CN104166491B - The preparation method and touch screen of touch screen - Google Patents
The preparation method and touch screen of touch screen Download PDFInfo
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- CN104166491B CN104166491B CN201410392562.5A CN201410392562A CN104166491B CN 104166491 B CN104166491 B CN 104166491B CN 201410392562 A CN201410392562 A CN 201410392562A CN 104166491 B CN104166491 B CN 104166491B
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Abstract
The present invention is applied to touch screen technical field, there is provided a kind of preparation method of touch screen and the touch screen obtained using the method, it is intended to solves how to increase the touch-control area of touch screen in the prior art and realizes the technical problem of touch screen Rimless.The preparation method of the touch screen is comprised the following steps:Substrate is provided;Conductive material is set;Pattern is etched;Binding flexible PCB;Laminating cover plate;Laminating display screen;Bending front lead, land is bent along the junction of touch area and land, front lead and flexible PCB bending is fitted in display screen surface.By on the first surface of substrate forming touch-control figure circuit and front lead and forming back side lead on a second surface, front lead and flexible PCB are bent and display screen surface is fitted in, the touch area for making to be formed with touch-control figure circuit is effective touch area of the touch screen, so as to obtain the touch screen of the equal Rimless of surrounding, effective touch-control area of touch screen is considerably increased.
Description
Technical field
The invention belongs to touch screen technical field, more particularly to a kind of touch screen preparation method and obtained using the method
The touch screen for arriving.
Background technology
At present, capacitive touch screen is substantially in occupation of whole mobile phone touch-screen market, and more giant-screen accounting, ultra-narrow frame
Or Rimless can provide good touch experience, increasingly be pursued by people.Especially Intelligent worn device, due to it
Touch-control area is small, how effectively to utilize its narrow and small touch-control area into one of urgent problem, therefore ultra-narrow frame is very
Touch to Rimless is just arisen at the historic moment.
In the structure of existing touch-screen, the cabling of the conductive membrane layer of viewfinder area is to walk to draw from touch-screen left and right edges
Line, then concentrates on binding region and is connected with flexible PCB, because left and right routing region has become invalid touch area, and
In order to attractive in appearance, these routing regions are generally covered with ink, i.e., usually said touch-screen frame, and current frame distance has
2~4mm, the presence of frame causes the displayable range of mobile phone screen to reduce.No matter in visual experience or functionally, all to hand
Certain influence is caused when machine user is in experience and using mobile phone.
The content of the invention
It is an object of the invention to provide a kind of preparation method of touch screen, lead and general are set by substrate back
Front lead and flexible PCB are bent to substrate back, it is intended to solve how to increase the touch-control area of touch screen in the prior art
And realize the technical problem of touch screen Rimless.
The present invention is achieved in that a kind of preparation method of touch screen, comprises the following steps:
Substrate is provided, the substrate is bent base material and first surface and second surface including being oppositely arranged, described
First surface is included for producing the touch area of touching signals and being connected with the touch area and for by the touch-control
The land of signal output;
Conductive material is set, there is provided simultaneously be arranged at the conductive material on the substrate and respectively at described by conductive material
The first conductive film layer and the second conductive film layer are formed on first surface and the second surface;
Pattern is etched, and carries out pattern etching process to first conductive film layer and second conductive film layer respectively, and
Touch-control figure circuit is formed in the touch area, is formed in the land and is electrically connected with the touch-control figure circuit
Front lead and form back side lead in the second surface, the back side lead is electrically connected with the touch-control figure circuit
Connect;
Binding flexible PCB, there is provided flexible PCB, the flexible PCB is attached in the land simultaneously
Electrically connected with the front lead;
Laminating cover plate, there is provided the cover plate is simultaneously fitted in the first surface side of the substrate for cover plate;
Laminating display screen, there is provided display screen and the display screen is fitted in the substrate second surface side;With
And
The front lead is bent, the line areas are bent with the junction of the land along the touch area
Domain, and the front lead and flexible PCB bending is fitted in the display screen surface.
Further, in pattern-etch step, the pattern etching process is included respectively to first conductive film layer
The touch-control figure for carrying out pasting protective film, exposure, etching and demoulding treatment successively respectively with second conductive film layer and being formed
Shape circuit, the front lead and the back side lead.
