CN104181578A - Earthquake detection system and detection method - Google Patents
Earthquake detection system and detection method Download PDFInfo
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- CN104181578A CN104181578A CN201310199226.4A CN201310199226A CN104181578A CN 104181578 A CN104181578 A CN 104181578A CN 201310199226 A CN201310199226 A CN 201310199226A CN 104181578 A CN104181578 A CN 104181578A
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Abstract
The invention discloses an earthquake detection system consisting of a vibration detection module, a magnetic field detection module, a processing module and an alarm module. The vibration detection module includes an X shaft vibration detection unit, a Y shaft vibration detection unit, and a Z shaft vibration detection unit, wherein the three units are used for respectively detecting vibration signals at an X shaft direction, a Y shaft direction, and a Z shaft direction; the magnetic field detection module is composed of an X shaft magnetic field detection unit, a Y shaft magnetic field detection unit, and a Z shaft magnetic field detection unit, wherein the three units are used respectively for detecting magnetic variation signals at the X shaft direction, the Y shaft direction, and the Z shaft direction; the processing module caries out processing on the vibration signals and the magnetic variation signals and generates an alarm signal based on the vibration signals and the magnetic variation signals; and the alarm module carries out alarming according to the alarm signal. Compared with the prior art, the provided detection system has the following beneficial effects: earthquake detection can be carried out dynamically in real time in terms of terrestrial magnetism variation and vibration variation; detection can be carried out easily; and the detection precision is high. In addition, the invention also discloses an earthquake detection method.
Description
Technical field
The invention belongs to micro-nano electronic technology field, be specifically related to a kind of earthquake detection system and detection method.
Background technology
Along with further carrying out of the work such as quick response after seismology and Earthquake Prediction Research and large shake, earthquake testing has been proposed to more and more high requirement, but present not only complex structure of earthquake detection equipment, and detection means is single, low precision, cannot detection earthquake promptly and accurately occur, for example Chinese patent document CN201110390546 has disclosed a kind of earthquake detection method and system, these earthquake detection method and system only can be carried out earthquake detection from Tensor measuring and strain measurement two aspects, but because earthquake is a very complicated physical and chemical process, in seismic process, tensor and strain are very small, therefore require high to measuring accuracy, make this earthquake detection system cannot meet existing needs in degree of accuracy.Therefore need high earthquake detection system and the detection method of a kind of accuracy of detection addressing the above problem.
Summary of the invention
The object of this invention is to provide a kind of earthquake detection system, this earthquake detection system can make a variation from earth magnetism, and Real-time and Dynamic Detection is carried out in vibrations variation aspect, and accuracy of detection is high.
Another object of the present invention is to provide a kind of earthquake detection method, and this earthquake detection method can make a variation from earth magnetism, and Real-time and Dynamic Detection is carried out in vibrations variation aspect, and accuracy of detection is high.
To achieve these goals, the invention provides a kind of earthquake detection system, this earthquake detection system involving vibrations detection module, magnetic field detection module, processing module and alarm module, described vibration detection module comprises X axis vibration detecting unit, Y axis vibration detecting unit and Z axis vibration detecting unit, detects respectively the vibration signal of X-direction, Y direction and Z-direction; Described magnetic field detection module comprises X-axis magnetic field detection unit, Y-axis magnetic field detection unit and Z axis magnetic field detection unit, detects respectively the magnetic variation signal of X-direction, Y direction and Z-direction; Described processing module is processed described vibration signal and magnetic variation signal and is produced alerting signal according to described vibration signal and magnetic variation signal; Described alarm module is reported to the police according to described alerting signal.Compared with prior art, the present invention, by from earth magnetism variation, shakes variation aspect and carries out Real-time and Dynamic Detection, and easily detection and accuracy of detection are high.
Preferably, also involving vibrations testing circuit plate of described vibration detection module, described X axis vibration detecting unit, Y axis vibration detecting unit and Z axis vibration detecting unit are respectively the vibration transducer being installed on described vibration detection circuit plate, described vibration transducer comprises matrix, elastic plate, be installed on the oscillator on described elastic plate and be installed on the piezoelectric patches on described elastic plate, the week of described elastic plate is along being supported on described matrix, described matrix provides space for hollow structure and for described elastic plate, described in while being given a shock, elastic plate moves and drives described oscillator to move along the direction of vertical described elastic plate, and make described piezoelectric patches because of distortion generation vibration signal.Compared with prior art, elastic plate of the present invention is along its axial vibration, and resonant frequency is low, and elasticity coefficient is little, also very sensitive to microvibration, and detection sensitivity is high and cost simple in structure is low.
Particularly, described elastic plate comprises the first elastic plate and the second elastic plate that plate face is relative, described piezoelectric patches is installed on described the first elastic plate, described oscillator comprises the first oscillator between the first elastic plate and the second elastic plate, and described the first oscillator is installed on the first elastic plate and/or the second elastic plate and is subject to the vibration of described the first elastic plate and the second elastic plate and moves.Wherein, when one end of described the first oscillator is installed on described the first elastic plate, the other end also can be installed on inconsistent on described the second elastic plate or with described the second elastic plate or close on described the second elastic plate (having a less distance with described the second elastic plate), described in while being subject to vibrating, the first elastic plate and the second elastic plate vibrate and drive described the first oscillator to move along its axis, and under the effect of the first oscillator, not only make the first elastic plate and the second elastic plate produce interlock, and increase the Oscillation Amplitude of the first elastic plate and the second elastic plate, accuracy of detection is high.Certainly, one end of described the first oscillator also can be installed on described the second elastic plate, the other end and described the first elastic plate inconsistent or and described the first elastic plate between there is less distance, its principle of work is similar to a upper scheme.Wherein, described the first oscillator can have one also can, by multiple, can be distributed in the center of described elastic plate, also can be positioned at the elastic arm place of described elastic plate.
