CN104155849B - Silicon wafer alignment light source system used for lithography equipment - Google Patents
Silicon wafer alignment light source system used for lithography equipment Download PDFInfo
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- CN104155849B CN104155849B CN201310173131.5A CN201310173131A CN104155849B CN 104155849 B CN104155849 B CN 104155849B CN 201310173131 A CN201310173131 A CN 201310173131A CN 104155849 B CN104155849 B CN 104155849B
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Abstract
The invention provides a silicon wafer alignment light source system used for lithography equipment, and the silicon wafer alignment light source system is characterized by comprising a light source module, a light intensity modulation module, an optical fiber module, a photoelectric detection module, an AD acquisition module, a phase position adjustment module, a control module and an alignment detection module; light emitted by the light source module passes through the light intensity modulation module for amplitude modulation, and then passes through the optical fiber module; one path of the light enters into the alignment detection module; and the other path of the light is photoelectrically conversed by the photoelectric detection module, after the AD acquisition module and the phase position adjustment module are calibrated, the control module controls the light intensity modulation module. The silicon wafer alignment light source system based on light source internal amplitude modulation can adjust the amount of light source fluctuation, greatly reduce the silicon wafer alignment light source system development cost, reduce the space structure size of the system, and improve the signal anti-jamming property and alignment repetition precision.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, more particularly to a kind of silicon chip alignment light source for lithographic equipment
System.
Background technology
In semiconducter IC ic manufacturing process, a complete chip typically requires through multiple photolithographic exposure
Can complete.In addition to first time photoetching, the photoetching of remaining level before exposure will be by the figure of this level and with front layer
The figure that secondary exposure stays is accurately positioned, and has correct relative position, that is, cover between each layer pattern of such guarantee
Carve precision.Under normal circumstances, alignment precision is the 1/3～1/5 of litho machine resolution ratio index, for 100 nanometers of litho machines
Speech, alignment precision index request is less than 35nm.Alignment precision is one of the key technical indexes of projection mask aligner, and mask and silicon
Alignment precision between piece is the key factor of impact alignment precision.When characteristic size CD requires less, to alignment precision
Require and the requirement of consequent alignment precision becomes more strict, such as CD dimensional requirement 10nm of 90nm or less right
Quasi- precision.
Between mask and silicon chip to mask will definitely be adopted（Coaxially）Be aligned+silicon chip（From axle）The mode of be aligned, that is, with work
Part stage fiducial plate is labeled as bridge, sets up the position relationship between mask mark and silicon chip mark, as shown in Figure 1.The base of be aligned
This process is：First pass through coaxial alignment system 9（I.e. mask alignment system）, realize mask mark 3 and on sports platform 5
Be aligned between datum plate mark 7, then utilizes off-axis alignment system 10（Silicon chip alignment system）, complete silicon chip alignment mark 6
Being aligned between work stage datum plate mark 7（By being directed at realization twice）, and then indirectly realize silicon chip alignment mark 6 and cover
It is aligned between mould alignment mark 3, set up position coordinates relation therebetween.
In the silicon chip aligning light source of existing lithographic equipment, the intensity due to being directed at optical signalling is faint, fluctuation is big, holds
The features such as easily disturbed by working environment, during alignment signal collecting, in order to improve the stability of signal and anti-interference energy
Power, employs amplitude modulation technique, and it directly using more independent unit, that is, includes photoelastic material 12, piezo-electric crystal 11, work(
Rate driver element 13, modulation controller 14, as shown in Figure 2.The driving of certain power is produced under the control of modulation controller 14
Signal, when driving the analog line driver 13 of piezo-electric crystal to apply periodic voltage signal to piezo-electric crystal 11, piezo-electric crystal 11
Apply periodic mechanical force to the photoelastic material 12 that it connects together, now produce periodically photoelastic in photoelastic material 12
Property effect.So-called photoelastic effect, that is, generally crystal show as isotropism in its natural state, but when applying mechanical external force
Be changed into anisotropy, light by when produce birefringence effect.After the analyzer after light path, the energy gauge of the light intensity of transmission
Rule is corresponding with the rule of the voltage signal being applied on piezo-electric crystal.This independent amplitude modulation means involves great expense, and occupies
Space is big.
Existing lithographic equipment silicon chip alignment system in, the power waves momentum of light source has direct shadow to be aligned repeatable accuracy
Ring, such as in scanning litho machine, the stability of light source 1% can cause the error of be aligned repeatable accuracy 0.5nm, and based on this problem, having must
The power waves momentum of light source is controlled, power waves momentum is the smaller the better, thus ensureing the reliability of subsystem.Existing skill
In art scheme, light intensity amplitude modulation(PAM) is realized using outside intensity modulation device, optical power attenuation is realized using external attenuation device,
Involve great expense, take up space big.
