CN104175679A - Electronic element unit and manufacturing method thereof - Google Patents
Electronic element unit and manufacturing method thereof Download PDFInfo
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- CN104175679A CN104175679A CN201410220382.9A CN201410220382A CN104175679A CN 104175679 A CN104175679 A CN 104175679A CN 201410220382 A CN201410220382 A CN 201410220382A CN 104175679 A CN104175679 A CN 104175679A
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Abstract
The invention provides an electronic element unit (1) which comprises an electronic element (2) and a resin sealing piece (3) coating the electronic element (2). The resin sealing piece (3) is made of foamed resin generated by foaming of thermosetting resin. The distribution of long diameter sizes of connecting holes (301, 302, 303, 304) connected in the foamed resin is characterized in that the average value of the long diameter sizes [alpha] [mu]m and a standard deviation o' [mu]m accords with the following relationship: [alpha] +3 o'<=500. In addition, a manufacturing method of the electronic element unit (1) is provided. The manufacturing method comprises a raw material liquid preparing process, a mixing process and a foam coating process.
Description
Technical field
The disclosure relates to electronic component unit and manufacture method thereof, and described electronic component unit provides by using the resin seal of being made by the foaming body of thermosetting resin to apply electronic component.
Background technology
Recently, electronic component is also used in a plurality of technical fields of mobile terminal except polytype electronic device, vehicles etc.Because need electronic component to there is fire resistance characteristic, thus for example developed a kind of electronic component unit, in this electronic component unit by the resin-sealed all print wiring board (whole printed wiring board) that comprises electronic component that completes.For the vehicles and mobile terminal, also need to reduce the weight of electronic component.Use is by making thermosetting resin if the Foamex of the foaming generations such as polyurethane is as the resin seal for resin-sealed.
The material liquid of at least two types is mixed, make polymerizable raw material to produce thermosetting resin, and make thermosetting resin foaming, to two liquid mixed types (two-liquid mixing type) foam thermal thermosetting resin is used as to Foamex.Particularly, for example, disclose the technology that applies electronic component with obturator-type (closed cell type) polyurathamc, described polyurathamc is by making polyurethane foam that (with reference to patent document 1) is provided with microballoon capsule.
Patent document 1:JP-A-2001-352156
Applicant of the present invention has found the following fact:
In any case, compare with the Foamex that uses blowing agent not use microballoon capsule to produce as physical blowing agent, CBA etc., the Foamex that uses microballoon capsule to produce may make manufacturing cost increase.In addition, in the Foamex that uses microballoon capsule to produce, the viscosity of liquid resin raw material may increase, and between the mixing of raw material or element to be sealed, the filling in gap can be insufficient.On the other hand, when not manufacturing Foamex with microballoon capsule with blowing agent, the gasification of blowing agent, gas such as emit at the connecting hole (connection hole) that is easy to cause between the foam hole (foamed cell) that is connected to Foamex to be increased.Therefore, can make the fire resistance characteristic of the resin seal made by Foamex reduce.
Summary of the invention
An object of the present disclosure is to provide electronic component unit and manufacture method thereof, and described electronic component unit is with low-cost and lightweight manufacture, and has excellent fire resistance characteristic.
According to first aspect of the present disclosure, provide a kind of electronic component unit that comprises electronic component and apply the resin seal of described electronic component.Resin seal is by making by the Foamex that thermosetting resin foaming is produced.For the distribution that is connected to the major diameter size of the connecting hole between the foam hole of Foamex, the mean value α μ m of major diameter size and standard deviation o ' μ m meet the relation of α+3o '≤500.
According to another aspect of the present disclosure, provide by apply the manufacture method of the electronic component unit of electronic component generation with resin seal.Resin seal is by by making the Foamex of the resin expanded generation of two liquid hybrid thermosettings.Described manufacture method comprises preparation the first material liquid and the second material liquid, make the first material liquid discharge and make in addition the second material liquid discharge from second row delivery nozzle from first row delivery nozzle, when discharging, make the first material liquid collide and mix with the second material liquid, the resin mixture liquor that generation comprises thermosetting resin, resin mixture liquor is injected to electronic component and be placed metal die within it, and make the thermosetting resin of resin mixture liquor in metal die, foam and solidify.The second material liquid is mixed with Heat of Formation thermosetting resin with the first material liquid, and the viscosity of the second material liquid is lower than the first material liquid.When colliding and mix, heating at least partly first row delivery nozzle with after reducing the viscosity of the first material liquid, the first material liquid is discharged from first row delivery nozzle.
According to electronic component unit and manufacture method thereof, can provide electronic component unit and the manufacture method thereof of not using microballoon capsule.Can low cost and lightweight ground manufacture electronic component unit.Electronic component unit can have good fire resistance characteristic.
