CN104155541A - Electromagnetic and thermal stress complex environmental sensitivity testing method for microprocessor - Google Patents
Electromagnetic and thermal stress complex environmental sensitivity testing method for microprocessor Download PDFInfo
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Abstract
The invention relates to an electromagnetic and thermal stress complex environmental sensitivity testing method for a microprocessor. An RF interference signal source (1), a power amplifier (2), a coupling capacitor (3), a power supply distribution network (4), a tested microprocessor (5), a PCB (6), a thermostatic heating tank (7), a DC power supply (8) and an oscilloscope (9) are included. The method also provides a capacity coupling injection interference based method for testing the electromagnetic and thermal stress complex environmental sensitivity of a microprocessor. The system is easy to build, low in cost and quick and convenient in testing, and solves the problem that the testing of the electromagnetic and thermal stress complex sensitivity of the microprocessor is difficult; meanwhile, the testing method is simple, the operating process is definite, the electromagnetic sensitivity of the microprocessor at different work environment temperatures can be accurately tested within the whole frequency band ranging from 150 KHz to 1 GHz, and sample testing can be carried out at an appointed operating temperature or a certain frequency point.
Description
Technical field
The present invention relates to microprocessor electromagnetism robustness testing field, be specifically related to a kind of microprocessor electromagnetism and thermal stress combinational environment sensitivity tests method.
Background technology
Microprocessor is as the core of electronic information, in key area widespread uses such as Aero-Space, space technology, communications and transportation and national defense and military.Under complicated electromagnetism and severe temperature environment, the deterioration of can drifting about of the intrinsic index of microprocessor Electro Magnetic Compatibility, causes the electromagnetism robustness problem of the responsive aggravation of chip and system electromagnetic environment and reliability decrease.Electromagnetism robustness refers to electromagnetic compatibility permanance and the functional safety reliability at complicated electromagnetism and climatic environment chips or system life-cycle mission profile.The electromagnetism robustness of microprocessor not only embodies himself parasitic electromagnetic compatibility characteristic, and what also reflection experience ambient temperature was aging resists electromagnetic interference capability, and concerns functional safety, comprehensive effectiveness and the Q-percentile life of constitution equipment, system.
Mainly to carry out respectively correlative study for processor chips level electromagnetic compatible and component reliability for the research of ic core chip level electromagnetism robustness in recent years, chip-scale electromagnetic compatibility is relative less with the research that reliability merges, and present situation shows to become focus direction both at home and abroad at present.For integrated circuit (IC) chip electromagnetic compatibility direction, IEEE electromagnetic compatibility journal (M Ramdani, E Sicard, A Boyer, S B Dhia, J J Whalen, T H.Hubing, M.Coenen, O.Wada.The Electromagnetic Compatibility of Integrated Circuits-Past, Present, and Future.IEEE Transactions on Electromagnetic Compatibility, February2009Vol.51, No.1:78-99) summarize correlative study.Integrated circuit electromagnetic susceptibility method of testing and statistics continue to bring out, and progressively go deep in integrated circuit electromagnetic compatibility theoretical foundation and experimental study.For the test of integrated circuit susceptibility, ICE62132-3 has provided the testing standard of Direct Power injection method (DPI), solve the test problem of device sensitivity, but this electromagnetic compatible testing method is not considered variation of ambient temperature influence factor, and power supply decoupling network and undesired signal isolation deficiency causes direct-flow voltage regulation source to be subject to inject undesired signal affecting.For the reliable aging test of components and parts, GJB548B-2005 and MIL-STD-883H (Department Of Defense Test Method Standard, Microcircuits, 26February2010) relevant test method has been carried out to standardization, but the method is not considered electromagnetic stress impact.Disclosed Chinese patent on October 3rd, 2012 " a kind of test macro and method of testing thereof of car body controller electromagnetic immunity performance " (CN102707706), provide a kind of method of testing of car body controller electromagnetism interference free performance, solve the electromagnetic compatibility test problem of car body controller, but not relating to temperature, the method affects vulnerability to jamming factor, and test needs microwave dark room environment, cost costliness.Said method considers that respectively unit environments factor tests, and temperature and electromagnetic environment is not integrated and is measured, and can not get the robustness under microprocessor electromagnetism and thermal stress combinational environment.The invention provides a kind of microprocessor electromagnetism and thermal stress combinational environment sensitivity tests method, considered electromagnetism and thermal stress complex effect factor, solve complicated electromagnetism and physical temperature environment robustness testing problem.