Content of the invention
It is an object of the invention to proposing a kind of silicon chip aligning light source based on light source internal amplitude modulation(PAM), again simultaneously
Adjustment can be carried out to the undulate quantity of light source, the development cost of silicon chip alignment system, the space structure chi of reduction system are greatly reduced
Very little, improve the anti-interference of signal, improve be aligned repeatable accuracy.
The present invention proposes a kind of silicon chip aligning light source for lithographic equipment it is characterised in that including：Light source module,
Intensity modulation module, optic module, photoelectric detection module, AD acquisition module, phase adjusting module, control module and be aligned are visited
Survey module；The light that described light source module sends through described intensity modulation module amplitude modulation(PAM), and after described optic module
One tunnel enters described be aligned detecting module；Another road carries out opto-electronic conversion through described photoelectric detection module, and described AD gathers mould
After block collection and the calibration of described phase adjusting module, through described control module, described intensity modulation module is controlled.
Wherein, described light source module includes laser instrument and laser controller, for exporting the laser of single wavelength.
Wherein, described intensity modulation module produces modulated signal, carries out light intensity width to the light beam of described light source module output
Degree modulation, and provide a road reference signal to phase adjusting module.
Wherein, described intensity modulation module includes signal source, filtering, buffering and four parts of Voltage-current conversion.
Wherein, described reference signal is identical with modulated signal.
Wherein, described modulated signal is, wherein A is amplitude, and f is modulating frequency,For phase place.
Wherein, described optic module includes fiber optic splitter, optical patchcord and optical fiber collimator；Fiber optic splitter is used for
Coupling is simultaneously split to light beam, and optical patchcord is used for transmission modulation light beam, and optical fiber collimator is used for light beam is collimated.
Wherein, described control module receives the signal of described AD acquisition module, and to described light source module, phase adjustment mould
Block is controlled.
The present invention also proposes a kind of alignment methods using above-mentioned silicon chip aligning light source it is characterised in that including as follows
Step：
Step one, opens light source module, and control module sets light intensity amplitude, and modulation module produces modulated signal；
Step 2, described modulated signal is divided into two-way, and a road inputs to phase adjusting module, Ling Yilu as reference signal
The light beam of light source module output is modulated, modulation light exports through optic module and obtains photodetection to photoelectric detection module
Signal, and received and gathered by AD acquisition module；
Step 3, phase adjusting module produces acquisition control signal and feeds back to AD acquisition module it is ensured that AD acquisition module is every
Secondary can collect peak value, i.e. light intensity amplitude；
Step 4, AD acquisition module is to photodetection signals collecting light intensity amplitude data, and feeds back to control module；
Step 5, the light intensity amplitude that the light intensity amplitude that control module comparison step one sets is collected with step 4 is to obtain
Light intensity undulate quantity, by the output of feedback control light source module it is ensured that the stable output power of light source module；
Step 6, carries out be aligned and detects.
Wherein, described step 3 also includes producing described acquisition control letter according to described reference signal and correcting time delay value
Number, described correcting time delay value is obtained by phase alignment, and phase alignment step is：Setting phase adjusting module initial time delay
Value, AD acquisition module gathers photodetection signal, changes initial time delay value successively by a fixed step size, the letter of collection photodetection simultaneously
Number；Signal is gathered according to a series of delay value and corresponding photoelectricity, the delay value obtaining corresponding maximum photoelectricity collection signal is
Described correcting time delay value, it is ensured that AD acquisition module can collect peak value every time after this correcting time delay value is locked.
Silicon chip aligning light source based on light source internal amplitude modulation(PAM) proposed by the present invention, is adjusted by light source internal amplitude
The mode of system, to improve amplitude modulation technique, is realized to power waves momentum by phase place Calibration Technology and Feedback of Power technology
Control, adjustment is carried out to the undulate quantity of light source, the development cost of silicon chip alignment system, the space structure of reduction system are greatly reduced
Size, improves anti-interference and the be aligned repeatable accuracy of signal.
Brief description
Can be described in detail by invention below with regard to the advantages and spirit of the present invention and institute's accompanying drawings obtain further
Solution.
Fig. 1 is lithographic equipment silicon chip alignment system structural representation；
Fig. 2 is light intensity amplitude modulation means schematic diagram in prior art；
Fig. 3 light intensity of the present invention amplitude modulation(PAM) module diagram；
Fig. 4 silicon chip of the present invention aligning light source structural representation；
Amplitude modulation(PAM) output signal time domain beamformer produced by Fig. 5 present invention.
Specific embodiment
Describe the specific embodiment of the present invention below in conjunction with the accompanying drawings in detail.