Accompanying drawing explanation
By the following detailed description with reference to accompanying drawing, above and other object of the present disclosure, feature and advantage will become more obvious.In the accompanying drawings:
Fig. 1 is the figure that the cross section structure of electronic component unit in the first embodiment is shown;
Fig. 2 is the integrally-built figure that schematically shows foam-formed device in the first embodiment;
Fig. 3 illustrates the figure that mixes the partial cross section structure of injection device under the state that makes material liquid circulation in the first embodiment;
Fig. 4 illustrates the zoomed-in view that mixes the partial cross section of the first column side wall in injection device in the first embodiment;
Fig. 5 illustrates the figure that mixes the partial cross section's structure under the state of injection device in material liquid is discharged to the first cylinder in the first embodiment;
Fig. 6 illustrates the figure that mixes the partial cross section's structure under the state of injection device in resin mixture liquor is sent to the second cylinder in the first embodiment;
Fig. 7 is the figure that the cross section structure of the metal die that clamps electronic component in the first embodiment is shown;
Fig. 8 illustrates the figure that resin mixture liquor in the first embodiment is injected into the cross section structure of the metal die in its cavity;
Fig. 9 is temperature T (K) that the first material liquid in the first embodiment is shown and the figure of the relation of viscosities il (mPas);
Figure 10 A is the scanning electron micrograph (50 x magnification) that the cross section of foamed resin products in the first embodiment (resin seal) is shown;
Figure 10 B is the figure corresponding to Figure 10 A;
Figure 11 A is the zoomed-in view that the region XIA in the scanning electron micrograph of Figure 10 A is shown;
Figure 11 B is the figure corresponding to Figure 11 A;
Figure 12 A illustrates the figure that determines oval method in the first embodiment based on five points in connecting hole outer rim;
Figure 12 B is the figure corresponding to Figure 12 A;
Figure 13 is the figure that Figure 12 elliptic equation that A describes is shown;
Figure 14 illustrates Figure 12 A to describe oval centre coordinate (X
0, Y
0) the figure of accounting equation;
Figure 15 illustrates the figure that Figure 12 A describes the accounting equation of oval inclination angle [theta];
Figure 16 illustrates the figure that Figure 12 A describes the accounting equation of oval length a;
Figure 17 illustrates the figure that Figure 12 A describes the accounting equation of oval length b;
Figure 18 illustrates determinant of coefficient A, the B being calculated by elliptic equation, the figure of C, D;
Figure 19 is the figure that the major diameter size of connecting hole in Foamex (α+3o ') and the relation of water seepage distance are shown in the embodiment of the present invention and comparative example;
Figure 20 is the figure that the major diameter size of connecting hole in Foamex (α+3o ') and the relation of water seepage distance apart from electronic component unit expose portion are shown in the embodiment of the present invention and comparative example; And
Figure 21 A to 21C be the first material liquid and the composition of the second material liquid in the embodiment of the present invention and comparative example are shown, the temperature of the first material liquid, the viscosity of the first material liquid, the figure of the character of resin seal.
Detailed Description Of The Invention
As follows, will describe according to an embodiment of the present disclosure.
The resin seal that comprises electronic component and the described electronic component of coating according to the electronic component unit of the present embodiment.Resin seal is by making by the Foamex that thermosetting resin foaming is provided.
The thermosetting resin using in the disclosure can be two liquid hybrid thermosetting resins.Particularly, for example, thermosetting resin can be polyurethane resin, epoxy resin, phenol resin, unsaturated polyester resin, melamine resin etc.Preferably use polyurethane resin.In the situation that using polyurethane resin, the advantage that can exist some that excellent feature is provided, for example low elasticity, high-adhesiveness and rapidly-curable, and smell is relatively little.
Electronic component unit can be manufactured by carrying out raw material preparation process, mixed process and coating foam process.For example, in raw material preparation process, preparation the first material liquid and the second material liquid, the viscosity of described the second material liquid is lower than the first material liquid.For example, in mixed process, make the first material liquid discharge and make the second material liquid to discharge from second row delivery nozzle from first row delivery nozzle, make the first material liquid collide and mix with the second material liquid, the resin mixture liquor that comprises thermosetting resin is provided.For example, in applying foam process, resin mixture liquor is injected to electronic component and be placed metal die within it, and make the thermosetting resin of resin mixture liquor in metal die, foam and solidify.
In material liquid preparation process, preparation the first material liquid and the second material liquid.When the first material liquid is mixed with the second material liquid, the raw material of thermosetting resin carries out polymerization, thereby thermosetting resin can be provided.Except the raw material of thermosetting resin, the first material liquid and the second material liquid also can comprise curing catalysts, blowing agent, foam stabiliser etc.Curing catalysts, blowing agent, foam stabiliser etc. can be added in any of the first material liquid and the second material liquid, or it not only can be added to the first material liquid but also adds in the second material liquid.Can suitably select curing catalysts and foam stabiliser according to the type of thermosetting resin.Can use physical blowing agent, CBA etc. as blowing agent.
In mixed process, the first material liquid is discharged from first row delivery nozzle, the second material liquid is discharged from second row delivery nozzle, and when discharging, make the first material liquid collide and mix with the second material liquid.In this case, heat at least partly first row delivery nozzle, make the reduced viscosity of the first material liquid and the first material liquid is discharged.Because the viscosity of the second material liquid is equal to or less than 200mPas, so preferably, by heating first row delivery nozzle, make the viscosity of the first material liquid be reduced to and be equal to or less than 200mPas when first row delivery nozzle is discharged at the first material liquid.In this case, can guarantee that the affinity between the first material liquid and the second material liquid increases.Therefore,, in mixed process, can more guarantee that the first raw material mixes equably with the second raw material.Therefore, the connecting hole of Foamex can be guaranteed to reduce, and the major diameter size of connecting hole can be guaranteed to reduce.In addition, the length of major diameter size Expressing connecting hole major diameter.
In mixed process, preferably make the first material liquid mix with the second material liquid, and 50ml or resin mixture liquor are still less provided.In this case, by carrying out the above-mentioned advantage of material liquid preparation process, mixed process and coating foam process implementation, can be significant.Therefore, for example,, when use mixing injection device etc. and make the first material liquid mix with the second material liquid and produce 50ml or a small amount of resin mixture liquor still less, in general, the mixing of material liquid may be not enough, and the major diameter size of the number of connecting hole and Foamex can increase.As mentioned above, even when by carrying out material liquid preparation process, mixed process and coating foam process while producing 50ml or a small amount of resin mixture liquor still less, also can make resin mixture liquor evenly mix, the number of connecting hole and the major diameter size of Foamex can be reduced.From similar viewpoint, in mixed process, preferably produce the resin mixture liquor that is equal to or less than 30ml.
In applying foam process, can make thermosetting resin foam with any expansion ratio.Particularly, for example, expansion ratio can be 2 to 30.By expansion ratio being set in this scope, can manufacture electronic component unit, wherein resin seal be lightweight and electronic component unit there is excellent fracture strength.
