CN104175679B - Electronic component unit and its manufacture method - Google Patents
Electronic component unit and its manufacture method Download PDFInfo
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- CN104175679B CN104175679B CN201410220382.9A CN201410220382A CN104175679B CN 104175679 B CN104175679 B CN 104175679B CN 201410220382 A CN201410220382 A CN 201410220382A CN 104175679 B CN104175679 B CN 104175679B
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Abstract
The invention provides a kind of electronic component unit (1), its resin seal (3) for including electronic component (2) and coating electronic component (2).Resin seal (3) is made up of the Foamex by making thermosetting resin foam and producing.O ' μm of the distribution of the major diameter size of connecting hole (301,302,303,304) for being connected between the foam hole of Foamex, α μm of the average value of major diameter size and standard deviation meet the relation of α+3o '≤500.Further it is provided that the manufacture method of electronic component unit (1).The manufacture method includes material liquid preparation process, mixed process and coating foam process.
Description
Technical field
This disclosure relates to electronic component unit and its manufacture method, the electronic component unit is by with by thermosetting resin
The resin seal coating electronic component that is made of foaming body provide.
Background technology
Recently, electronic component is also used for mobile terminal, the vehicles in addition to polytype electronic device etc.
In multiple technical fields.Since it is desired that electronic component has fire resistance characteristic, so a kind of electronic component unit is for example had been developed for,
Complete to include all print wiring board (the whole printed of electronic component by resin seal in the electronic component unit
wiring board).For the vehicles and mobile terminal, in addition it is also necessary to reduce the weight of electronic component.Using by making thermosetting
Property the Foamex that produces of the foaming such as resin such as polyurethane as the resin seal for resin seal.
At least two kinds of material liquid is mixed, makes polymerizable raw material to produce thermosetting resin, and make thermosetting tree
Fat foams, so that two liquid mixed types (two-liquid mixing type) foamed thermosetting resin is used as into Foamex.Tool
Body ground, for example, disclosing the technology that electronic component is coated with obturator-type (closed cell type) polyurathamc, the hair
Bubble polyurethane makes polyurethane foam to provide (with reference to patent document 1) by using microballoon capsule.
Patent document 1：JP-A-2001-352156
Applicant of the present invention is found that the following fact：
In any case, with using foaming agent such as physical blowing agent, CBA etc. without the hair that is produced using microballoon capsule
Bubble resin is compared, and the Foamex produced using microballoon capsule may increase manufacturing cost.Additionally, being produced using microballoon capsule
In Foamex, the viscosity of liquid resin raw material may increase, and gap between the mixing of raw material or element to be sealed
Filling can be insufficient.On the other hand, when using foaming agent without using microballoon capsule to manufacture Foamex, the gas of foaming agent
Change, gas releasing etc. easily cause the connecting hole being connected between the foam hole of Foamex (foamed cell)
(connection hole) increases.Therefore, can make the fire resistance characteristic of the resin seal being made up of Foamex reduces.
The content of the invention
One purpose of the disclosure is to provide electronic component unit and its manufacture method, the electronic component unit with it is low into
This and lightweight are manufactured, and with excellent fire resistance characteristic.
According to the one side of the disclosure, there is provided a kind of resin including electronic component and the coating electronic component
The electronic component unit of seal.Resin seal is made up of the Foamex by making thermosetting resin foam and producing.For
The distribution of the major diameter size of the connecting hole being connected between the foam hole of Foamex, α μm of the average value of major diameter size and standard
O ' μm of deviation meets the relation of α+3o '≤500.
According to another aspect of the disclosure, there is provided coat the electronics unit that electronic component is produced by with resin seal
The manufacture method of part unit.Resin seal is by the Foamex system by making the two resin expanded generations of liquid hybrid thermosetting
Into.The manufacture method includes preparing the first material liquid and the second material liquid, the first material liquid is discharged from first row delivery nozzle
And the second material liquid is discharged from second row delivery nozzle in addition, the first material liquid and the collision of the second material liquid are made in discharge simultaneously
Mixing, produces the resin mixture liquor comprising thermosetting resin, and resin mixture liquor injection electronic component is placed on the gold in it
In category mould, and the thermosetting resin of resin mixture liquor is set to foam and solidify in metal die.Make the second material liquid and
The mixing of one material liquid is to generate thermosetting resin, and the viscosity of the second material liquid is less than the first material liquid.Colliding and mixing
When, after at least partially heating first row delivery nozzle is with the viscosity for reducing the first material liquid, make the first material liquid from first
Discharge nozzle discharge.
According to electronic component unit and its manufacture method, it is possible to provide the not electronic component unit using microballoon capsule and its manufacture
Method.Can low cost and lightweight ground manufacture electronic component unit.Electronic component unit can have excellent fire resistance characteristic.