Further, in the step of setting conductive material, the conductive material is Nano Silver or nano-copper ink magnetic
Control sputter, and be coated with the substrate the Nano Silver or Nanometer Copper using volume to volume vacuum coater.
Further, the step of edge fills pin is also included in the step of pattern is etched, there is provided metal stitch, aligns and press
Close the metal stitch and the metal stitch is electrically connected to the touch-control figure circuit and form tactile with the back side lead
Control inductor.
Further, in the step of binding flexible PCB, using anisotropic conductive film by the flexible PCB
It is attached at the front lead region.
Further, it is additionally included in the display screen surface in the step of fitting display screen and is attached at the conductive material
And conductive layer is formed, the display location is between the second surface and the conductive layer of the substrate.
Present invention also offers the touch screen obtained using the preparation method of above-mentioned touch screen, the touch screen includes having
The first surface and the substrate of second surface that are oppositely arranged, the first conductive film layer being formed on the first surface, it is formed at
The second conductive film layer on the second surface and fit in cover plate on first conductive film layer;The substrate is bendable
Qu Jicai and in being formed with touch area for producing touching signals on first surface and be connected simultaneously with the touch area
For the land for exporting the touching signals;The touch screen also includes the flexible electrical being arranged in the land
Road plate, the lead for being electrically connected to the flexible PCB and the touch area and the relative described lid for fitting in the substrate
The display screen of plate side, the lead includes being formed in the land and being located at the touch area and the flexible electrical
Front lead between the plate of road and it is formed on the second surface and is electrically connected at least side of the touch area
The back side lead of edge, the land is bent along the junction of the touch area and the land, and make it is described just
Face lead and flexible PCB bending fit in the display screen surface.
Further, the touch screen also includes be glued between the flexible PCB and the land first
Conducting resinl film layer and the second conducting resinl film layer being glued between the flexible PCB and the display screen, described first leads
Electric adhesive film and the second conducting resinl film layer are formed by anisotropic conductive film.
Further, the material Nano Silver or Nanometer Copper of first conductive film layer and second conductive film layer.
Further, the touch screen also includes the optics being adhered between first conductive film layer and the cover plate
Glue, the optical cement is transparence.
Further, the touch screen also includes being arranged at the substrate side and connects the first surface and described the
The metal stitch on two surfaces, the metal stitch is electrically connected between the touch-control figure circuit and the back side lead.
Having the technical effect that relative to prior art of the invention:Touched by being formed on the first surface of the substrate respectively
Control figure circuit and front lead and back side lead is formed on the second surface, and using the front lead and described
Back side lead is electrically connected between the touch-control figure circuit and the flexible PCB, and by the front lead and described soft
Property circuit board bend and fit in the display screen surface so that be formed with touch-control figure circuit touch area be the touch screen
Effective touch area, so as to obtain the touch screen of the equal Rimless of surrounding, considerably increase effective touch-control area of touch screen.
Brief description of the drawings
Fig. 1 is the flow chart of the preparation method of touch screen provided in an embodiment of the present invention;
Fig. 2 is the sectional view of touch screen provided in an embodiment of the present invention;
Fig. 3 is the front view of touch screen in Fig. 2, the structure chart of touch screen when representing non-bending state;
Fig. 4 is the rearview of touch screen in Fig. 2, represents the structure chart of the touch screen after bending;
Fig. 5 is the front view of touch screen in Fig. 2, represents the structure chart of the touch screen after bending.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Fig. 1 to Fig. 5 is refer to, the preparation method of touch screen provided in an embodiment of the present invention is comprised the following steps:
S1:Substrate 10 is provided, the substrate 10 is bent base material and the first surface 11 and second including being oppositely arranged
Surface 12, the first surface 11 includes being connected for producing the touch area 13 of touching signals and with the touch area 13
And the land 14 for the touching signals to be exported;It is to be appreciated that the substrate 10 is bent base material, such as it is soft
Property substrate or bendable transparent conductive material, it is preferable that the substrate 10 can be that macromolecule membrane or thickness are less than
The ultra-thin glass of 0.1mm, such as rising sun whistle 0.05mm float glasses are rolled up.Effectively touched for the touch screen 1 the touch area 13
Be divided into two for the first surface 11 of the substrate 10 by control region 13, the touch area 13 and the land 14, generally,
According to the use habit of user, the land 14 is located at the surface or underface of the touch area 13.