More specifically, described elastic plate also comprises three elastic plate relative with the plate face of described the first elastic plate, described oscillator comprises the second oscillator between described the 3rd elastic plate and the first elastic plate, described the second oscillator is installed on described the 3rd elastic plate and/or the first elastic plate, and is subject to the oscillating movement of described the first elastic plate and the 3rd elastic plate.Wherein, when one end of described the second oscillator can be installed on described the first elastic plate, the other end of described the second oscillator is installed on inconsistent on described the 3rd elastic plate or with described the 3rd elastic plate or closes on described the 3rd elastic plate, while being subject to vibrating, described the first elastic plate and the 3rd elastic plate vibrate and drive described the second oscillator to move along its axis, described the second oscillator moves being subject to the vibration of described the first elastic plate and the 3rd elastic plate, and under the impact of described the second oscillator, produce interlock and effectively increase the Oscillation Amplitude of the first elastic plate and the 3rd elastic plate described in it, accuracy of detection is high.Certainly, described the second oscillator also can be installed on described the 3rd elastic plate one end, the other end and described the first elastic plate inconsistent or and described the first elastic plate between there is less distance, its principle of work is similar to a upper scheme.
Particularly, described oscillator is positioned at the center of described elastic plate.Certainly, described oscillator also can be positioned at the elastic arm place of described elastic plate.
Particularly, described hollow structure is the cylindrical hole being opened on described matrix.
Particularly, described elastic plate is laminar, there is central active region, around at least one elastic arm of described central active region and around the support portion, outer of described elastic arm, between described central active region, elastic arm and support portion, outer, all there is certain gap, in described gap, be distributed with supporting bridge to connect adjacent central active region, elastic arm and support portion, outer, the support portion, outer of described elastic plate is installed on described matrix.More specifically, described elastic arm has several, all has certain gap between adjacent elastic arm, is distributed with supporting bridge to connect adjacent elastic arm in described gap.Supporting bridge in adjacent segment is interspersed along described central active region.Described elastic plate is made up of as silicon dioxide, stupalith or compound substance as aluminium oxide, nonmetal oxide as plastics, metal oxide as stainless steel, nonmetallic materials metal material.
Particularly, described piezoelectric patches is formed by connecting by some strip PZT piezoelectric patches, and some described strip PZT piezoelectric patches radially distribute along the center of described elastic plate.
Particularly, described matrix is also provided with vibration transducer conduction capillary, and described vibration transducer conduction capillary is electrically connected to export described vibration signal to described vibration detection circuit plate with described piezoelectric patches.Described vibration transducer conduction capillary is delivered to described vibration signal vibration detection circuit plate from vibration transducer.
Particularly, described vibration transducer also comprises screening cover, and described screening cover is covered on the end of described matrix and forms with the hollow structure of described matrix the accommodating cavity that described elastic plate is installed.More specifically, described screening cover comprises to be located at the upper screening cover of holding on described matrix and to be located at the lower screening cover of holding under described matrix, and described vibration transducer conduction capillary is installed on described matrix and through described lower screening cover.
Preferably, described magnetic field detection module also comprises magnetic variation testing circuit plate, described X-axis magnetic field detection unit, Y-axis magnetic field detection unit and Z axis magnetic field detection unit are respectively the Magnetic Sensor being installed on described magnetic variation testing circuit plate, described Magnetic Sensor comprises pcb board and be installed on the magnetic induction chip on described pcb board, and described magnetic induction chip induced field changes to produce magnetic variation signal.
Particularly, described magnetic induction chip comprises anisotropic magnetoresistive AMR magnetic induction chip, giant magnetoresistance GMR magnetic induction chip, tunnel magnetoresistive TMR magnetic induction chip, Hall HALL effect magnetic susceptibility chip or huge Hall HALL effect magnetic susceptibility chip.
Particularly, described magnetic induction chip comprises at least two sections of magnetic susceptibility films, and described in two, magnetic susceptibility film is along level or vertical direction parallel arranged and be electrically connected and be connected into Wheatstone bridge by described pcb board.
Particularly, Magnetic Sensor capillary is installed on described pcb board, described Magnetic Sensor capillary is electrically connected to export described magnetic variation signal to described magnetic variation testing circuit plate with described magnetic induction chip, and described Magnetic Sensor capillary is delivered to described magnetic variation signal magnetic variation testing circuit plate from Magnetic Sensor.
More specifically, described Magnetic Sensor also comprises housing, and described pcb board is installed in described housing, and described Magnetic Sensor capillary is installed on described pcb board and stretches out described housing.
Preferably, described earthquake detection system also comprises acceleration of gravity detection module, make a variation to export acceleration of gravity signal for detection of acceleration of gravity, described processing module is processed described acceleration of gravity signal and is produced alerting signal according to described acceleration of gravity signal.
Preferably, described earthquake detection system also comprises underground water radon gas detection module, make a variation to export underground water radon gas signal for detection of underground water radon gas content, described processing module is processed described underground water radon gas signal and is produced alerting signal according to described underground water radon gas signal.
Preferably, described earthquake detection system also comprises testing circuit plate, X axis vibration magnetic field detection unit is installed on described testing circuit plate, Y axis vibration magnetic field detection unit and Z axis vibration magnetic field detection unit, X axis vibration magnetic field detection unit, Y axis vibration magnetic field detection unit and Z axis vibration magnetic field detection unit are respectively oscillating magnetic field dual sensor, and described X axis vibration magnetic field detection unit comprises described X axis vibration detecting unit and X-axis magnetic field detection unit, described Y axis vibration magnetic field detection unit comprises described Y axis vibration detecting unit and Y-axis magnetic field detection unit, described Z axis vibration magnetic field detection unit comprises described Z axis vibration detecting unit and Z axis magnetic field detection unit, described oscillating magnetic field dual sensor comprises pedestal, vibrating sensing portion, vibrating sensing portion conduction capillary, magnetic detecting means and magnetic detecting means capillary, and described pedestal is hollow structure, described vibrating sensing portion comprises elastic plate, is installed on piezoelectric patches and magnetic oscillator on described elastic plate, the week of described elastic plate is along being supported on described pedestal, described hollow structure provides space for described elastic plate, described in while being given a shock, elastic plate moves along the direction of vertical described elastic plate, so that described magnetic oscillator provides the magnetic field of variation, described piezoelectric patches to produce vibration signal, described vibrating sensing portion conduction capillary, is installed on described pedestal and with described piezoelectric patches and is electrically connected to export described vibration signal, described magnetic detecting means comprises the pcb board being installed on described pedestal and is installed on the magnetic induction chip on described pcb board, the magnetic susceptibility direction of described magnetic induction chip is parallel with the magnetic direction of described magnetic oscillator, and the magnetic field of the variation that described magnetic induction chip produces according to magnetic oscillator produces magnetic variation signal, described magnetic detecting means capillary, is installed on described pedestal and with described magnetic induction chip and is electrically connected to export described magnetic variation signal.On the one hand, described in when wherein said oscillating magnetic field dual sensor is given a shock, elastic plate drives described magnetic oscillator to move along the direction of vertical described elastic plate, described piezoelectric patches is because of the distortion output voltage signal while, described magnetic induction chip is responded to the kinetic heat treatment of described magnetic oscillator and output difference divided voltage signal, two kinds of outputs all can change in reaction environment vibration, in the time that friction occurs, while being vibration induction portion no-output, can whether there is output to judge whether environmental magnetic field changes according to magnetic induction chip, can carry out vibration detection and magnetic variation and detect dual-use function, applicability is wide, therefore this programme adopts the oscillating magnetic field dual sensor that can detect vibration signal and magnetic variation signal to form described vibration detection module and magnetic field detection module simultaneously.Moreover compared with prior art, elastic plate of the present invention is along its axial vibration, resonant frequency is low, and elasticity coefficient is little, also very sensitive to microvibration, and detection sensitivity is high and cost simple in structure is low.