Brief description of the drawings
By referring to the described in detail below of accompanying drawing, the above and other objects, features and advantages of the disclosure will become more
Plus substantially.In the accompanying drawings：
Fig. 1 is the figure of the cross section structure for showing electronic component unit in first embodiment；
Fig. 2 is the integrally-built figure for schematically showing foam-formed device in first embodiment；
Fig. 3 is to show to mix partial cross section structure of the injection device in the state of material liquid is circulated in first embodiment
Figure；
Fig. 4 is that the amplification for showing the partial cross section for mixing the first column side wall in injection device in first embodiment is regarded
Figure；
Fig. 5 shows to mix in first embodiment injection device in the state of material liquid is discharged in the first cylinder
The figure of partial cross section's structure；
Fig. 6 is that mixing injection device is sent to the state in the second cylinder in resin mixture liquor in showing first embodiment
Under partial cross section's structure figure；
Fig. 7 is the figure of the cross section structure of the metal die for showing clamping electronic component in first embodiment；
Fig. 8 is to show that resin mixture liquor in first embodiment is injected into the cross section structure of the metal die in its cavity
Figure；
Fig. 9 is figure of temperature T (K) with the relation of viscosities il (mPas) for showing the first material liquid in first embodiment；
Figure 10 A are the scanning electron microscopies in the section for showing foamed resin products (resin seal) in first embodiment
Photo (50 times of magnifying powers)；
Figure 10 B correspond to the figure of Figure 10 A；
Figure 11 A are the zoomed-in views for showing the region XIA in the scanning electron micrograph of Figure 10 A；
Figure 11 B correspond to the figure of Figure 11 A；
Figure 12 A are to show the figure based on the oval method of the five points determination in connecting hole outer rim in first embodiment；
Figure 12 B correspond to the figure of Figure 12 A；
Figure 13 is the figure for showing elliptic equation described by Figure 12 A；
Figure 14 is to show centre coordinate (X oval described by Figure 12 A0,Y0) accounting equation figure；
Figure 15 is the figure of the accounting equation of the inclination angle theta for showing oval described by Figure 12 A；
Figure 16 is the figure of the accounting equation of the length a for showing oval described by Figure 12 A；
Figure 17 is the figure of the accounting equation of the length b for showing oval described by Figure 12 A；
Figure 18 is determinant of coefficient A, B, the figure of C, D for showing to be calculated by elliptic equation；
Figure 19 is the major diameter size (α+3o ') and water for showing connecting hole in Foamex in the embodiment of the present invention and comparative example
The figure of the relation of seepage distance；
Figure 20 be show in the embodiment of the present invention and comparative example in Foamex the major diameter size (α+3o ') of connecting hole with away from
The figure of the relation of the water penetration distance of electronic component unit expose portion；And
Figure 21 A to 21C are composition, for showing the first material liquid and the second material liquid in the embodiment of the present invention and comparative example
The temperature of one material liquid, the viscosity of the first material liquid, the figure of the property of resin seal.
Detailed description of the invention
It is as follows, an embodiment according to the disclosure will be described.
Electronic component unit according to the present embodiment includes the resin seal of electronic component and the coating electronic component
Part.Resin seal is made up of the Foamex by making thermosetting resin foam and providing.
The thermosetting resin used in the disclosure can be two liquid hybrid thermosetting resins.Specifically, for example, thermosetting
Resin can be polyurethane resin, epoxy resin, phenol resin, unsaturated polyester resin, melamine resin etc..Preferably with poly-
Urethane resin.Using in the case of polyurethane resin, there may be some advantages for providing excellent feature, such as low elasticity,
High-adhesiveness and rapidly-curable, and smell is relatively small.
Electronic component unit can be manufactured by carrying out stock preparation process, mixed process and coating foam process.For example,
In stock preparation process, the first material liquid and the second material liquid are prepared, the viscosity of second material liquid is less than the first raw material
Liquid.For example, in mixed process, making the first material liquid be discharged from first row delivery nozzle and making the second material liquid from the second discharge
Nozzle is discharged, and the first material liquid is collided and is mixed with the second material liquid, there is provided the resin mixture liquor comprising thermosetting resin.Example
Such as, during foam is coated, resin mixture liquor injection electronic component is placed in the metal die in it, and make tree
The thermosetting resin of fat mixed liquor foams and solidifies in metal die.
In material liquid preparation process, the first material liquid and the second material liquid are prepared.When making the first material liquid and second former
When feed liquid mixes, the raw material of thermosetting resin is polymerized, so as to thermosetting resin can be provided.Except thermosetting resin raw material it
Outward, the first material liquid and the second material liquid can also be comprising curing catalysts, foaming agent, foam stabilisers etc..Solidification can be catalyzed
Agent, foaming agent, foam stabiliser etc. be added to the first material liquid and the second material liquid any one in, or it can both be added
It is added to again in the second material liquid to the first material liquid.Curing catalysts can be properly selected according to the type of thermosetting resin
And foam stabiliser.Physical blowing agent, CBA etc. can be used as foaming agent.
In mixed process, the first material liquid is discharged from first row delivery nozzle, make the second material liquid from the second discharge spray
Mouth is discharged, and in discharge, the first material liquid is collided and is mixed with the second material liquid.In this case, at least locally
Ground heating first row delivery nozzle so that the viscosity of the first material liquid is reduced and discharges the first material liquid.Because the second raw material
The viscosity of liquid is equal to or less than 200mPas, it may be preferred that by heating first row delivery nozzle, making the first material liquid
Viscosity is reduced to equal to or less than 200mPas when the first material liquid is discharged from first row delivery nozzle.In this case, may be used
To ensure that the affinity between the first material liquid and the second material liquid increases.Therefore, in mixed process, can more be ensured
One raw material equably mixes with the second raw material.Thereby it can be assured that reducing the connecting hole of Foamex, and may insure to reduce
The major diameter size of connecting hole.In addition, the length of major diameter size Expressing connecting hole major diameter.
In mixed process, the first material liquid is mixed with the second material liquid, and 50ml or less is provided
Resin mixture liquor.In this case, by carrying out what material liquid preparation process, mixed process and coating foam process were realized
Above-mentioned advantage can be significant.Thus, for example, work as making the first material liquid and the second material liquid mixed using mixing injection device etc.
When merging and producing 50ml or less a small amount of resin mixture liquor, in general, the mixing of material liquid is probably not enough, and
The number of connecting hole and the major diameter size of Foamex can increase.Even if as described above, when by carry out material liquid preparation process,
When mixed process and coating foam process produce 50ml or less a small amount of resin mixture liquor, resin mixture liquor can also uniformly mixed
Close so that the number of connecting hole and the major diameter size of Foamex can reduce.From from the viewpoint of similar, in mixed process,
Preferably produce the resin mixture liquor equal to or less than 30ml.
During foam is coated, thermosetting resin can be made to be foamed with any expansion ratio.Specifically, for example, foaming times
Rate can be 2 to 30.It is set in the scope by by expansion ratio, electronic component unit, wherein resin seal can be manufactured
It is lightweight and electronic component unit has excellent fracture strength.
(first embodiment)
It is as follows, electronic component unit and its manufacture method are illustrated with reference to the accompanying drawings.As depicted in fig. 1, this implementation
Electronic component unit 1 in example includes the resin seal 3 of electronic component 2 and coating electronic component 2.Resin seal 3 is by sending out
Bubble polyurethane resin is made.Electronic component unit 1 in the present embodiment be for the vehicles electronic control unit (ECU) and
And with printed substrate 20 as electronic component 2.Electronic circuit (not shown) is arranged on printed substrate.Track
Road plate 20 (printed substrates 20) is the plate that 60mm is long, 67mm is wide, 1.6mm is thick, and is made up of general glass epoxide substrate.