(the first embodiment)
As follows, with reference to the accompanying drawings electronic component unit and manufacture method thereof are described.As Fig. 1 describes, the electronic component unit 1 in the present embodiment comprises electronic component 2 and applies the resin seal 3 of electronic component 2.Resin seal 3 is made by foaming polyurethane resin.Electronic component unit 1 in the present embodiment is the electronic control unit (ECU) for the vehicles and has printed substrate 20 as electronic component 2.Electronic circuit (not shown) is arranged on printed substrate.Printed substrate 20 (printed substrates 20) is the plate that 60mm is long, 67mm is wide, 1.6mm is thick, and is made by general glass epoxide substrate.On the two sides of printed substrate 20, polytype semiconductor element 21,22,23 is installed and corresponding to the connector 24 of printed substrate 20 external connection terminals.Semiconductor element 21,22,23 is coated with resin seal 3 completely.A part for connector 24 is coated with resin seal 3 with integrated with printed substrate 20, and another part of connector is exposed to the external world.In addition, outside the end face 201 of a part for printed substrate 20 and printed substrate 20 is also exposed to.That is to say, electronic component unit 1 comprises the expose portion 11 that seal 12 that electronic component 2 is sealed by resin seal 3 and electronic component 2 parts expose.
As Fig. 2 to Fig. 8 describes, the electronic component unit 1 in the present embodiment can be manufactured with foam-formed device 4, and described foam-formed device 4 has two head tanks 41,42, mixes injection device 5 and metal die 6.Particularly, first, by the polyalcohol of 100 mass parts Dow Chemical Ltd. " SPECFLEX NC630 (mean molecule quantity is 7400) ", the polyalcohol of 40 mass parts Sanyo Chemical Industries Ltd. " TP-400 (mean molecule quantity is 400) ", the water of 3 mass parts (blowing agent), 1 mass parts Dow Corning Toray Co., Ltd. foam stabiliser " SZ-1327 (polyethylene oxide alkyl ethers) ", the 4-methyl hexamethylene diamine (curing catalysts B) of the triethylenediamine of 0.3 mass parts (curing catalysts A) and 0.5 mass parts drops in the first head tank 41 (with reference to Fig. 2).Polyalcohol is corresponding to for providing first raw material (raw material of polyalcohol aspect) of two liquid hybrid thermosetting resins (polyurethane resin).Then, by making the contents mixed in the first head tank 41, obtain the first material liquid 31.
The first material liquid 31 is 1240mPas the viscosity of 25 ℃.The temperature T (K) of the first material liquid 31 and the relation between viscosities il (mPas) have been described in Fig. 9.In Fig. 9, transverse axis is corresponding to 1/T, and the longitudinal axis is corresponding to the natural logrithm ln (η) of viscosities il, and 1/T and the proportional relation of natural logrithm ln (η).In addition, in Fig. 9, longitudinal axis ln (η) is represented by following formula by so-called Andrade (Andrade) equation: ln (η)=lnA+ (E/RT).η is corresponding to viscosity, and A is corresponding to constant value, and E is corresponding to viscous flow activation energy, and R is corresponding to gas constant, and T is corresponding to absolute temperature.
In addition,, by 4 of 40 mass parts, the toluene di-isocyanate(TDI) (TDI) of 4 '-'-diphenylmethane diisocyanate (MDI) and 25 mass parts drops in the second head tank 42 (with reference to Fig. 2).Isocyanates is corresponding to the second raw material (raw material of isocyanates aspect) that two liquid hybrid thermosetting resins (polyurethane resin) are provided.Then, by making the contents mixed in the second head tank 42, obtain the second material liquid 32.
Then, make the first material liquid 31 in the first head tank 41 maintain 40 ℃, and make the first material liquid 31 the first head tank 41 with mix between injection device 5 circulation.The first material liquid 31 is 505mPas the viscosity of 40 ℃.Make the second material liquid 32 in the second head tank 42 maintain 40 ℃, and make the second material liquid 32 the second head tank 42 with mix between injection device 5 circulation.The second material liquid 32 is 110mPas the viscosity of 40 ℃.The first head tank 41 is connected with mixing injection device 5 use pipelines 415,416, and the second head tank 42 is connected with mixing injection device 5 use pipelines 425,426.
As described in Figure 3, mix injection device 5 and comprise first cylindrical column 51 of placing with horizontal direction and the first piston 52 sliding with horizontal direction in the first cylinder 51.In addition, mix injection device 5 and also comprise second cylindrical column 53 of placing with vertical direction and the second piston 54 sliding with vertical direction in the second cylinder 53.
As described in Figure 3, in the sidewall 510 of the first cylinder 51, be provided with the through hole (penetration hole) 511,512 that penetrates sidewall 510, and in the side surface 520 of first piston 52, be provided with depression 521.At first piston 52, be inserted under the state of head portion 517 1 sides (right in Fig. 3) of the first cylinder 51, through hole 511,512 and depression 521 form the passage of the first material liquids 31.Therefore, as shown in Figures 2 and 3, the first material liquid 31 that is sent to mixing injection device 5 by the first head tank 41 by pipeline 415 passes through the through hole 511 forming on the sidewall 510 at the first cylinder 51 in porch.The first material liquid 31, by the depression 521 of first piston 52, passes through pipeline 416 in the through hole 512 forming on the sidewall 510 at the first cylinder 51 in exit, again return to the first head tank 41.As mentioned above, the first material liquid 31 the first head tank 41 with mix between injection device 5 circulation.
As described in Figure 3, in the sidewall 510 of the first cylinder 51, be provided with other through holes 513,514 except through hole 511,512, and in the side surface 520 of first piston 52, be provided with another depression 522 except depression 521.At first piston 52, be inserted under the state of head portion 517 1 sides (right in Fig. 3) of the first cylinder 51, through hole 513,514 and depression 522 provide the passage of the second material liquid 32.Therefore, similar with the situation of the first material liquid, the second material liquid 32 that is sent to mixing injection device 5 by the second head tank 42 by pipeline 425 passes through through hole 513 in porch, and by depression 522.The second material liquid 32 is passed through pipeline 426 in exit by through hole 514, again return to the second head tank 42 (with reference to Fig. 2 and Fig. 3).As mentioned above, the second material liquid 32 also the second head tank 42 with mix between injection device 5 circulation.
In addition, as described in Figure 3, in each through hole 511,513 of porch, be all provided with by-pass line 515,516 separately, by-pass line 515,516 respectively separates in through hole 511,513, and is connected to the interior section 519 of the first cylinder 51.As described in Figure 3, be inserted under the state of head portion 517 1 sides of the first cylinder 51 at first piston 52, port of export 515a, the 516a of by-pass line 515,516 is by side surface 520 blocking-up of first piston 52.Therefore, the first material liquid 31 and the second material liquid 32 are not discharged in the first cylinder 51, and as mentioned above head tank 41,42 separately with mix circulation between injection device 5.In this case, the first material liquid 31 is retained in the by-pass line 515 of the first material liquid side, and the second material liquid 32 is retained in the by-pass line 516 of the second material liquid side.
In addition, by-pass line 515 can be described as first row delivery nozzle, and by-pass line 516 can be described as second row delivery nozzle.
In addition as described in Figure 4, for the solenoid coil 57 of high-frequency eddy-current heating, be centered around around the by-pass line 515 of the first feed side.By the first material liquid 31 in coil 57 heating by-pass lines 515.In the present embodiment, the first material liquid 31 is heated to 80 ℃, makes the reduced viscosity of the first material liquid 31 in by-pass line 515 to 132mPas.In addition, the first material liquid is obtained by Fig. 9 in the viscosity of predetermined temperature.
As described in Figure 5, when first piston 52 is moved into end portion 518 1 sides (left in Fig. 5 to) of the first cylinder 51, port of export 515a, the 516a of by-pass line 515,516 are opened.Therefore, the by-pass line 515 of the first material liquid side provides first row delivery nozzle 515, for making the first material liquid 31 be discharged to the interior section 519 of cylinder.The by-pass line 516 of the second material liquid side provides second row delivery nozzle 516, for making the second material liquid 32 be discharged to the interior section 519 of cylinder.Therefore, the first material liquid 31 and the second material liquid 32 separately with the direction of arrow described in Fig. 5 from the interior section 519 that first row delivery nozzle 515 separately and second row delivery nozzle 516 are discharged to the first cylinder 51.The first material liquid 31 and second material liquid of having discharged collide and mix in the interior section 519 of the first cylinder 51.By mixing, polymerization is carried out, thereby obtained the resin mixture liquor that comprises polyurethane resin.In the present embodiment, after mixing, obtained 10ml resin mixture liquor.
In the present embodiment, the internal diameter φ of by-pass line 515,516 is 10mm, and total length is 102mm.The cumulative volume of by-pass line 515,516 can be according to the discharge rate appropriate change of material liquid.In the present embodiment, the mixing ratio of the first material liquid 31 and the second material liquid 32 is adjusted, made the mixing ratio of polyalcohol and isocyanates count by volume 1:1.
As described in Fig. 5 and Fig. 6, at the second piston 54, be moved under the state of end portion 538 1 sides (the upper direction of Fig. 6) of the second cylinder 53, first piston 52 is moved into head portion 517 1 sides (right in Fig. 6) of the first cylinder 51.Therefore, the resin mixture liquor 33 in the first cylinder 51 interior sections 519 is transferred in the interior section 539 of the second cylinder 53.
In addition, as described in Figure 7, the head portion 537 of the second cylinder 53 is connected with metal die 6.Metal die 6 is by mold 61 and bed die 62 structures and in inside, comprise cavity 63.In cavity 63, place electronic component 2.Polytype semiconductor element 21,22,23 and connector 24 are installed to the printed substrate 20 in electronic component 2.As described in Figure 7, electronic component 2 is clamped by metal die 6, and a part for printed substrate 20 and connector 24 is exposed to outside cavity 63.That is to say, under the state outside the part of electronic component 2 is exposed to the cavity 63 of metal die 6, electronic component 2 is placed in cavity 63.In addition,, under the state at the end face 201 of printed substrate 20 near cavity 63 inner surfaces of metal die 6, electronic component 2 is placed in cavity 63.In this state, by electronic component 2 is placed in metal die 6, as described below, can be filled in cavity 63 and after being cured in resin mixture liquor, the electronic component unit 1 (with reference to Fig. 1) with expose portion 11 is provided.In addition, in mold 61, be provided with for resin mixture liquor being introduced to the leading-in end 64 of cavity 63.
As mentioned above, when the second piston 54 is moved into head portion 537 1 sides (the lower direction in Fig. 6 to Fig. 8), the resin mixture liquor 33 (with reference to Fig. 6) being sent in the second cylinder 53 interior sections 539 is injected cavity 63 (with reference to Fig. 6 to Fig. 8) by the leading-in end 64 that is heated in advance the metal die 6 of predetermined temperature.In the present embodiment, the temperature of metal die is 80 ℃.By making thermosetting resin in resin mixture liquor 33 in the interior foaming of cavity 63 and solidifying, produced the resin seal 3 (with reference to Fig. 1) of being made by foaming polyurethane resin.In the present embodiment, the isocyanate reaction in the water in the first material liquid and the second material liquid, has generated carbon dioxide and has worked to serve as blowing agent.
Therefore, as described in Figure 1, provide such electronic unit 1, its resin seal 3 by electronic component 2 and the described electronic component 2 of covering is made.The composition of the first material liquid when the electronic component unit in manufacturing the present embodiment has been described in Figure 21 A to Figure 21 C, temperature and viscosity, the composition of the second material liquid and the temperature of metal die when the first material liquid is discharged from first row delivery nozzle.In addition, for the electronic component unit 1 obtaining in the present embodiment, studied in electronic component 2 filling of resin around.Particularly, the cross section of visual observations electronic component unit 1, and check at electronic component 2 whether have living space around.This space provides because of potting resin not.When not observing space, determine that it is good filling, and when observing space, determine that it is bad filling.In Figure 21 A to Figure 21 C, result has been described.
Carry out evaluation test to evaluate the quality of the resin seal 3 of the electronic component unit 1 obtaining in the present embodiment.Particularly, manufacturing test part individually under the identical condition of the resin seal with manufacturing electronic component in the present embodiment.Test block is the rectangle foamed resin products of 65 * 70 * 18mm.With test block, evaluate.Afterwards, each evaluation test is made an explanation.
" the major diameter size of connecting hole "
Locate at an arbitrary position to cut test block, by SEM (SEM), with the magnifying power of 50 times, observe cross section, and take pictures.An example of SEM photo has been shown in Figure 10 A and Figure 10 B.In Figure 10 A and Figure 10 B, aterrimus part is corresponding to connecting hole.As shown in Figure 11 A and Figure 11 B, connecting hole has overlapping part.In this case, as described in the dotted line in Figure 11 A and Figure 11 B, overlapping connecting hole is broken down into a plurality of connecting holes 301,302,303,304, and measures the major diameter size of each connecting hole 301,302,303,304.When measuring major diameter size, for each connecting hole 301,302,303,304, along external curve, select arbitrarily five points, as described in Figure 12 A and Figure 12 B.Five points are considered to coordinate, by least square method, have determined the elliptical shape by the expression formula explanation described in Figure 13 and described five points of process.In Figure 12 A and 12B, an example has been described to determine the elliptical shape for connecting hole 303 in Figure 11 A and Figure 11 B.In described elliptical shape, the major diameter that the expression formula in Figure 13 is described is defined as the major diameter size of connecting hole 303.Centre coordinate (X in Figure 12 A and Figure 12 B
0, Y
0) expression formula in Figure 14 describes.In Figure 12 A and Figure 12 B, the expression formula of the inclination angle [theta] of ellipse in Figure 15 described.The expression formula of length a in Figure 12 A and Figure 12 B in Figure 16 described.The expression formula of length b in Figure 12 A and Figure 12 B in Figure 17 described.In addition, the A in Figure 14 to Figure 17, B, C and the D determinant computation in Figure 18.Xi in Figure 18 and Yi are corresponding to the arbitrary coordinate on ellipse in Figure 12 A and Figure 12 B.And then (2 * data a), have obtained the distribution of major diameter size, and have calculated the value of the data of α+3o ' (α is corresponding to mean value, and o ' is corresponding to standard deviation) to have calculated major diameter size for 50 connecting holes.Result of calculation is shown in Figure 21 A to Figure 21 C.In addition, use by Nippon Avionics Co., the image analysis apparatus " SPICCA " that Ltd. manufactures is measured, and carries out the binarization of SEM photograph image, and calculates major diameter size by detecting elliptical shape.
" A type hardness tester meter hardness "
According to the regulation of JIS K6253 (1997), measured test block at the durometer hardness (A type) of 25 ℃.The results are shown in Figure 21 A to Figure 21 C.
" the water seepage distance in simple body (simple body) "
By the test rectangle part of 65 * 70 * 18mm, made the test rectangle part of 10 * 70 * 18mm.Then, the surface of test block 10 * 18mm is defined as to bottom surface.In the water-soluble red ink that is 5mm by bottom surface immersion depth by test block, maintain 24 hours.Test block is taken out from red ink, and be dried 3 hours in the thermostatic chamber of 90 ℃.Along short transverse cutting test block, the maximum seepage distance (mm) for cross section test red ink apart from bottom surface.Measure the maximum seepage distance of four test blocks, and calculate mean value+3o ' (o ' corresponding to standard deviation) as the water seepage distance in the simple body of resin seal.In Figure 21 A to Figure 21 C, result has been described.
" fracture strength "
By the test rectangle part of 65 * 70 * 18mm, make JIS5 dumbbell shape sample (JIS dumbbell No.5) (thickness is 6mm), and measure tensile break strength according to JIS K6251 (1993).Extension speed in measurement is set as 20mm/min.Measured the fracture strength of 20 test blocks, and the value of mean value-3o ' (o ' corresponding to standard deviation) has been shown in Figure 21 A to Figure 21 C.
Then, the water seepage distance of having measured in the electronic component unit 1 providing in the present embodiment apart from expose portion 11 as described below.Fire resistance characteristic in the expose portion 11 of electronic component unit 1 has been carried out evaluating (with reference to Fig. 1).
" apart from the water seepage distance of expose portion "
Expose portion 11 1 sides of a part for electronic component unit 1 electronic component unit 1 in the present embodiment (being in particular the side that the end face 201 by printed substrate 20 exposes) (with reference to Fig. 1) are immersed in water-soluble red ink, maintain 24 hours.Subsequently, electronic component unit 1 is taken out from red ink and be in the constant temperature oven of 90 ℃ dry 3 hours in temperature.Subsequently, measure red ink by expose portion 11 to the maximum seepage distance (mm) in resin seal 3.Measure the maximum seepage distance of four test blocks of electronic component unit 1, and calculated mean value+3o ' (o ' corresponding to standard deviation).This is corresponding to the water seepage distance apart from expose portion.In Figure 21 A to Figure 21 C, result has been described.
(the second embodiment)
In the present embodiment, except the first material liquid is become 100 ℃ by the heating-up temperature that high-frequency load coil is realized, manufactured similarly electronic component unit with the first embodiment.When heating-up temperature is set to 100 ℃, the viscosity of the first material liquid is 71mPas.In the present embodiment, with the first embodiment similarly, carried out the evaluation of resin filling.In addition, in the present embodiment, with the situation of the first embodiment similarly, under the condition identical with resin seal, produced the test block of being made by foamed resin products, and measured major diameter size, durometer hardness, water seepage distance and the fracture strength of connecting hole.In addition, measured the water seepage distance apart from electronic component unit expose portion.The results are shown in Figure 21 A to Figure 21 C.
(the 3rd to the 6th embodiment)
In the 3rd to the 5th embodiment, except being each temperature illustrating in following Figure 21 A to Figure 21 C by the temperature change of metal die, provide similarly electronic component unit with the first embodiment.In addition, in the 6th embodiment, except the first material liquid is become to 70 ℃ and make the temperature of metal die changes as described in Figure 21 A to Figure 21 C, to provide similarly electronic component unit with the first embodiment by the heating-up temperature that high-frequency load coil is realized.In addition, in the present embodiment, with the first embodiment similarly, carry out the evaluation of resin filling.In addition, also in the present embodiment, with the situation of the first embodiment similarly, under the condition identical with resin seal, produce the test block of being made by foamed resin products, and measured the major diameter size, durometer hardness of connecting hole, water seepage distance and the fracture strength in simple body.In addition, measured similarly the water seepage distance apart from electronic component unit expose portion with the first embodiment.These the results are shown in Figure 21 A to Figure 21 C.
(first to fourth comparative example)
In these embodiments, the by-pass line that is used in the first feed side does not around comprise that the mixing injection device of high-frequency load coil has produced electronic component unit.Therefore,, when the first material liquid is mixed with the second material liquid, the first material liquid is not heated.In the first comparative example, the first raw material that to use the viscosity of 40 ℃ be 510mPas.In the second comparative example, the first material liquid that to use the viscosity of 30 ℃ be 770mPas.In the 3rd comparative example, the first material liquid that to use the viscosity of 250 ℃ be 1240mPas.In the 4th comparative example, the first material liquid that to use the viscosity of 20 ℃ be 1600mPas.Other points are similar with the first embodiment, thereby produce according to the electronic component unit of first to fourth comparative example.In first to fourth comparative example, with the situation of the first embodiment similarly, carry out the evaluation of resin filling.In each of first to fourth comparative example, with the situation of the first embodiment similarly, under the condition identical with resin seal, produce the test block of being made by foamed resin products, and measured the major diameter size, durometer hardness of connecting hole, water seepage distance and the fracture strength in simple body.In addition, with the situation of the first embodiment similarly, measured the water seepage distance apart from electronic component unit expose portion.These the results are shown in Figure 21 A to Figure 21 C.
(comparison of the first to the 6th embodiment, first to fourth comparative example)
Based on Figure 21 A to Figure 21 C, by the major diameter size of connecting hole (α+3o ': μ m) with simple body in water seepage distance (mm) be related to drafting pattern.The results are shown in Figure 19.As described in Figure 21 A to 21C and Figure 19, along with the major diameter size of Foamex connecting hole (α+3o ') reduces, water seepage distance can reduce, and can make fire resistance characteristic increase.Along with major diameter size increases, the increase degree of water seepage distance also increases.Therefore,, by major diameter size being set as being equal to or less than 500 μ m, water seepage distance is can be enough short and can realize good high fire resistance characteristic.By same insight, preferably the major diameter size of connecting hole (α+3o ') is equal to or less than 250 μ m (α+3o '≤250).
As shown in Figure 21 A to Figure 21 C, the resin seal 3 of the electronic component unit 1 in the first to the 6th embodiment is made by foaming polyurethane resin, has good fire resistance characteristic, and has high rigidity meter hardness and high fracture strength (with reference to Fig. 1).Therefore, the electronic component unit 1 in the first to the 6th embodiment has good impact resistance.Therefore, the electronic component unit 1 in the first embodiment and the second embodiment is especially preferred for being mounted to the vehicles.When durometer hardness is less than 15, impact resistance may be not enough, and may especially be difficult to be applicable to the vehicles etc.On the contrary, when durometer hardness is greater than 35, the stress occurring in electronic component and welding electronic elements part increases, and reason is that the operating environment occurrence temperature of electronic component unit changes, thereby makes to destroy.Electronic component is sealed by resin seal.Therefore, can be preferably, the A type hardness tester meter hardness of resin seal 3 is 15 to 45, and more preferably 15 to 35.
In addition, based on Figure 21 A to Figure 21 C, by the major diameter size of Foamex connecting hole (α+3o ': μ m) with the drafting pattern that is related to apart from the water seepage distance of electronic component unit 1 expose portion.Result has been described in Figure 20.
As Figure 21 A to 21C and illustrated in fig. 20, along with the major diameter size of Foamex connecting hole (α+3o ': μ m) reduce, apart from the water seepage distance of expose portion 11 in electronic component unit 1, can reduce, can make fire resistance characteristic increase (with reference to Fig. 1).
In general, when electronic component unit 11 has the expose portion 11 that the part of electronic component 2 comes out from resin seal 3, water can be easily penetrated in resin seal 3 by expose portion 11, as described in first to fourth comparative example in Figure 21 A to Figure 21 C.Water can easily permeate from the electronic component 2 of exposure and the marginal portion of resin seal 3.In first to fourth embodiment in Figure 21 A to Figure 21 C, more much bigger than the water seepage distance in simple body apart from the water seepage distance of expose portion, thus can determine above-mentioned tendency.
On the contrary, as described in the first to the 6th embodiment in Figure 21 A to Figure 21 C, by the major diameter size of connecting hole is set as being equal to or less than 500 μ m, even when electronic component unit 1 has expose portion 11, also can be enough to anti-sealing and be penetrated in resin seal 3.That is to say, when electronic component unit 1 has expose portion 11, by the major diameter size of connecting hole is set as being equal to or less than 500 μ m, can further improve the effect of improving of fire resistance characteristic.In addition,, when electronic component unit 1 has expose portion 11, by the length of connecting hole is set as being equal to or less than 250 μ m apart from diameter, can reduce more the water seepage distance (with reference to Figure 20) apart from expose portion 11.