Wherein, described magnetic oscillator is positioned at the center of described elastic plate.
Wherein, described elastic plate and relative laying the in described pcb board position, further increase the sensitivity that on described pcb board, magnetic induction chip induced field changes.Wherein, described hollow structure is the cylindrical hole being opened on described pedestal, and described elastic plate is installed on one end opening part of described cylindrical hole, and described pcb board is installed on the other end opening part of described cylindrical hole, simple in structure, be convenient to assembling.Wherein, described magnetic oscillator comprises connector and at least one magnet piece, and described connector is connected between described elastic plate and magnet piece, makes the size of described magnet piece not be subject to the restriction of elastic plate size.
Wherein, described elastic plate is laminar, there is central active region, around at least one elastic arm of described central active region and around the support portion, outer of described elastic arm, between described central active region, elastic arm and support portion, outer, all there is certain gap, in described gap, be distributed with supporting bridge to connect adjacent central active region, elastic arm and support portion, outer, the support portion, outer of described elastic plate is installed on described pedestal.Particularly, described elastic arm has several, all has certain gap between adjacent elastic arm, is distributed with supporting bridge to connect adjacent elastic arm in described gap.Particularly, the supporting bridge in adjacent segment is interspersed along described central active region.Particularly, the interior edge of described piezoelectric patches is positioned at the central active region of described elastic plate, and the outer of described piezoelectric patches is positioned at the support portion, outer of described elastic plate.Described elastic plate is by metal material if stainless steel, nonmetallic materials are if plastics, metal oxide are if aluminium oxide, nonmetal oxide are as silicon dioxide, and stupalith or compound substance form.
Wherein, described piezoelectric patches is formed by connecting by some strip PZT piezoelectric patches, and some described strip PZT piezoelectric patches radially distribute along the center of described elastic plate.
Wherein, described oscillating magnetic field dual sensor also comprises the matrix of being located on described pedestal upper surface, described matrix is provided with the conducting wire for described piezoelectric patches and the conduction capillary electrical connection of vibrating sensing portion, and described matrix is printed circuit board (PCB), described elastic plate is pasted or screw thread is installed on described printed circuit board (PCB).Certainly, described matrix can be also metallic matrix, and now, described elastic plate is elastic metal sheet or condensate flexible board, and described elastic plate laser bonding is on described matrix.
Wherein, described oscillating magnetic field dual sensor also comprises screening cover, and described screening cover is covered on the end of described pedestal and is coated on outside described magnetic detecting means and vibrating sensing portion.
Wherein, described magnetic induction chip comprises anisotropic magnetoresistive AMR magnetic induction chip, giant magnetoresistance GMR magnetic induction chip, tunnel magnetoresistive TMR magnetic induction chip, Hall HALL effect magnetic susceptibility chip or huge Hall HALL effect magnetic susceptibility chip.
Wherein, described magnetic induction portion comprises at least two sections of magnetic susceptibility films, and described in two, magnetic susceptibility film is along level or vertical direction parallel arranged and be electrically connected and be connected into Wheatstone bridge by described pcb board.
The present invention also provides a kind of earthquake detection method, comprising: (1) detects vibration signal and the magnetic variation signal in three directions of X-axis, Y-axis, Z axis at a certain check point place; (2) process described vibration signal and magnetic variation signal and produce alerting signal according to described vibration signal and magnetic variation signal; (3) report to the police according to described alerting signal.Compared with prior art, the present invention, by from earth magnetism variation, shakes variation aspect and carries out Real-time and Dynamic Detection, and easily detection and accuracy of detection are high.
Preferably, described step (1) also comprises: detect the acceleration of gravity signal at described check point place, described step (2) also comprises: produce alerting signal according to described acceleration of gravity signal.
Preferably, described step (1) also comprises: detect the underground water radon gas signal at described check point place, described step (2) also comprises: produce alerting signal according to described underground water radon gas signal.
Brief description of the drawings
Fig. 1 is the structured flowchart of the system of earthquake detection described in first embodiment of the invention.
Fig. 2 is the schematic perspective view of vibration detection module of the present invention in Fig. 1.
Fig. 3 is the perspective exploded view of vibration transducer of the present invention in Fig. 2.
Fig. 4 is the cut-open view of vibration transducer of the present invention in Fig. 2.
Fig. 5 is the schematic perspective view of elastic plate of the present invention.
Fig. 6 is the schematic perspective view of magnetic field detection module of the present invention in Fig. 1.
Fig. 7 is the perspective exploded view of Magnetic Sensor described in Fig. 6.
Fig. 8 is the schematic perspective view of the chip of magnetic induction described in Fig. 6.
Fig. 9 is the structured flowchart of the system of earthquake detection described in second embodiment of the invention.
Figure 10 is the schematic perspective view of the dual sensor of oscillating magnetic field described in Fig. 9.
Figure 11 is the cut-open view of the dual sensor of oscillating magnetic field described in Figure 10.
Figure 12 is the decomposing schematic representation of the dual sensor of oscillating magnetic field described in Figure 10.
Figure 13 is the part-structure schematic diagram of the vibrating sensing portion of the dual sensor of oscillating magnetic field described in Figure 10.