On the two sides of printed substrate 20, polytype semiconductor element 21,22,23 is installed and corresponding to printed substrate 20
The connector 24 of external connection terminals.Semiconductor element 21,22,23 is completely coated with resin seal 3.One of connector 24
Resin seal 3 point is coated with integrated with printed substrate 20, another part of connector is exposed to the external world.Additionally, printing
A part for wiring board 20 and the end face 201 of printed substrate 20 also expose outside.That is, electronic component unit 1 includes
Electronic component 2 is sealed by resin the exposed expose portion 11 of seal 12 and the part of electronic component 2 of the sealing of part 3.
As described by Fig. 2 to Fig. 8, the electronic component unit 1 in the present embodiment can be used foam-formed device 4 to manufacture,
The foam-formed device 4 has two head tanks 41,42, mixes injection device 5 and metal die 6.Specifically, first, will
The polyalcohol " SPECFLEX NC630 (mean molecule quantity is 7400) " of 100 mass parts Dow Chemical Ltd., 40 mass parts
The polyalcohol " TP-400 (mean molecule quantity is 400) " of Sanyo Chemical Industries Ltd., the water of 3 mass parts
Foam stabiliser " SZ-1327 (the polyoxyethylene allylic alkylations of (foaming agent), 1 mass parts Dow Corning Toray Co., Ltd.
Ether) ", the 4-methyl hexamethylene diamine (curing catalysts of the triethylenediamine (curing catalysts A) of 0.3 mass parts and 0.5 mass parts
B) in the first head tank 41 (reference picture 2) of input.Polyalcohol corresponds to for providing two liquid hybrid thermosetting resin (polyurethane
Resin) the first raw material (raw material in terms of polyalcohol).Then, mixed by making the content in the first head tank 41, obtained
First material liquid 31.
First material liquid 31 is 1240mPas in 25 DEG C of viscosity.The temperature T of the first material liquid 31 is described in Fig. 9
(K) relation and between viscosities il (mPas).In fig .9, transverse axis corresponds to 1/T, and the longitudinal axis corresponds to the natural logrithm of viscosities il
Ln (η), and 1/T and natural logrithm ln (η) proportional relation.In addition, in fig .9, longitudinal axis ln (η) is by so-called Andrade
(Andrade) equation is represented by following formula：Ln (η)=lnA+ (E/RT).η corresponds to viscosity, and A corresponds to constant value, E
Corresponding to viscous flow activation energy, R corresponds to gas constant, and T corresponds to absolute temperature.
Additionally, by the 4 of 40 mass parts, the toluene diisocynate of 4 '-'-diphenylmethane diisocyanate (MDI) and 25 mass parts
Ester (TDI) is put into the second head tank 42 (reference picture 2).It is (poly- that isocyanates corresponds to two liquid hybrid thermosetting resins of offer
Urethane resin) the second raw material (raw material in terms of isocyanates).Then, mixed by making the content in the second head tank 42
Close, obtain the second material liquid 32.
Then, the first material liquid 31 in the first head tank 41 is maintained 40 DEG C, and make the first material liquid 31
One head tank 41 circulate between injection device 5 with mixing.First material liquid 31 is 505mPas in 40 DEG C of viscosity.Make second
The second material liquid 32 in head tank 42 maintains 40 DEG C, and make the second material liquid 32 the second head tank 42 with mix injection
Circulated between device 5.Second material liquid 32 is 110mPas in 40 DEG C of viscosity.First head tank 41 with mix injection device 5
Connected with pipeline 415,416, and the second head tank 42 is connected with mixing injection device 5 with pipeline 425,426.
As described in Figure 3, mixing injection device 5 includes the first cylindrical column 51 placed with horizontal direction and in the first post
The first piston 52 slided with horizontal direction in body 51.Additionally, mixing injection device 5 also includes placed with vertical direction second
Cylindrical column 53 and the second piston 54 slided with vertical direction in the second cylinder 53.
As described in Figure 3, the through hole for penetrating side wall 510 is provided with the side wall 510 of the first cylinder 51
(penetration hole) 511,512, and depression 521 is provided with the side surface 520 of first piston 52.Lived first
Plug 52 is inserted into the state of the side of tip portion 517 (right direction in Fig. 3) of the first cylinder 51, through hole 511,512 and
Depression 521 forms the passage of the first material liquid 31.Therefore, as shown in Figures 2 and 3, passed by the first head tank 41 by pipeline 415
The first material liquid 31 for mixing injection device 5 is delivered in porch by penetrating for being formed on the side wall 510 of the first cylinder 51
Hole 511.The depression 521 that first material liquid 31 passes through first piston 52, by penetrating for being formed on the side wall 510 of the first cylinder 51
The first head tank 41 is again returned to by pipeline 416 in exit in hole 512.As described above, the first material liquid 31 is former first
Batch can 41 circulate between injection device 5 with mixing.
As described in Figure 3, in the side wall 510 of the first cylinder 51, there is provided other in addition to through hole 511,512 are penetrated
Hole 513,514, and in the side surface 520 of first piston 52, there is provided another depression 522 in addition to depression 521.
First piston 52 is inserted into the state of the side of tip portion 517 (right direction in Fig. 3) of the first cylinder 51, through hole 513,
514 passages that the second material liquid 32 is provided with depression 522.Therefore, the situation with the first material liquid is similar, by pipeline 425
The second material liquid 32 for being sent to mixing injection device 5 by the second head tank 42 passes through through hole 513 in porch, and passes through
Depression 522.Second material liquid 32 passes through pipeline 426 by through hole 514 in exit, again returns to (the reference of the second head tank 42
Fig. 2 and Fig. 3).As described above, the second material liquid 32 also the second head tank 42 with mix injection device 5 between circulate.
Additionally, as described in Figure 3, be provided with each through hole 511,513 of porch respective by-pass line 515,
516, by-pass line 515,516 is respectively separated, and be connected to the interior section 519 of the first cylinder 51 since in through hole 511,513.
