CN102288892A - Semiconductor components and wireless automatic testing apparatus for simultaneous testing thereof - Google Patents
Semiconductor components and wireless automatic testing apparatus for simultaneous testing thereof Download PDFInfo
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/3025—Wireless interface with the DUT
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
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Abstract
Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
Description
Technical field
The present invention relates to the test of semiconductor element in the semiconductor crystal wafer, more particularly, wireless test when relating in the semiconductor crystal wafer semiconductor element, and the performance measurement of semiconductor element in the semiconductor crystal wafer optionally.
Background technology
The semiconductor devices preparation manipulation is often used in preparing on the semiconductor substrate element to form semiconductor crystal wafer.The semiconductor devices preparation manipulation uses the program of default photoetching and/or chemical technology step to form element on semiconductor substrate.Yet, the defective in the semiconductor crystal wafer, the defective such as in the design of the defective of the defective of semiconductor substrate, semiconductor devices preparation manipulation or element itself can cause one or more semiconductor elements not according to operating of expecting.
(automatic test equipment ATE) is generally used for verifying the interior semiconductor devices of semiconductor crystal wafer operating by expection to conventional automatic testing equipment.Conventional automatic testing equipment comprises that a complete set of Electronic Testing probe is to implement test operation.This complete set Electronic Testing probe comprises that the Electronic Testing probe arrives each semiconductor element to carry out test operation with loading power, digital test signal and/or analog test signal.This complete set Electronic Testing probe comprises that also electronic probe reads signal with each node place at semiconductor element, to verify each semiconductor element operating by expection in test operating procedure.
The improvement of semiconductor devices technology of preparing has realized complicated more semiconductor element with the preparation of bigger quantity on semiconductor substrate, therefore needs more electronic probe to carry out test operation.Usually, specially appointed position in the direct contact semiconductor element of electronic probe is commonly called test point.These more complicated semiconductor elements need more test point to carry out test operation, and described test point will take the physical region (real estate) that more can distribute elsewhere on semiconductor substrate.The result is that the improvement of semiconductor devices preparation has caused the overall dimensions of conventional automatic testing equipment and the increase of adult.
Summary of the invention
Therefore, need the automatic testing equipment whether semiconductor element in the checking semiconductor crystal wafer that can overcome above-described weak point is operated by expection.According to detailed description hereinafter, others of the present invention and advantage will become apparent.
According to an aspect of of the present present invention, the invention provides a kind of wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously, comprising:
Receiver module is used for receiving a plurality of result of test operation from described a plurality of semiconductor elements, and so that the test result of a plurality of recoveries to be provided, described a plurality of test results point out whether its corresponding semiconductor element is operated by expection; And
Test processor is determined first group of semiconductor element operating by expection based on the test result of described a plurality of recoveries from described a plurality of semiconductor elements.
Preferably, described wireless automatic testing equipment further comprises:
The a plurality of receiving antennas that are connected with receiver module are used for from the described a plurality of result of test operation of a plurality of direction observations of three dimensions.
Preferably, described a plurality of receiving antenna in three dimensions along the radius setting of spherical shell.
Preferably, described a plurality of receiving antenna in three dimensions along the respective radius setting in a plurality of radiuses of the corresponding spherical shell in a plurality of spherical shells.
Preferably, described receiver module further receives described a plurality of result of test operation simultaneously on General Purpose Communication Channel.
Preferably, described receiver module is further decoded so that the test result of described a plurality of recoveries to be provided to described a plurality of result of test operation according to the multiple access transmission plan.
Preferably, described multiple access transmission plan is CDMA (CDMA) scheme.
Preferably, based on the test result of described a plurality of recoveries, described test processor is further determined second group of semiconductor element not operating by expection from described a plurality of semiconductor elements.
Preferably, described wireless automatic testing equipment further comprises:
Metrics measurement module is used for determining a plurality of signal metrics of the test result of described a plurality of recoveries;
Wherein, based on described a plurality of signal metrics, described test processor is further determined the position of described a plurality of semiconductor elements in described semiconductor crystal wafer.
Preferably, described test processor further in order to:
(i) distribute described a plurality of signal metrics to give the respective coordinates in many group coordinates in the three dimensions,
(ii) distribute the unique identifier in a plurality of unique identifier be embedded in described a plurality of test result to give described many group coordinates, in each of described a plurality of unique identifiers and the described a plurality of semiconductor elements is corresponding, and
(iii) described a plurality of unique identifiers are mapped to the semiconductor element of their correspondences, to determine the position of described a plurality of semiconductor elements in described semiconductor crystal wafer.
Preferably, described test processor further compares with described many group coordinates and at the preset signals tolerance of each in described a plurality of semiconductor elements, described a plurality of unique identifiers are mapped to the semiconductor of their correspondences.
Preferably, based on the relation between described a plurality of signal metrics, described test processor is further with the semiconductor element of described a plurality of unique identifier iteration map to their correspondences.
Preferably, described wireless automatic testing equipment further comprises:
Sender module in order to from described test processor acceptance test operation command signal, and carries test operation in order to described test operation command signal is encoded to provide to start;
Wherein, described a plurality of semiconductor element responds described startup and carries test operation and carry test operation with execution.
Preferably, the described startup of the further wireless transmission of described sender module carries test operation and gives described a plurality of semiconductor elements.
According to another aspect of the present invention, the invention provides the semiconductor element that forms on a kind of semiconductor crystal wafer, comprising:
Test module carries test operation in order to storage;
Tested integrated circuit describedly carries the execution of test operation and operability indication is provided in order to respond, and described operability points out whether described tested integrated circuit is operated by expection; And
Transceiver module is encoded to described operability indication in order to foundation multiple access transmission plan.
Preferably, described multiple access transmission plan is CDMA (CDMA) scheme.
Preferably, described transceiver module further receives and starts the test operation signal, and described startup test operation signal makes described test module enter the test pattern of operation, thereby described test module provides the described test operation that carries to described tested integrated circuit.
Preferably, described transceiver module comprises:
Coding module is encoded to described operability indication in order to foundation multiple access transmission plan, thereby the operability indication of coding is provided;
Modulation module is modulated the operability indication of described coding in order to the foundation digital modulation technique, thereby the operability indication of modulation is provided; And
The up-conversion module is carried out up-conversion in order to the operability indication to described modulation, thereby result of test operation is provided.
Preferably, described coding module comprises:
The spreading code maker is unique bit sequence in order to provide for described semiconductor element; And
Spread spectrum module comes described operability indication is encoded in order to adopt described bit sequence.
Preferably, described semiconductor element is in a plurality of semiconductor elements that form on the described semiconductor crystal wafer, and,
Wherein, described transceiver module is encoded to described operability indication according to the multiple access transmission plan, and to send on General Purpose Communication Channel, described General Purpose Communication Channel is shared by described a plurality of semiconductor elements.
Preferably, described test module to be storing unique identifier, and described unique identifier is added to described operability indication.
Preferably, described semiconductor element is included in a plurality of semiconductor elements that form on the described semiconductor crystal wafer, and described unique identifier is in each a plurality of unique identifier in the described a plurality of semiconductor elements of unique identification.
Description of drawings
Hereinafter with reference to accompanying drawing embodiments of the invention are described.In the accompanying drawing, similarly Reference numeral is used to represent identical parts or intimate parts in each width of cloth accompanying drawing.The numbering of that width of cloth accompanying drawing when in addition, the leftmost numeral of Reference numeral is used to identify this Reference numeral and occurs first.In the accompanying drawing:
Fig. 1 has described first block diagram according to the wireless element test environment of the present invention's first example embodiment;
Fig. 2 has described first block diagram according to the semiconductor element of the present invention's first example embodiment;
Fig. 3 has described the block diagram according to the demonstration sender module of the part enforcement of the conduct first demonstration semiconductor element of the present invention's first example embodiment;
Fig. 4 has described the block diagram according to the first wireless automatic testing equipment of first embodiment of the invention;
Fig. 5 A has described the first demonstration location according to the receiving antenna of the wireless automatic testing equipment of first embodiment of the invention;
Fig. 5 B has described the second demonstration location according to the receiving antenna of the wireless automatic testing equipment of first embodiment of the invention;
Fig. 5 C has described the 3rd demonstration location according to the receiving antenna of the wireless automatic testing equipment of first embodiment of the invention;
Fig. 6 has described the block diagram according to the demonstration receiver module of the part enforcement of the wireless automatic testing equipment of conduct of the embodiment of the invention;
Fig. 7 from figure described according to the embodiment of the invention be no less than a semiconductor element first the transmission field mode synoptic diagram;
Fig. 8 has described the block diagram according to the second wireless element test environment of second embodiment of the invention;
Fig. 9 has described the block diagram according to second semiconductor element of first embodiment of the invention;
Figure 10 has described the block diagram according to the demonstration receiver module of the part enforcement of the conduct second demonstration semiconductor element of the embodiment of the invention;
Figure 11 has described the block diagram according to the second wireless automatic testing equipment of the present invention's first example embodiment;
Figure 12 has described the block diagram according to first sender module of the part enforcement of the wireless automatic testing equipment of conduct second demonstration of first embodiment of the invention;
Figure 13 is the process flow diagram according to the demonstration step of the wireless automatic testing equipment of the embodiment of the invention;
Figure 14 has described the block diagram according to the tested integrated circuit of the part enforcement of the conduct first of the embodiment of the invention and/or the second demonstration semiconductor element;
Figure 15 has described the block diagram according to the thermal imaging module of the part enforcement that can be used as the wireless automatic testing equipment of first or second demonstration of the embodiment of the invention;
Figure 16 has described the block diagram according to the washability energy measurement module of the part enforcement that can be used as the wireless automatic testing equipment of first or second demonstration of the embodiment of the invention;
Figure 17 A has described the block diagram that is used in the thermography processor in the second wireless automatic testing equipment according to the embodiment of the invention;
Figure 17 B has described the default semiconductor element Thermogram according to the embodiment of the invention;
Figure 18 is the process flow diagram according to the demonstration step of the second wireless element test environment of the embodiment of the invention.