Figure 14 is the structural representation of the first embodiment of the magnetic detecting means of described oscillating magnetic field dual sensor.
Figure 15 is the structural representation of the first embodiment of the magnetic detecting means of described oscillating magnetic field dual sensor.
Figure 16 is the process flow diagram of earthquake detection method of the present invention.
Embodiment
By describing technology contents of the present invention, structural attitude in detail, being realized object and effect, below in conjunction with embodiment and coordinate accompanying drawing to be explained in detail.
With reference to figure 1, the invention discloses a kind of earthquake detection system 100, these earthquake detection system 100 involving vibrations detection modules 101, magnetic field detection module 102, processing module 103 and alarm module 104, described vibration detection module 101 comprises X axis vibration detecting unit 201, Y axis vibration detecting unit 202 and Z axis vibration detecting unit 203, detects respectively the vibration signal of X-direction, Y direction and Z-direction; Described magnetic field detection module 102 comprises X-axis magnetic field detection unit 301, Y-axis magnetic field detection unit 302 and Z axis magnetic field detection unit 303, detects respectively the magnetic variation signal of X-direction, Y direction and Z-direction; Described processing module 103 is processed described vibration signal and magnetic variation signal and is produced alerting signal according to described vibration signal and magnetic variation signal; Described alarm module 104 is reported to the police according to described alerting signal.Compared with prior art, the present invention carries out Real-time and Dynamic Detection from earth magnetism variation, vibrations variation aspect, and detection is easy and accuracy of detection is high.
Preferably, continue with reference to figure 1, described earthquake detection system 100 also comprises acceleration of gravity detection module 105, make a variation to export acceleration of gravity signal for detection of acceleration of gravity, described processing module 103 is processed described acceleration of gravity signal and is produced alerting signal according to described acceleration of gravity signal.
Preferably, continue with reference to figure 1, described earthquake detection system 100 also comprises underground water radon gas detection module 106, make a variation to export underground water radon gas signal for detection of underground water radon gas content, described processing module 103 is processed described underground water radon gas signal and is produced alerting signal according to described underground water radon gas signal.
With reference to figure 3 and Fig. 4, described X axis vibration detecting unit 201, Y axis vibration detecting unit 202 and Z axis vibration detecting unit 203 are respectively and are installed on the vibration transducer 200 on described vibration detection circuit plate 21 and are installed on a vibration detection circuit plate 21.In this scheme, after described X axis vibration detecting unit 201, Y axis vibration detecting unit 202 and the equal individual packages of Z axis vibration detecting unit 203 are good, be arranged on vibration detection circuit plate 21, certainly, described X axis vibration detecting unit 201, Y axis vibration detecting unit 202 and Z axis vibration detecting unit 203 are installed on described vibration detection circuit plate 21 after also can being encapsulated in a housing, also can with other device packages after be installed on described vibration detection circuit plate 21.
Continue with reference to figure 3 and Fig. 4, described vibration transducer 200 comprises the first matrix 111, the first elastic plate 12a, be installed on the first oscillator 131 on described the first elastic plate 12a and be installed on the piezoelectric patches 14 on described the first elastic plate 12a, the week of described the first elastic plate 12a is along being supported on described the first matrix 111, described the first matrix 111 provides space for hollow structure and for described the first elastic plate 12a, described in while being given a shock, the first elastic plate 12a moves and drives described the first oscillator 131 to move along the direction of vertical described the first elastic plate 12a, and make described piezoelectric patches 14 because of distortion generation vibration signal.Compared with prior art, the first elastic plate 12a of the present invention is along its axial vibration, and resonant frequency is low, and elasticity coefficient is little, also very sensitive to microvibration, and detection sensitivity is high and cost simple in structure is low.Wherein, described the first oscillator 131 is positioned at the center of described the first elastic plate 12a.Certainly, described the first oscillator 131 also can be positioned at the elastic arm place of described elastic plate 12.
Preferably, continue with reference to figure 3 and Fig. 4, described vibration transducer 200 also comprises the second elastic plate 12b identical with described the first elastic plate 12a structure and that plate face is relative, the week of described the second elastic plate 12b is along being supported on described the first matrix 111, described the first elastic plate 12a is installed on the upper surface of described the first matrix 111, described the second elastic plate 12b is installed on the lower surface of described the first matrix 111, one end of described the first oscillator 131 is installed on described the first elastic plate 12a, the other end described the second elastic plate 12b that conflicts, so that described the first oscillator 131 is installed between described the first elastic plate 12a and the second elastic plate 12b and is subject to the vibration of described the first elastic plate 12 and the second elastic plate 12 and moves.While being subject to vibrating, described the first elastic plate 12a vibrates and drives described the first oscillator 131 to move along its axis, described the second elastic plate 12b vibration also links with described the first elastic plate 12a under the impact of described the first oscillator 131, now described the first oscillator 131 is subject to the vibration of described the first elastic plate 12a and the second elastic plate 12b and moves, and increasing the Oscillation Amplitude of the first elastic plate 12a and the second elastic plate 12b at the gravity effect of described the first oscillator 131, accuracy of detection is high.Certainly, described the first oscillator 131 also can be installed on described the first elastic plate 12a one end, the other end is installed on described the second elastic plate 12b above or closes on described the second elastic plate 12b, or described the first oscillator 131 also can be installed on described the second elastic plate 12b above in one end, and the other end is conflicted or closed on described the first elastic plate 12a.In the present embodiment, described the first oscillator 131 is a mass, and described the first oscillator 131 also can be made up of multiple masses certainly, and it can be distributed in the center of described the first elastic plate 12a, also can be positioned at the elastic arm place of described the first elastic plate 12a.
Better person, continue with reference to figure 3 and Fig. 4, second matrix 112 relative with described the first matrix 111 is also installed on described the first matrix 111, described the second matrix 112 is hollow structure, now described the first elastic plate 12a is positioned at described the second matrix 112 lower surfaces, on described the second matrix 112 upper surfaces, the 3rd elastic plate 12c is also installed, week of described the 3rd elastic plate 12c is along being supported on described the second matrix 112 and relative with described the first elastic plate 12a plate face, between described the 3rd elastic plate 12c and the first elastic plate 12a, be also provided with the second oscillator 132, described second oscillator 132 one end are installed on described the 3rd elastic plate 12c, the other end described the first elastic plate 12a that conflicts, and be subject to the oscillating movement of described the first elastic plate 12a and the 3rd elastic plate 12c.Certainly, described the second oscillator 132 also can be installed on described the first elastic plate 12a one end, the other end is installed on described the 3rd elastic plate 12c above or closes on described the 3rd elastic plate 12c, or the second oscillator 132 also can be installed on 12c on described the 3rd elastic plate in one end, and the other end closes on described the first elastic plate 12a.
