CN104181453A - Chip testing machine - Google Patents
Chip testing machine Download PDFInfo
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- CN104181453A CN104181453A CN201310198205.0A CN201310198205A CN104181453A CN 104181453 A CN104181453 A CN 104181453A CN 201310198205 A CN201310198205 A CN 201310198205A CN 104181453 A CN104181453 A CN 104181453A
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Abstract
The invention discloses a chip testing machine which is provided with a testing module. The testing module comprises a testing disc and a testing substrate. The testing substrate of the chip testing machine can be aligned with all chips in one step by utilizing conductors on the testing disc so that large amount of technological work time is reduced when detection is performed within the same period of time, profits are increased for testers, and positive benefits can also be generated on the progress of subsequent products.
Description
Technical field
The invention relates to a kind of chip testing machine, particularly relevant for a kind of chip testing machine for a large amount of test chips.
Background technology
In recent years, progress along with correlation techniques such as electronics technology, networks, and the lifting of global electronic market comsupton level, the demand of the electronic products such as personal computer, multimedia, workstation, network, communication relevant device is increased sharply, and drives the flourish of All Around The World semiconductor industry.
And create an integrated circuit (IC) chip (integrate circuit chip by a Silicon Wafer; IC chip), need expend the technique of multiple tracks, comprise: product design (IC design), wafer manufacture (Wafer manufacture), mask (Photo mask) are manufactured, IC encapsulates (Packaging), test (Testing), packing (Assembly), and peripheral lead frame manufacture (Lead-framemanufacture), connector manufacture (Connector manufacture), circuit board fabrication (Boardmanufacture) etc., this compact process system, forms high-tech crystallization now.
In each electronic product, integrated circuit (IC) chip is regarded as its heart hinge, so each Electronics Factory of the world is also harsh to integrated circuit (IC) chip buying standard.In the situation that now integrated circuit (IC) chip demand being increased, supplier, also must can be rapidly a large amount of shipment except guaranteeing that final test (final testing) is accurate.
Referring to Fig. 1, is the tester table schematic diagram for prior art.As shown in Figure 1, tester table 9 comprises: tester table 90, one pick board 92, one feeding mechanism 94, one discharging mechanisms 96; When chip detection, the test panel (tray) of one year full integrated circuit (IC) chip can be fed through to the robotic arm below of feeding mechanism 94, robotic arm front end is provided with suction nozzle, decline robotic arm, can utilize suction nozzle to draw in charging tray after a chip, put into the testing agency of a plurality of adjacent arrangements on pick board 92, and by tester table 90 test chips, come test chip electrical functionality whether normal; To be tested complete after, then by the robotic arm of discharging mechanism 96, chip pick-up is gone back in test panel.
Yet, on test panel (tray), there is a plurality of crystal grain, with robotic arm, draw to testing agency and detect one by one, it need expend a large amount of man-hours, in the situation that now integrated circuit (IC) chip being had to heavy demand, it can reduce tester's income, also can affect to some extent the progress of subsequent product.
Summary of the invention
This is in order to solve above-mentioned mentioned problem, and a fundamental purpose of the present invention is to provide a kind of chip testing machine, particularly a kind of the same time of chip on test panel is detected, and it fast and accurately.
According to above-mentioned purpose, the invention provides a kind of chip testing machine, comprising: a test board; One test module, comprises a test panel and a test base; Test panel, has a upper surface and with respect to a lower surface of upper surface; Technique standing groove is the upper surface that is formed at test panel; Technique conductor, is to run through in standing groove, and on the upper surface of standing groove, forms on one and pad contact, forms a underlay contact on the lower surface of standing groove; Test base, has a upper surface and with respect to a lower surface of upper surface, is to be disposed at test panel below; Technique detection zone, is the upper surface that is formed at test base, and every detection zone is to have technique check point, and every detection contact is with respect to every underlay contact; One link is a side that is formed at test base; One test bench, is disposed on test board, has a test lead, and test lead is to be connected with link; And a pick-up unit, be to be electrically connected with test bench.
The invention provides another chip testing machine, comprising: a test board; Process test module, often this test module comprises a test panel and a test base; This test panel, has a upper surface and with respect to a lower surface of upper surface; Technique standing groove is the upper surface that is formed at test panel; Technique conductor, is to be disposed in standing groove, and on the upper surface of standing groove, forms on one and pad contact, forms a underlay contact on the lower surface of standing groove; This test base, has a upper surface and with respect to a lower surface of upper surface, every test base is to be disposed at every test panel below; Technique detection zone, is the upper surface that is formed at test base, and every detection zone is to have technique check point, and every detection contact is with respect to every underlay contact; One link is a side that is formed at test base; One test bench, is disposed on test board, has the test lead of technique longitudinal arrangement, and every test lead is to be connected with the link of every test base; And a pick-up unit, be to be electrically connected with test bench.