Embodiment
Now with reference to the accompanying drawings embodiments of the invention are described.In the accompanying drawing, similarly Reference numeral is used to represent identical parts or intimate parts in each width of cloth accompanying drawing.The numbering of that width of cloth accompanying drawing when in addition, the leftmost numeral of Reference numeral is used to identify this Reference numeral and occurs first.
The following detailed description will be described the embodiment consistent with the present invention with reference to the accompanying drawings.The described example embodiment of indication such as " example embodiment " quoted in the detailed description, " example embodiment ", " example embodiment for example " can comprise specific feature, structure or characteristic, but each example embodiment does not have to comprise specific feature, structure or characteristic.In addition, these vocabulary do not require necessary with reference to same example embodiment.In addition, when specific feature, structure or characteristic being described, describe, realize that in conjunction with other example embodiment this feature, structure or characteristic should know for those skilled in the relevant art no matter whether have clearly in conjunction with example embodiment.
Example embodiment described herein only is used as and describes purpose, and does not have restricted.Other example embodiment may be within the spirit and scope of the present invention, and can make improvement to example embodiment within the spirit and scope of the present invention.Therefore, describing in detail is not to be used to limit the present invention.On the contrary, protection scope of the present invention should be only according to claim and be equal to and limit.
Hereinafter the detailed description of example embodiment full disclosure generic features of the present invention, so other staff only need use the technical know-how in the association area and not need excessive experiment to make amendment easily under the condition that does not break away from the present invention spirit and protection domain and/or adapt to various application.Therefore, based on instruction and guide herein, this adaptation and modification will be in the meanings of example embodiment with within a plurality of being equal to.Should be understood that term herein and term are quoted and done the description purpose, rather than limit, make and by the those skilled in the relevant art that receive slight instruction herein term or the term that the present invention stipulates to be made an explanation.
Embodiments of the invention available hardware, software, firmware or its make up to be realized.Embodiments of the invention also can be implemented by the instruction that is stored on the machine readable media, can read or carry out described instruction by one or more processors.Machine readable media can comprise any mechanism that is used for the machine-readable form storage or the information of transmission.For example, machine readable media can comprise ROM (read-only memory) (ROM); Random access storage device (RAM); The deposit storage medium; Optical storage media; Flash memory device; Transmitting signal (for example, carrier wave, infrared signal, digital signal etc.) electricity, light, sound or other form, and other.In addition, can be with firmware, software, program, instruction description for carrying out concrete action.Yet what should know is that this is described only for convenience's sake, and should action in fact be produced by the miscellaneous equipment of computing equipment, processor, controller or execution firmware, software, program, instruction etc.
The first demonstration wireless element test environment
Fig. 1 shows the block diagram of having described according to the wireless element test environment of the present invention's first example embodiment.The semiconductor devices preparation manipulation is often used in preparing on the semiconductor substrate element to form semiconductor crystal wafer.The semiconductor devices preparation manipulation uses the program of default photoetching and/or chemical technology step to form element on semiconductor substrate.Yet, the defective in the semiconductor crystal wafer, the defective such as in the design of the defective of the defective of semiconductor substrate, semiconductor devices preparation manipulation or element itself can cause one or more semiconductor elements not according to operating of expecting.
Wireless one or more measuring semiconductor elements 106 of 104 wireless while of automatic testing equipment one or more are to verify this one or more whether operation by expection of these one or more semiconductor elements 106.Wireless automatic testing equipment 104 provides and starts test operation signal 150 to semiconductor element 106.Start the radiocommunication signals that 150 representatives of test operation signal are wirelessly transmitted to semiconductor element 106.
One or more the observing simultaneously of semiconductor element 106 starts test operation signal 150.Receive the semiconductor element 106 that starts test operation signal 150 and enter the test pattern of operation, these semiconductor elements 106 are carried out and are carried test operation in view of the above.Carry first group of parameter that test operation can adopt startup test operation signal 150 to provide, so that described first group of parameter used in the first group of instruction that is stored in the semiconductor element 106.Perhaps, carrying test operation can carry out and start second group of instruction that test operation signal 150 provides and/or carry out by second group that starts that test operation signal 150 provides and instruct employed second group of parameter.In another embodiment, carry the combination in any that test operation can comprise first group of instruction, second group of instruction, first group of parameter and/or second group of parameter.Wireless automatic testing equipment 104 can provide in carrying test operating procedure and start test operation signal 150, extra parameter to be provided and/or to instruct to semiconductor element 106.
Carry after test operation finishes, semiconductor element 106 wireless transmission result of test operation 152.1 to 152.n (being referred to as result of test operation 152) via General Purpose Communication Channel 154 to wireless automatic testing equipment.The communication channel that General Purpose Communication Channel 154 representatives are adopted simultaneously or shared by semiconductor element 106.Generally speaking, semiconductor element 106 uses multiple access to insert transmission plan and transmit result of test operation 152 on General Purpose Communication Channel 154.Multiple access inserts transmission plan can comprise that the single carrier multiple access inserts transmission plan arbitrarily, such as CDMA (CDMA), frequency division multiple access (FDMA), time division multiple access (TDMA) (TDMA) and/or for various equivalent modifications conspicuous and any other suitable single carrier multiple access that do not break away from the spirit and scope of the present invention insert transmission plan.Perhaps, multiple access inserts transmission plan can comprise that the multicarrier multiple access inserts transmission plan arbitrarily, such as discrete multitone (DMT) modulation, orthogonal frequency division multiplexi (OFDM), COFDM technology (COFDM) and/or conspicuous and do not break away from any other suitable multicarrier multiple access access transmission plan of the spirit and scope of the present invention for various equivalent modifications.In another was selected, multiple access inserts transmission plan can comprise that the single carrier multiple access inserts the combination in any of transmission plan and multicarrier multiple access access transmission plan.
Wireless automatic testing equipment 104 uses one or more receiving antennas that are arranged in the three dimensions to observe these result of test operation 152 during by General Purpose Communication Channel 154 at result of test operation 152.Wireless automatic testing equipment 104 is determined one or more signal metrics of the result of test operation 152 that observes by one or more receiving antennas, such as mean value, gross energy, average power, all side, instantaneous power, root all side, variance, norm, electric pressure and/or for conspicuous other any suitable signal metric of various equivalent modifications.Wireless automatic testing equipment 104 uses one or more signal metrics so that result of test operation 152 is mapped to semiconductor element 106.Wireless automatic testing equipment 104 is based on the result of test operation 152 that observes by one or more receiving antennas, from semiconductor element 106, determine first group of semiconductor element, and optionally determine their positions in semiconductor crystal wafer 102 by the expection operation.Perhaps, wireless automatic testing equipment 104 can be determined second group of semiconductor element not operating by expection based on the result of test operation 152 that observes by one or more receiving antennas from semiconductor element 106.Wireless automatic testing equipment 104 optionally provides second group of semiconductor element position in semiconductor crystal wafer 102.Select among the embodiment at another, wireless automatic testing equipment 104 can be determined the combination in any of first group of semiconductor element and second group of semiconductor element, and their relevant positions in semiconductor crystal wafer 102 optionally are provided.
The first demonstration semiconductor element
Fig. 2 has described the block diagram according to the semiconductor element of the present invention's first example embodiment.Semiconductor element 200 observes the startup test operation signal 150 from wireless automatic testing equipment 104.Semiconductor element 200 is represented one of them example embodiment of semiconductor element 106.Semiconductor element 200 response receives and starts test operation signal 150 and carry out and carry test operation.Carry after test operation finishes, semiconductor element 200 wireless transmissions carry the single result of test operation 250 of test operation.This single result of test operation 250 is represented one example embodiment of result of test operation 152.
Semiconductor element 200 comprises transceiver module 202, tested integrated circuit 204 and test module 206.Transceiver module 202 provides startup test control signal 252 based on starting test operation signal 150, and provides single result of test operation 250 based on operability indication 254.More particularly, transceiver module 202 comprises receiver module 208 and sender module 210.Receiver module 208 down coversions, demodulation and/or decoding start test operation signal 150, start test control signal 252 to provide.Similarly, sender module 210 is according to multiple access transmission plan (as discussed above) coding, modulation and/or up-conversion operability indication 254, so that single result of test operation 250 to be provided.