With reference to figure 5, described the first elastic plate 12a is laminar, there is central active region 121, around the elastic arm 122 of described central active region 121 and around the support portion, outer 123 of described elastic arm 122, between described central active region 121, elastic arm 122 and support portion, outer 124, all there is certain gap 125, in described gap 125, be distributed with supporting bridge 124 to connect adjacent central active region 121, elastic arm 12 and support portion, outer 123.Continue with reference to figure 5, the elastic arm 122 of elastic plate 12 has four, between adjacent elastic arm 122, all has certain gap 125, is distributed with supporting bridge 124 to connect adjacent elastic arm 122 in described gap 125.Supporting bridge 124 in each gap 125 has two.Supporting bridge in same gap 125 is uniformly distributed along described central active region 121, and in adjacent segment 125,125 supporting bridge 124 is interspersed along described central active region 121.Certainly, described elastic arm 122 can be also one, two, three or other numbers, and supporting bridge 124 also can increase and decrease according to actual requirement.
With reference to figure 3, described piezoelectric patches 14 is formed by connecting by some strip PZT piezoelectric patches, and some described strip PZT piezoelectric patches radially distribute along the center of described the first elastic plate 12a.Certainly, the shape of described piezoelectric patches 14 is not limited to this, and described piezoelectric patches 14 can also be one-piece construction PZT piezoelectric patches.Wherein, described piezoelectric patches 14 is for having lead piezoelectric ceramics lead zirconate titanate (PZT) piezoelectric patches, PMN-PT (PMN-Pt) piezoelectric patches, leadless piezoelectric ceramics barium titanate (BT) leadless piezoelectric ceramics or niobate lead-free piezoelectric ceramics niobium nickel acid potassium (KNN) piezoelectric patches.Described piezoelectric patches 14 is d33 or d31 type piezoelectric patches.Described piezoelectric patches 14 is individual layer PZT piezoelectric patches or multilayer PZT piezoelectric patches.Wherein, the interior edge of described piezoelectric patches 14 is positioned at the central active region of described the first elastic plate 12a, and the outer of described piezoelectric patches is positioned at the support portion, outer of described the first elastic plate 12a.
Preferably, referring to figs. 2 and 3, described the first matrix 111 is also provided with vibration transducer conduction capillary 15, and described vibration transducer conduction capillary 15 is electrically connected to export described vibration signal to described vibration detection circuit plate 21 with described piezoelectric patches 14.
Wherein, described the first matrix 111 and the second matrix 112 are printed circuit board (PCB), on it, be provided with the conducting wire of the described piezoelectric patches 14 of electrical connection and vibration transducer conduction capillary 15, described the first elastic plate 12a, the second elastic plate 122 and the 3rd elastic plate 123 are pasted or screw thread is installed on described printed circuit board (PCB), certainly, described the first matrix 111 and the second matrix 112 can also be metallic matrix, described the first elastic plate 12a, the second elastic plate 122 and the 3rd elastic plate 123 are elastic metal sheet or condensate flexible board, and described the first elastic plate 12a, the second elastic plate 122 and the corresponding laser bonding of the 3rd elastic plate 123 are on described the first matrix 111 and the second matrix 112.Wherein, described hollow structure is the cylindrical hole being opened on described the first matrix 111 and the second matrix 112.
Preferably, referring to figs. 2 and 3, described vibration transducer 200 also comprises screening cover, described screening cover comprises the upper screening cover 161 of being located at end on described the first matrix 111 and the lower screening cover 162 of being located at end under described the second matrix 112, and described vibration transducer conduction capillary 15 is installed on described the first matrix 111 and through described lower screening cover 162.Wherein, the inside surface of described upper screening cover 161 and lower screening cover 162 is equipped with convex body 163, to limit the vibration amplitude of described the second elastic plate 122 and the 3rd elastic plate 123.
With reference to figure 6 and Fig. 7, described magnetic field detection module 102 also comprises magnetic variation testing circuit plate 22, and described X-axis magnetic field detection unit 301, Y-axis magnetic field detection unit 302 and Z axis magnetic field detection unit 303 are respectively the Magnetic Sensor 300 being installed on described magnetic variation testing circuit plate 22.In the present embodiment, described X-axis magnetic field detection unit 301, Y-axis magnetic field detection unit 302 and Z axis magnetic field detection unit 303 respectively individual packages are installed on described magnetic variation testing circuit plate 22 after good, certainly, also X-axis magnetic field detection unit 301, Y-axis magnetic field detection unit 302 can be encapsulated in to a shell with Z axis magnetic field detection unit 303 in or together with other device packages after be installed on described magnetic variation testing circuit plate 22.
Continue with reference to figure 6 and Fig. 7, particularly, described Magnetic Sensor 300 comprises pcb board 31 and is installed on the magnetic induction chip 32 on described pcb board 31, and described magnetic induction chip 32 induced fields change to produce magnetic variation signal.Particularly, described magnetic induction chip 32 comprises anisotropic magnetoresistive AMR magnetic induction chip, giant magnetoresistance GMR magnetic induction chip, tunnel magnetoresistive TMR magnetic induction chip, Hall HALL effect magnetic susceptibility chip or huge Hall HALL effect magnetic susceptibility chip.Particularly, with reference to figure 8, described magnetic induction chip 32 comprises at least two sections of magnetic susceptibility films 321 and is electrically connected and is connected into Wheatstone bridge by described pcb board 31, described in two, magnetic susceptibility film 321 can be along level or vertical direction parallel arranged, and described magnetic induction chip 32 can level or is vertically installed on described pcb board.Particularly, on described pcb board 31, Magnetic Sensor capillary 33 is installed, described Magnetic Sensor capillary 33 is electrically connected to export described magnetic variation signal to described magnetic variation testing circuit plate 22 with described magnetic induction chip 32.More specifically, described Magnetic Sensor 300 also comprises housing 34, and described pcb board 31 is installed in described housing 34, and described Magnetic Sensor capillary 33 is installed on described pcb board 31 and stretches out described housing 34.