The present invention to improve amplitude modulation technique by way of light source internal amplitude modulation(PAM), by phase place Calibration Technology and
Feedback of Power technology is realizing the control to power waves momentum.
Light intensity amplitude modulation(PAM) module diagram of the present invention is as shown in figure 3, mainly comprise signal source, filtering and buffering, V-I
Four parts of conversion.Signal source produces analog signal, and filtering and buffer portion realize the analog signal to signal generator output
It is filtered and buffers, the noise improving output analog signal when carries load energy.Due to the strong and weak direct of light source output light and drive
Streaming current size is relevant, and therefore, continuous analog voltage signal is changed into current signal and is loaded directly into light by V-I conversion realization
In source and drive light source, amplitude modulation(PAM) is realized to the light beam of light source output.
Silicon chip aligning light source structure of the present invention is as shown in figure 4, this system includes：Light source module, by laser instrument 15 He
Laser controller 16 forms.It is aligned for silicon chip and provide the laser instrument 15 of light source to be a kind of can to export the half of single discrete wavelength
Conductor laser, such as ruddiness, green glow, far red light, near infrared light.Laser controller 16 is used for controlling opening of laser instrument 15
Close.
The major function of control module 17 is that laser controller 16, phase adjusting module 22 are controlled, and receives
The feedback signal of AD acquisition module 21.
The major function of modulation module 18 is to produce modulated signal, carries out light intensity amplitude modulation(PAM) to the light beam of light source output,
And provide a road reference signal to phase adjusting module 22, this reference signalIdentical with modulated signal, wherein A
For amplitude, f is modulating frequency,For phase place.
The major function of optic module 19 is that the light beam exporting laser instrument 15 is coupled and exports, for ensureing incidence
A light part exports and detects for be aligned, and part coupling output is used for light beam being acquired analyze and processing.Including：Optical fiber
Beam splitter, optical patchcord, optical fiber collimator.Fiber optic splitter is used for coupling and light beam is split, and optical patchcord is used for passing
Defeated modulation light beam, optical fiber collimator is used for light beam is collimated.
The modulated optical signal that photodetector module 20 exports to optic module 19 detects, and realizes opto-electronic conversion.
The major function of AD acquisition module 21 is that the electric signal to photoelectric detection module 20 output is acquired.
The major function of phase adjusting module 22 is that the signal to AD acquisition module 21 collection carries out phase alignment.
Be aligned detecting module 24 is used for be aligned and detects.
To punctual, control module 17 transmitting order to lower levels, to modulation module 18, makes modulation module produce modulated signal and be loaded into
On laser beam, modulation module 18 exports a road reference signal to phase adjusting module 22 simultaneously.Tune through laser instrument 15 output
Optical signal processed exports to photoelectric detection module 20 through optic module 19, converts optical signals to telecommunications by photoelectric detection module 20
Number, then peak-data is gathered by AD acquisition module 21, and store in register.Phase adjusting module 22 is according to reference signal
With the delay value of setting, produce acquisition control signal.Time delay needs to obtain by calibrating flow process, and phase alignment step is：If
Put phase adjusting module initial time delay value, AD acquisition module 21 gathers photodetection signal, by a fixed step size, change initial successively
Delay value, gathers photodetection signal simultaneously.Signal is gathered according to a series of delay value and corresponding photoelectricity, it is right to obtain
Answer maximum photoelectricity to gather the delay value of signal, that is, obtain the delay value of calibration.In normal work, this correcting time delay value is arranged
Go down using it is ensured that each collection can collect peak value.After phase-delay quantity locking, AD acquisition module 21 is to modulation light
Signals collecting peak-data, the amplitude B ' of peak-data as light intensity now.Required light intensity width is set by control module
Value B, now the undulate quantity of light intensity be.
Alignment procedures are as follows：
Step one, by control module 17 transmitting order to lower levels to laser controller 16, laser instrument 15 is opened preheating；Control
Module 17 issues to phase adjusting module 22 and executes order, and control module 17 transmitting order to lower levels produces modulation letter to modulation module 18
Number, control module 17 sets light intensity amplitude.
Step 2, after laser instrument 15 is stable, the light beam that a road modulated signal exports to laser instrument 15 is modulated, another
Road inputs to phase adjusting module 22 as reference signal.
Step 3, phase adjusting module 22 carries out phase alignment, obtains phase-delay quantity and locks.
Step 4, the amplitude data collecting is deposited by AD acquisition module 21, and feeds back to control module 17.
Step 5, control module 17 compares and sets amplitude and the collected amplitude of step 4, by feedback control laser instrument
Output it is ensured that the stable output power of laser instrument.
Step 6, carries out be aligned and detects.