Summary of the invention
Given this, the present invention has set up microprocessor electromagnetism and thermal stress combinational environment sensitivity tests method, and build corresponding test macro based on the method, this test macro is easy to build, and cost is low, and method of testing is simple, operating process is clear, the conduction sensitivity characteristic that can test fast microprocessor under thermal stress and electromagnetism combinational environment, contributes to the forecast analysis of microprocessor electromagnetism robustness, provides foundation for improving in actual applications microprocessor electromagnetism robustness.
Technical scheme of the present invention is to provide a kind of for testing the system of microprocessor susceptibility under thermal stress and electromagnetism combinational environment, comprise: heated at constant temperature case, RF interference signal source, power amplifier, injection coupling capacitance, one-way electric power distributed network, tested microprocessor, printed circuit board (PCB), direct supply, oscillograph, it is characterized in that: heated at constant temperature case produces the thermal stress of test use, in it, place tested microprocessor brassboard; RF interference signal source produces the high-frequency interferencing signal of test use, and it is connected with power amplifier by SMA connector; Power amplifier carries out power amplification to the undesired signal of test use, and is connected with coupling capacitance by SMA connector; Coupling capacitance is injected into the undesired signal coupling after amplifying on the pin of tested microprocessor, and coupling capacitance is connected with the test pin of tested microprocessor; Tested microprocessor output connects oscillograph; The output signal of oscillograph for observing tested microprocessor; Direct supply provides operating voltage for tested microprocessor, and it connects power distribution network; Power distribution network is made up of inductance and low voltage difference diode, forms perfectly straight stream, removes the one-way feed power distribution network of interchange, is connected with the power pins of tested microprocessor; Coupling capacitance, power distribution network and tested microprocessor are installed on printed circuit board (PCB).
The present invention also provides the method for microprocessor electromagnetic susceptibility test under a kind of thermal stress and electromagnetism combinational environment, it is characterized in that, the method adopts following steps to realize:
The 1st step, build microprocessor electromagnetism and thermal stress combinational environment sensitivity tests system, tested microprocessor is put in to constant temperature oven, set constant temperature the temperature inside the box at 25 DEG C to 85 DEG C operating ambient temperatures, other equipment are by high temperature resistant line connecting test microprocessor, be placed in outside constant temperature oven, under room temperature.Set the output signal frequency bandwidth of RF interference signal source at 150KHz-1GHz, coupling capacitance value 6.8nF, power distribution network comprises 4.7 μ H inductance and low voltage difference diode, and direct supply obtains stable power-supplying voltage by power distribution network;
The 2nd step, setting microprocessor electromagnetism and thermal stress combinational environment susceptibility physical quantity, i.e. conducted susceptibility;
The 3rd step, structure microprocessor Conduction Interference coupled transfer path
Build microprocessor Conduction Interference coupled transfer path by 50 Ω impedances, comprise the PCB terminal at RF interference signal source, power amplifier, coupling capacitance and tested microprocessor place; Configuring high-frequency interference signal source, wideband power amplifer, route matching impedance, power distribution network are injected in design; The interference and coupling injection circuit of design, the directed radiofrequency signal of injecting is disturbed tested micro processor leg or position, and isolated DC signal content is directly added in tested device pin simultaneously; The power distribution network of design, ensures the normal direct current supply of tested microprocessor or element circuit, and blocking-up high-frequency ac disturbs feed-in external power source or other non-tested circuit;
The 4th step, the environment temperature of microprocessor work is set
Adjust the temperature of constant temperature oven at 25 DEG C to 85 DEG C, to provide experiment required environment temperature.Constant temperature oven is the temperature in show case in real time, in the time that calorstat temperature arrives assigned temperature, tested equipment is put into constant temperature oven and should stablize and be not less than 10 minutes so that tested equipment physical attribute reaches stable;
The 5th step, define microprocessor electromagnetic susceptibility threshold value criterion