With reference to figure 9 to Figure 13, for the part schematic diagram of the second embodiment of earthquake detection system of the present invention, different from the first embodiment is, in this embodiment, described earthquake detection system 100 ' also comprises testing circuit plate 23, X axis vibration magnetic field detection unit 401 is installed on described testing circuit plate 23, Y axis vibration magnetic field detection unit 402 and Z axis vibration magnetic field detection unit 403, described X axis vibration magnetic field detection unit 401, Y axis vibration magnetic field detection unit 402 and Z axis vibration magnetic field detection unit 403 are respectively oscillating magnetic field dual sensor 400, and described X axis vibration magnetic field detection unit 401 comprises described X axis vibration detecting unit and X-axis magnetic field detection unit, described Y axis vibration magnetic field detection unit 402 comprises described Y axis vibration detecting unit and Y-axis magnetic field detection unit, described Z axis vibration magnetic field detection unit 403 comprises described Z axis vibration detecting unit and Z axis magnetic field detection unit.
With reference to figures 10 to Figure 14, described oscillating magnetic field dual sensor 400 comprises pedestal 41, vibrating sensing portion, magnetic detecting means, vibrating sensing portion capillary 412 and magnetic detecting means conduction capillary 44, described pedestal 41 is hollow structure, described vibrating sensing portion comprises elastic plate 42, be installed on piezoelectric patches 14 and magnetic oscillator 45 on described elastic plate 42, the week of described elastic plate 42 is along being supported on described pedestal 41, described hollow structure provides space for described elastic plate 42, described in while being given a shock, elastic plate 42 moves along the direction of vertical described elastic plate 42, the magnetic field that described magnetic oscillator 45 changes thereupon, described piezoelectric patches 14 produces electric energy to form vibration signal thereupon, described vibrating sensing portion conduction capillary 142 is installed on described pedestal 41 and with described piezoelectric patches 14 and is electrically connected to export described vibration signal, on described pcb board 43, magnetic induction chip 32 is installed, described magnetic induction chip 32 produces magnetic variation signal according to the variation of surrounding magnetic field, and described magnetic detecting means conduction capillary 44 is installed on described pedestal 41 and with described pcb board 43 and is electrically connected to export magnetic variation signal.Wherein, described magnetic oscillator 45 is installed on the center of described elastic plate 42 in the present embodiment, and certainly, described magnetic oscillator 45 also can be by several and be installed on respectively other positions of described elastic plate 42.Wherein, described elastic plate 42, piezoelectric patches 14 and magnetic induction chip 32 are identical with the structure of the first elastic plate 12a, piezoelectric patches 14 and magnetic induction chip 32 in described the first embodiment respectively, just will not describe in detail at this.
Preferably, with reference to Figure 11, described elastic plate 42 is relative with described pcb board 43 positions, further increases the sensitivity that on described pcb board 43, magnetic induction chip induced field changes.Particularly, with reference to Figure 11 and Figure 12, described hollow structure is the cylindrical hole being opened on described pedestal 41, and described elastic plate 42 is installed on one end opening part of described cylindrical hole, described pcb board 43 is installed on the other end opening part of described cylindrical hole, simple in structure, be convenient to assembling.
Preferably, with reference to Figure 11 and Figure 12, is covered with screening cover 47 on described pedestal 41, and the coated described magnetic detecting means of described screening cover 47 and vibrating sensing portion.
With reference to Figure 11 and Figure 12, described magnetic oscillator 45 comprises connector 451 and magnet piece 452, and described connector 451 is connected between described elastic plate 42 and magnet piece 452, makes the size of described magnet piece 452 not be subject to the restriction of elastic plate 42 sizes.Wherein, described magnet piece 452 can be one or polylith.
With reference to figures 11 to Figure 13, described oscillating magnetic field dual sensor 400 also comprises the matrix 51 of being located on described pedestal 41 upper surfaces, described matrix 51 is printed circuit board (PCB), which is provided with the conducting wire of the described piezoelectric patches 14 of electrical connection and vibrating sensing portion capillary 412, described elastic plate 42 is pasted or screw thread is installed on described printed circuit board (PCB), certainly, described elastic plate 42 can also be elastic metal sheet or condensate flexible board, now described matrix 51 is metallic matrix, and described elastic plate 42 laser bonding are on described matrix 51.
Preferably, with reference to Figure 14, two magnetic susceptibility film 321 along continuous straight runs of described magnetic induction chip 3 are arranged in parallel on described pcb board 43.
With reference to Figure 15, be third embodiment of the invention, different from the second embodiment, in this embodiment, described magnetic induction chip 32 two described in magnetic susceptibility film 321 be vertically arranged in parallel on described pcb board 431.
With reference to Figure 16, the invention also discloses a kind of earthquake detection method, comprising: (S1) detect vibration signal and magnetic variation signal in three directions of X-axis, Y-axis, Z axis at a certain check point place; (S2) process described vibration signal and magnetic variation signal and produce alerting signal according to described vibration signal and magnetic variation signal; (S3) report to the police according to described alerting signal.Compared with prior art, the present invention, by from earth magnetism variation, shakes variation aspect and carries out Real-time and Dynamic Detection, and detection is easy and accuracy of detection is high.
Preferably, described step (S1) also comprises: detect the acceleration of gravity signal at described check point place, described step (S2) also comprises: produce alerting signal according to described acceleration of gravity signal.
Preferably, described step (S1) also comprises: detect the underground water radon gas signal at described check point place, described step (S2) also comprises: produce alerting signal according to described underground water radon gas signal.
Above disclosed is only the preferred embodiments of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the present patent application the scope of the claims, still belongs to the scope that the present invention is contained.
Claims (28)
1. an earthquake detection system, is characterized in that, comprising:
Vibration detection module, comprises X axis vibration detecting unit, Y axis vibration detecting unit and Z axis vibration detecting unit, detects respectively the vibration signal of X-direction, Y direction and Z-direction;
Magnetic field detection module, comprises X-axis magnetic field detection unit, Y-axis magnetic field detection unit and Z axis magnetic field detection unit, detects respectively the magnetic variation signal of X-direction, Y direction and Z-direction;
Processing module, processes described vibration signal and magnetic variation signal and produces alerting signal according to described vibration signal and magnetic variation signal;
Alarm module, reports to the police according to described alerting signal.