Chip testing machine proposed by the invention, can not only do same time detecting to a plurality of chips on a test panel, also can detect the same time of process test dish, to reduce technique a large amount of man-hour, and increase tester's income, also can produce forward benefit to the progress of subsequent product.
Accompanying drawing explanation
Can be to the object of the invention, technical characterictic and effect thereof for just auditor, do further understanding and understand, below in conjunction with embodiment and accompanying drawing, be described in detail as follows, wherein:
Fig. 1 is the tester table schematic diagram of prior art.
Fig. 2 is the vertical view of the test module on test board of the present invention.
Fig. 3 is the cut-open view of chip testing machine of the present invention.
Fig. 4 is the cut-open view of detection chip of the present invention.
Fig. 5 is the cut-open view of the chip testing machine of another embodiment of the present invention.
Embodiment
For making object of the present invention, technical characterictic and advantage, more correlative technology field personnel understand and are implemented the present invention, at this, coordinate accompanying drawing, in follow-up instructions, illustrate technical characterictic of the present invention and embodiment, and enumerate preferred embodiment and further illustrate, so following examples explanation is not in order to limit the present invention, and the accompanying drawing hereinafter to be contrasted, and is to express the signal relevant with feature of the present invention.
First, referring to Fig. 2, is the vertical view for the test module on test board of the present invention.As shown in Figure 2, the test board 2 on chip testing machine of the present invention includes a test module 1, comprising a test panel 10 (tray) and a test base 20; Test panel 10 has a upper surface 101 and with respect to a lower surface 103 of upper surface 101; On upper surface 101, form technique standing groove 12, each standing groove 12 is in order to place a chip 50 to be measured, and in the interior configuration technique of each standing groove 12 conductor 14, each conductor 14 runs through standing groove 12 and on upper surface 123, forms on one and pads contact 141 (referring to Fig. 3), in order to the conductive connecting pin 501 of contact measured chip 50; Meanwhile, conductor 14 forms a underlay contact 143 (referring to Fig. 3) in the lower surface 125 of standing groove 12; Wherein, the material of conductor is metal material (such as gold, copper or nickel etc.); In addition, dispose at least one correcting part 121 (for example: reference column or protrusion) on standing groove 12 corners, its effect is in order to correcting chip 50 to be measured, it can not placed crooked, affects the test of chip; It should be noted that, when chip 50 to be measured is when detecting, can put plate 70 pressures with a pressure and put chip 50 to be measured (referring to Fig. 4), therefore for avoiding 121 impacts of correcting part to press, put effect, so the height of correcting part 121 must be lower than the height of chip 50 to be measured; And the material of test panel 10 is macromolecular compound.
Test base 20 of the present invention has a upper surface 201 and with respect to a lower surface 203 of upper surface 201; On upper surface 201, form technique detection zone 22, and on detection zone 22, there is technique detection contact 221; Wherein, each detects contact 221 its positions with respect to each the underlay contact 143 on test panel 10.In addition, one end of test base 20 forms a link 24, forms the golden finger 241 that technique is electrically connected on link, and each golden finger 241 is electrically connected by many circuits (not being shown in figure) and the technique conductor 14 in each standing groove 12.At this, be noted that the present embodiment illustrates with golden finger 241, but the connected mode of link 24 can also be probe pogopin, fixture or shell fragment etc.; In addition, the link 24 on test base 20 of the present invention is to be disposed at a side to explain, but link 24 it is also configurable in plural limit (as: front and back end or four limits all configure), the present invention is not limited the configuration of link 24.