Utilize the monitoring of RF signal source to inject the power of undesired signal, set microprocessor chip operating ambient temperature, observe microprocessor output pin signal waveform by oscillograph, monitoring state, in the time of microprocessor work abnormal state, define the power that injects undesired signal as microprocessor sensitivity threshold;
The 6th step, setting coupling inject disturbing pulse signal
Adopt the continuous sine wave of continuous sine wave and AM modulation as disturbing pulse signal;
The 7th step, setting undesired signal frequency test conducted susceptibility
When test, on the setting original frequency point of undesired signal, progressively improve the power of undesired signal, when microprocessor work abnormal state, judge chip failure, record the power of the front undesired signal that breaks down; Otherwise continuing increases power, until power target value finishes;
The 8th step, change undesired signal frequency test conducted susceptibility
Increase the frequency of undesired signal, repeat the test of the 7th step, finish until frequency reaches the upper limit of test frequency;
The 9th step, change calorstat temperature, after temperature stabilization, repeat the experiment of the 7th step and the 8th step, until temperature reaches the maximum of setting;
The 10th step, analyzing test data and result
Microprocessor sensitivity tests related data, shape information under electromagnetism and thermal stress combinational environment gathered, record, export and be stored in, carry out test result analysis, tested microprocessor electromagnetism and thermal stress combinational environment susceptibility obtained;
The invention has the beneficial effects as follows:
(1) under electromagnetism and thermal stress combinational environment, microprocessor sensitivity tests system is easy to build, and cost is low, tests rapid and convenient, has solved the problem of microprocessor sensitivity tests difficulty under combinational environment stress.
(2) this method combines thermal stress and the impact of electromagnetic environment on microprocessor, can draw temperature and the electromagnetic environment compound influence ability to microprocessor susceptibility.
(3) method of testing of the present invention is simple, and operating process is clear, can be under 20 DEG C to 85 DEG C temperature ranges, and DCO detailed checkout electromagnetic susceptibility in the whole frequency range of 150KHz to 1GHz, also can carry out sample testing at certain Frequency point of assigned temperature or certain frequency range.
(4) method of testing of the present invention can obtain microprocessor sensitivity threshold data under different thermal stress, for the forecast analysis of varying environment temperature work microprocessor electromagnetic susceptibility, provides foundation for improving in actual applications microprocessor electromagnetic susceptibility.
Brief description of the drawings
Fig. 1 is microprocessor sensitivity tests system chart under electromagnetism of the present invention and thermal stress combinational environment;
Fig. 2 is microprocessor sensitivity tests method flow diagram under electromagnetism of the present invention and thermal stress combinational environment;
Fig. 3 is microprocessor sensitivity tests process flow diagram under electromagnetism of the present invention and thermal stress combinational environment;
Fig. 4 is microprocessor sensitivity tests result curve figure under electromagnetism of the present invention and thermal stress combinational environment.
Wherein 1-RF interference signal source; 2-power amplifier; 3-coupling capacitance; 4-power distribution network; The tested microprocessor of 5-, 6-printed circuit board (PCB); 7-constant temperature oven; 8-direct supply; 9-oscillograph.
Embodiment
The present invention is further detailed explanation for 1-4 with reference to the accompanying drawings.
Microprocessor sensitivity tests method under a kind of electromagnetism that the present invention proposes and thermal stress combinational environment, mainly under different thermal stress conditions, the tested pin to microprocessor carries out real-time sensitivity tests, apply the thermal stress of specified temp by constant temperature oven, inject electromagnetic interference signal (sine, amplitude modulation, frequency modulation, fast-pulse etc.) by capacitive coupling, test chip duty and Injection Signal power, frequency and temperature relation, mainly reflect electromagnetism and the compound conduction sensitivity characteristic of thermal stress of tested microprocessor.Specific practice is that tested microprocessor is placed into constant temperature oven, RF undesired signal is injected on tested micro processor leg by coupled transfer path, by oscillograph Real-Time Monitoring output signal, judge the duty of tested microprocessor, thermal stress and the electromagnetism of studying tested microprocessor conduct responsive composite attribute.