The demonstration sender module of implementing as the part of the first demonstration semiconductor element
Fig. 3 has described the block diagram according to the demonstration sender module of the part enforcement of the conduct first demonstration semiconductor element of the present invention's first example embodiment.Sender module 300 is according to multiple access transmission plan (as discussed above) coding, modulation and/or up-conversion operability indication 254.Sender module 200 is represented the example embodiment of sender module 210.
Sender module 300 comprises coding module 302, modulation module 308 and upconverter module 310.Coding module 302 is encoded so that the operability indication 350 of coding to be provided to operability indication 254 according to the multiple access transmission plan.In example embodiment, coding module 302 is encoded to operability indication 254 according to CDMA (CDMA) scheme.In this example embodiment, coding module 302 comprises spreading code maker 304 and spread spectrum module 306.Spreading code maker 304 provide unique at random, pseudorandom and/or nonrandom data sequence (being spreading code 352) give spread spectrum module 306.It is unique bit sequence that spreading code 352 is represented for each of semiconductor element 106 or semiconductor element group, so that operability indication 254 is encoded.Spread spectrum module 306 adopts 352 pairs of operability indications 254 of spreading code to encode, so that the operability indication 350 of spread spectrum to be provided.
Frequency inverted or up-conversion are carried out in the operability indication 354 of 310 pairs of modulation of upconverter module, so that single result of test operation 250 to be provided.More particularly, upconverter module 310 can be used the single carrier frequency and/or in multicarrier single result of test operation 250 be carried out up-conversion, transmits to implement multiple access, thereby single result of test operation 250 is provided.In example embodiment, upconverter module 310 is optional.In this embodiment, modulation module 308 directly provides the operability indication 354 of modulation as single result of test operation 250.
Refer again to Fig. 2, test module 206 response starts test control signals 252 and provides and carry test operation 256.Carry first group of parameter that test operation 256 can adopt startup test operation signal 150 to provide, so that described first group of parameter used in first group of instruction of test module 206 stored.Perhaps, carrying test operation can carry out and start second group of instruction that test operation signal 150 provides and/or carry out by second group that starts that test operation signal 150 provides and instruct employed second group of parameter.In another embodiment, carry the combination in any that test operation 256 can comprise first group of instruction, second group of instruction, first group of parameter and/or second group of parameter.
Starting test control signal 252 makes test module 206 enter the test pattern of operation.In the test pattern of operation, test module 206 can load first group of instruction and/or the first group of parameter that carries test operation 256 from one or more memory devices.Test module 206 can individually or as cohort offer tested integrated circuit 204 with first group of instruction and/or first group of parameter as test routine.Perhaps, test module 206 is collected second group of instruction and/or the second group of parameter that carries test operation 256 from carrying test operation 252.Test module 206 can individually or as cohort offer tested integrated circuit 204 with second group of instruction and/or second group of parameter as test routine.Perhaps, test module 206 can offer tested integrated circuit 204 as test routine 256 with the combination in any of first and second groups of instructions and/or first and second groups of parameters.
Tested integrated circuit 204 is carried out and is carried test operation 256 to determine whether tested integrated circuit 204 is operated according to expection.Tested integrated circuit 204 is in carrying the implementation of test operation and/or provide operability indication 258 to test module 206 afterwards.Operability indication 258 is pointed out by tested integrated circuit 204 operating by expection whether, whether perhaps tested integrated circuit 204 is not operated by expection, and the one or more positions in the tested integrated circuit of optionally pointing out not to operate by expection 204.
Provide operability indication 254 to transceiver module 202 before, but test module 206 additional analysis can be operated indication 258, unique identifier by additional semiconductor element 200 formats operability indication 258 to operability indication 258, or for example according to known communication standard format operability indication 258, and/or use the Error Correction of Coding that is fit to come operability indication 258 is encoded, wherein said Error Correction of Coding is such as block code, convolutional code and/or for various equivalent modifications conspicuous any other suitable Error Correction of Coding scheme.In example embodiment, test module 206 comprises that random number generator is to generate unique identifier.Yet this example embodiment is nonrestrictive, and those skilled in the relevant art will recognize, can use other method to generate unique identifier under the condition that does not break away from the spirit and scope of the present invention.For example, can generate unique identifier by wireless automatic testing equipment 104, and use direct current (DC) probe will this unique identifier to offer semiconductor element 200 being stored in the memory devices, described memory devices such as the non-volatility memorizer that is fit to arbitrarily, arbitrarily suitable volatile storage or for various equivalent modifications the combination in any of conspicuous non-volatile and volatile storage.
In example embodiment, when operability indication 258 pointed out that tested integrated circuit 204 is operated by expection, 206 of test modules provided operability indication 254 to transceiver module 202.In this case, when tested integrated circuit 204 was not operated by expection, transceiver module 202 did not provide single result of test operation 250.Perhaps, when operability indication 258 pointed out that tested integrated circuit 204 is not operated by expection, 206 of test modules provided operability indication 254 to transceiver module 202.In this case, when tested integrated circuit 204 was operated by expection, transceiver module 202 did not provide single result of test operation 250.
The wireless automatic testing equipment of first demonstration
Fig. 4 has described the block diagram according to the first wireless automatic testing equipment of first embodiment of the invention.Semiconductor element 106 sends result of test operation 152 to wireless automatic testing equipment 400 by General Purpose Communication Channel 154.Wireless automatic testing equipment 400 comprises that one or more receiving antennas are with the one or more direction observation result of test operation 152 from three dimensions.Wireless automatic testing equipment 400 can determine whether the one or more of semiconductor element 106 operate by expection, and optionally use three-dimensional character to determine one or more position of the semiconductor element 106 in the semiconductor crystal wafer 102, wherein said three-dimensional character is such as each antenna in a plurality of receiving antennas and/or the distance between the semiconductor element 106.The example embodiment of the wireless automatic testing equipment 104 of wireless automatic testing equipment 400 representatives.
Wireless automatic testing equipment 400 comprises receiving antenna 402.1 to 402.i, receiver module 404, metrics measurement module 406, test processor 408, operator interface module 410, sender module 412 and transmitting antenna 414.Receiving antenna 402.1 to 402.i (being collectively referred to as receiving antenna 402) is arranged on position corresponding in the three dimensions.In example embodiment, receiving antenna 402 comprises two receiving antennas, i.e. first receiving antenna 402.1 and second receiving antenna 402.2.In this example embodiment, with first receiving antenna 402.1 and second receiving antenna 402.2 be separately positioned on from the center of semiconductor crystal wafer 102 apart from d
1And d
2The place is apart from d
1And d
2Can be similar or different.In this embodiment, the angle of separating between first receiving antenna 402.1 and second receiving antenna 402.2 is θ, and θ is such as being 90 degree.
The first demonstration location of the receiving antenna of wireless automatic testing equipment
Fig. 5 A has described the first demonstration location according to the receiving antenna of the wireless automatic testing equipment of first embodiment of the invention.As shown in Fig. 5 A, receiving antenna 402 near in the three dimensions of semiconductor crystal wafer 102 along the radius r setting of spherical shell 502.In example embodiment, receiving antenna 402 can form the polygonal angle that is positioned at the plane of intersecting with spherical shell 102.This polygon can be characterized by the limit with similar or different length.Yet this is nonrestrictive for example, and those skilled in the relevant art will recognize, only otherwise break away from the spirit and scope of the present invention, can with receiving antenna 402 along and spherical shell 502 one or more planes of intersecting in the radius r setting that is fit to arbitrarily.
The second demonstration location of the receiving antenna of wireless automatic testing equipment
Fig. 5 B has described the second demonstration location according to the receiving antenna of the wireless automatic testing equipment of first embodiment of the invention.Receiving antenna 402 arrives the radius r of 504.i along corresponding spherical shell 504.1 in the close three dimensions of semiconductor crystal wafer 102
1To r
iBe provided with.For example, receiving antenna 402.1 radius along spherical shell 504.1 in three dimensions is r
1Be provided with.Similarly, receiving antenna 402.i radius along i spherical shell 504.i in three dimensions is r
nBe provided with.Have bigger down target radius can greater than, be less than or equal to and have littler target radius down.For example, radius r
nCan greater than, be less than or equal to r
1
Although Fig. 5 A and Fig. 5 B have described the location of receiving antenna 402 with reference to spherical shell, those skilled in the relevant art will recognize, only otherwise break away from the spirit and scope of the present invention, can use arbitrarily other regular geometric structure, irregular geometry, open architecture, closing structure or above-described combination in any in three dimensions, receiving antenna 402 to be positioned.
The 3rd demonstration location of the receiving antenna of wireless automatic testing equipment
Fig. 5 C has described the 3rd demonstration location according to the receiving antenna of the wireless automatic testing equipment of first embodiment of the invention.Each receiving antenna 402 can be provided with near the optional position along geometry 506 in the three dimensions of semiconductor crystal wafer 102.Geometry 506 can be represented irregular geometry, and as shown in the figure, or representative is for the conspicuous regular geometric arbitrarily of various equivalent modifications structure.In addition, geometry 506 can be represented closing structure, and as shown in the figure, or representative is for the conspicuous open architecture arbitrarily of various equivalent modifications.