In the first to the 6th embodiment, in the manufacture method of electronic component, by the coil 57 for high-frequency eddy-current heating, heat at least partly first row delivery nozzle 515.Therefore,, after making the reduced viscosity of the first material liquid 31, make the first material liquid 31 mix (with reference to Fig. 3 to Fig. 5) with the second material liquid 32.Therefore, the first material liquid becomes and easily mixes with the second material liquid, and the first material liquid can mix more equably with the second material liquid.Therefore, can make the connecting hole connecting between the foam hole of Foamex reduce, and make the major diameter size reduction of connecting hole.Therefore, the resin seal being provided by the Foamex that meets the described α of relation+3o '≤500 can be manufactured, and the electronic component unit 1 with good fire resistance characteristic can be manufactured.
Especially, in the first to the 6th embodiment, the reduced viscosity that makes the first material liquid 31 to the level (viscosity be equal to or less than 200mPas) identical with the second material liquid 32 afterwards, make the first material liquid 31 mix (with reference to Fig. 3 to Fig. 5) with the second material liquid 32.Therefore, when the first material liquid 31 is mixed with the second material liquid 32, the affinity of material liquid can be determined increase, thereby evenly mixes.Therefore, can make the connecting hole of Foamex determine minimizing, and can make the major diameter size reduction of connecting hole.Therefore, can manufacture as described above the electronic component unit 1 (with reference to Fig. 1) with good fire resistance characteristic.Especially, in the present embodiment, as mentioned above, because the electronic component unit 1 (with reference to Fig. 1) with expose portion 11 is provided, so as mentioned above, reduce connecting hole size improving effect and can become apparent fire resistance characteristic.
In addition, in the first to the 6th embodiment, by carrying out high-frequency eddy-current heating, heating the first material liquid 31.Therefore, the first material liquid 31 can be by Fast Heating, thereby can make the viscosity fast reducing of the first material liquid.Thereby can improve the productivity ratio of electronic component unit 1.
In addition,, when resin mixture liquor 33 is injected to metal die 6, the temperature of metal die 6 can preferably be equal to or greater than 50 ℃ and be less than 100 ℃.As described in Figure 21 A to 21C, when the temperature of metal die 6 is less than 50 ℃ (with reference to embodiment 6), because the solidification rate of resin reduces, so may be difficult to make connecting hole to reduce.On the contrary, when the temperature of metal die 6 is equal to or greater than 100 ℃, the filling of resin can worsen (embodiment 5).
According to the first to the 6th embodiment, blowing agent can be used and the resin seal 3 that do not use the manufacture of microballoon capsule to be provided by Foamex.Therefore, can manufacture at low cost electronic component unit 1 lightweight and that there is good fire resistance characteristic.
In addition, in the first to the 6th embodiment, the first material liquid comprises polyalcohol, and the second material liquid comprises isocyanate mixture, and thermosetting resin is made by polyurethane resin.In this case, by add water in material liquid, make isocyanate mixture, react with water, generate carbon dioxide.Therefore, can easily carry out the foaming of thermosetting resin with low cost.
An aspect of the present disclosure provides electronic component unit.Described electronic component unit comprises electronic component and applies the resin seal of described electronic component.Resin seal comprises the Foamex by thermosetting resin foaming is produced.For the distribution of the major diameter size of the connecting hole connecting between the foam hole of Foamex, mean value α μ m and standard deviation o ' μ m meet the relation of α+3o '≤500.
Another aspect of the present disclosure provides by apply the manufacture method of the electronic component unit that electronic component produces with resin seal, and described resin seal is by by making the Foamex of the resin expanded generation of two liquid hybrid thermosettings.Described manufacture method comprises: material liquid preparation process, and preparation the first material liquid and the second material liquid, the second material liquid mixes to generate thermosetting resin with the first material liquid, and the viscosity of the second material liquid is less than the first material liquid; Mixed process, makes the first material liquid discharge and make in addition the second material liquid to discharge from second row delivery nozzle from first row delivery nozzle, makes the first material liquid collide and mix with the second material liquid, and produce the resin mixture liquor that comprises thermosetting resin when discharging; And apply foam process, resin mixture liquor is injected to electronic component and be placed metal die within it, and make the thermosetting resin of resin mixture liquor in metal die, foam and solidify.In mixed process, heat at least partly first row delivery nozzle to reduce the viscosity of the first material liquid, and the first material liquid is discharged from first row delivery nozzle.
In electronic component unit, resin seal can be by making thermosetting resin foam to produce such as physical blowing agent, CBA etc., and can with microballoon capsule, not manufacture.Therefore, can reduce the manufacturing cost of resin seal.In addition, therefore Foamex can be reduced to the use amount of per unit volume thermosetting resin as resin seal and its.From this viewpoint, can reduce the manufacturing cost of resin seal.Therefore, can reduce the manufacturing cost of electronic component unit.In addition,, in electronic component unit, because used the resin seal of being made by Foamex, can alleviate the weight of electronic component unit.
In addition,, in Foamex, the major diameter size of the connecting hole connecting between foam hole has changeability.In the distribution of the major diameter size of connecting hole, most of data are in the scope of α ± 3o '.Therefore, as mentioned above, meet the relation of α+3o '≤500, and the major diameter size major part of connecting hole can be equal to or less than 500 μ m.Along with α+3o ' increases, the fire resistance characteristic of resin seal tends to reduce, and along with α+3o ' increases, the decline degree of fire resistance characteristic is tended to increase.By meeting α+3o '≤500 as above, can realize fully the fire resistance characteristic of the electronic component unit that comprises electronic component.