As shown in Figure 1, the system of microprocessor susceptibility under a kind of electromagnetism that the present invention proposes and thermal stress combinational environment, this system comprises: RF interference signal source 1, power amplifier 2, coupling capacitance 3, power distribution network 4, tested microprocessor 5, printed circuit board (PCB) 6, constant temperature oven 7, direct supply 8, oscillograph 9; Wherein, RF interference signal source 1 produces the undesired signal of test use, mainly contains continuous sine wave and AM modulation continuous sine wave signal, has the function of monitoring input interfering signal power size, and it is connected with power amplifier 2 by SMA connector; Power amplifier 2 carries out power amplification to the undesired signal of test use, to meet test request, and is connected with coupling capacitance 3 by SMA connector; Coupling capacitance 3 is coupled to the undesired signal after amplifying on the pin of tested microprocessor, its capacitance choose the effect that will consider stray inductance on input path, and undesired signal want the loss-free first-class factor of chip testing pin that is added in, coupling capacitance 3 is connected with the test pin of tested microprocessor 5; Tested microprocessor 5 outputs connect oscillograph 9; Oscillograph 9 is observed the output signal of tested microprocessor 5; Direct supply 7 provides operating voltage for tested microprocessor, and it connects power distribution network 4; Power distribution network 4 is made up of inductance and low voltage difference diode, forms perfectly straight stream, removes the one-way feed power distribution network of interchange, is connected with the power pins of tested microprocessor 5, and effect is that isolation exchanges the impact of undesired signal on direct supply; Coupling capacitance 3, power distribution network 4 and tested microprocessor 5 are installed on printed circuit board (PCB) 6; Printed circuit board (PCB) 6 is placed in constant temperature oven 7, by the power amplifier 2 outside coaxial cable and high temperature resistant line and case, and direct supply 8, oscillograph 9 is connected.
In fact, the microprocessor susceptibility under electromagnetism and thermal stress combinational environment reflects its electromagnetism health indices, and electromagnetism robustness is new ideas that merge Electro Magnetic Compatibility, functional safety and three problem in science of reliability.Its basic intension refers to electromagnetic compatibility permanance and the functional safety reliability of system life-cycle mission profile in complicated electromagnetism and climatic environment.Electromagnetism robustness has reflected the internal association of chip and system EMC, functional safety and reliability, electromagnetic environmental effects, electromagnetic compatibility stability and the functional safety degree of reliability of embodiment system, relate to the key technical problems such as combinational environment effector mechanism, electromagnetic compatibility deterioration law and the assessment of systemic-function safety and risk from components and parts to system.Internal system electrical structure and characteristics determined its parasitic Electro Magnetic Compatibility and inherent reliability, when after the complicated electromagnetism of experience and physical environment effect of stress and aging effect, can cause the problems such as the decline of system electromagnetism robustness, the aggravation of functional safety risk.
Therefore, the present invention proposes a kind of microprocessor sensitivity tests method under electromagnetism and thermal stress combinational environment, setting electromagnetism and thermal stress combinational environment microprocessor sensitivity characteristic is the problem that the present invention studies; Building electromagnetism and thermal stress combinational environment is prerequisite and the basis of analyzing microprocessor electromagnetic susceptibility; Defining the port susceptibility threshold value criterion that under different thermal stress conditions, the injection of microprocessor capacitive coupling is disturbed is the foundation that judges whether chip lost efficacy; Inject dissimilar coupled flutter, observe the responsive state of microprocessor; Based on above-mentioned principle test system building, under different thermal stress conditions, microprocessor is carried out to real-time sensitivity tests according to electromagnetic susceptibility testing process, analysis result, solves microprocessor electromagnetic susceptibility test problem under thermal stress conditions.