2. earthquake detection system as claimed in claim 1, it is characterized in that, also involving vibrations testing circuit plate of described vibration detection module, described X axis vibration detecting unit, Y axis vibration detecting unit and Z axis vibration detecting unit are respectively the vibration transducer being installed on described vibration detection circuit plate, described vibration transducer comprises matrix, elastic plate, be installed on the oscillator on described elastic plate and be installed on the piezoelectric patches on described elastic plate, the week of described elastic plate is along being supported on described matrix, described matrix has hollow structure and provides space for described elastic plate, described in while being given a shock, elastic plate moves and drives described oscillator to move along the direction of vertical described elastic plate, so that described piezoelectric patches is because of distortion generation vibration signal.
3. earthquake detection system as claimed in claim 2, it is characterized in that, described elastic plate comprises the first elastic plate and the second elastic plate that plate face is relative, described piezoelectric patches is installed on described the first elastic plate, described oscillator comprises the first oscillator between the first elastic plate and the second elastic plate, and described the first oscillator is installed on the first elastic plate and/or the second elastic plate and is subject to the vibration of described the first elastic plate and the second elastic plate and moves.
4. earthquake detection system as claimed in claim 3, it is characterized in that, described elastic plate also comprises three elastic plate relative with the plate face of described the first elastic plate, described oscillator comprises the second oscillator between described the 3rd elastic plate and the first elastic plate, described the second oscillator is installed on described the 3rd elastic plate and/or the first elastic plate, and is subject to the vibration of described the first elastic plate and the 3rd elastic plate and moves.
5. earthquake detection system as claimed in claim 2, is characterized in that, described oscillator is positioned at the center of described elastic plate.
6. earthquake detection system as claimed in claim 2, is characterized in that, described hollow structure is the cylindrical hole being opened on described matrix.
7. earthquake detection system as claimed in claim 2, it is characterized in that, described elastic plate is laminar, there is central active region, around at least one elastic arm of described central active region and around the support portion, outer of described elastic arm, between described central active region, elastic arm and support portion, outer, all there is certain gap, in described gap, be distributed with supporting bridge to connect adjacent central active region, elastic arm and support portion, outer, the support portion, outer of described elastic plate is installed on described matrix.
8. earthquake detection system as claimed in claim 7, is characterized in that, described elastic arm has several, all has certain gap between adjacent elastic arm, is distributed with supporting bridge to connect adjacent elastic arm in described gap.
9. earthquake detection system as claimed in claim 7, is characterized in that, the supporting bridge in adjacent segment is interspersed along described central active region.
10. earthquake detection system as claimed in claim 2, is characterized in that, described piezoelectric patches is formed by connecting by some strip PZT piezoelectric patches, and some described strip PZT piezoelectric patches radially distribute along the center of described elastic plate.
11. earthquake detection systems as claimed in claim 2, is characterized in that, described matrix is also provided with vibration transducer conduction capillary, and described vibration transducer conduction capillary is electrically connected to export described vibration signal to described vibration detection circuit plate with described piezoelectric patches.
12. earthquake detection systems as claimed in claim 11, is characterized in that, described vibration transducer also comprises screening cover, and described screening cover is covered on the end of described matrix and forms with the hollow structure of described matrix the accommodating cavity that described elastic plate is installed.
13. earthquake detection systems as claimed in claim 12, it is characterized in that, described screening cover comprises to be located at the upper screening cover of holding on described matrix and to be located at the lower screening cover of holding under described matrix, and described vibration transducer conduction capillary is installed on described matrix and through described lower screening cover.
14. earthquake detection systems as claimed in claim 1, it is characterized in that, described magnetic field detection module also comprises magnetic variation testing circuit plate, described X-axis magnetic field detection unit, Y-axis magnetic field detection unit and Z axis magnetic field detection unit are respectively the Magnetic Sensor being installed on described magnetic variation testing circuit plate, described Magnetic Sensor comprises pcb board and be installed on the magnetic induction chip on described pcb board, and described magnetic induction chip induced field changes to produce magnetic variation signal.
15. earthquake detection systems as claimed in claim 14, it is characterized in that, described magnetic induction chip comprises anisotropic magnetoresistive AMR magnetic induction chip, giant magnetoresistance GMR magnetic induction chip, tunnel magnetoresistive TMR magnetic induction chip, Hall HALL effect magnetic susceptibility chip or huge Hall HALL effect magnetic susceptibility chip.
16. earthquake detection systems as claimed in claim 14, is characterized in that, described magnetic induction chip comprises at least two sections of magnetic susceptibility films, and described in two, magnetic susceptibility film is along level or vertical direction parallel arranged and be electrically connected and be connected into Wheatstone bridge by described pcb board.
17. earthquake detection systems as claimed in claim 14, is characterized in that, Magnetic Sensor capillary is installed on described pcb board, and described Magnetic Sensor capillary is electrically connected to export described magnetic variation signal to described magnetic variation testing circuit plate with described magnetic induction chip.
18. earthquake detection systems as claimed in claim 17, is characterized in that, described Magnetic Sensor also comprises housing, and described pcb board is installed in described housing, and described Magnetic Sensor capillary is installed on described pcb board and stretches out described housing.
19. earthquake detection systems as claimed in claim 1, it is characterized in that, described earthquake detection system also comprises acceleration of gravity detection module, make a variation to export acceleration of gravity signal for detection of acceleration of gravity, described processing module is processed described acceleration of gravity signal and is produced alerting signal according to described acceleration of gravity signal.
20. earthquake detection systems as claimed in claim 1, it is characterized in that, described earthquake detection system also comprises underground water radon gas detection module, make a variation to export underground water radon gas signal for detection of underground water radon gas content, described processing module is processed described underground water radon gas signal and is produced alerting signal according to described underground water radon gas signal.