S2:Conductive material is set, there is provided simultaneously be arranged on the substrate 10 conductive material and difference by conductive material
In forming the first conductive film layer 21 and the second conductive film layer 22 on the first surface 11 and the second surface 12;
S3:Pattern is etched, and carries out pattern etching to first conductive film layer 21 and second conductive film layer 22 respectively
Treatment, and touch-control figure circuit is formed in the touch area 13, is formed and the touch-control figure in the land 14
Front lead 15 and form back side lead 16, the back side lead 16 and institute in the second surface 12 that shape circuit is electrically connected
State the electrical connection of touch-control figure circuit;It is to be appreciated that one end of the back side lead 16 electrically connects with the touch-control figure circuit
And the other end is connected with one end of the part lead in the front lead 15, the another part in the front lead 15
One end of lead electrically connects with the touch-control figure circuit, and so, the signal end of the touch-control figure circuit passes through the front
Lead 15 and the back side lead 16 are exported.
S4:Binding flexible PCB 30, there is provided flexible PCB 30, the circuit is attached at by the flexible PCB 30
Electrically connect in region 14 and with the front lead 15;The flexible PCB 30 is electrically connected with the other end of the front lead 15
Connect, so, the touch-control figure circuit is realized electrically connecting with the flexible PCB 30.
S5:Laminating cover plate 40, there is provided the cover plate 40 is simultaneously fitted in the first surface 11 1 of the substrate 10 for cover plate 40
Side;Preferably, the cover plate 40 is made up of glass, makrolon or polymethyl methacrylate.Using transparent optical cement 42
The cover plate 40 is attached on the substrate 10.
S6:Laminating display screen 60, there is provided the display screen 60 is simultaneously fitted in the second table of the substrate 10 for display screen 60
The side in face 12;The display screen 60 is attached on the substrate 10 using transparent optical cement 42, so that the substrate 10
Between the cover plate 40 and the display screen 60.
S7:The front lead 15 is bent, institute is bent with the junction of the land 14 along the touch area 13
Land 14 is stated, and the front lead 15 and the bending of the flexible PCB 30 is fitted in the surface of the display screen 60.
It is to be appreciated that bending the substrate 10 along the junction of the touch area 13 and the land 14, make the substrate
10 bend together with the front lead 15 and the flexible PCB 30 and are attached at the surface of the display screen 60, and the surface is institute
The surface relative with the substrate 40 of display screen 60 is stated, specifically, the display screen 60 has and the phase of the second surface 12
The front for facing and the back side being oppositely arranged with the front, and after the front lead 15 and the flexible PCB 30 bend
It is attached at the back side of the display screen 60.Preferably, its bending angle is 90 °, and the substrate 10 after bending is C-shaped, i.e., first
The surface of the display screen 60 is attached at after bending twice afterwards.So as to the surface or underface of realizing whole touch screen 1 are boundless
Frame is set.
The preparation method of touch screen provided in an embodiment of the present invention, by respectively on the first surface 11 of the substrate 10
Form touch-control figure circuit and front lead 15 and back side lead 16 is formed on the second surface 12, and utilization is described just
Face lead 15 and the back side lead 16 are electrically connected between the touch-control figure circuit and the flexible PCB 30, and by institute
State front lead 15 and the flexible PCB 30 bends and fits in the surface of the display screen 60, so as to be formed with touch-control figure
The touch area 13 of circuit is effective touch area 13 of the touch screen 1, so that the touch screen 1 of the equal Rimless of surrounding is obtained, greatly
The big effective touch-control area that increased touch screen 1.