As described in Figure 3, in the state of the side of tip portion 517 that first piston 52 is inserted into the first cylinder 51, by-pass line 515,516
The port of export 515a, 516a blocked by the side surface 520 of first piston 52.Therefore, the first material liquid 31 and the second material liquid 32
Be not discharged in the first cylinder 51, and as described above respective head tank 41,42 with mix injection device 5 between circulation.
In this case, the first material liquid 31 is retained in the by-pass line 515 of the first material liquid side, and the second material liquid 32 retains
In the by-pass line 516 of the second material liquid side.
In addition, by-pass line 515 can be described as first row delivery nozzle, and by-pass line 516 can be described as second row delivery nozzle.
Additionally, as described in Figure 4, the solenoid coil 57 for high-frequency sensing heating is centered around the bypass of the first feed side
Around line 515.The first material liquid 31 in by-pass line 515 is heated by coil 57.In the present embodiment, the quilt of the first material liquid 31
80 DEG C are heated to, the viscosity of the first material liquid 31 in by-pass line 515 is reduced to 132mPas.In addition, the first material liquid exists
The viscosity of predetermined temperature is obtained by Fig. 9.
As described in Figure 5, when first piston 52 is moved into the side of the end section 518 (left in Fig. 5 of the first cylinder 51
To) when, the port of export 515a, 516a of by-pass line 515,516 are opened.Therefore, the by-pass line 515 of the first material liquid side is provided
First row delivery nozzle 515, for making the first material liquid 31 be discharged in the interior section 519 of cylinder.The side of the second material liquid side
Route 516 provides second row delivery nozzle 516, for making the second material liquid 32 be discharged in the interior section 519 of cylinder.Cause
This, the first material liquid 31 and the second material liquid 32 are each with the direction of arrow described in Fig. 5 from respective first row delivery nozzle 515 and the
Two discharge nozzles 516 are discharged in the interior section 519 of the first cylinder 51.The first material liquid 31 discharged and the second material liquid
Collide and mix in the interior section 519 of the first cylinder 51.By mixing, carry out polymerization, so as to obtain comprising polyurethane
The resin mixture liquor of resin.In the present embodiment, after blending, 10ml resin mixture liquors are obtained.
In the present embodiment, the internal diameter φ of by-pass line 515,516 is 10mm, and total length is 102mm.By-pass line 515,516
Cumulative volume can suitably be changed according to the discharge rate of material liquid.In the present embodiment, to the first material liquid 31 and the second material liquid
32 mixing ratio is adjusted so that polyalcohol is calculated as 1 by volume with the mixing ratio of isocyanates:1.
As described in the fig 5 and 6, second piston 54 be moved into the second cylinder 53 the side of end section 538 (Fig. 6's
Upper direction) in the state of, first piston 52 is moved into the side of tip portion 517 (right direction in Fig. 6) of the first cylinder 51.
Therefore, the resin mixture liquor 33 in the interior section 519 of the first cylinder 51 is transferred into the interior section 539 of the second cylinder 53.
Additionally, as described in Figure 7, the tip portion 537 of the second cylinder 53 is connected with metal die 6.Metal die 6 is by upper mould
Tool 61 and lower mould 62 are constructed and internally include cavity 63.Electronic component 2 is placed in cavity 63.It is polytype partly to lead
Volume elements part 21,22,23 and connector 24 are installed to the printed substrate 20 in electronic component 2.As described in Figure 7, electronic component 2
Clamped by metal die 6, and a part for printed substrate 20 and connector 24 is exposed to outside cavity 63.That is,
In the state of a part for electronic component 2 is outside the cavity 63 of metal die 6, electronic component 2 is placed in cavity 63.
Additionally, in the state of the end face 201 of printed substrate 20 abuts the inner surface of cavity 63 of metal die 6, electronic component 2 is put
Put in cavity 63.In this state, it is placed in metal die 6 by by electronic component 2, it is as described below, can be in resin
After mixed liquor is filled into cavity 63 and is cured, there is provided (the reference picture of electronic component unit 1 with expose portion 11
1).In addition, the leading-in end 64 in being provided with for resin mixture liquor to be introduced into cavity 63 in mold 61.
As described above, when second piston 54 is moved into the side of tip portion 537 (the lower direction in Fig. 6 to Fig. 8), passing
Resin mixture liquor 33 (reference picture 6) in the interior section 539 of the second cylinder 53 is delivered to by being previously heated to the metal of predetermined temperature
In the injection cavity 63 of leading-in end 64 of mould 6 (reference picture 6 to Fig. 8).In the present embodiment, the temperature of metal die is 80 DEG C.
Foam and solidify in cavity 63 by making the thermosetting resin in resin mixture liquor 33, generate by foaming polyurethane resin system
Into resin seal 3 (reference picture 1).In the present embodiment, the isocyanic acid in the water and the second material liquid in the first material liquid
Ester reacts, and generates carbon dioxide and is worked with serving as foaming agent.
Therefore, as described in Figure 1, there is provided such electronic unit 1, it is by electronic component 2 and the covering electronic component 2
Resin seal 3 be made.The first original in the electronic component unit in manufacturing the present embodiment is illustrated in Figure 21 A to Figure 21 C
The composition of feed liquid, the first material liquid from first row delivery nozzle discharge when temperature and viscosity, the composition and gold of the second material liquid
Belong to the temperature of mould.Additionally, for the electronic component unit 1 obtained in the present embodiment, have studied in the surrounding resin of electronic component 2
Filling.Specifically, the cross section of visual observations electronic component unit 1, and check whether had time around electronic component 2
Between.The space provides because being not filled by resin.When space is not observed, it is determined that filling is good, and it is empty when observing
Between when, it is determined that filling be bad.Result is described in Figure 21 A to Figure 21 C.
Evaluation test is carried out to evaluate the quality of the resin seal 3 of the electronic component unit 1 obtained in the present embodiment.Tool
Body ground, manufactures separately made test block under the conditions of the resin seal identical of electronic component in the present embodiment.Test
Part is the rectangle foamed resin products of 65 × 70 × 18mm.Evaluated with test block.Afterwards, each evaluation test is carried out
Explain.