Refer again to Fig. 4, receiving antenna 402 observation result of test operation 452.1 to 452.i (being collectively referred to as result of test operation 452 herein) are to provide one or more result of test operation that observe 454.1 to 454.i (being referred to as the result of test operation 454 that observes herein).Result of test operation 452 representative is positioned at the result of test operation 152 that the receiving antenna 402 of corresponding position in the three dimensions is observed when result of test operation 152 is propagated by General Purpose Communication Channel 154.For example, 454.1 representatives of the result of test operation that observes are positioned at the result of test operation 152 that the receiving antenna 402.1 at primary importance place in the three dimensions is observed when result of test operation 152 is propagated by General Purpose Communication Channel 154.Similarly, 454.2 representatives of the result of test operation that observes are positioned at the result of test operation 152 that the receiving antenna 402.2 at second place place in the three dimensions is observed when result of test operation 152 is propagated by General Purpose Communication Channel 154.
The result of test operation 454 that receiver module 404 down coversions, demodulation and/or decoding observe, with at providing the test result 456 of corresponding recovery, add up to n*i=k the test result of recovering 456 in each n the result of test operation 152 in i the result of test operation 454 each.In other words, each result of test operation 454 of being observed by each receiving antenna 402 of receiver module 404 down coversions, demodulation and/or decoding.In example embodiment, the result of test operation 152.1 that result of test operation 456.1 representatives are observed by receiving antenna 402.1, the result of test operation 152.2 that result of test operation 456.2 representatives are observed by receiving antenna 402.1.In this example embodiment, the result of test operation 152.n that result of test operation 456.k representative is observed by receiving antenna 402.i.
The demonstration receiver module of implementing as the part of wireless automatic testing equipment
Fig. 6 has described the block diagram according to the demonstration receiver module of the part enforcement of the wireless automatic testing equipment of conduct of the embodiment of the invention.The test result 456 of result of test operation 454 that receiver module 600 observes according to multicarrier multiple access transmission plan down coversion, demodulation and/or decoding so that recovery to be provided.Receiver module is represented the example embodiment of receiver module 404.
At the modulation technique that is fit to arbitrarily, the analog or digital demodulation techniques that demodulation module 604 uses are fit to are arbitrarily carried out demodulation to the result of test operation 652 of down coversion, wherein suitable arbitrarily modulation technique such as amplitude modulation(PAM) (AM), frequency modulation (PFM) (FM), phase modulation (PM) (PM), phase shift modulated (PSK), frequency shift keying (FSK), amplitude shift keying (ASK), quadrature amplitude modulation and/or for various equivalent modifications conspicuous any other suitable modulation technique, with the result of test operation 654.1 to 654.i (being referred to as the result of test operation 654 of demodulation herein) that demodulation is provided.
Refer again to Fig. 4, metrics measurement module 406 is determined one or more signal metrics of the test result 456 of recovery, with the signal metric 458.1 to 458.k (being referred to as the signal metric 458 of measurement herein) that measurement is provided.These one or more signal metrics can comprise mean value, gross energy, average power, all side, instantaneous power, root all side, variance, norm, electric pressure and/or conspicuous and do not break away from other signal metric that is fit to arbitrarily of test result 456 of the recovery of the spirit and scope of the present invention for various equivalent modifications.
In example embodiment, test processor 408 can provide test operation command signal 464 to sender module 412, start test operation signal 466 thereby make sender module 412 provide, thereby make those semiconductor elements 106 of operating by expection enter transmit status, and those semiconductor elements 106 of not operating by expection enter non-transmit status.Perhaps, test processor 408 can provide test operation command signal 464 to sender module 412, start test operation signal 466 thereby make sender module 412 provide, thereby make the semiconductor element of not operating 106 enter transmit status, and enter non-transmit status by those semiconductor elements 106 of expection operation by expection.In these embodiments, have only those semiconductor elements that are in transmit status 106 that separately result of test operation 152 is provided.
The first demonstration mapping of result of test operation
Fig. 7 from figure described according to the embodiment of the invention be no less than a semiconductor element first the transmission field mode synoptic diagram.As discussed above, semiconductor element 106 is sent to result of test operation 152 wireless automatic testing equipment 400 on General Purpose Communication Channel 154.
First semiconductor element 702.1 uses first antenna such as dipole antenna to send first result of test operation 752.1 on General Purpose Communication Channel 154 according to the multiple access scheme.Yet, this is nonrestrictive for example, and those skilled in the relevant art will recognize that antenna such as random line antenna, electromagnetic horn, cubical antenna, the paster antenna of other type maybe can convert electromagnetic wave to any other suitable antenna of electric current or the combination of various antennas can be adopted by first semiconductor element 702.1.First result of test operation 752.1 is transmitted to first receiving antenna 402.1 and second receiving antenna 402.2 by General Purpose Communication Channel 154, shown in first field mode 704.1.Under the condition that does not break away from the spirit and scope of the present invention, those skilled in the relevant art will recognize and can adopt more receiving antenna 402, as Fig. 5 A to shown in the 5C.
Similarly, second semiconductor element 702.2 uses second antenna to send second result of test operation 752.2 on General Purpose Communication Channel 154 according to the multiple access scheme.Second result of test operation 752.2 is transmitted to first receiving antenna 402.1 and second receiving antenna 402.2 by General Purpose Communication Channel 154, shown in second field mode 704.2.
First semiconductor element 702.1 and second semiconductor element 702.2 are represented any two example embodiment of semiconductor element 106.Similarly, first result of test operation 752.1 and second result of test operation 752.2 are represented any two example embodiment of result of test operation 152.
First receiving antenna 402.1 is apart from d at distance semiconductor crystal wafer 102 in the three dimensions
1Second receiving antenna 402.2 is apart from d at distance semiconductor crystal wafer 102 in the setting at place and the three dimensions
2The place be arranged so that wireless automatic testing equipment 400 can determine that first result of test operation 752.1 is provided by first semiconductor element 702.1 and second result of test operation 752.2 by second semiconductor element 702.2.More particularly, one or more signal metrics of first result of test operation 752.1 and second result of test operation 752.2 depart from when they propagate by General Purpose Communication Channel 154.For example, first result of test operation 752.1 and second result of test operation 752.2 that are observed by first receiving antenna will come down to similarly because first semiconductor element 702.1 and second semiconductor element 702.2 respectively with first receiving antenna 402.1 between distance come down to equate.The result is, it is similar that one or more signal metrics of first result of test operation 752.1 and one or more signal metrics of second result of test operation 752.2 will come down to, make wireless automatic testing equipment 400 determine first semiconductor elements 702.1 and second semiconductor element 702.2 respectively with first receiving antenna 402.1 between distance equate.
Yet, first result of test operation 752.1 that is observed by second receiving antenna 402.2 and second result of test operation 752.2 will come down to dissimilar because first semiconductor element 702.1 and second semiconductor element 702.2 respectively and the distance between second receiving antenna 402.2 be unequal.For example, first result of test operation 752.1 along radius r
1One or more signal metrics less than second result of test operation 752.2 along radius r
2One or more signal metrics.The result is, one or more signal metrics of the one or more signal metrics of first result of test operation 752.1 and second result of test operation 752.2 are inequality, make wireless automatic testing equipment 400 determine first semiconductor elements 702.1 and second semiconductor element 702.2 respectively and the distance between second receiving antenna 402.2 be unequal.On the contrary, compare with second semiconductor element 702.2, the distance between first semiconductor element 702.1 and second receiving antenna 402.2 is farther.
Refer again to Fig. 4, test processor 408 is distributed to the respective coordinates in the i group coordinate in the three dimensions with the test result of recovering 456, to determine the position of semiconductor element 106 in the semiconductor crystal wafer 102.For example, in the embodiment of the wireless automatic testing equipment 400 with first receiving antenna 402.1 and second receiving antenna 402.2, first receiving antenna 402.1 and second receiving antenna 402.2 correspondingly observe result of test operation 452.1 and result of test operation 452.2.This for example in, test processor 408 is specified each first coordinate as i group coordinate in the three dimensions corresponding to the signal metric 458.1 of the measurement of first receiving antenna 402.1 and 458.i.Similarly, test processor 408 is specified corresponding to the signal metric 458. (i+1) of the measurement of second receiving antenna 402.2 and 458.k organizes coordinate as i in the three dimensions second coordinate of each.