In this embodiment, the back side lead 16 is formed at the relative with the touch area 13 of the second surface 12
Region in, and with following several positions:Specifically, relative to the touch area 13, the back side lead 16 is formed at
The left and right sides of the touch area 13 and partially overlapped with the touch area 13 in the projection in the touch area 13, i.e.,
Its lead is communicated to touch-control figure circuit in the touch area 13 second surface of the substrate 10 along its left and right sides
12, and the other end by the back side lead 16 is connected to the front lead 15;Or, relative to the touch area
13, the back side lead 16 formed the left side or right side of the touch area 13 and in the projection in the touch area 13 with
The left side of the touch area 13 or right part overlap, i.e., the touch-control figure circuit in described touch area 13 is along its left side
Or its lead to be communicated to the second surface 12 of the substrate 10, and the other end connection for passing through the back side lead 16 on right side
To the front lead 15.It is described by the way that be arranged at for its circuit one end along its left and right at least side by the touch-control figure circuit
On second surface 12, i.e., by forming back side lead 16 so that whole touch screen 1 reaches and set without left and right side frame, greatly increases
Effective touch-control area of touch screen 1.
In pattern-etch step S3, optionally the first conductive film layer 21 and second conductive film layer 22 can be pressed
Sequencing is processed, specifically, can be after pattern etching process be carried out to first conductive film layer 21 to described
Two conductive film layers 22 carry out pattern etching, it is also possible to led to described first after pattern etching is carried out to second conductive film layer 22
Electrolemma layer 21 carries out pattern etching, finally to make first conductive film layer 21 and second conductive film layer 22 be schemed
For the purpose of case etching process.
Fig. 1 to Fig. 3 is refer to, further, in pattern-etch step S3, it is right respectively that the pattern etching process includes
First conductive film layer 21 and second conductive film layer 22 are carried out at pasting protective film, exposure, etching and demoulding successively respectively
The touch-control figure circuit, the front lead 15 and the back side lead 16 managed and formed.It is to be appreciated that in pattern erosion
During quarter, two-sided etched pattern treatment is carried out to the substrate 10 using gold-tinted technique, specifically, to first conductive film layer
21 carry out pattern etch when, carry out successively pasting protective film, exposure, etching and demoulding process, with the shape on the first surface 11
Into the touch-control figure circuit and the front lead 15;When pattern etching is carried out to second conductive film layer 22, successively
Pasting protective film, exposure, etching and demoulding treatment are carried out, to form the surface leads on the second surface 12.Protected in patch
In cuticula step, photoresist is applied and is invested on first conductive film layer 21 or the surface of the second conductive film layer 22;Exposure
When, there is the photoresist of illuminated part in the film vertical irradiation photoresist surface for passing through to pre-set using ultraviolet
Reaction;During development, go to remove the photoresist of footpath light irradiation part from glass surface using weak potassium hydroxide solution, retain not according to
Penetrate the photoresist of part;During etching, first conductive film layer 21 that is covered unglazed photoresist using appropriate acid solution or
The second conductive film layer 22 is removed described in person, the touch-control figure circuit required for thus having obtained us;During demoulding, using stronger
Potassium hydroxide stripper solution will remain photoresist remove, by the surface clean of the substrate 10 dry.
In this embodiment, the preparation method of the touch screen also includes the step of attaching protective layer, the attaching protective layer
The step of carried out after pattern-etch step, attach protective layer respectively by the first surface 11 and the second surface 12
To protect formed touch-control figure circuit, front lead 15 and back side lead 16, the protective layer can be two to (not shown)
Silicon oxide protective layer, protected polymeric film layer or insulating film layer.
Fig. 1 to Fig. 4 is refer to, further, the step of conductive material is set in S2, the conductive material is Nano Silver
Or Nanometer Copper, and the Nano Silver or Nanometer Copper are coated on the substrate 10 using volume to volume vacuum coater.Profit
With Nano Silver or Nanometer Copper as transparent conductive material, to realize first conductive film layer 21 and second conductive film layer
22 is bent.Front is formed by the use of Nano Silver or Nanometer Copper on the first surface 11 of the substrate 10 as conductive material to draw
Line 15 so that the front lead 15 can bend with the bending of the substrate 10, so as to effectively increase touch screen 1
Effective touch-control area.
Further, the step of edge fills pin is also included in S3 the step of pattern is etched, there is provided metal stitch 50, contraposition
With press the metal stitch 50 and the metal stitch 50 is electrically connected to the touch-control figure circuit with the back side lead
16 and form touch-control sensor.Specifically, using automatic pointer assembling machine in the case where CCD is precisely aligned, the metal stitch 50 is pressed
Side to the substrate 10 to connect the first surface 11 and the second surface 12, so as to by the metal stitch 50
It is electrically connected between the touch-control figure circuit and back side lead 16 and is electrically connected to the front lead 15 and the back side
Between lead 16, so as to form touch-control sensor.Preferably, the metal stitch 50 is perpendicular to the first surface 11 and described
Second surface 12, and its quantity is identical with the quantity of the back side lead 16.