Fig. 5 is amplitude modulation(PAM) output signal time domain beamformer produced by the present invention.From fig. 5, it can be seen that
The preferred embodiment of the simply present invention described in this specification, above example is only in order to illustrate the present invention
Technical scheme rather than limitation of the present invention.All those skilled in the art pass through logic analysis, reasoning under this invention's idea
Or the available technical scheme of limited experiment, all should be within the scope of the present invention.
Claims (8)
1. a kind of alignment methods of silicon chip aligning light source are it is characterised in that comprise the steps：
Step one, opens light source module, and control module sets light intensity amplitude, and modulation module produces modulated signal；
Step 2, described modulated signal is divided into two-way, and a road inputs to phase adjusting module as reference signal, and another road is to light
The light beam of source module output is modulated, and modulation light exports through optic module and obtains photodetection letter to photoelectric detection module
Number, and received and gathered by AD acquisition module；
Step 3, phase adjusting module produce acquisition control signal feed back to AD acquisition module it is ensured that AD acquisition module every time
Peak value can be collected, i.e. light intensity amplitude；
Step 4, AD acquisition module is to photodetection signals collecting light intensity amplitude data, and feeds back to control module；
Step 5, the light intensity amplitude that the light intensity amplitude that control module comparison step one sets is collected with step 4 is to obtain light
Strong undulate quantity, by the output of feedback control light source module it is ensured that the stable output power of light source module；
Step 6, carries out be aligned and detects.
2. alignment methods as claimed in claim 1 it is characterised in that：Described light source module includes laser instrument and laser controlling
Device, for exporting the laser of single wavelength.
3. alignment methods as claimed in claim 1 it is characterised in that：Described modulation module include signal source, filtering, buffering with
And four parts of Voltage-current conversion.
4. alignment methods as claimed in claim 1 it is characterised in that：Described reference signal is identical with modulated signal.
5. alignment methods as claimed in claim 1 it is characterised in that：Described modulated signal isWherein A is
Amplitude, f is modulating frequency,For phase place.
6. alignment methods as claimed in claim 1 it is characterised in that：Described optic module includes fiber optic splitter, optical fiber is jumped
Line and optical fiber collimator；Fiber optic splitter is used for coupling and light beam is split, and optical patchcord is used for transmission modulation light beam,
Optical fiber collimator is used for light beam is collimated.
7. alignment methods as claimed in claim 1 it is characterised in that：Described control module receives the letter of described AD acquisition module
Number, and described light source module, phase adjusting module are controlled.
8. alignment methods as claimed in claim 1 it is characterised in that：Described step 3 also include according to described reference signal and
Correcting time delay value is obtained by phase alignment producing described acquisition control signal, described correcting time delay value, and phase alignment walks
Suddenly it is：Setting phase adjusting module initial time delay value, AD acquisition module gathers photodetection signal, changes successively by a fixed step size
Initial time delay value, gathers photodetection signal simultaneously；Signal is gathered according to a series of delay value and corresponding photoelectricity, it is right to obtain
The delay value that maximum photoelectricity gathers signal is answered to be described correcting time delay value, it is ensured that AD gathers after this correcting time delay value is locked
Module can collect peak value every time.
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| CN201310173131.5A CN104155849B (en) | 2013-05-13 | 2013-05-13 | Silicon wafer alignment light source system used for lithography equipment |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1026550A2 (en) * | 1999-02-04 | 2000-08-09 | Asm Lithography B.V. | Lithographic projection apparatus |
| CN102243442A (en) * | 2010-05-12 | 2011-11-16 | 上海微电子装备有限公司 | Light source amplitude modulation apparatus for silicon wafer pointing |
| CN102419520A (en) * | 2010-09-27 | 2012-04-18 | 上海微电子装备有限公司 | Alignment signal simulating generator |
| CN102540780A (en) * | 2010-12-28 | 2012-07-04 | 上海微电子装备有限公司 | Alignment signal processing system and alignment signal processing method for photoetching equipment |
-
2013
- 2013-05-13 CN CN201310173131.5A patent/CN104155849B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1026550A2 (en) * | 1999-02-04 | 2000-08-09 | Asm Lithography B.V. | Lithographic projection apparatus |
| CN102243442A (en) * | 2010-05-12 | 2011-11-16 | 上海微电子装备有限公司 | Light source amplitude modulation apparatus for silicon wafer pointing |
| CN102419520A (en) * | 2010-09-27 | 2012-04-18 | 上海微电子装备有限公司 | Alignment signal simulating generator |
| CN102540780A (en) * | 2010-12-28 | 2012-07-04 | 上海微电子装备有限公司 | Alignment signal processing system and alignment signal processing method for photoetching equipment |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |