastic plate of the present invention.
Fig. 6 is the schematic perspective view of magnetic field detection module of the present invention in Fig. 1.
Fig. 7 is the perspective exploded view of Magnetic Sensor described in Fig. 6.
Fig. 8 is the schematic perspective view of magnetic induction chip described in Fig. 6.
Fig. 9 is the structured flowchart of earthquake detection system described in second embodiment of the invention.
Figure 10 is the schematic perspective view of oscillating magnetic field dual sensor described in Fig. 9.
Figure 11 is the sectional view of oscillating magnetic field dual sensor described in Figure 10.
Figure 12 is the decomposing schematic representation of oscillating magnetic field dual sensor described in Figure 10.
Figure 13 is the part-structure schematic diagram in the vibrating sensing portion of oscillating magnetic field dual sensor described in Figure 10.
Figure 14 is the structural representation of the first embodiment of the magnetic detecting means of the oscillating magnetic field dual sensor.
Figure 15 is the structural representation of the first embodiment of the magnetic detecting means of the oscillating magnetic field dual sensor.
Figure 16 is the flow chart of earthquake detection method of the present invention.
Embodiment
To describe the technology contents of the present invention in detail, feature, the objects and the effects being constructed, below in conjunction with embodiment
And coordinate accompanying drawing to be explained in detail.
With reference to Fig. 1, the invention discloses a kind of earthquake detection system 100, the earthquake detection system 100 includes vibration detection
Module 101, magnetic field detection module 102, processing module 103 and alarm module 104, the vibration detection module 101 are shaken including X-axis
Dynamic detection unit 201, Y axis vibration detection unit 202 and Z axis vibration detection unit 203, detect X-direction, Y direction respectively
With the vibration signal of Z-direction；The magnetic field detection module 102 includes X-axis magnetic field detection unit 301, Y-axis magnetic field detection unit
302 and Z axis magnetic field detection unit 303, the magnetic variation signal of X-direction, Y direction and Z-direction is detected respectively；The processing mould
Block 103 handles the vibration signal and magnetic variation signal and produces alarm signal according to the vibration signal and magnetic variation signal；It is described
Alarm module 104 is alarmed according to the alarm signal.Compared with prior art, the present invention is in terms of earth magnetism variation, vibrations variation
Real-time and Dynamic Detection is carried out, detection is easily and accuracy of detection is high.
Preferably, with continued reference to Fig. 1, the earthquake detection system 100 also includes acceleration of gravity detection module 105, uses
In the variation of detection acceleration of gravity to export acceleration of gravity signal, the processing module 103 handles the acceleration of gravity letter
Number and according to the acceleration of gravity signal produce alarm signal.
Preferably, with continued reference to Fig. 1, the earthquake detection system 100 also includes underground water radon gas detection module 106, uses
In detection Radon In Groundwater Gas content variation to export underground water radon gas signal, the processing module 103 handles the Radon In Groundwater
Gas signal simultaneously produces alarm signal according to the underground water radon gas signal.
With reference to Fig. 3 and Fig. 4, the X axis vibration detection unit 201, Y axis vibration detection unit 202 and Z axis vibration detection are single
Member 203 is respectively the vibrating sensor 200 being installed on the vibration detection circuit plate 21 and is installed on a vibration detection circuit
On plate 21.In the program, the X axis vibration detection unit 201, Y axis vibration detection unit 202 and Z axis vibration detection unit 203
It is arranged on after equal individual packages are good on vibration detection circuit plate 21, certainly, the X axis vibration detection unit 201, Y axis vibration inspection
Surveying unit 202 and Z axis vibration detection unit 203 can also be encapsulated in after a housing and be installed on the vibration detection circuit plate
21, can also be with being installed on after the encapsulation of other devices on the vibration detection circuit plate 21.
With continued reference to Fig. 3 and Fig. 4, the vibrating sensor 200 includes the first matrix 111, the first elastic plate 12a, installed
It is described in the first oscillator 131 and the piezoelectric patches 14 being installed on the first elastic plate 12a on the first elastic plate 12a
First matrix 111 was hollow structure and was described along being supported on first matrix 111 first elastic plate 12a week
First elastic plate 12a provides space, and the first elastic plate 12a described in when being given a shock is along the vertical first elastic plate 12a
Direction move and drive first oscillator 131 to move, and make the piezoelectric patches 14 because deformation produce vibration signal.With it is existing
Technology is compared, and the first elastic plate 12a of the present invention is along its axial vibration, and resonant frequency is low, and coefficient of elasticity is small, to microvibration
Also very sensitive, detection sensitivity is high and cost simple in construction is low.Wherein, first oscillator 131 is located at the described first elasticity
Plate 12a center.Certainly, first oscillator 131 can also be located at the elastic arm of the elastic plate 12.
Preferably, with continued reference to Fig. 3 and Fig. 4, the vibrating sensor 200 also includes tying with the first elastic plate 12a
The week edge for the second elastic plate 12b, the second elastic plate 12b that structure is identical and plate face is relative is supported in first matrix 111
On, the first elastic plate 12a is installed on the upper surface of first matrix 111, and the second elastic plate 12b is installed on described
The lower surface of first matrix 111, one end of first oscillator 131 is installed on the first elastic plate 12a, and the other end is contradicted
The second elastic plate 12b so that first oscillator 131 be installed on the first elastic plate 12a and the second elastic plate 12b it
Between and moved by the vibration of the elastic plate 12 of the first elastic plate 12 and second.When vibrated, the first elastic plate 12a
Vibrated along its axis and drive first oscillator 131 to move, the second elastic plate 12b vibrates and in first oscillator
Linked under the influence of 131 with the first elastic plate 12a, now first oscillator 131 is by the first elastic plate 12a and the
Two elastic plate 12b vibration and move, and first oscillator 131 gravity influence increase the first elastic plate 12a and second
Elastic plate 12b Oscillation Amplitude, accuracy of detection is high.Certainly, first oscillator 131 can also one end be installed on first bullet
On property plate 12a, the other end, which is installed on the second elastic plate 12b, either closes on the second elastic plate 12b or described
One oscillator 131 can also one end be installed on the second elastic plate 12b, the other end contradicts or closes on first elastic plate
12a.In the present embodiment, first oscillator 131 is a mass, and certain first oscillator 131 can also be by multiple quality
Block is constituted, and it can be distributed in the center of the first elastic plate 12a, can also be located at the bullet of the first elastic plate 12a
At property arm.
Better, with continued reference to Fig. 3 and Fig. 4, it is also equipped with first matrix 111 and the phase of the first matrix 111
To the second matrix 112, second matrix 112 be hollow structure, now the first elastic plate 12a be located at second base
The 3rd elastic plate 12c is also equipped with the lower surface of body 112, the upper surface of the second matrix 112, the 3rd elastic plate 12c's
Week along being supported on second matrix 112 and relative with the first elastic plate 12a plate faces, the 3rd elastic plate 12c and
The second oscillator 132 is additionally provided between first elastic plate 12a, described one end of second oscillator 132 is installed on the 3rd elastic plate 12c
On, the other end contradicts the first elastic plate 12a, and is transported by the first elastic plate 12a and the 3rd elastic plate 12c vibration
It is dynamic.Certainly, second oscillator 132 can also one end be installed on the first elastic plate 12a, the other end is installed on described
Either closed on three elastic plate 12c the 3rd elastic plate 12c or the second oscillator 132 can also one end be installed on described
12c on three elastic plates, the other end closes on the first elastic plate 12a.
With reference to Fig. 5, the first elastic plate 12a is in flake, with central active region 121, around the central movable
The elastic arm 122 in area 121 and the outer supporting part 123 around the elastic arm 122, the central active region 121, elastic arm
Have between 122 and outer supporting part 124 and be distributed with support bridge 124 in certain gap 125, the gap 125 to connect
Adjacent central active region 121, elastic arm 12 and outer supporting part 123.With continued reference to Fig. 5, the elastic arm 122 of elastic plate 12 has
Four, have between adjacent elastic arm 122 and support bridge 124 is distributed with certain gap 125, the gap 125 with even
Connect adjacent elastic arm 122.Support bridge 124 in each gap 125 has two.Support bridge in same gap 125 is described in
Central active region 121 is uniformly distributed, and 125 support bridge 124 is interspersed along the central active region 121 in adjacent segment 125.
Certainly, the elastic arm 122 can also be one, two, three or other numbers, and support bridge 124 can also be according to being actually subjected to
Ask increase and decrease.
With reference to Fig. 3, the piezoelectric patches 14 is formed by connecting by some strip PZT piezoelectric patches, some strip PZT piezoelectric patches
Radially distributed along the center of the first elastic plate 12a.Certainly, the shape of the piezoelectric patches 14 is not limited to this, institute
It can also be overall structure PZT piezoelectric patches to state piezoelectric patches 14.Wherein, the piezoelectric patches 14 is to have lead piezoelectric ceramics lead zirconate titanate
（PZT）Piezoelectric patches, PMN-PT (PMN-Pt) piezoelectric patches, leadless piezoelectric ceramics barium titanate（BT）Leadless piezoelectric ceramics
Or sour potassium (KNN) piezoelectric patches of niobate lead-free piezoelectric ceramics niobium nickel.The piezoelectric patches 14 is d33 or d31 type piezoelectric patches.Institute
Piezoelectric patches 14 is stated for individual layer PZT piezoelectric patches or multilayer PZT piezoelectric patches.Wherein, the interior edge of the piezoelectric patches 14 is located at described first
Elastic plate 12a central active region, the outer of the piezoelectric patches is located at the outer supporting part of the first elastic plate 12a.
Preferably, referring to figs. 2 and 3 first matrix 111 is also equipped with the conductive capillary 15 of vibrating sensor, described
Vibrating sensor conduction capillary 15 electrically connects to export the vibration signal to the vibration detection circuit with the piezoelectric patches 14
Plate 21.
Wherein, the matrix 112 of the first matrix 111 and second is printed circuit board (PCB), is provided with electrical connection described
The conducting wire of the conductive capillary 15 of piezoelectric patches 14 and vibrating sensor, the first elastic plate 12a, the second elastic plate 122 and the
Three elastic plates 123 are pasted or screw thread is installed on the printed circuit board (PCB), certainly, the matrix 112 of the first matrix 111 and second
Can also be metallic matrix, the first elastic plate 12a, the second elastic plate 122 and the 3rd elastic plate 123 be elastic metal sheet or
Condensate flexible board, and the first elastic plate 12a, the second elastic plate 122 and the 3rd elastic plate 123 correspondence laser welding are in institute
State on the first matrix 111 and the second matrix 112.Wherein, the hollow structure is to be opened in the base of the first matrix 111 and second
Cylindrical hole on body 112.
Preferably, referring to figs. 2 and 3 the vibrating sensor 200 also includes screening cover, and the screening cover includes being located at
The upper screening cover 161 of the upper end of first matrix 111 and the lower screening cover 162 located at the lower end of second matrix 112, institute
The conductive capillary 15 of vibrating sensor is stated to be installed on first matrix 111 and pass through the lower screening cover 162.Wherein, it is described
The inner surface of upper screening cover 161 and lower screening cover 162 is equipped with convex body 163, to limit the bullet of the second elastic plate 122 and the 3rd
The vibration amplitude of property plate 123.
With reference to Fig. 6 and Fig. 7, the magnetic field detection module 102 also includes magnetic variation and detects circuit board 22, the X-axis magnetic field inspection
It is respectively to be installed on the magnetic variation detection circuit to survey unit 301, Y-axis magnetic field detection unit 302 and Z axis magnetic field detection unit 303
Magnetic Sensor 300 on plate 22.In the present embodiment, the X-axis magnetic field detection unit 301, Y-axis magnetic field detection unit 302 and Z axis
It is installed on after magnetic field detection unit 303 is independently packaged on the magnetic variation detection circuit board 22, it is of course also possible to by X-axis
Magnetic field detection unit 301, Y-axis magnetic field detection unit 302 and Z axis magnetic field detection unit 303 be encapsulated in a shell or with
Other devices are installed on after being packaged together on the magnetic variation detection circuit board 22.
With continued reference to Fig. 6 and Fig. 7, specifically, the Magnetic Sensor 300 includes pcb board 31 and is installed on the pcb board 31
On magnetic induction chip 32, the induced field of magnetic induction chip 32 change is to produce magnetic variation signal.Specifically, the magnetic induction
Chip 32 includes anisotropic magnetoresistive AMR magnetic induction chip, giant magnetoresistance GMR magnetic induction chip, tunnel magnetoresistive TMR magnetic induction cores
Piece, Hall HALL effect magnetosensitive sense chips or huge Hall HALL effects magnetosensitive sense chip.Specifically, with reference to Fig. 8, the magnetic induction
Chip 32 includes at least two sections magnetic susceptibility films 321 and is electrically connected by the pcb board 31 to be connected into Wheatstone bridge, magnetic susceptibility described in two
Film 321 can be along horizontally or vertically direction parallel arranged, i.e., described magnetic induction chip 32 can horizontally or vertically be installed on described
On pcb board.Specifically, Magnetic Sensor capillary 33, the Magnetic Sensor capillary 33 and the magnetic strength are installed on the pcb board 31
Answer chip 32 to electrically connect to export the magnetic variation signal to magnetic variation detection circuit board 22.More specifically, the magnetic sensing
Device 300 also includes housing 34, and the pcb board 31 is installed in the housing 34, and the Magnetic Sensor capillary 33 is installed on described
On pcb board 31 and stretch out the housing 34.
It is the partial schematic diagram of the second embodiment of earthquake detection system of the present invention, with first with reference to Fig. 9 to Figure 13
Unlike embodiment, in this embodiment, the earthquake detection system 100 ' also includes detection circuit board 23, the detection electricity
X axis vibration magnetic field detection unit 401, Y axis vibration magnetic field detection unit 402 and Z axis vibration magnetic field detection are installed on road plate 23
Unit 403, the X axis vibration magnetic field detection unit 401, Y axis vibration magnetic field detection unit 402 and Z axis vibration magnetic field detection list
Member 403 is respectively oscillating magnetic field dual sensor 400, and the X axis vibration magnetic field detection unit 401 includes the X axis vibration
Detection unit and X-axis magnetic field detection unit, the Y axis vibration magnetic field detection unit 402 include the Y axis vibration detection unit and
Y-axis magnetic field detection unit, the Z axis vibration magnetic field detection unit 403 includes the Z axis vibration detection unit and Z axis magnetic field is examined
Survey unit.
With reference to figures 10 to Figure 14, the oscillating magnetic field dual sensor 400 includes pedestal 41, vibrating sensing portion, magnetic sensing
The conductive capillary 44 of portion, vibrating sensing portion capillary 412 and magnetic detecting means, the pedestal 41 is in hollow structure, the vibrating sensing portion
Including elastic plate 42, the piezoelectric patches 14 and magnetic oscillator 45 that are installed on the elastic plate 42, the week edge branch of the elastic plate 42
Support on the pedestal 41, the hollow structure is that the elastic plate 42 provides space, elastic plate when being given a shock
42 move along the direction of the vertical elastic plate 42, and the magnetic oscillator 45 produces the magnetic field of change, the piezoelectric patches 14 therewith
Electric energy is produced therewith to form vibration signal, the conductive capillary 142 in the vibrating sensing portion be installed on the pedestal 41 and with institute
Piezoelectric patches 14 is stated to electrically connect to export the vibration signal；Magnetic induction chip 32, the magnetic induction are installed on the pcb board 43
Chip 32 produces magnetic variation signal according to the change of surrounding magnetic field, and the conductive capillary 44 of the magnetic detecting means is installed on the pedestal 41
And electrically connect to export magnetic variation signal with the pcb board 43.Wherein, described in the magnetic oscillator 45 is installed in the present embodiment
The center of elastic plate 42, certainly, the magnetic oscillator 45 can also by it is several and be respectively arranged in the elastic plate 42 its
His position.Wherein, the elastic plate 42, piezoelectric patches 14 and magnetic induction chip 32 respectively with the first bullet in the first embodiment
Property plate 12a, piezoelectric patches 14 it is identical with the structure of magnetic induction chip 32, be just not described in detail herein.
Preferably, with reference to Figure 11, the elastic plate 42 is relative with the position of pcb board 43, further increases the pcb board
The sensitivity that magnetic induction chip induced field changes on 43.Specifically, with reference to Figure 11 and Figure 12, the hollow structure is to be opened in
Cylindrical hole on the pedestal 41, the elastic plate 42 is installed at the one end open of the cylindrical hole, and the pcb board 43 is installed
At another end opening of the cylindrical hole, it is simple in construction, be easy to assembling.
Preferably, with reference to Figure 11 and Figure 12, is covered with screening cover 47, and the cladding of the screening cover 47 institute on the pedestal 41
State magnetic detecting means and vibrating sensing portion.
With reference to Figure 11 and Figure 12, the magnetic oscillator 45 includes connector 451 and magnet piece 452, and the connector 451 connects
It is connected between the elastic plate 42 and magnet piece 452 so that the size of the magnet piece 452 is not limited by the size of elastic plate 42
System.Wherein, the magnet piece 452 can be one piece or polylith.
With reference to figures 11 to Figure 13, the oscillating magnetic field dual sensor 400 also includes on the upper surface of pedestal 41
Matrix 51, described matrix 51 is printed circuit board (PCB), which is provided with the electrical connection piezoelectric patches 14 and vibrating sensing portion capillary 412
Conducting wire, the elastic plate 42 is pasted or screw thread is installed on the printed circuit board (PCB), certainly, and the elastic plate 42 may be used also
Think elastic metal sheet or condensate flexible board, now described matrix 51 is metallic matrix, and the laser welding of the elastic plate 42
In in described matrix 51.
Preferably, with reference to Figure 14, two magnetic susceptibility films 321 of the magnetic induction chip 3 are arranged in parallel in institute in the horizontal direction
State on pcb board 43.
It is third embodiment of the invention with reference to Figure 15, and unlike second embodiment, in this embodiment, the magnetic
Magnetic susceptibility film 321 described in the two of induction chip 32 is vertically arranged in parallel on the pcb board 431.
With reference to Figure 16, the invention also discloses a kind of earthquake detection method, including：（S1）Detect the X at a certain test point
Axle, Y-axis, vibration signal and magnetic variation signal on three directions of Z axis；（S2）Handle the vibration signal and magnetic variation signal and foundation
Vibration signal and the magnetic variation signal produces alarm signal；（S3）According to alarm signal alarm.Compared with prior art, originally
Invention carries out Real-time and Dynamic Detection, detection is easily and accuracy of detection is high by being made a variation from earth magnetism in terms of vibrations variation.
Preferably, the step（S1）Also include：Detect the acceleration of gravity signal at the test point, the step
（S2）Also include：Alarm signal is produced according to the acceleration of gravity signal.
Preferably, the step（S1）Also include：Detect the underground water radon gas signal at the test point, the step
（S2）Also include：Alarm signal is produced according to the underground water radon gas signal.
Above disclosed is only the preferred embodiments of the present invention, can not limit the right of the present invention with this certainly
Scope, therefore the equivalent variations made according to scope of the present invention patent, still belong to the scope that the present invention is covered.
Claims (26)
1. a kind of earthquake detection system, it is characterised in that including：
Vibration detection module, including X axis vibration detection unit, Y axis vibration detection unit and Z axis vibration detection unit, are examined respectively
Survey the vibration signal of X-direction, Y direction and Z-direction；
Magnetic field detection module, including X-axis magnetic field detection unit, Y-axis magnetic field detection unit and Z axis magnetic field detection unit, are examined respectively
Survey the magnetic variation signal of X-direction, Y direction and Z-direction；
Processing module, handles the vibration signal and magnetic variation signal and produces alarm signal according to the vibration signal and magnetic variation signal
Number；
Alarm module, according to alarm signal alarm；
Acceleration of gravity detection module, for detecting that acceleration of gravity makes a variation to export acceleration of gravity signal, the processing mould
The block processing acceleration of gravity signal simultaneously produces alarm signal according to the acceleration of gravity signal.
2. earthquake detection system as claimed in claim 1, it is characterised in that the vibration detection module also includes vibration detection
Circuit board, the X axis vibration detection unit, Y axis vibration detection unit and Z axis vibration detection unit are respectively to be installed on described shake
Vibrating sensor on dynamic detection circuit board, the vibrating sensor includes matrix, elastic plate, is installed on the elastic plate
Oscillator and the piezoelectric patches being installed on the elastic plate, the week of the elastic plate, described matrix had along being supported in described matrix
There is hollow structure and provide space for the elastic plate, side of the elastic plate along vertical elastic plate when being given a shock
To moving and driving the movement of pendulum, so that the piezoelectric patches produces vibration signal because of deformation.
3. earthquake detection system as claimed in claim 2, it is characterised in that the elastic plate includes the first relative bullet of plate face
Property plate and the second elastic plate, the piezoelectric patches is installed on first elastic plate, and the oscillator includes being located at the first elastic plate
And second the first oscillator between elastic plate, first oscillator be installed on the first elastic plate and/or the second elastic plate and by
The vibration of first elastic plate and the second elastic plate and move.
4. earthquake detection system as claimed in claim 3, it is characterised in that the elastic plate also includes and the described first elasticity
The 3rd relative elastic plate of the plate face of plate, the oscillator includes second be located between the 3rd elastic plate and the first elastic plate
Oscillator, second oscillator is installed on the 3rd elastic plate and/or the first elastic plate, and by first elastic plate and
The vibration of three elastic plates and move.
5. earthquake detection system as claimed in claim 2, it is characterised in that the oscillator is located at the center of the elastic plate
Place.
6. earthquake detection system as claimed in claim 2, it is characterised in that the hollow structure is to be opened in described matrix
Cylindrical hole.
7. earthquake detection system as claimed in claim 2, it is characterised in that the elastic plate is indecisive and changeable in flake in having
Dynamic area, at least one elastic arm around the central active region and the outer supporting part around the elastic arm, it is described in
Have between heart behaviour area, elastic arm and outer supporting part in certain gap, the gap and be distributed with support bridge to connect
Adjacent central active region, elastic arm and outer supporting part, the outer supporting part of the elastic plate is installed in described matrix.
8. earthquake detection system as claimed in claim 7, it is characterised in that the elastic arm has several, adjacent elasticity
Have between arm in certain gap, the gap and be distributed with support bridge to connect adjacent elastic arm.
9. earthquake detection system as claimed in claim 7, it is characterised in that support bridge in adjacent segment is indecisive and changeable along in described
Dynamic area is interspersed.
10. earthquake detection system as claimed in claim 2, it is characterised in that the piezoelectric patches is by some strip PZT piezoelectric patches
It is formed by connecting, center of some strip PZT piezoelectric patches along the elastic plate radially distributes.
11. earthquake detection system as claimed in claim 2, it is characterised in that described matrix is also equipped with vibrating sensor and led
Pin is welded, the conductive capillary of the vibrating sensor electrically connects to export the vibration signal to the vibration inspection with the piezoelectric patches
Slowdown monitoring circuit plate.
12. earthquake detection system as claimed in claim 11, it is characterised in that the vibrating sensor also includes screening cover,
The screening cover is covered on the end of described matrix and constitutes the accommodating of the installation elastic plate with the hollow structure of described matrix
Chamber.
13. earthquake detection system as claimed in claim 12, it is characterised in that the screening cover include located at described matrix it
The upper screening cover of upper end and the lower screening cover located at the lower end of described matrix, the conductive capillary of the vibrating sensor are installed on described
On matrix and through the lower screening cover.
14. earthquake detection system as claimed in claim 1, it is characterised in that the magnetic field detection module also includes magnetic variation and examined
Slowdown monitoring circuit plate, the X-axis magnetic field detection unit, Y-axis magnetic field detection unit and Z axis magnetic field detection unit be respectively be installed on it is described
Magnetic Sensor on magnetic variation detection circuit board, the Magnetic Sensor includes pcb board and the magnetic induction core being installed on the pcb board
Piece, the magnetic induction chip induced field changes to produce magnetic variation signal.
15. earthquake detection system as claimed in claim 14, it is characterised in that the magnetic induction chip includes anisotropic magnetic
Hinder AMR magnetic induction chip, giant magnetoresistance GMR magnetic induction chip, tunnel magnetoresistive TMR magnetic induction chip, Hall HALL effect magnetic susceptibilities
Chip or huge Hall HALL effects magnetosensitive sense chip.
16. earthquake detection system as claimed in claim 14, it is characterised in that the magnetic induction chip includes at least two sections magnetic
Sensitive membrane, magnetic susceptibility film described in two is along horizontally or vertically direction parallel arranged and is electrically connected by the pcb board and is connected into favour stone
Electric bridge.
17. earthquake detection system as claimed in claim 14, it is characterised in that Magnetic Sensor weldering is provided with the pcb board
Pin, the Magnetic Sensor capillary is electrically connected with the magnetic induction chip detects circuit to export the magnetic variation signal to the magnetic variation
On plate.
18. earthquake detection system as claimed in claim 17, it is characterised in that the Magnetic Sensor also includes housing, described
Pcb board is installed in the housing, and the Magnetic Sensor capillary is installed on the pcb board and stretches out the housing.
19. earthquake detection system as claimed in claim 1, it is characterised in that the earthquake detection system also includes underground water
Radon gas detection module, for detecting the variation of Radon In Groundwater Gas content to export underground water radon gas signal, the processing module is handled
The underground water radon gas signal simultaneously produces alarm signal according to the underground water radon gas signal.