Fig. 1 to Fig. 5 is refer to, in other embodiments, pattern etching process can be carried out in the side of the substrate 10
To form corresponding connecting line, and electrically connect the touch-control figure circuit and back side lead 16 using the connecting line and electrically connect
The front lead 15 and the back side lead 16.Specific pattern-etch step draws with above-mentioned to touch-control figure circuit, front
Line 15 is identical with the pattern-etch step of back side lead 16, does not repeat herein.
Fig. 1 to Fig. 5 is refer to, further, the step of flexible PCB is bound in S4, using anisotropic conductive film
The flexible PCB 30 is attached at the region of front lead 15.It is to be appreciated that in the institute of front lead 15
There is the binding region for binding the flexible PCB 30 in region, the other end of the front lead 15 is all converged at
Electrically connected with the flexible PCB 30 in the binding region.Specifically, using anisotropic conductive film by the flexible electrical
Road plate 30 is attached in the binding region so that the other end of the front lead 15 is electrically connected to the flexible PCB 30,
And pre- pressure is carried out to the flexible PCB 30 using binding board, form FOG with the binding region.
Fig. 1 to Fig. 5 is refer to, in the step of fitting cover plate 40, vacuum is inhaled using vacuum attaching machine and is positioned FOG, and
Diaphragm on the surface of transparent optical cement 42 1 is torn and is attached at using the vacuum abutted board and is formed with FOG's
On first surface 11, then the diaphragm on another surface of the transparent optical cement 42 is torn and the vacuum attaching machine is used
Platform is attached on described, and so the cover plate 40 is attached on the substrate 10, and makes the FOG and the touch-control figure
Shape circuit is located between the cover plate 40 and the substrate 10.Similarly, pasted using vacuum in S6 the step of display screen is fitted
Conjunction machine inhales vacuum and fits on the second surface 12 of the substrate 10 display screen 60, specifically each step as described above, herein
Do not repeat.
Fig. 1 to Fig. 5 is refer to, further, the table of the display screen 60 is additionally included in S6 the step of display screen is fitted
Face is attached at the conductive material and forms conductive layer 62, and the display screen 60 is located at second surface 12 and the institute of the substrate 10
State between conductive layer 62.The conductive material is Nano Silver or Nanometer Copper, and is received described using volume to volume vacuum coater
Rice silver or Nanometer Copper are coated on the display screen 60, and the flexible PCB 30 being bent on the display screen 60 is led with described
Electric layer 62 is electrically connected.Preferably, it is electrically connected to using anisotropic conductive film the flexible PCB 30 after the bending described
Conductive layer 62.
Fig. 2 to Fig. 5 is refer to, the embodiment of the present invention additionally provides the touch-control obtained using the preparation method of above-mentioned touch screen
Screen 1, the touch screen 1 includes the substrate 10 with the first surface 11 that is oppositely arranged and second surface 12, is formed at described the
The first conductive film layer 21 on one surface 11, the second conductive film layer 22 being formed on the second surface 12 and fit in institute
State the cover plate 40 on the first conductive film layer 21;The substrate 10 is flexible base material and is formed with for producing on first surface 11
Give birth to the touch area 13 of touching signals and be connected with the touch area 13 and the circuit for the touching signals to be exported
Region 14;The touch screen 1 also includes the flexible PCB 30 being arranged in the land 14, is electrically connected to the flexibility
The lead of circuit board 30 and the touch area 13 and fit in the substrate 10 the side of relative described cover plate 40 display
Screen 60, the lead includes being formed in the land 14 and is located at the touch area 13 and the flexible PCB 30
Between front lead 15 and be formed on the second surface 12 and be electrically connected at least side of the touch area 13
The back side lead 16 at edge, the land 14 is bent along the touch area 13 with the junction of the land 14,
And the front lead 15 and the bending of the flexible PCB 30 is fitted in the surface of the display screen 60.