" the major diameter size of connecting hole "
Test block is cut at place at an arbitrary position, with SEM (SEM) with 50 times of power view cross section,
And shoot photo.An example of SEM photograph is shown in Figure 10 A and Figure 10 B.In Figure 10 A and Figure 10 B, pitch black color part
Corresponding to connecting hole.As seen in figs. 11a and 11b, connecting hole has the part of overlap.In this case, such as Figure 11 A and figure
Described in dotted line in 11B, the connecting hole of overlap is broken down into multiple connecting holes 301,302,303,304, and measures each company
Connect the major diameter size in hole 301,302,303,304.When major diameter size is measured, for each connecting hole 301,302,303,304
Five points are arbitrarily selected along external curve, as described in Figure 12 A and Figure 12 B.Five points are considered as coordinate, true by least square method
Determine the expression formula as described in Figure 13 to illustrate and by the elliptical shape of five points.In Figure 12 A and 12B, describe
One example is determining the elliptical shape for connecting hole 303 in Figure 11 A and Figure 11 B.In the elliptical shape, by Figure 13
The major diameter of expression formula description be defined as the major diameter size of connecting hole 303.Centre coordinate (X in Figure 12 A and Figure 12 B0,Y0) by
Expression formula description in Figure 14.Oval inclination angle theta is described by the expression formula in Figure 15 in Figure 12 A and Figure 12 B.Figure 12 A and Figure 12 B
In length a by Figure 16 expression formula describe.Length b in Figure 12 A and Figure 12 B is described by the expression formula in Figure 17.In addition,
A, B, C and D in Figure 14 to Figure 17 is by the determinant computation in Figure 18.Xi and Yi in Figure 18 correspond in Figure 12 A and Figure 12 B
Arbitrary coordinate on ellipse.And then the data of major diameter size (2 × a) for 50 connecting holes are calculated, obtain major diameter
The distribution of size, and calculate the value of the data of α+3o ' (α corresponds to average value, and o ' corresponds to standard deviation).Calculate
Result is shown in Figure 21 A to Figure 21 C.In addition, using the image analysis apparatus manufactured by Nippon Avionics Co., Ltd.s
" SPICCA " is measured, is carried out the binarization of SEM photograph image, and major diameter size is calculated by detecting elliptical shape.
" A type hardness tester meters hardness "
According to the regulation of JIS K6253 (1997), durometer hardness (A type) of the test block at 25 DEG C is measured.Result is shown
In Figure 21 A to Figure 21 C.
" the water penetration distance in simple body (simple body) "
The test rectangle part of 10 × 70 × 18mm is made up of the test rectangle part of 65 × 70 × 18mm.Then, by test block
The surface of 10 × 18mm is defined as bottom surface.By test block by bottom surface immersion depth in the water-soluble red ink of 5mm, maintenance 24 is small
When.Test block is taken out from red ink, and is dried 3 hours in 90 DEG C of thermostatic chamber.Test block is cut along short transverse, it is right
In maximum seepage distance (mm) of the cross section test red ink away from bottom surface.Four maximum seepage distances of test block of measurement, and
Average value+3o ' (o ' corresponds to standard deviation) is calculated as the water penetration distance in the simple body of resin seal.Figure 21 A
Result is described into Figure 21 C.
" fracture strength "
JIS5 dumbbell shapes sample (JIS dumbbell No.5) is made by the test rectangle part of 65 × 70 × 18mm (thick
It is 6mm to spend), and tensile break strength is measured according to JIS K6251 (1993).Extension speed in measurement is set as 20mm/
min.20 fracture strengths of test block are measured, and shows that (o ' corresponds to average value -3o ' in Figure 21 A to Figure 21 C
Standard deviation) value.
Then, the water for measuring the middle-range expose portion 11 of electronic component unit 1 provided in the present embodiment as described below oozes
Saturating distance.Fire resistance characteristic in the expose portion 11 of electronic component unit 1 is evaluated (reference picture 1).
" away from the water penetration distance of expose portion "
A part for electronic component unit 1 is (specific by the side of expose portion 11 of electronic component unit in the present embodiment 1
Ground is the exposed side of end face 201 by printed substrate 20) in the water-soluble red ink of (reference picture 1) immersion, maintenance 24 is small
When.Then, electronic component unit 1 is taken out and is dried 3 hours in the constant temperature oven that temperature is 90 DEG C from red ink.Then,
Measurement red ink is by the maximum seepage distance (mm) in expose portion 11 to resin seal 3.Measure electronic component unit 1
Four maximum seepage distances of test block, and calculate average value+3o ' (o ' corresponds to standard deviation).This corresponds to away from sudden and violent
Reveal the water penetration distance of part.Result is described in Figure 21 A to Figure 21 C.
(second embodiment)
In the present embodiment, except the heating-up temperature that the first material liquid high-frequency load coil is realized is changed into
Outside 100 DEG C, electronic component unit is similarly produced with first embodiment.When heating-up temperature is set to 100 DEG C, first
The viscosity of material liquid is 71mPas.In the present embodiment, with first embodiment similarly, the evaluation of resin filling has been carried out.
Additionally, in the present embodiment, with the situation of first embodiment similarly, generated under the conditions of with resin seal identical by
The test block that foamed resin products are made, and measure the major diameter size of connecting hole, durometer hardness, water penetration distance and
Fracture strength.Additionally, measuring the water penetration distance away from electronic component unit expose portion.Result is shown in Figure 21 A to Figure 21 C
In.
(three to sixth embodiment)
In the 3rd to the 5th embodiment, except saying during the temperature of metal die is changed into following Figure 21 A to Figure 21 C
Outside each bright temperature, electronic component unit is similarly provided with first embodiment.Additionally, in the sixth embodiment, removing
The heating-up temperature that first material liquid high-frequency load coil is realized is changed into 70 DEG C and makes the temperature of metal die
Outside being changed as described in Figure 21 A to Figure 21 C, electronic component unit is similarly provided with first embodiment.In addition,
In the present embodiment, with first embodiment similarly, the evaluation of resin filling is carried out.Additionally, also in this embodiment, it is real with first
Apply the situation of example similarly, the test being made up of foamed resin products is generated under the conditions of with resin seal identical
Part, and measure water penetration distance and fracture strength in major diameter size, durometer hardness, the simple body of connecting hole.This
Outward, the water penetration distance away from electronic component unit expose portion is similarly measured with first embodiment.These results are shown in figure
In 21A to Figure 21 C.