Test processor 408 is mapped to unique identifier on the semiconductor element 106 of their correspondences, to determine the position of the semiconductor element 106 in the semiconductor crystal wafer 102.Test processor 408 can be determined the position of semiconductor crystal wafer 102 interior semiconductor elements 106 by the signal metric 458 of the measurement of corresponding each the unique identifier preset signals tolerance with each semiconductor element 106 is compared.The desired value of the signal metric 458 that the representative of preset signals tolerance is measured.For example, before test operation, pre-determine the one or more preset signals tolerance of each semiconductor element 106 or the scope of signal metric.Test processor 408 can be with comparing at the i group coordinate of unique identifier and one or more preset signals tolerance of each semiconductor element 106, effectively unique identifier is mapped on the semiconductor element 106.Perhaps, test processor 408 can be based on the relation between the measuring-signal of the unique identifier correspondence tolerance 458, and iterated interpolation is carried out in the position of unique identifier of the semiconductor element 106 in the relative semiconductor crystal wafer 102.For example, if distribute to first coordinate in first group of coordinate of first unique identifier greater than first coordinate in second group of coordinate distributing to second unique identifier, compare with the semiconductor element 106 that second unique identifier is provided, the semiconductor element 106 that first unique identifier is provided is more near first receiving antenna 402.1.Give an example as another, if first coordinate in first group of coordinate is less than first coordinate in the 3rd group of coordinate distributing to the 3rd unique identifier, then compare, provide semiconductor element 106 distances first receiving antenna 402.1 of first unique identifier farther with the semiconductor element 106 that the 3rd unique identifier is provided.
The second demonstration wireless element test environment
As the alternative of semiconductor discussed above mapping, in the preparation, test or in the process implemented, in one or more semiconductor elements each is marked with unique identifier.This unique identifier representative is unique Bit String in these one or more semiconductor elements each.
Fig. 8 has described the block diagram according to the second wireless element test environment of second embodiment of the invention.Wireless test environment 800 allows to test simultaneously by 802 pairs of semiconductor elements 106 of wireless automatic testing equipment.Whether wireless automatic testing equipment 802 is one or more in the wireless test semiconductor element 106 simultaneously, operate by expection to verify these one or more semiconductor elements 106.
Wireless automatic testing equipment 802 sends and starts test operation signal 850.1 to 850.n (be referred to as and start test operation signal 850) herein to semiconductor element 106.Start the one or more radiocommunication signals of test operation signal 850 representatives, use General Purpose Communication Channel 154 to be wirelessly sent to semiconductor element 106 by the one or more transmitting antennas of discussing in Fig. 5 C as Fig. 5 A that are positioned in the three dimensions.Wireless automatic testing equipment 802 serializables provide and start test operation signal 850, perhaps, use the multiple access transmission plan to provide simultaneously and start test operation signal 850.In example embodiment, wireless automatic testing equipment 802 can use different spreading codes that each that starts test operation signal 850 encoded according to CDMA (CDMA) scheme.For example, wireless automatic testing equipment 802 can use first spreading code and second spreading code correspondingly to start test operation signal 850.1 to first and the second startup test operation signal 850.2 is encoded, and on General Purpose Communication Channel 854 the first startup test operation signal 850.1 and the second startup test operation signal 850.2 is offered semiconductor element 106 simultaneously.
When starting test operation signal 850 by General Purpose Communication Channel 854, one or more the observing in the semiconductor element 106 starts test operation signal 850.These semiconductor elements 106 determine to start one or more signal metrics of test operation signals 850, such as mean value, gross energy, average power, all side, instantaneous power, root all side, variance, norm, electric pressure and/or for conspicuous other any suitable signal metric of various equivalent modifications.Semiconductor element 106 adopts these one or more signal metrics to generate unique identifier or mark, and it can be by wireless automatic testing equipment 802 in order to determine the position of semiconductor element 106 in the semiconductor crystal wafer 102.Semiconductor element 106 can store unique identifier of their correspondences in one or more memory devices, described memory devices such as the non-volatility memorizer that is fit to arbitrarily, the volatile storage that is fit to arbitrarily or conspicuous and do not break away from the combination in any of the non-volatile and volatile storage of the spirit and scope of the present invention for various equivalent modifications.
Receive the semiconductor element 106 that starts test operation signal 850 and enter the test pattern of operation, thereby these semiconductor elements 106 are carried out the test operation that carries as discussed above.Carry after test operation finishes, semiconductor element 106 is given wireless automatic testing equipment 802 via General Purpose Communication Channel 854 wireless transmission result of test operation 852.Generally speaking, semiconductor element 106 uses multiple access transmission plan as discussed above to transmit result of test operation 852 on General Purpose Communication Channel 154.Result of test operation 852 comprises the unique identifier at each semiconductor element 106, so that wireless test device 802 is determined the position of semiconductor element 106 in the semiconductor crystal wafer 102.
When result of test operation 852 passed through General Purpose Communication Channel, wireless automatic testing equipment 802 used the receiving antenna that is positioned in the three dimensions to observe result of test operation 852.Based on the result of test operation 852 that observes by receiving antenna, wireless automatic testing equipment 802 is determined first group of semiconductor element operating by expection from semiconductor element 106, and optionally determines their positions in semiconductor crystal wafer 102.Perhaps, based on the result of test operation 852 that observes by receiving antenna, wireless automatic testing equipment 802 can be determined second group of semiconductor element not operating by expection from semiconductor element 106.Wireless automatic testing equipment 802 optionally provides the position of second group of semiconductor element in the semiconductor crystal wafer 102.In another embodiment, wireless automatic testing equipment 104 can be determined the combination in any of first group of semiconductor element and second group of semiconductor element, and their correspondence positions in semiconductor crystal wafer 102 optionally are provided.
The second demonstration semiconductor element
Fig. 9 has described the block diagram according to second semiconductor element of first embodiment of the invention.Semiconductor element 900 observations are from the startup test operation signal 850 of wireless automatic testing equipment 802.Semiconductor element 900 is represented one example embodiment of semiconductor element 106.One or more signal metrics that semiconductor element 900 is determined to start test operation signal 850 are to generate unique identifying number or mark, and it is by the position of wireless automatic testing equipment 802 in order to semiconductor elements 106 in definite semiconductor crystal wafer 102.Response has received startup test operation signal 850, and semiconductor element 900 is carried out and carried test operation.Carry after test operation finishes, semiconductor element 900 wireless transmissions carry the single result of test operation 950 of test operation.Single result of test operation is represented one example embodiment of result of test operation 852.
The demonstration receiver module of implementing as the part of the second demonstration semiconductor element
Figure 10 has described the block diagram according to the demonstration receiver module of the part enforcement of the conduct second demonstration semiconductor element of the embodiment of the invention.Receiver module 1000 starts test operation signal 850 according to multiple access transmission plan down coversion, demodulation and/or decoding, starts test control signal 952 to provide.Receiver module 1000 is represented the example embodiment of receiver module 908.
At the modulation technique that is fit to arbitrarily, the analog or digital demodulation techniques that demodulation module 1004 uses are fit to are arbitrarily carried out demodulation to the result of test operation 1052 of down coversion, wherein suitable arbitrarily modulation technique such as amplitude modulation(PAM) (AM), frequency modulation (PFM) (FM), phase modulation (PM) (PM), phase shift modulated (PSK), frequency shift keying (FSK), amplitude shift keying (ASK), quadrature amplitude modulation and/or for various equivalent modifications conspicuous any other suitable modulation technique, with the result of test operation 1054.1 to 1054.i (being referred to as the result of test operation 1054 of demodulation herein) that demodulation is provided.
Refer again to Fig. 9, as discussed above, sender module 210 is according to multiple access transmission plan coding, modulation and/or up-conversion operability indication 254, so that single result of test operation 950 to be provided.
Test module 906 is according to operating with the similar in fact mode of test module 216; Therefore difference between test module 216 and the test module 906 only is discussed in further going through.Test module 906 adopts the signal metric of measuring 954 to generate the unique identifier or the mark of corresponding semiconductor element 900.Particularly, the signal metric 954 of the measurement of each of the semiconductor element 900 in the semiconductor crystal wafer 106 can be different and different with distance between one or more transmitting antennas that startup test operation signal 850 is provided because of each semiconductor element 900.But the signal metric 954 of test module 906 measures of quantizations is to generate unique identifier.For example, have among the embodiment of first transmitting antenna and second transmitting antenna at wireless automatic testing equipment 802, test module 906 can be quantified as the signal metric of measuring 954.1 r bit of the unique identifier of s bit, and t bit of the unique identifier of s bit will be provided corresponding to the signal metric 954.2 of the measurement of the startup test operation signal 850.2 that is provided by second transmitting antenna.Test module 906 can use look-up table, analog to digital converter (ADC) or for various equivalent modifications conspicuous and any other suitable mode that do not break away from spirit and scope of the invention come the signal metric of measuring 954 is quantized.Test module 906 can store unique identifier in one or more memory devices into, described memory devices such as the non-volatility memorizer that is fit to arbitrarily, the volatile storage that is fit to arbitrarily or the combination in any of conspicuous non-volatile and volatile storage for various equivalent modifications.
Provide operability indication 254 to transceiver module 902 before, test module 906 can additionally add to operability indication 258 as header unique identifier of storing in one or more memory devices or add operability to and indicate in 258.
In example embodiment, when operability indication 258 pointed out that tested integrated circuit 204 is operated by expection, 906 of test modules provided operability indication 254 to transceiver module 202.In this case, when tested integrated circuit 204 was not operated by expection, transceiver module 202 did not provide single result of test operation 950.Perhaps, when operability indication 258 pointed out that tested integrated circuit 204 is not operated by expection, 906 of test modules provided operability indication 254 to transceiver module 202.In this case, when tested integrated circuit 204 was operated by expection, transceiver module 202 did not provide single result of test operation 950.