Then, referring to Fig. 3, is the cut-open view for chip testing machine of the present invention.As shown in Figure 3, when chip 50 to be measured will detect, each chip 50 to be measured is positioned in each standing groove 12 on test panel 10, technique conductive connecting pin 501 on chip 50 to be measured is electrically connected with the conductor 14 in standing groove 12, and wherein the technique conductive connecting pin 501 of chip 50 to be measured is the upper pad contacts 141 that are contacted with conductor 14.After chip 50 to be measured has been positioned in the standing groove 12 on test panel 10, then test panel 10 is positioned over to test base 20 tops, and the underlay contact 143 of conductor 14 is contacted with the technique detection contact 221 on test base 20; Be connected afterwards, then by the test lead 32 that the link of test base 20 24 and is disposed at the test bench 30 on test board 2; And test bench 30 and a pick-up unit 40 are electrically connected, wherein, test bench 30, or connects in the mode of wireless connections with wire 60 wired connections with pick-up unit 40; Wherein, in pick-up unit 40, have test procedure, mainly in order to detect, be positioned over the chip to be measured 50 on test panel 10, carry out test chip electrically and chip functions whether normal, to reduce the fraction defective of finished product, reduce expending of manufacturing cost.In addition, in a preferred embodiment, when chip 50 to be measured is disposed in standing groove 12, chip 50 to be measured may be put crooked, therefore for making placement location correct of its chip 50 to be measured, to guarantee that the technique conductive connecting pin 501 on chip 50 to be measured is electrically connected with the conductor 14 in standing groove 12, can make chip 50 to be measured be configured in tram by disposing at least one correcting part 121 in standing groove 12.
Following, refer to Fig. 4, is the cut-open view for detection chip of the present invention.As shown in Figure 4, when detecting, test panel 10 tops can dispose a pressure and put plate 70, and chip to be measured 50, toward pressing down, and is all electrically connected in the technique in each standing groove 12 on test panel 10 the technique conductive connecting pin 501 of each chip 50 to be measured to pad contact 141; Each underlay contact 143 on test panel 10 is contacted with each the detection contact 221 on test base 20, is electrically connected thus to detect each chip 50 to be measured on test panel 10; And its measurement result can reach via the link 24 of test base 20 test bench 30, finally reach pick-up unit 40, show testing result thereon.In addition, on test base 20, further configure a control element 80, in order to control the detection signal that receives each chip 50 to be measured.By connecting whole piece test base 20, can detect at one time large quantities of chips, increase the quantity of detection chip, reduce technique a large amount of man-hour, and increase tester's income, also can produce forward benefit to the progress of subsequent product; In addition, when detecting, a configurable conductive adhesive layer (not being shown in figure) between test panel 10 and test base 20, in order to contacting between buffering test dish 10 and test base 20, and this conductive adhesive layer inside comprises process metal call wire, can conduct conductor 14 and detect the testing electrical property between contact 221.
Following, refer to Fig. 5, is the cut-open view for the chip testing machine of another embodiment of the present invention.As shown in Figure 5, in the present embodiment, its test bench 30 being disposed on test board 2 has process test end 32,32 ', 32 " ...; each test lead 32 is that the mode with longitudinal arrangement is disposed at test bench 30, and the test lead 32 of each longitudinal arrangement is in order to connect process test substrate 20,20 ', 20 " ... on golden finger 241; And the detection mode of each test base 20 is as above described in Fig. 3, at this, is no longer repeated.By connecting plural pieces test base 20, can detect at one time large quantities of chips, increase the quantity of detection chip, to reduce technique a large amount of man-hour, and increase tester's income, also can produce forward benefit to the progress of subsequent product.
The conductive connecting pin 501 of the chip to be measured 50 that the present invention detects can be pin, weld pad or tin ball, the detection contact 221 on test base 20, and the measurement that it can coordinate pin or weld pad, configures corresponding gauge point, and the present invention is not limited; In addition, chip 50 to be measured of the present invention can be integrated circuit (IC) chip (IC) or other such as the memory chips such as solid state hard disc (SSD), storage card (SD, micro SD), but the present invention is not limited the type of chip 50 to be measured.
Although the present invention discloses as above with aforesaid preferred embodiment; so it is not in order to limit the present invention; anyly have the knack of art technology person; without departing from the spirit and scope of the present invention; when doing a little change and retouching, what therefore scope of patent protection of the present invention must define depending on the appended claim scope of this instructions is as the criterion.
Claims (10)
1. a chip testing machine, comprising:
One test board;
One test module, comprises a test panel and a test base;
This test panel, has a upper surface and with respect to a lower surface of this upper surface;
Technique standing groove, is formed at the upper surface of this test panel;
Technique conductor, runs through in this standing groove, and on the upper surface of this standing groove, forms on one and pad contact, forms a underlay contact on the lower surface of this standing groove;
This test base, has a upper surface and with respect to a lower surface of this upper surface, is disposed at this test panel below;
Technique detection zone, is formed at the upper surface of this test base, and often this detection zone has technique check point, and often this detects contact with respect to every this underlay contact;
One link, is formed at a side of this test base;
One test bench, is disposed on this test board, has a test lead, and this test lead is connected with this link; And
One pick-up unit, is electrically connected with this test bench.