As shown in Figure 2, taking 32-bit number signal processor TMS320F2812 as example illustrates method of testing of the present invention, specifically comprise the following steps:
The 1st step, build electromagnetism and thermal stress combinational environment microprocessor electromagnetic susceptibility test macro
According to building microprocessor Conducted Electromagnetic sensitivity tests system shown in Fig. 1.This system mainly comprises RF interference signal source 1, power amplifier 2, coupling capacitance 3, power distribution network 4, tested microprocessor 5, printed circuit board (PCB) 6, constant temperature oven 7, direct supply 8 and oscillograph 9.The temperature of constant temperature oven is controlled at 25 DEG C-85 DEG C, the output signal frequency bandwidth 150KHz-1GHz of RF interference signal source, and coupling capacitance value 6.8nF, power distribution network comprises 4.7 μ H inductance and low voltage difference diode, and direct supply adopts adjustable D. C regulated.
The 2nd step, setting microprocessor electromagnetism conduction sensitivity characteristic physical quantity, i.e. conducted susceptibility;
Under electromagnetism and thermal stress combinational environment, microprocessor susceptibility refers to the electromagnetic susceptibility characteristic of microprocessor at varying environment temperature; At varying environment temperature the existence of RF undesired signal cause microprocessor chip logical miss, when producing wrong signal and instruction or causing microprocessor misoperation, show to enter sensitizing range, set microprocessor chip different operating environment temperature, reflection microprocessor electromagnetism and thermal stress combinational environment sensitivity characteristic; Electromagnetic susceptibility comprises conducted susceptibility and radiosusceptibility, and the susceptibility of mentioning in this article does not add specified otherwise and all refers to conducted susceptibility;
Due to the existence of RF undesired signal, the supply voltage of microprocessor produces fluctuation, when mains fluctuations are greater than 20% of rated voltage, or the minimizing of the difference of supply voltage VDD and VSS exceed VDD 30% time, microprocessor enters sensitizing range.
The 3rd step, structure microprocessor Conduction Interference coupled transfer path
Build microprocessor Conduction Interference coupled transfer path by 50 Ω impedances, comprise the PCB terminal at RF interference signal source, power amplifier, coupling capacitance and tested microprocessor place.For reducing the impact of signal reflex, test macro adopts the cable of 50 Ω to connect each ingredient, comprises the PCB cabling mating with 50 Ω, ensures to be 50 Ω from RF interference signal source 1 to the undesired signal transmission path input impedance tested microprocessor 5.
The 4th step, the environment temperature of microprocessor work is set
Adjust the temperature of constant temperature oven at 25 DEG C to 85 DEG C, to provide experiment required environment temperature.Constant temperature oven is the temperature in show case in real time, in the time that calorstat temperature arrives assigned temperature, tested equipment is put into constant temperature oven and should stablize and be not less than 10 minutes so that tested equipment physical attribute reaches stable.
The 5th step, the microprocessor electromagnetic susceptibility threshold value criterion defining under specified temp utilize the monitoring of RF signal source to inject the power of undesired signal, observe microprocessor output pin signal waveform by oscillograph, monitoring state, in the time of microprocessor work abnormal state, defining now the interfering signal power injecting is microprocessor sensitivity threshold, be injected into signal on micro processor leg and be RF undesired signal and+stack of 3.3V DC power signal.
Do not add while interference, can on oscillograph, obtain output signal and set its marginal range, this marginal range is set as 20% of output voltage level in the present embodiment, on each Frequency point of input undesired signal, continues to increase the power of undesired signal, until the voltage levvl of output signal exceedes marginal range, think that microprocessor lost efficacy, interfering signal power now inputted in record, under different input undesired signal frequencies, sensitizing range critical power value is different, and representative value is 36dBm.
The continuous sine wave of the 6th step, employing continuous sine wave (CW) and AM modulation is set coupling as disturbing pulse signal source and is injected disturbing pulse signal.