The wireless automatic testing equipment of second demonstration
Figure 11 has described the block diagram according to the second wireless automatic testing equipment of the present invention's first example embodiment.Wireless automatic testing equipment 1100 comprises that one or more transmitting antennas start test operation signal 850 to semiconductor element 106 to provide via General Purpose Communication Channel 154 by the one or more directions in the three dimensions.Wireless automatic testing equipment 1100 comprises that receiving antenna is with observation result of test operation 852 in three dimensions.Wireless automatic testing equipment 1100 can be determined one or more whether the operation by expection in the semiconductor element 106, and optionally uses the unique identifier that is embedded in the result of test operation 852 to determine this position of one or more semiconductor elements 106 in semiconductor crystal wafer 102.The example embodiment of the wireless automatic testing equipment 104 of wireless automatic testing equipment 1100 representatives.
Wireless automatic testing equipment 1100 comprises operator interface module 410, receiving antenna 1102, receiver module 1104, test processor 1106, sender module 1108 and transmitting antenna 1110.1 to 1110.i.Observation result of test operation 852 when receiving antenna 1102 passes through General Purpose Communication Channel 154 at result of test operation 852 is to provide the result of test operation 1152 that observes.Perhaps, wireless automatic testing equipment 1100 can comprise a plurality of receiving antennas 1102.1 to 1102.i, described a plurality of receiving antenna 1102.1 to 1102.i is similar with receiving antenna discussed above 402 in fact, in order to position corresponding in three dimensions observation result of test operation 852 when result of test operation 852 passes through General Purpose Communication Channel 154, thereby provide the result of test operation 1152.1 to 1152.i that observes.
Based on the test result of recovering 1154, test processor 1106 can be determined first group of semiconductor element operating by expection from semiconductor element 106.Perhaps, based on the test result of recovering 1154, test processor 1106 can be determined second group of semiconductor element not operating by expection from semiconductor element 106.In another was selected, test processor 1106 can be determined the first group of semiconductor element of semiconductor element and the combination in any of second group of semiconductor element.
In example embodiment, test processor 1106 can provide test operation command signal 1156 to sender module 1108, make sender module 1108 provide and start test operation signal 850, thereby make those semiconductor elements 106 of operating by expection enter transmit status, and those do not enter non-transmit status by the semiconductor element 106 that expection is operated.Perhaps, test processor 1106 can provide test operation command signal 1156 to sender module 1108, make sender module 1108 provide and start test operation signal 850, thereby make those not enter transmit status, and those semiconductor elements 106 of operating by expection enter non-transmit status by the semiconductor element 106 that expection is operated.In these example embodiment, have only those semiconductor elements that are in transmit status 106 that their result of test operation 852 separately are provided.
Based on the unique identifier that is embedded in each semiconductor element 106 in the result of test operation 852, test processor 1106 is optionally determined this semiconductor element 106 position in semiconductor crystal wafer 102.Test processor 1106 can be determined half each conductor element 106, those are in each the position in semiconductor element 106, those semiconductor elements that are in non-transmit status 106 and/or their combination in any of transmit status.Compare test processor 1106 figure that go out to indicate the position of semiconductor element 106 in the semiconductor crystal wafer 102 capable of being combined by default mapping with their relevant position in unique identifier and unique identifier and the semiconductor crystal wafer 102.Perhaps, based on the relation between unique identifier of each semiconductor element 106, test processor 1106 can carry out iterated interpolation to the position of the semiconductor element 106 in the semiconductor crystal wafer 102.For example, the unique identifier that is embedded in the result of test operation 852 can comprise first unique identifier and second unique identifier.In this was given an example, test processor 1106 can compare a r bit of first unique identifier and a r bit of second unique identifier.If a r bit of first unique identifier is greater than a r bit of second unique identifier, when then comparing with the semiconductor element 106 of corresponding second unique identifier, the semiconductor element of corresponding first unique identifier is more near receiving antenna 1102.Give an example as another, if a r bit of first unique identifier is less than a r bit of second unique identifier, when then comparing with the semiconductor element 106 of corresponding second unique identifier, the semiconductor element of corresponding first unique identifier is farther apart from receiving antenna 1102.
The demonstration sender module of implementing as the part of the wireless automatic testing equipment of second demonstration
Figure 12 has described the block diagram according to first sender module of the part enforcement of the wireless automatic testing equipment of conduct second demonstration of first embodiment of the invention.According to multiple access transmission plan as discussed above, sender module 1200 codings, modulation and/or the indication 254 of up-conversion operability are to provide single result of test operation 250.Sender module 1200 is represented the example embodiment of sender module 210.
The test operation 1256.1 to 1256.i that carries of 1210 pairs of modulation of upconverter module carries out frequency inverted or up-conversion, starts test operation signal 1158.1 to 1158.i to provide.More particularly, upconverter module 1210 can be used the single carrier frequency and/or in multicarrier the test operation of modulating 1256.1 to 1256.i that carries be carried out up-conversion, to implement the multiple access transmission, starts test operation signal 1158.1 to 1158.i thereby provide.In example embodiment, upconverter module 1210 is optional.In this embodiment, modulation module 1208 directly provides the test operation 1256.1 to 1256.i that carries of modulation to arrive 1158.i as starting test operation signal 1158.1.
Refer again to Figure 11, transmitting antenna 1110 will start test operation signal 1158.1 to 1158.i and offer semiconductor element 106 as starting test operation signal 850.1 to 850.i.In example embodiment, sender module 1108 wireless transmissions start all semiconductor elements 106 that test operation signal 850.1 to 850.i is given in the semiconductor crystal wafer 102.Yet this is that branch is restrictive for example, and those skilled in the relevant art will recognize, only otherwise break away from the spirit and scope of the present invention, can send and starts test operation signal 850.1 to the 850.i semiconductor elements 106 to the lesser amt in the semiconductor crystal wafer 102.Can be according to transmitting antenna 1110 being positioned in the three dimensions with the similar in fact mode of receiving antenna 402.In another embodiment, transmitting antenna 1110 comprises two transmitting antennas, i.e. first transmitting antenna 1110.1 and second transmitting antenna 1110.2.In this example embodiment, with first transmitting antenna 1110.1 and second transmitting antenna 1110.2 be separately positioned on apart from the center of semiconductor crystal wafer 102 apart from d
1And d
2The place is apart from d
1And d
2Can be similar or different.In this embodiment, the angle of separating between first transmitting antenna 1110.1 and second transmitting antenna 1110.2 is θ, and θ is such as being 90 degree.
The special characteristic, structure or the characteristic that should be noted in the discussion above that wireless automatic testing equipment 400 and/or wireless automatic testing equipment 1100 are nonrestrictive for these wireless automatic testing equipments of being discussed among Fig. 4 and Figure 11.On the contrary, the special characteristic of wireless automatic testing equipment 400, structure or characteristic can combine with special characteristic, structure or the characteristic of wireless automatic testing equipment 1100, so that the extra example embodiment of wireless automatic testing equipment to be provided.For example, discuss as Figure 11, another example embodiment of wireless automatic testing equipment can comprise receiving antenna 402.Similarly, special characteristic, structure or the characteristic of semiconductor element 200 and/or semiconductor element 900 are nonrestrictive for the embodiment of these semiconductor elements of being discussed among Fig. 2 and Fig. 9.On the contrary, can be in conjunction with special characteristic, structure or the characteristic of semiconductor element 200 and/or semiconductor element 900 so that the extra example embodiment of semiconductor element to be provided.
Verify that semiconductor element is operated by expection and optionally determine semiconductor in the semiconductor crystal wafer
The method of the position of element
Figure 13 is the process flow diagram 1300 according to the demonstration step of the wireless automatic testing equipment of the embodiment of the invention.The present invention is not limited to this operation and describes.On the contrary, other control flow according to this instruction is conspicuous within the spirit and scope of the present invention for those skilled in the relevant art.Below discuss and described the step among Figure 13.
Step 1302 place, the one or more semiconductor elements (such as the one or more semiconductor elements in the semiconductor element 106) in the activating semiconductor wafer (such as semiconductor crystal wafer 102).One or more semiconductor elements can be represented some or all of the semiconductor element that forms on the semiconductor crystal wafer.Can be by energy activated one or more semiconductor elements from wireless automatic testing equipment wireless receiving, wherein said wireless automatic testing equipment can be such as wireless automatic testing equipment 104 or wireless automatic testing equipment 802, U.S. Patent application No.12/877 as application on September 8th, 2010,955 is disclosed, described U.S. Patent application No.12/877,955 to require the applying date be the U.S. Provisional Patent Application No.61/298 on January 27th, 2010,751 right of priority, above-mentioned two patented claims all by reference integral body be incorporated among the application.Perhaps, one or more semiconductor elements can be from the test semiconductor wafer probe received energy of simplifying.The test semiconductor wafer probe of simplifying does not have conventional wafer sort probe complicated, i.e. the pop one's head in Electronic Testing that do not comprise a complete set of the test semiconductor wafer of this simplifications is popped one's head in and verified that semiconductor element operates by expection.In example embodiment, the test semiconductor wafer of simplification probe only comprises that enough probes provide energy to one or more semiconductor elements.