In this embodiment, the substrate 10 is bent base material, and such as flexible base board or bendable transparent are conductive
Material, it is preferable that the substrate 10 can be the ultra-thin glass of macromolecule membrane or thickness less than 0.1mm, such as rising sun whistle
0.05mm float glasses are rolled up.The touch area 13 is effective touch area 13 of the touch screen 1, the touch area 13 and institute
State land 14 first surface 11 of the substrate 10 is divided into two, generally, according to the use habit of user, the line
Road region 14 is located at the surface or underface of the touch area 13.One end of the back side lead 16 and the touch-control figure
Shape circuit is electrically connected and the other end is connected with one end of the part lead in the front lead 15, the front lead 15
In one end of another part lead electrically connected with the touch-control figure circuit, so, the signal end of the touch-control figure circuit
Exported by the front lead 15 and the back side lead 16.
In this embodiment, the cover plate 40 is made up of glass, makrolon or polymethyl methacrylate.Using saturating
Be attached at the cover plate 40 on the substrate 10 by bright optical cement 42.
In this embodiment, the touch screen 1 also include display screen 60, the display screen 60 fit in the substrate 10 it
The side of second surface 12, so that the substrate 10 is located between the cover plate 40 and the display screen 60.Using transparent optical
Be attached at the display screen 60 on the substrate 10 by glue 42.
Touch screen provided in an embodiment of the present invention 1 has touch-control figure by being formed in the first surface 11 of the substrate 10
The touch area 13 of circuit and front lead 15 and the formation back side lead 16, Ji Jiangyuan of second surface 12 in the substrate 10
Originally the lead for being formed at the left and right sides of the touch area 13 is arranged at the second surface 12 of the substrate 10, and by the front
Lead 15 and the flexible PCB 30 bend and fit in the surface of the display screen 60, so as to be formed with touch-control figure circuit
Touch area 13 is effective touch area 13 of the touch screen 1, so as to obtain the touch screen 1 of the equal Rimless of surrounding, is greatly increased
Effective touch-control area of touch screen 1.
Refer to Fig. 2 to Fig. 5, in this embodiment, the back side lead 16 be formed at the second surface 12 with institute
State in the relative region in touch area 13, and with following several positions:Specifically, it is described relative to the touch area 13
Back side lead 16 is formed at the left and right sides of the touch area 13 and in the projection in the touch area 13 and the touch-control
Region 13 partially overlaps, i.e., be communicated to for its lead along its left and right sides described by the touch-control figure circuit in described touch area 13
The second surface 12 of substrate 10, and the other end by the back side lead 16 is connected to the front lead 15;Or, relatively
In the touch area 13, the back side lead 16 forms the left side or right side of the touch area 13 and in the Touch Zone
Projection in domain 13 overlaps with the left side of the touch area 13 or right part, i.e., the touch-control figure in described touch area 13
Its lead is communicated to shape circuit the second surface 12 of the substrate 10 along its left side or right side, and by the back side lead
16 other end is connected to the front lead 15.By by the touch-control figure circuit along its left and right at least side by its circuit
One end is arranged on the second surface 12, i.e., by forming back side lead 16 so that whole touch screen 1 is reached without left and right side frame
Set, considerably increase effective touch-control area of touch screen 1.
Refer to Fig. 2 to Fig. 5, further, the touch screen 1 also include be glued in the flexible PCB 30 with it is described
The first conducting resinl film layer (not shown) between land 14 and it is glued in the flexible PCB 30 and the display screen
The second conducting resinl film layer 32 between 60, the first conducting resinl film layer and the second conducting resinl film layer 32 are led by anisotropy
Electric glued membrane and formed.The flexible PCB 30 is set to be electrically connected with the front lead 15 using the first conducting resinl film layer.
The binding region for bind flexible PCB 30 is provided with the land 14, using the first conducting resinl film layer will described in
Flexible PCB 30 is bound in the binding region, so as to realize that the flexible PCB 30 is electrical with the front lead 15
Conducting.Similarly, the flexible PCB 30 is made to be electrically connected to the display screen 60 using the second conducting resinl film layer 32
The back side.