(first to fourth comparative example)
In these embodiments, it is mixed not including high-frequency load coil around the by-pass line of the first feed side
Close injection device and generate electronic component unit.Therefore, when making the first material liquid mix with the second material liquid, the first material liquid
Without heated.The use of the viscosity at 40 DEG C is first raw material of 510mPas in the first comparative example.In the second comparative example
In, the use of the viscosity at 30 DEG C is first material liquid of 770mPas.In the 3rd comparative example, it is using the viscosity at 250 DEG C
First material liquid of 1240mPas.The use of the viscosity at 20 DEG C is first raw material of 1600mPas in the 4th comparative example
Liquid.Other points are similar with first embodiment, so as to produce the electronic component unit according to first to fourth comparative example.First to
In 4th comparative example, with the situation of first embodiment similarly, the evaluation of resin filling is carried out.In first to fourth comparative example
In each, with the situation of first embodiment similarly, generated by Foamex under the conditions of with resin seal identical
The test block that formed body is made, and measure the water penetration in major diameter size, durometer hardness, the simple body of connecting hole away from
From and fracture strength.Additionally, with the situation of first embodiment similarly, measuring the water away from electronic component unit expose portion and oozing
Saturating distance.These results are shown in Figure 21 A to Figure 21 C.
(the first to sixth embodiment, the comparing of first to fourth comparative example)
Based on Figure 21 A to Figure 21 C, by the major diameter size (α+3o ' of connecting hole:μm) with simple body in water penetration distance
(mm) relation drafting pattern.Result is shown in Figure 19.As described in Figure 21 A to 21C and Figure 19, with Foamex connecting hole
Major diameter size (α+3o ') reduces, and water penetration distance can reduce, and can increase fire resistance characteristic.As major diameter size increases, water penetration
The increase degree of distance also increases.Therefore, it is dimensioned so as to equal to or less than 500 μm by by major diameter, water penetration distance can be sufficient
It is enough short and excellent fire resistance characteristic high can be realized.From the point of view of by same insight, the major diameter size (α+3o ') of preferably connecting hole is equal to
Or less than 250 μm (α+3o '≤250).
As shown in Figure 21 A to Figure 21 C, the resin seal 3 of the electronic component unit 1 in the first to sixth embodiment is by sending out
Bubble polyurethane resin is made, with excellent fire resistance characteristic, and with high rigidity meter hardness and fracture strength (reference picture high
1).Therefore, the electronic component unit 1 in the first to sixth embodiment has excellent impact resistance.Therefore, first embodiment and
Electronic component unit 1 in second embodiment is especially preferred for being attached to the vehicles.When durometer hardness is less than 15
When, impact resistance is probably not enough, and may especially be difficult to be applied to vehicles etc..On the contrary, working as durometer hardness
During more than 35, the stress occurred in electronic component and electronic component welding portion increases, and reason is the operation of electronic component unit
Environment occurrence temperature changes, so that can destroy.Electronic component is sealed by resin part sealing.Thus, it may be preferable to,
The A type hardness tester meters hardness of resin seal 3 is 15 to 45, and more preferably 15 to 35.
Additionally, Figure 21 A to Figure 21 C are based on, by the major diameter size (α+3o ' of Foamex connecting hole:μm) first with away from electronics
The relation drafting pattern of the water penetration distance of the expose portion of part unit 1.Result is illustrated in Figure 20.
Such as Figure 21 A to 21C and illustrated in fig. 20, with the major diameter size (α+3o ' of Foamex connecting hole:μm) subtract
Small, the water penetration distance of expose portion 11 can reduce in electronic component unit 1, and fire resistance characteristic can be made to increase (reference picture 1).
In general, when the part that electronic component unit 11 has electronic component 2 is exposed from resin seal 3
Expose portion 11 when, water can be penetrated into easily in resin seal 3 by expose portion 11, such as in Figure 21 A to Figure 21 C the
Described in one to the 4th comparative example.Water easily can permeate from the marginal portion of exposed electronic component 2 and resin seal 3.
In first to fourth embodiment in Figure 21 A to Figure 21 C, the water penetration distance away from expose portion is oozed than the water in simple body
Thoroughly apart from much bigger, so as to can determine that above-mentioned tendency.
On the contrary, as described in the first to sixth embodiment in Figure 21 A to Figure 21 C, by by the major diameter size of connecting hole
It is set equal to or less than 500 μm, even if when electronic component unit 1 has expose portion 11, can also be enough to prevent water penetration
To in resin seal 3.That is, when electronic component unit 1 has expose portion 11, by by the major diameter chi of connecting hole
It is very little to be set equal to or less than 500 μm, can further improve the improvement of fire resistance characteristic.Additionally, when electronic component unit 1 has
When having expose portion 11, it is set equal to or less than 250 μm by by the long range diameter of connecting hole, can be more reduced away from sudden and violent
Reveal water penetration distance (reference picture 20) of part 11.
In the first to the sixth embodiment in the manufacture method of electronic component, by the coil for high-frequency sensing heating
57 at least partially heat first row delivery nozzle 515.Therefore, after the viscosity reduction for making the first material liquid 31, the first original is made
Feed liquid 31 mixes (reference picture 3 to Fig. 5) with the second material liquid 32.Therefore, the first material liquid and the second material liquid become easily mixed
Close, and the first material liquid can more uniformly mix with the second material liquid.Therefore, can make to enter between the foam hole of Foamex
The connecting hole of row connection is reduced, and reduces the major diameter size of connecting hole.Therefore, can manufacture by meeting the relation α+3o '
The resin seal that≤500 Foamex is provided, and the electronic component unit 1 with excellent fire resistance characteristic can be manufactured.
Especially, in the first to sixth embodiment, it is reduced to and the second material liquid the viscosity of the first material liquid 31 is made
After 32 identical levels (viscosity is equal to or less than 200mPas), the first material liquid 31 is set to mix (ginseng with the second material liquid 32
According to Fig. 3 to Fig. 5).Therefore, when making the first material liquid 31 mix with the second material liquid 32, the affinity of material liquid can determine that increasing
Plus, so as to uniformly mix.Therefore, the connecting hole of Foamex can be made to determine to reduce, and can subtracts the major diameter size of connecting hole
It is small.Therefore, the electronic component unit 1 (reference picture 1) with excellent fire resistance characteristic can as described above be manufactured.Especially, at this
In embodiment, as described above, because providing the electronic component unit 1 (reference picture 1) with expose portion 11, as above institute
State, reduce connecting hole size and the improvement of fire resistance characteristic may become apparent from.