20. earthquake detection system as claimed in claim 1, it is characterised in that the earthquake detection system also includes detection electricity
X axis vibration magnetic field detection unit, Y axis vibration magnetic field detection unit and Z axis vibration magnetic are installed on road plate, the detection circuit board
Field detection unit, X axis vibration magnetic field detection unit, Y axis vibration magnetic field detection unit and Z axis vibration magnetic field detection unit are respectively
Oscillating magnetic field dual sensor, and the X axis vibration magnetic field detection unit forms the X axis vibration detection unit and described respectively
X-axis magnetic field detection unit, the Y axis vibration magnetic field detection unit forms the Y axis vibration detection unit and the Y-axis magnetic respectively
Field detection unit, the Z axis vibration magnetic field detection unit forms the Z axis vibration detection unit and Z axis magnetic field inspection respectively
Survey unit；The oscillating magnetic field dual sensor includes pedestal, vibrating sensing portion, the conductive capillary in vibrating sensing portion, magnetic detecting means
With magnetic detecting means capillary, the pedestal is in hollow structure；The vibrating sensing portion includes elastic plate, is installed on the elastic plate
Piezoelectric patches and magnetic oscillator, the week of the elastic plate, the hollow structure was the elastic plate along being supported on the pedestal
Space is provided, direction of the elastic plate along the vertical elastic plate is moved when being given a shock, so that the magnetic oscillator
The magnetic field of change, the piezoelectric patches are provided and produce vibration signal；The conductive capillary in the vibrating sensing portion, is installed on the pedestal
And electrically connect to export the vibration signal with the piezoelectric patches；The magnetic detecting means include the PCB being installed on the pedestal
Plate and the magnetic induction chip being installed on the pcb board, magnetic susceptibility direction and the magnetic oscillator of the magnetic induction chip
Magnetic direction is parallel, and the magnetic field for the change that the magnetic induction chip is produced according to magnetic oscillator produces magnetic variation signal；The magnetic is passed
Sense portion capillary, is installed on the pedestal and electrically connects to export the magnetic variation signal with the magnetic induction chip.
21. earthquake detection system as claimed in claim 20, it is characterised in that the magnetic oscillator is located at the elastic plate
Center.
22. earthquake detection system as claimed in claim 20, it is characterised in that the elastic plate and pcb board position phase
To laying.
23. earthquake detection system as claimed in claim 22, it is characterised in that the hollow structure is to be opened in the pedestal
On cylindrical hole, the elastic plate is installed at the one end open of the cylindrical hole, and the pcb board is installed on the cylindrical hole
At another end opening.
24. earthquake detection system as claimed in claim 20, it is characterised in that also including screening cover, the screening cover lid is set
In the end of the pedestal and it is coated on outside the magnetic detecting means and vibrating sensing portion.
25. a kind of earthquake detection method, it is characterised in that including：
(1) X-axis at a certain test point, Y-axis, vibration signal and magnetic variation signal on three directions of Z axis are detected；
(2) vibration signal and magnetic variation signal are handled and alarm signal is produced according to the vibration signal and magnetic variation signal；
(3) alarmed according to the alarm signal；
The step (1) also includes：The acceleration of gravity signal at the test point is detected, the step (2) also includes：Foundation
The acceleration of gravity signal produces alarm signal.
26. earthquake detection method as claimed in claim 25, it is characterised in that the step (1) also includes：The detection inspection
Underground water radon gas signal at measuring point, the step (2) also includes：Alarm signal is produced according to the underground water radon gas signal.
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| CN104914459A (en) * | 2015-05-18 | 2015-09-16 | 谢镕键 | Geomagnetic sensor real-time networking short-impending earthquake monitoring system and forecasting method |
| CN106199687A (en) * | 2016-06-27 | 2016-12-07 | 吉林大学 | Simple component geophone |
| CN107505662B (en) * | 2017-09-25 | 2019-08-30 | 华中科技大学 | A kind of 3 axis MEMS gravimeter |
| CN107870350B (en) * | 2017-12-13 | 2023-12-15 | 中国地质大学（武汉） | Differential dual-piezoelectric-patch geophone core and piezoelectric geophone |
| CN108168685B (en) * | 2017-12-27 | 2019-07-30 | 燕山大学 | External drive vibration detection device and detection method |
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