Fig. 2 to Fig. 5 is refer to, further, the material of first conductive film layer 21 and second conductive film layer 22
Nano Silver or Nanometer Copper.Using these materials corresponding touch-control is formed on the first surface 11 and the second surface 12
Figure circuit, front lead 15 and back side lead 16, divide on first conductive film layer 21 and second conductive film layer 22
Not Tie Fu protective layer (not shown), to protect formed touch-control figure circuit, front lead 15 and back side lead 16, the guarantor
Sheath can be silicon dioxide layer of protection, protected polymeric film layer or insulating film layer.
Fig. 2 is refer to, further, the touch screen 1, also including being adhered to first conductive film layer 21 and the lid
Optical cement 42 between plate 40, the optical cement 42 is transparence.
Fig. 2 to Fig. 5 is refer to, further, the touch screen 1, also including being arranged at the side of the substrate 10 and connecting
The metal stitch 50 of the first surface 11 and the second surface 12, the metal stitch 50 is electrically connected to the touch-control figure
Between circuit and the back side lead 16.The metal stitch 50 is pressure bonded to the side of the substrate 10 to connect first table
Face 11 and the second surface 12, so as to be electrically connected to the touch-control figure circuit and back side lead by the metal stitch 50
Between 16 and it is electrically connected between the front lead 15 and the back side lead 16, so as to form touch-control sensor.It is preferred that
Ground, the metal stitch 50 is perpendicular to the first surface 11 and the second surface 12, and its quantity and the back side lead
16 quantity is identical.
The touch screen 1 that various embodiments of the present invention are provided is applied to touch screen terminal device, is particularly suited in touch screen 1 week
While the touch screen terminal device without other parts, for example, Intelligent worn device (such as intelligent watch).
The touch screen 1 that various embodiments of the present invention are provided can be GF structure condenser types touch screen, GFF structure condenser type touch-controls
Screen, GG structure condenser types touch screen, PF structure condenser types touch screen, PFF structure condenser types touch screen or PG structure condenser types
Touch screen.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (10)
1. a kind of preparation method of touch screen, it is characterised in that comprise the following steps:
Substrate is provided, the substrate is bent base material and first surface and second surface including being oppositely arranged, described first
Surface is included for producing the touch area of touching signals and being connected with the touch area and for by the touching signals
The land of output;
Conductive material is set, there is provided simultaneously be arranged at the conductive material on the substrate and respectively at described first by conductive material
The first conductive film layer and the second conductive film layer are formed on surface and the second surface;
Pattern is etched, and carries out pattern etching process to first conductive film layer and second conductive film layer respectively, and in institute
State and formed in touch area touch-control figure circuit, formed in the land and electrically connected just with the touch-control figure circuit
Face lead and back side lead is formed in the second surface, the back side lead electrically connects with the touch-control figure circuit, institute
Back side lead is stated to be formed at the left side of the touch area and/or right side and touched with described in the projection in the touch area
Control region partially overlaps;
Binding flexible PCB, there is provided flexible PCB, the flexible PCB is attached in the land and in institute
The side for stating land electrically connects with the front lead, and the front lead and the back side lead are electrically connected at institute
State between touch-control figure circuit and the flexible PCB, the back side lead extends to the circuit where the back side lead
Region is electrically connected with the flexible PCB;
Laminating cover plate, there is provided the cover plate is simultaneously fitted in the first surface side of the substrate for cover plate;
Laminating display screen, there is provided display screen and the display screen is fitted in the substrate second surface side;And
The front lead is bent, the land is bent with the junction of the land along the touch area, and
The front lead and flexible PCB bending is set to fit in the display screen surface.
2. the preparation method of touch screen as claimed in claim 1, it is characterised in that:In pattern-etch step, the pattern
Etching process includes respectively carrying out first conductive film layer and second conductive film layer successively respectively pasting protective film, exposes
The touch-control figure circuit, the front lead and the back side lead that light, etching and demoulding are processed and formed.
3. the preparation method of touch screen as claimed in claim 1, it is characterised in that:In the step of conductive material is set, institute
Conductive material is stated for Nano Silver or nano-copper ink magnetic control sputtering plating, and using volume to volume vacuum coater by the Nano Silver or
Person's Nanometer Copper is coated with the substrate.