The first startup test operation signal and/or second starts the test operation signal and can comprise by being stored in first group of parameter using from first group in one or more semiconductor elements of step 1302 instruction, carries test operation with execution.Perhaps, first starts test operation signal and/or second starts the test operation signal and can comprise second group of instruction and/or second group of parameter will being used by second group of instruction, and this second group instruction used by the one or more semiconductor elements from step 1302 and carried test operation with execution.In another was selected, first starts test operation signal and/or second started the combination in any that the test operation signal can comprise first group of parameter, second group of parameter and/or second group of instruction.
Based on the result of test operation that observes from step 1310, can be from from first group of semiconductor element determining one or more semiconductor elements of step 1302 to operate from the wireless automatic testing equipment of step 1302 by expection.Whether the result of test operation that observes from step 1310 at each the unique identifier assessment from step 1304 from the wireless automatic testing equipment of step 1302 is to determine and are parts of first group of semiconductor element from the pairing one or more semiconductor elements from step 1302 of unique identifier of step 1304.Perhaps, based on the result of test operation that observes from step 1310, can be from from second group of semiconductor element determining one or more semiconductor elements of step 1302 not operate from the wireless automatic testing equipment of step 1302 by expection.In another is selected, can determine the combination in any of first group of semiconductor element and second group of semiconductor element from the wireless automatic testing equipment of step 1302.Optionally determine one or more signal metrics of the result of test operation that observes from step 1310 from the wireless automatic testing equipment of step 1302, to determine from one or more semiconductor elements of step 1302 from the position in the semiconductor crystal wafer of step 1302.
One or more signal metrics can be distributed to the respective coordinates in the i group coordinate in the three dimensions from the wireless automatic testing equipment of step 1302.Wireless automatic testing equipment from step 1302 will be distributed to i group coordinate from unique identifier of step 1304.Wireless automatic testing equipment from step 1302 will be mapped to from unique identifier of step 1304 on the semiconductor element 106 of their correspondences, to determine from one or more semiconductor elements of step 1302 from the position in the semiconductor crystal wafer of step 1302.By will with compare from the corresponding one or more signal metrics of each unique identifier of step 1304 with from the preset signals tolerance of each in one or more semiconductor elements of step 1302, can determine position from the wireless automatic testing equipment of step 1302 from one or more semiconductor elements of step 1302.Perhaps, based on from the relation between the pairing one or more signal metrics of unique identifier of step 1304, can be from the wireless automatic testing equipment of step 1302 to carrying out iterated interpolation from the position in the semiconductor crystal wafer of step 1302 relatively from unique identifier of step 1304 from the semiconductor element of step 1302.
Perhaps, by unique identifier and this unique identifier and its are being compared from the default mapping between the position in the semiconductor crystal wafer of step 1032, from the wireless automatic testing equipment of step 1302 capable of being combined go out to indicate from the semiconductor crystal wafer of step 1302 from the figure of the position of the semiconductor element of step 1302.Perhaps, based on from the relation between each unique identifier of the semiconductor element of step 1302, can be from the wireless automatic testing equipment of step 1302 to carrying out iterated interpolation from the position from the semiconductor element of step 1302 in the semiconductor crystal wafer of step 1302.
The mark of the functional block of semiconductor element
Figure 14 has described the block diagram according to the functional block of the tested integrated circuit of the part enforcement of the conduct first of the embodiment of the invention and/or the second demonstration semiconductor element.Tested integrated circuit 1400 is carried out and is carried test operation 256 to determine whether it operates by expection.Tested integrated circuit 1400 comprises one or more hardware modules, thereby in these hardware modules some can be divided into functional block B1 to B4.Yet, should be for example only as describing purpose, under the condition that does not break away from spirit and scope of the invention, the functional block that tested integrated circuit 1400 can differently be divided into smaller amounts or greater number is conspicuous for those skilled in the relevant art.
Functional block B1 can comprise the different hardware module of tested integrated circuit 1400 to B4, and described different hardware module can be carried out different and/or similar function.For example, the first functional block B1 can comprise first transmitter, disposes described first transmitter to operate according to Institute of Electrical and Electric Engineers (IEEE) communication standard (such as IEEE 802.11 communication standards).In this was given an example, the second functional block B2 can comprise second transmitter, disposes described second transmitter to operate according to bluetooth communication standard.Correspondingly, some hardware modules of tested integrated circuit 1400 can be distributed to functional block B1 more than in the B4.Give an example from above, first transmitter and second transmitter can be shared general amplification module.This general amplification module can be distributed to the first functional block B1 and the second functional block B2, or distribute to the 3rd functional block B3, described the 3rd functional block B3 comprises the hardware that is different from the first functional block B1 and the second functional block B2.
Each functional block B1 can be assigned or be marked with unique identifier to B4.The representative of this unique identifier is unique bit sequence for functional block B1 to each of B4.In an embodiment, functional block B1 is stored in the memory devices to each the unique identifier of B4, described memory devices such as the non-volatility memorizer that is fit to arbitrarily, the volatile storage that is fit to arbitrarily or for various equivalent modifications the combination in any of conspicuous non-volatile and volatile storage, wherein said memory devices is implemented as the part of test module, described test module such as test module 206 or test module 906.In another embodiment, can functional block B1 be offered memory devices to the unique identifier of B4 by wireless automatic testing equipment, described wireless automatic testing equipment is such as wireless automatic testing equipment 400 or wireless automatic testing equipment 1100.In this example embodiment, can by wireless automatic testing equipment functional block B1 be offered memory devices to the unique identifier of B4 by starting the test operation signal, described startup test operation signal is such as starting test operation signal 150 or startup test operation signal 850.Perhaps, can in the preparation process of the semiconductor element that comprises tested integrated circuit 1400, functional block B1 be written in the memory devices to the unique identifier of B4.In another was selected, each functional block B1 can include memory devices to B4, for each functional block B1 stores unique identifier to B4.
Whether functional block B1 can carry out a part that carries test operation 256 or carry test operation 256 to B4, operate by expection to determine them.For example, carry test operation 256 and can comprise one or more test routines of carrying out to B4 by functional block B1.These one or more test routines can comprise the combination in any of first group of instruction as discussed above, second group of instruction, first group of parameter and/or second group of parameter.Whether in this was given an example, functional block B1 and functional block B2 can carry out their first test routine and second test routine respectively, operate by expection to determine them.Perhaps, functional block B1 can carry out first test routine and will offer functional block B2 from the information that execution obtained of first test routine.Whether functional block B2 can use this information to carry out second test routine, operate by expection to determine it.
In the implementation that carries test operation 256 and/or afterwards, functional block B1 offers test module, described test module such as test module 206 or test module 906 to B4 with operability indication 258.Operability points out whether functional block B1 operates by expection to B4, points out perhaps whether functional block B1 does not operate by expection to B4, and optionally point out functional block B1 in the B4 not by expection operate one or more.Perhaps, whether whether functional block B1 can provide their unique identifier to B4 as operability indication 258, operate by expection to B4 with the functional block B1 that points out this unique identifier correspondence, perhaps do not operate by expection.
Test module (such as test module 206 or test module 906) can be analyzed operability indication 258 so that operability indication (such as operability indication 254) to be provided.Test module can provide operability indication, described operability point out functional block B1 to B4 whether operate by expection or point out functional block B1 to B4 whether do not operate by expection and optionally point out with the functional block B1 that does not operate by expection to the corresponding unique identifier of B4.
The mark of the functional block of the semiconductor element in the aforesaid way makes wireless automatic testing equipment (such as wireless automatic testing equipment 400 or wireless automatic testing equipment 1100) can determine which functional block operates by expection.This allows the manufacturer of semiconductor element to distribute the semiconductor element with minor feature, even these semiconductor elements can be designed to carry out bigger function.For example, tested integrated circuit 1400 can comprise first transmitter and second transmitter, and first transmitter is operated according to the ieee communication standard, and second transmitter is operated according to bluetooth communication standard.In this was given an example, the manufacturer of tested integrated circuit 1400 can distribute the semiconductor element with tested integrated circuit 1400 as having first transmitter, even second transmitter is not operated by expection.
Can be used as the optional module of the part enforcement of the wireless automatic testing equipment of first or second demonstration
Figure 15 has described the block diagram according to the thermal imaging module of the part enforcement that can be used as the wireless automatic testing equipment of first or second demonstration of the embodiment of the invention.Wireless test environment 1500 comprises wireless test device 1502, and so that semiconductor crystal wafer 152 is tested simultaneously, thereby whether checking semiconductor element 106 is operated by expection.Wireless test device 1502 has the common feature of many wireless test devices 104 as discussed above and/or wireless test device 802, and the difference of wireless test device 1502 and wireless test device 104 and/or wireless test device 802 only is discussed in further discussing below therefore.
Wireless test device 1502 comprises that performance measurement module 1504 is to measure the performance of semiconductor element 106.The semiconductor crystal wafer infrared energy 1550 that 1504 observations of performance measurement module are produced by semiconductor crystal wafer 152.More particularly, before the execution that carries test operation, in the process and/or afterwards, semiconductor element 106 produces one of correspondence in the semiconductor element infrared energies 1552.1 to 1552.n.For example, in carrying the implementation of test operation, semiconductor element 156.1 produces semiconductor element infrared energy 1552.1.