2. a chip testing machine, comprising:
One test board;
Process test module, often this test module comprises a test panel and a test base;
This test panel, has a upper surface and with respect to a lower surface of this upper surface;
Technique standing groove, is formed at the upper surface of this test panel;
Technique conductor, is disposed in this standing groove, and on the upper surface of this standing groove, forms on one and pad contact, forms a underlay contact on the lower surface of this standing groove;
This test base, has a upper surface and with respect to a lower surface of this upper surface, often this test base is disposed at often this test panel below;
Technique detection zone, is formed at the upper surface of this test base, and often this detection zone has technique check point, and often this detects contact with respect to every this underlay contact;
One link, is formed at a side of this test base;
One test bench, is disposed on this test board, has the test lead of technique longitudinal arrangement, and often this test lead is connected with every this link of this test base; And
One pick-up unit, is electrically connected with this test bench.
3. chip testing machine according to claim 1 and 2, wherein the material of this conductor is metal material.
4. chip testing machine according to claim 3, wherein this metal material is gold, copper or nickel.
5. chip testing machine according to claim 1 and 2, wherein between this test panel and this test base, further configure a conductive adhesive layer, and this conductive adhesive layer inside has process metal call wire.
6. chip testing machine according to claim 1 and 2, wherein further comprises at least one correcting part in this standing groove.
7. chip testing machine according to claim 1 and 2, wherein this test base further comprises a control element.
8. chip testing machine according to claim 1 and 2, wherein this pick-up unit is connected in this test bench in the mode of wired connection.
9. chip testing machine according to claim 1 and 2, wherein this pick-up unit is connected in this test bench in the mode of wireless connections.
10. chip testing machine according to claim 1 and 2, wherein this link is golden finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310198205.0A CN104181453A (en) | 2013-05-24 | 2013-05-24 | Chip testing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310198205.0A CN104181453A (en) | 2013-05-24 | 2013-05-24 | Chip testing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104181453A true CN104181453A (en) | 2014-12-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310198205.0A Pending CN104181453A (en) | 2013-05-24 | 2013-05-24 | Chip testing machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN104181453A (en) |
Citations (9)
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| US20070159188A1 (en) * | 2000-08-28 | 2007-07-12 | Cram Daniel P | Method for testing electronic modules using board with test contactors having beam contacts |
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| CN101750577A (en) * | 2008-12-17 | 2010-06-23 | 陈文祺 | Semiconductor test system |
| CN101978485A (en) * | 2008-03-26 | 2011-02-16 | 爱德万测试株式会社 | Probe wafer, probe device, and testing system |
| CN102288892A (en) * | 2010-06-16 | 2011-12-21 | 美国博通公司 | Semiconductor components and wireless automatic testing apparatus for simultaneous testing thereof |
| CN102565573A (en) * | 2010-12-03 | 2012-07-11 | 三星电子株式会社 | Tester and test apparatus including the same |
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2013
- 2013-05-24 CN CN201310198205.0A patent/CN104181453A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070159188A1 (en) * | 2000-08-28 | 2007-07-12 | Cram Daniel P | Method for testing electronic modules using board with test contactors having beam contacts |
| CN1416163A (en) * | 2002-10-24 | 2003-05-07 | 威盛电子股份有限公司 | System, equipment and method for automatic testing IC complete device |
| CN1847859A (en) * | 2005-03-18 | 2006-10-18 | 阿尔卑斯电气株式会社 | Semiconductor carrier tray, and burn-in board, burn-in test method, and semiconductor manufacturing method |
| CN101315405A (en) * | 2007-06-01 | 2008-12-03 | 致茂电子股份有限公司 | Semiconductor component test station with detachable electric property detecting system |
| CN101978485A (en) * | 2008-03-26 | 2011-02-16 | 爱德万测试株式会社 | Probe wafer, probe device, and testing system |
| US20100109688A1 (en) * | 2008-11-04 | 2010-05-06 | Formfactor, Inc. | Printing of redistribution traces on electronic component |
| CN101750577A (en) * | 2008-12-17 | 2010-06-23 | 陈文祺 | Semiconductor test system |
| CN102288892A (en) * | 2010-06-16 | 2011-12-21 | 美国博通公司 | Semiconductor components and wireless automatic testing apparatus for simultaneous testing thereof |
| CN102565573A (en) * | 2010-12-03 | 2012-07-11 | 三星电子株式会社 | Tester and test apparatus including the same |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141203 |
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| WD01 | Invention patent application deemed withdrawn after publication |