4. the preparation method of touch screen as claimed in claim 1, it is characterised in that:Also include side in the step of pattern is etched
The step of edge dress pin, there is provided metal stitch, align and press the metal stitch and to be electrically connected to the metal stitch described
Touch-control figure circuit forms touch-control sensor with the back side lead.
5. the preparation method of touch screen as claimed in claim 1, it is characterised in that:Also include in the step of fitting display screen
The conductive material being attached in the display screen surface and forming conductive layer, the display location is in the second table of the substrate
Between face and the conductive layer.
6. the touch screen that a kind of preparation method of touch screen using as described in claim 1 to 5 any one is obtained, its feature
It is:The touch screen includes having the substrate of the first surface and second surface being oppositely arranged, is formed at the first surface
On the first conductive film layer, the second conductive film layer for being formed on the second surface and fit in first conductive film layer
On cover plate;The substrate be flexible base material and in be formed with first surface for produce the touch area of touching signals with
And be connected with the touch area and the land for the touching signals to be exported;The touch screen also includes being arranged at
Flexible PCB in the land, the lead for being electrically connected to the flexible PCB and the touch area and fit
In the display screen of the relatively described cover plate side of the substrate, the lead includes being formed in the land and being located at institute
State the front lead between touch area and the flexible PCB and be formed on the second surface and be electrically connected to institute
State the back side lead of an at least lateral edges of touch area, the back side lead be formed at the touch area left side and/or
Partially overlapped on the right side of person and with the touch area in the projection in the touch area, along the touch area and the circuit
The junction in region bends the land, and it is described aobvious to fit in the front lead and flexible PCB bending
Display screen surface, the flexible PCB is attached in the land and draws with the front in the side of the land
Line is electrically connected, and the front lead and the back side lead are electrically connected at the touch-control figure circuit and the flexible circuit
Between plate, the land where the back side lead extends to the back side lead electrically connects with the flexible PCB
Connect.
7. touch screen as claimed in claim 6, it is characterised in that:Also include being glued in the flexible PCB and the circuit
The first conducting resinl film layer between region and the second conducting resinl being glued between the flexible PCB and the display screen
Film layer, the first conducting resinl film layer and the second conducting resinl film layer are formed by anisotropic conductive film.
8. touch screen as claimed in claim 6, it is characterised in that:First conductive film layer and second conductive film layer
Material Nano Silver or Nanometer Copper.
9. touch screen as claimed in claim 6, it is characterised in that:Also include being adhered to first conductive film layer and the lid
Optical cement between plate, the optical cement is transparence.
10. touch screen as claimed in claim 1, it is characterised in that:Also include being arranged at the substrate side and connecting described
The metal stitch of first surface and the second surface, the metal stitch is electrically connected to the touch-control figure circuit and the back of the body
Between the lead of face.
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CN104991672B (en) * | 2015-07-06 | 2018-06-05 | 业成光电(深圳)有限公司 | Touching device and electronic device |
WO2017096628A1 (en) * | 2015-12-11 | 2017-06-15 | 深圳市柔宇科技有限公司 | Flexible display module bonding method |
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CN107153472A (en) * | 2016-03-02 | 2017-09-12 | 深圳欧菲光科技股份有限公司 | Touch-screen |
CN106775172A (en) * | 2017-01-20 | 2017-05-31 | 京东方科技集团股份有限公司 | Touch-screen, the preparation method of touch-screen and touch control display apparatus |
CN108664158B (en) * | 2017-03-29 | 2023-10-20 | 宸美(厦门)光电有限公司 | touch display |
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CN108646944A (en) * | 2018-05-08 | 2018-10-12 | 惠州市华星光电技术有限公司 | Rimless touch-control display module and preparation method thereof |
CN108762592B (en) * | 2018-05-31 | 2021-08-27 | 信利光电股份有限公司 | Preparation method of touch sensor and touch sensor |
CN109669569B (en) * | 2018-12-04 | 2022-05-17 | 盈天实业(深圳)有限公司 | Touch display screen, manufacturing method thereof and electronic equipment |
CN110058747A (en) * | 2019-04-30 | 2019-07-26 | 意力(广州)电子科技有限公司 | A kind of transparent border touch screen and preparation method thereof |
CN110428739B (en) * | 2019-07-31 | 2022-02-11 | 广州国显科技有限公司 | Display panel and display device |
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