Can manufacture electronic component unit by carrying out raw material preparation process, mixed process and coating foam process.In raw material preparation process, the first material liquid and viscosity have been prepared lower than the second material liquid of the first material liquid.Make the first material liquid mix to produce thermosetting resin with the second material liquid.Therefore, thermosetting resin is so-called two liquid mixed types.In mixed process, the first material liquid is discharged from first row delivery nozzle, the second material liquid is discharged from second row delivery nozzle, and when discharging, makes the first material liquid collide and mix with the second material liquid.In this case, heat at least partly first row delivery nozzle, make the reduced viscosity of the first material liquid, and the first material liquid is discharged from first row delivery nozzle.Therefore, in mixed process, can easily make the first material liquid mix with the second material liquid, and can make the first material liquid mix more equably with the second material liquid.
By using mixed uniformly resin mixture liquor in mixed process to apply foam process, can make the connecting hole connecting between the foam hole of Foamex reduce, and can make the major diameter size reduction of connecting hole.Therefore, can produce the resin seal that is related to that by meeting the Foamex of α+3o '≤500 is made, and can produce the electronic component unit with good fire resistance characteristic.In addition,, in raw material preparation process, mixed process and coating foam process, can manufacture the resin seal of being made by Foamex that uses blowing agent and do not use microballoon capsule.Therefore, can be with electronic component low cost fabrication lightweight and that there is good fire resistance characteristic.
Although described the disclosure with reference to embodiment of the present disclosure, it should be understood that, the disclosure is not limited to described embodiment and configuration.The disclosure is intended to comprise multiple modification and equivalent arrangements.In addition, although multiple combination and configuration have been described, comprise more, less or only a single key element other combination and configuration also in spirit and scope of the present disclosure.
Claims (13)
1. an electronic component unit (1), comprising:
Electronic component (2); With
Apply the resin seal (3) of described electronic component (2),
Wherein said resin seal (3) is by making by the Foamex that thermosetting resin foaming is produced, and
Wherein, for the distribution that is connected to the major diameter size of the connecting hole (301,302,303,304) between the foam hole of described Foamex, the mean value α μ m of the described major diameter size of described connecting hole (301,302,303,304) and standard deviation o ' μ m meet the relation of α+3o '≤500.
2. electronic component unit according to claim 1 (1), wherein
For the distribution of the described major diameter size of described connecting hole (301,302,303,304), described mean value α μ m and described standard deviation o ' μ m meet the relation of α+3o '≤250.
3. electronic component unit according to claim 1 (1), wherein
Described thermosetting resin is polyurethane resin.
4. electronic component unit according to claim 1 (1), wherein
Described resin seal (3) is 15 to 45 the A type hardness tester meter hardness of 25 ℃.
5. electronic component unit according to claim 1 (1), wherein
Described electronic component unit (1) is for the vehicles.
6. according to the electronic component unit described in any one in claim 1 to 5 (1), wherein
Described electronic component unit (1) comprises the expose portion (11) that a part for described electronic component (2) comes out from described resin seal (3).
7. one kind is passed through to use resin seal (3) to apply the manufacture method of the electronic component unit (1) of electronic component (2) formation, described resin seal (3) is by by making the Foamex of the resin expanded generation of two liquid hybrid thermosettings, and described manufacture method comprises:
Prepare the first material liquid (31) and the second material liquid (32), described the second material liquid (32) is mixed to generate described thermosetting resin with described the first material liquid (31), and the viscosity of described the second material liquid (32) is lower than described the first material liquid (31);
(i) make described the first material liquid (31) discharge and (ii) described the second material liquid (32) be discharged from second row delivery nozzle (516) from first row delivery nozzle (515);
When discharging described the first material liquid (31) and described the second material liquid (32), make described the first material liquid (31) collide and mix with described the second material liquid (32), to produce the resin mixture liquor (33) that comprises described thermosetting resin;
Described resin mixture liquor (33) is injected to described electronic component (2) and be placed metal die within it; And
Make the described thermosetting resin of described resin mixture liquor (33) foam and solidify in described metal die (6), wherein
In described collision mixing, heating at least partly described first row delivery nozzle (515) with after reducing the viscosity of described the first material liquid (31), described the first material liquid (31) is discharged from described first row delivery nozzle (515).
8. the manufacture method of electronic component unit according to claim 7 (1), wherein
The viscosity of described the second material liquid (32) is equal to or less than 200mPas, and
In described collision mixing, by heating described first row delivery nozzle (515), make the reduced viscosity of described the first material liquid (31) to being equal to or less than 200mPas.
9. the manufacture method of electronic component unit according to claim 7 (1), wherein
In described collision mixing, make described the first material liquid (31) mix the described resin mixture liquor (33) that is equal to or less than 50ml to produce with described the second material liquid (32).
10. the manufacture method of electronic component unit according to claim 7 (1), wherein
In described mixing, by high-frequency induction heating, heat described first row delivery nozzle (515).
The manufacture method of 11. electronic component units according to claim 7 (1), wherein
Described thermosetting resin is polyurethane resin,
Described the first material liquid (31) comprises polyalcohol, and
Described the second material liquid (32) comprises isocyanate compound.
The manufacture method of 12. electronic component units according to claim 7 (1), wherein
Described electronic component unit (1) comprises the expose portion (11) that a part for described electronic component (2) comes out from described resin seal (3).
13. according to the manufacture method of the electronic component unit described in any one in claim 7 to 12 (1), wherein
In described foaming, the temperature of described metal die (6) is adjusted to and is equal to or greater than 50 ℃ and be less than 100 ℃.
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| JP2013109840 | 2013-05-24 | ||
| JP2013-109840 | 2013-05-24 | ||
| JP2014-078456 | 2014-04-07 | ||
| JP2014078456A JP6323129B2 (en) | 2013-05-24 | 2014-04-07 | Electronic component unit and manufacturing method thereof |
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| CN104175679B CN104175679B (en) | 2017-06-09 |
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Cited By (1)
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| CN110196357A (en) * | 2019-06-19 | 2019-09-03 | 南通海星电子股份有限公司 | A kind of electrode foil for aluminum electrolytic capacitors single side specific volume test method |
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