In addition, in the first to sixth embodiment, by carrying out high-frequency sensing heating, heating the first material liquid 31.Cause
This, the first material liquid 31 can be rapidly heated, so as to can make the viscosity of the first material liquid quickly reduce.So as to electronics unit can be improved
The productivity ratio of part unit 1.
Additionally, when resin mixture liquor 33 is injected in metal die 6, the temperature of metal die 6 be preferably equal to or
More than 50 DEG C and less than 100 DEG C.As described in Figure 21 A to 21C, when the temperature of metal die 6 is less than 50 DEG C (with reference to embodiment 6)
When, because the solidification rate reduction of resin, it is possible that being difficult to reduce connecting hole.On the contrary, temperature when metal die 6 etc.
When 100 DEG C, the filling of resin can deteriorate (embodiment 5).
According to the first to sixth embodiment, foaming agent can be used without manufacturing the tree provided by Foamex using microballoon capsule
Fat seal 3.Therefore, can manufacture at low cost lightweight and the electronic component unit 1 with excellent fire resistance characteristic.
Additionally, in the first to sixth embodiment, the first material liquid includes polyalcohol, the second material liquid includes isocyanates
Mixture, and thermosetting resin is made up of polyurethane resin.In this case, by water is added in material liquid, making different
Cyanate ester compositions, with water reaction, generate carbon dioxide.Therefore, it can easily be carried out with low cost the hair of thermosetting resin
Bubble.
An aspect of this disclosure provides electronic component unit.The electronic component unit includes electronic component and coating
The resin seal of the electronic component.Resin seal includes the Foamex by making thermosetting resin foam and producing.It is right
In the distribution of the major diameter size of the connecting hole being attached between the foam hole of Foamex, α μm of average value and standard deviation
O ' μm of relation for meeting α+3o '≤500.
Another aspect of the disclosure is provided and coats the electronic component list that electronic component is produced by with resin seal
The manufacture method of unit, the resin seal is by the Foamex system by making the two resin expanded generations of liquid hybrid thermosetting
Into.The manufacture method includes：Material liquid preparation process, prepares the first material liquid and the second material liquid, the second material liquid and the
One material liquid mixes to generate thermosetting resin, and the viscosity of the second material liquid is less than the first material liquid；Mixed process, makes the first original
Feed liquid is discharged from first row delivery nozzle and the second material liquid is discharged from second row delivery nozzle in addition, and the first original is made in discharge
Feed liquid is collided and mixed with the second material liquid, and produces the resin mixture liquor comprising thermosetting resin；And coating foam mistake
Journey, resin mixture liquor injection electronic component is placed in the metal die in it, and make the thermosetting of resin mixture liquor
Resin foams and solidifies in metal die.In mixed process, first row delivery nozzle is at least partially heated to reduce by the
The viscosity of one material liquid, and the first material liquid is discharged from first row delivery nozzle.
In electronic component unit, resin seal can make thermosetting for example, by physical blowing agent, CBA etc.
It is resin expanded to produce, and can not be manufactured using microballoon capsule.Therefore, it is possible to decrease the manufacturing cost of resin seal.Additionally,
Therefore Foamex is used as resin seal and its usage amount that can reduce per unit volume thermosetting resin.From this sight
From the point of view of point, it is possible to decrease the manufacturing cost of resin seal.Therefore, it is possible to decrease the manufacturing cost of electronic component unit.Additionally, in electricity
In subcomponent unit, because using the resin seal being made up of Foamex, the weight of electronic component unit can be mitigated
Amount.
Additionally, in Foamex, the major diameter size of the connecting hole being attached between foam hole has changeability.
In the distribution of the major diameter size of connecting hole, most of data are in the scope of α ± 3o '.Therefore, as described above, meet α+3o '≤
500 relation, and the major diameter size major part of connecting hole can be equal to or less than 500 μm.As α+3o ' increase, resin seal
The fire resistance characteristic of part tends to reduce, and as α+3o ' increase, the decline degree of fire resistance characteristic is tended to increase.By full
Foot α+3o '≤500 as described above, fully can realize including the fire resistance characteristic of the electronic component unit of electronic component.
Electronic component unit can be manufactured by carrying out stock preparation process, mixed process and coating foam process.In original
In material preparation process, the second material liquid of the first material liquid and viscosity less than the first material liquid is prepared for.Make the first material liquid with
Second material liquid mixes to produce thermosetting resin.Therefore, thermosetting resin is so-called two liquid mixed type.In mixed process
In, the first material liquid is discharged from first row delivery nozzle, the second material liquid is discharged from second row delivery nozzle, and in discharge,
The first material liquid is set to collide and mix with the second material liquid.In this case, first row delivery nozzle is at least partially heated, is made
The viscosity reduction of the first material liquid is obtained, and the first material liquid is discharged from first row delivery nozzle.Therefore, in mixed process,
The first material liquid is mixed with the second material liquid, and the first material liquid can be made more uniformly to be mixed with the second material liquid
Close.
Foam process is coated by using the mixed uniformly resin mixture liquor in mixed process, can make to be set in foaming
The connecting hole being attached between the foam hole of fat is reduced, and can reduce the major diameter size of connecting hole.Therefore, can produce by
Meet the resin seal that the Foamex of relation α+3o '≤500 is made, and the electronics with excellent fire resistance characteristic can be produced
Cell.Additionally, during stock preparation process, mixed process and coating foam, can manufacture using foaming agent without making
With the resin seal being made up of Foamex of microballoon capsule.Therefore, it can with low cost manufacture lightweight and with excellent
The electronic component of good fire resistance characteristic.
Although describing the disclosure with reference to embodiment of the disclosure, however, it is understood that the disclosure is not limited to the implementation
Example and configuration.The disclosure is intended to include various modifications and equivalent arrangements.In addition, although describe multiple combination and configuration, but
Other combinations and configuration including more, less or only a single key element are also in spirit and scope of the present disclosure.