Performance measurement module 1504 is handled semiconductor crystal wafer infrared energy 1550, so that the semiconductor crystal wafer thermography of semiconductor crystal wafer 152 to be provided.Performance measurement module 1504 is separated the thermography of semiconductor element 106 from the semiconductor crystal wafer thermography.Performance measurement module 1504 compares semiconductor element thermography and one or more default semiconductor element thermography, to measure the performance of semiconductor element 106.
The wireless automatic testing equipment of second demonstration
Figure 16 has described the block diagram according to the washability energy measurement module of the part enforcement that can be used as the wireless automatic testing equipment of first or second demonstration of the embodiment of the invention.Performance measurement module 1600 comprises thermal imaging module 1602 and thermography processor 1604, measures the performance of semiconductor element 106 with based semiconductor wafer infrared energy 1550.Performance measurement module 1600 can representative energy measurement module 1504 example embodiment.
The exemplary treatments of thermography
Figure 17 A has described the block diagram that is used in the thermography processor in the washability energy measurement module according to the embodiment of the invention.The thermal infrared energy 1650 that 1604 processing of thermography processor observe is to provide semiconductor crystal wafer thermography 1700.1700 indications of semiconductor crystal wafer thermography are by the infrared energy of semiconductor crystal wafer 102 emissions, transmission and/or emission, and described infrared energy is resolved by one or more thermal treatment algorithms.More infrared energy is launched, sends and/or launched in those zones with more shallow shade than the zone that those have dark shade in the semiconductor crystal wafer thermography 1700.Shown semiconductor crystal wafer thermography 1700 is only as purposes of illustration, and those skilled in the relevant art will recognize, only otherwise break away from the spirit and scope of the present invention, other semiconductor crystal wafer thermography also is possible.
Figure 17 B has described the default semiconductor element Thermogram according to the embodiment of the invention.Thermography processor 1604 compares semiconductor element thermography 1702.1 to 1702.n and default semiconductor crystal wafer thermography 1704 so that performance measurement 1152 to be provided.
Default semiconductor crystal wafer thermography 1704 comprises default semiconductor element thermography 1706.1 to 1706.n.Each default semiconductor element thermography 1706.1 to 1706.n is assigned to a performance indicia 1708.1 to 1708.n.In the example embodiment, performance indicia 1708.1 is represented the semiconductor element of minimum quality, and performance indicia 1708.n represents the semiconductor element of E.B.B..When execution carries test operation, to compare with the semiconductor element of E.B.B., more infrared energy is launched, sends and/or reflected to the semiconductor element of minimum quality.The result is, compares with low-qualityer semiconductor element, and the semiconductor element of E.B.B. is suitable for operating with higher operating speed.
To have with one of default semiconductor crystal wafer thermography 1706.1 to 1706.n very the semiconductor element 106 of approximate corresponding semiconductor element thermography 1702.1 to 1702.n be assigned to corresponding performance indicia 1708.1 and arrive 1708.n.For example, semiconductor element 106.1 and 106.n present semiconductor element thermography 1702.1 and the 1702.n very approximate with default semiconductor crystal wafer thermography 1706.1 accordingly; Therefore, semiconductor element 106.1 to 106.n is distributed to performance indicia 1708.1.Similarly, semiconductor element 106.2 presents semiconductor element thermography 1702.2 and the 1702.n very approximate with default semiconductor crystal wafer thermography 1706.2; Therefore, semiconductor element 106.2 is distributed to performance indicia 1708.2.
Measure the method for the performance of semiconductor element in the semiconductor crystal wafer
Figure 18 is the process flow diagram 1800 according to the demonstration step of the second wireless element test environment of the embodiment of the invention.The present invention is not limited to this operation and describes.On the contrary, other control flow according to this instruction is conspicuous within the spirit and scope of the present invention for those skilled in the relevant art.Below discuss and described the step among Figure 18.
Conclusion
The purpose that should be appreciated that embodiment chapters and sections rather than summary chapters and sections is to set forth claim.The summary chapters and sections can illustrate one or more example embodiment of the present invention, but are not all example embodiment, and the purpose of the chapters and sections of therefore making a summary is not by any way the present invention and additional claim to be limited.
Below also invention has been described by means of the enforcement of setting forth function and the functional module that concerns between them.For the convenience of describing, define the boundary of these functional modules herein arbitrarily.As long as be suitable for carrying out specific function and their relation, can limit other boundary.
Only otherwise break away from the spirit and scope of the present invention, the various variations of making in the form and details are conspicuous for those skilled in the relevant art.Therefore, the present invention is not subjected to the restriction of any example embodiment discussed above, but should only limit the present invention according to claim and being equal to of they.
Claims (10)
1. a wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously is characterized in that, comprising:
Receiver module is used for receiving a plurality of result of test operation from described a plurality of semiconductor elements, and so that the test result of a plurality of recoveries to be provided, described a plurality of test results point out whether its corresponding semiconductor element is operated by expection; And
Test processor is determined first group of semiconductor element operating by expection based on the test result of described a plurality of recoveries from described a plurality of semiconductor elements.
2. the wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously according to claim 1 is characterized in that described wireless automatic testing equipment further comprises:
The a plurality of receiving antennas that are connected with receiver module are used for from the described a plurality of result of test operation of a plurality of direction observations of three dimensions.
3. the wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously according to claim 2 is characterized in that, described a plurality of receiving antennas in three dimensions along the radius setting of spherical shell.
4. the wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously according to claim 2, it is characterized in that, described a plurality of receiving antennas in three dimensions along the respective radius setting in a plurality of radiuses of the corresponding spherical shell in a plurality of spherical shells.
5. the wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously according to claim 1, it is characterized in that described receiver module further receives described a plurality of result of test operation simultaneously on General Purpose Communication Channel.
6. the wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously according to claim 1, it is characterized in that described receiver module is further decoded so that the test result of described a plurality of recoveries to be provided to described a plurality of result of test operation according to the multiple access transmission plan.
7. the wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously according to claim 1, it is characterized in that, based on the test result of described a plurality of recoveries, described test processor is further determined second group of semiconductor element not operating by expection from described a plurality of semiconductor elements.
8. the wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously according to claim 1 is characterized in that described wireless automatic testing equipment further comprises:
Metrics measurement module is used for determining a plurality of signal metrics of the test result of described a plurality of recoveries;
Wherein, based on described a plurality of signal metrics, described test processor is further determined the position of described a plurality of semiconductor elements in described semiconductor crystal wafer.
9. the wireless automatic testing equipment that is used for a plurality of semiconductor elements of forming on the measuring semiconductor wafer simultaneously according to claim 8 is characterized in that, described test processor further in order to:
(i) distribute described a plurality of signal metrics to give the respective coordinates in many group coordinates in the three dimensions,
(ii) distribute the unique identifier in a plurality of unique identifier be embedded in described a plurality of test result to give described many group coordinates, in each of described a plurality of unique identifiers and the described a plurality of semiconductor elements is corresponding, and
(iii) described a plurality of unique identifiers are mapped to the semiconductor element of their correspondences, to determine the position of described a plurality of semiconductor elements in described semiconductor crystal wafer.
10. the semiconductor element that forms on the semiconductor crystal wafer is characterized in that, comprising:
Test module carries test operation in order to storage;
Tested integrated circuit describedly carries the execution of test operation and operability indication is provided in order to respond, and described operability points out whether described tested integrated circuit is operated by expection; And
Transceiver module is encoded to described operability indication in order to foundation multiple access transmission plan.
Applications Claiming Priority (6)
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| US35522610P | 2010-06-16 | 2010-06-16 | |
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| US201161429277P | 2011-01-03 | 2011-01-03 | |
| US61/429,277 | 2011-01-03 | ||
| US13/025,657 | 2011-02-11 | ||
| US13/025,657 US9002673B2 (en) | 2010-06-16 | 2011-02-11 | Simultaneous testing of semiconductor components on a wafer |
Publications (2)
| Publication Number | Publication Date |
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| CN102288892A true CN102288892A (en) | 2011-12-21 |
| CN102288892B CN102288892B (en) | 2014-09-17 |
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| CN201110162538.9A Expired - Fee Related CN102288892B (en) | 2010-06-16 | 2011-06-16 | Semiconductor components and wireless automatic testing apparatus for simultaneous testing thereof |
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| US (1) | US9002673B2 (en) |
| EP (1) | EP2397862A3 (en) |
| CN (1) | CN102288892B (en) |
| HK (1) | HK1165207A1 (en) |
| TW (1) | TWI498575B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102288892B (en) | 2014-09-17 |
| EP2397862A3 (en) | 2012-08-08 |
| HK1165207A1 (en) | 2012-09-28 |
| TW201226941A (en) | 2012-07-01 |
| US20110313710A1 (en) | 2011-12-22 |
| US9002673B2 (en) | 2015-04-07 |
| TWI498575B (en) | 2015-09-01 |
| EP2397862A2 (en) | 2011-12-21 |
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