21. earthquake detection systems as claimed in claim 1, it is characterized in that, described earthquake detection system also comprises testing circuit plate, X axis vibration magnetic field detection unit is installed on described testing circuit plate, Y axis vibration magnetic field detection unit and Z axis vibration magnetic field detection unit, X axis vibration magnetic field detection unit, Y axis vibration magnetic field detection unit and Z axis vibration magnetic field detection unit are respectively oscillating magnetic field dual sensor, and described X axis vibration magnetic field detection unit comprises described X axis vibration detecting unit and X-axis magnetic field detection unit, described Y axis vibration magnetic field detection unit comprises described Y axis vibration detecting unit and Y-axis magnetic field detection unit, described Z axis vibration magnetic field detection unit comprises described Z axis vibration detecting unit and Z axis magnetic field detection unit, described oscillating magnetic field dual sensor comprises pedestal, vibrating sensing portion, vibrating sensing portion conduction capillary, magnetic detecting means and magnetic detecting means capillary, and described pedestal is hollow structure, described vibrating sensing portion comprises elastic plate, is installed on piezoelectric patches and magnetic oscillator on described elastic plate, the week of described elastic plate is along being supported on described pedestal, described hollow structure provides space for described elastic plate, described in while being given a shock, elastic plate moves along the direction of vertical described elastic plate, so that described magnetic oscillator provides the magnetic field of variation, described piezoelectric patches to produce vibration signal, described vibrating sensing portion conduction capillary, is installed on described pedestal and with described piezoelectric patches and is electrically connected to export described vibration signal, described magnetic detecting means comprises the pcb board being installed on described pedestal and is installed on the magnetic induction chip on described pcb board, the magnetic susceptibility direction of described magnetic induction chip is parallel with the magnetic direction of described magnetic oscillator, and the magnetic field of the variation that described magnetic induction chip produces according to magnetic oscillator produces magnetic variation signal, described magnetic detecting means capillary, is installed on described pedestal and with described magnetic induction chip and is electrically connected to export described magnetic variation signal.
22. earthquake detection systems as claimed in claim 21, is characterized in that, described magnetic oscillator is positioned at the center of described elastic plate.
23. earthquake detection systems as claimed in claim 21, is characterized in that, described elastic plate and relative laying the in described pcb board position.
24. earthquake detection systems as claimed in claim 23, it is characterized in that, described hollow structure is the cylindrical hole being opened on described pedestal, and described elastic plate is installed on one end opening part of described cylindrical hole, and described pcb board is installed on the other end opening part of described cylindrical hole.
25. earthquake detection systems as claimed in claim 21, is characterized in that, also comprise screening cover, and described screening cover is covered on the end of described pedestal and is coated on outside described magnetic detecting means and vibrating sensing portion.
26. 1 kinds of earthquake detection methods, is characterized in that, comprising:
(1) detect vibration signal and the magnetic variation signal in three directions of X-axis, Y-axis, Z axis at a certain check point place;
(2) process described vibration signal and magnetic variation signal and produce alerting signal according to described vibration signal and magnetic variation signal;
(3) report to the police according to described alerting signal.
27. earthquake detection methods as claimed in claim 26, is characterized in that, described step (1) also comprises: detect the acceleration of gravity signal at described check point place, described step (2) also comprises: produce alerting signal according to described acceleration of gravity signal.
28. earthquake detection methods as claimed in claim 26, is characterized in that, described step (1) also comprises: detect the underground water radon gas signal at described check point place, described step (2) also comprises: produce alerting signal according to described underground water radon gas signal.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104914459A (en) * | 2015-05-18 | 2015-09-16 | 谢镕键 | Geomagnetic sensor real-time networking short-impending earthquake monitoring system and forecasting method |
| CN106199687A (en) * | 2016-06-27 | 2016-12-07 | 吉林大学 | Simple component geophone |
| CN107505662A (en) * | 2017-09-25 | 2017-12-22 | 华中科技大学 | A kind of 3 axis MEMS gravimeter |
| CN107870350A (en) * | 2017-12-13 | 2018-04-03 | 中国地质大学（武汉） | A kind of differential type bimorph geophone core body and piezoelectric seismometer |
| CN108168685A (en) * | 2017-12-27 | 2018-06-15 | 燕山大学 | External drive vibration detection device and detection method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3302744A (en) * | 1963-12-02 | 1967-02-07 | Frederick L Lemm | Electro-magnetic acceleration method of increasing impact of dropped body and apparatus therefor |
| CN102428389A (en) * | 2009-03-16 | 2012-04-25 | 德克萨斯大学体系董事会 | Electromagnetic seismology vibrator systems and methods |
| CN101710185A (en) * | 2009-04-23 | 2010-05-19 | 李子恩 | Short-period digital seismometer |
| CN201413563Y (en) * | 2009-05-20 | 2010-02-24 | 于舒隆 | Earthquake-sound, geomagnetic and earthquake motion anti-interference earthquake precaution device |
| CN102279413B (en) * | 2011-05-09 | 2012-12-19 | 深圳市鸿鹄成实业发展有限公司 | Earthquake alarm |
| CN103258404A (en) * | 2012-02-21 | 2013-08-21 | 新科实业有限公司 | Earthquake monitoring device, earthquake monitoring system and earthquake monitoring method |
| CN202693810U (en) * | 2012-07-16 | 2013-01-23 | 姜新猛 | Electronic monitoring system for landslide |
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2013
- 2013-05-24 CN CN201310199226.4A patent/CN104181578B/en not_active Expired - Fee Related
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| CN104914459A (en) * | 2015-05-18 | 2015-09-16 | 谢镕键 | Geomagnetic sensor real-time networking short-impending earthquake monitoring system and forecasting method |
| CN106199687A (en) * | 2016-06-27 | 2016-12-07 | 吉林大学 | Simple component geophone |
| CN107505662A (en) * | 2017-09-25 | 2017-12-22 | 华中科技大学 | A kind of 3 axis MEMS gravimeter |
| CN107870350A (en) * | 2017-12-13 | 2018-04-03 | 中国地质大学（武汉） | A kind of differential type bimorph geophone core body and piezoelectric seismometer |
| CN107870350B (en) * | 2017-12-13 | 2023-12-15 | 中国地质大学（武汉） | Differential dual-piezoelectric-patch geophone core and piezoelectric geophone |
| CN108168685A (en) * | 2017-12-27 | 2018-06-15 | 燕山大学 | External drive vibration detection device and detection method |
| CN108168685B (en) * | 2017-12-27 | 2019-07-30 | 燕山大学 | External drive vibration detection device and detection method |
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