Claims (13)
1. a kind of electronic component unit (1), including：
Electronic component (2)；With
The resin seal (3) of the electronic component (2) is coated,
Wherein described resin seal (3) is made up of the Foamex by making thermosetting resin foam and producing, and
Wherein, the major diameter chi of the connecting hole (301,302,303,304) for being connected between the foam hole of the Foamex
Very little distribution, o ' μm of α μm of the average value of the major diameter size of the connecting hole (301,302,303,304) and standard deviation are full
The relation of sufficient α+3o '≤500.
2. electronic component unit (1) according to claim 1, wherein
For the distribution of the major diameter size of the connecting hole (301,302,303,304), α μm of the average value and the mark
O ' μm of quasi- deviation meets the relation of α+3o '≤250.
3. electronic component unit (1) according to claim 1, wherein
The thermosetting resin is polyurethane resin.
4. electronic component unit (1) according to claim 1, wherein
The resin seal (3) is 15 to 45 in 25 DEG C of A type hardness tester meters hardness.
5. electronic component unit (1) according to claim 1, wherein
The electronic component unit (1) is for the vehicles.
6. electronic component unit (1) according to any one of claim 1 to 5, wherein
The part of the electronic component unit (1) including the electronic component (2) exposes from the resin seal (3)
The expose portion (11) for coming.
7. the manufacture method that one kind passes through the electronic component unit (1) with resin seal (3) coating electronic component (2) formation,
The resin seal (3) is made by by making the Foamex of the two resin expanded generations of liquid hybrid thermosetting, the manufacture
Method includes：
The first material liquid (31) and the second material liquid (32) are prepared, by second material liquid (32) and first material liquid
(31) mix to generate the thermosetting resin, and the viscosity of second material liquid (32) is less than first material liquid
(31)；
I () makes that first material liquid (31) is expelled to cylinder (51) from first row delivery nozzle (515) and (ii) makes described
Two material liquids (32) are expelled to the cylinder from second row delivery nozzle (516)；
Make when first material liquid (31) and second material liquid (32) is discharged first material liquid (31) with it is described
Second material liquid (32) is collided and mixed, to produce the resin mixture liquor (33) comprising the thermosetting resin；
The resin mixture liquor (33) is injected into the electronic component (2) to be placed in the metal die in it；And
The thermosetting resin of the resin mixture liquor (33) is set to foam and solidify in the metal die (6), wherein
It is former to reduce described first the first row delivery nozzle (515) is at least partially heated in the collision and mixing
After the viscosity of feed liquid (31), first material liquid (31) is set to be discharged from the first row delivery nozzle (515),
The first row delivery nozzle is provided by the port of export of the first by-pass line separated from the first through hole (511,512), described
First material liquid passes through first through hole,
The second row delivery nozzle is provided by the port of export of the second by-pass line separated from the second through hole (513,514), described
Second material liquid passes through second through hole,
When piston (52) are inserted, first material liquid passes through first through hole without being discharged in the cylinder, and
And second material liquid passes through second through hole without being discharged in the cylinder, and
When being moved in the collision and piston described in mixing, first material liquid is added at first by-pass line
Heat and be discharged to the cylinder, and second material liquid is discharged to the cylinder.
8. the manufacture method of electronic component unit (1) according to claim 7, wherein
The viscosity of second material liquid (32) is equal to or less than 200mPas, and
In the collision and mixing, by heating the first row delivery nozzle (515), make the viscous of first material liquid (31)
Degree is reduced to equal to or less than 200mPas.
9. the manufacture method of electronic component unit (1) according to claim 7, wherein
In the collision and mix, first material liquid (31) is mixed with second material liquid (32) and be equal to producing
Or the resin mixture liquor (33) less than 50ml.
10. the manufacture method of electronic component unit (1) according to claim 7, wherein
In the mixing, the first row delivery nozzle (515) is heated by high-frequency induction heating.
The manufacture method of 11. electronic component units (1) according to claim 7, wherein
The thermosetting resin is polyurethane resin,
First material liquid (31) comprising polyalcohol, and
Second material liquid (32) is comprising isocyanate compound.
The manufacture method of 12. electronic component units (1) according to claim 7, wherein
The part of the electronic component unit (1) including the electronic component (2) exposes from the resin seal (3)
The expose portion (11) for coming.
The manufacture method of 13. electronic component unit (1) according to any one of claim 7 to 12, wherein
In the foaming, the temperature of the metal die (6) is adjusted to equal to or more than 50 DEG C and less than 100 DEG C.
Applications Claiming Priority (4)
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| JP2013109840 | 2013-05-24 | ||
| JP2013-109840 | 2013-05-24 | ||
| JP2014-078456 | 2014-04-07 | ||
| JP2014078456A JP6323129B2 (en) | 2013-05-24 | 2014-04-07 | Electronic component unit and manufacturing method thereof |
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| CN104175679A CN104175679A (en) | 2014-12-03 |
| CN104175679B true CN104175679B (en) | 2017-06-09 |
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| CN110196357A (en) * | 2019-06-19 | 2019-09-03 | 南通海星电子股份有限公司 | A kind of electrode foil for aluminum electrolytic capacitors single side specific volume test method |
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| CN1247496A (en) * | 1997-02-17 | 2000-03-15 | 拜尔公司 | Method and device for producing polyurethanes containing filling materials |
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| CN102037044A (en) * | 2007-11-08 | 2011-04-27 | Sika技术股份公司 | Polyurethane foam |
| CN102216045A (en) * | 2008-11-27 | 2011-10-12 | 井上株式会社 | Mixing head apparatus and molding method using the apparatus |
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| US3892389A (en) * | 1972-11-29 | 1975-07-01 | Bekaert Sa Nv | Device and method for injecting liquids into a mixing head |
| CN1247496A (en) * | 1997-02-17 | 2000-03-15 | 拜尔公司 | Method and device for producing polyurethanes containing filling materials |
| CN102037044A (en) * | 2007-11-08 | 2011-04-27 | Sika技术股份公司 | Polyurethane foam |
| US20090241331A1 (en) * | 2008-03-25 | 2009-10-01 | Commercial Vehicle Group, Inc. | System and Method of Forming a Protective Covering for a Wire Harness |
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