In this embodiment, modulation signal is 1KHz sine wave, and modulation factor is fixed as 80%, and when microprocessor is tested, CW and AM signal use same constant peak value, the signal peak P of AM
amsignal peak P with CW
cwbetween relation suc as formula shown in (1):
Wherein m is modulation factor, and when m=0.8 (namely 80%), CW and AM signal peak relation are suc as formula shown in (2):
P
am＝0.407P
cw (2)
When to use modulation factor be 80% AM signal is during as undesired signal, for CW undesired signal, the signal level of the signal source 5.1dB that declined.
Undesired signal in this embodiment adopts continuous sine wave signal, and frequency is 150KHz-1GHz, and it is 5W (36dBm) that power target value is set, and prevents that the too high circuit to chip internal of power from causing damage physically.In test process, undesired signal acts on the time of microprocessor at least than microprocessor Best-case Response Time length, and under any circumstance, should not be less than 1 second action time.
The 7th step, setting undesired signal frequency test conducted susceptibility
Testing process as shown in Figure 3.When test, the original frequency of undesired signal is from 150KHz or a certain setting value, and for saving the test duration, the initial power of undesired signal is set as P
limit-xdBm, wherein x is the allowance of power, P
limitfor power target value, on each Frequency point, progressively improve the power of undesired signal, until reaching 5W (36dBm), power target value finishes, if microprocessor work abnormal state, judges chip failure, record the power of the front undesired signal that breaks down; Otherwise continuing increases power, until power target value finishes.
The 8th step, change undesired signal frequency test conducted susceptibility
Increase or change the frequency of undesired signal, repeat the test of the 7th step, finish until frequency reaches the upper limit (1GHz) or the target setting value of test frequency, while carrying out next frequency test, initial power can be made as than the little 6dBm of previous frequency, to reduce the loop iteration of power.
The temperature test conducted susceptibility of the 9th step, change constant temperature oven
Increase or reduce the design temperature of constant temperature oven, repeat the test of the 7th step and the 8th step, until temperature reaches the upper temperature limit of setting or reaches the lowest temperature of setting.
The 10th step, analyzing test data and result
Gather, record, output with store under thermal stress and electromagnetism combinational environment the information such as microprocessor Conducted Electromagnetic sensitivity tests related data, waveform, typical data is as shown in Figure 4.
According to the result of measured data, obtain injecting under different thermal stress the change curve of undesired signal frequency and microprocessor port sensitivity threshold, Fig. 4 is 32-bit microprocessor TMS320F2812 electromagnetic susceptibility test result curve under different thermal stress conditions.Can draw to draw a conclusion by microprocessor sensitivity tests under thermal stress and electromagnetism combinational environment:
(1) under identical thermal stress conditions, disturbance signal frequency lower threshold value difference, near 400MHz and 700MHz, threshold value is lower, and susceptibility is higher, and reflection microprocessor is subject to outer signals in this frequency range and disturbs;
(2), under identical frequency, the responsive threshold values of microprocessor, along with the rising of temperature is slightly improved, illustrates that the antijamming capability of the higher microprocessor of temperature is more weak, need to be optimized measure to the microprocessor under hot operation.
(3) frequency, on the impact of the responsive threshold values of microprocessor significantly higher than temperature, illustrate that in combinational environment, working what dominate influence factor is the intensity of electromagnetic environment.
(4), in the operating temperature range of chip nominal, microprocessor port sensitivity threshold major part, more than 20dBm, meets common engineering application (20dBm) requirement; At the application scenario that susceptibility is had relatively high expectations (30dBm), need to implement Optimized Measures to the lower frequency range of microprocessor sensitivity threshold.
Although the present invention is described in detail in conjunction with the embodiments; but those skilled in the art are with being to be understood that; the present invention is not limited only to specific embodiment; on the contrary; in the various corrections that do not exceed the application's spirit and essence, distortion and replacement all drop among the application's protection domain.
Claims (2)
1. one kind for testing the system of microprocessor electromagnetism and thermal stress combinational environment susceptibility, comprise: RF interference signal source (1), power amplifier (2), coupling capacitance (3), power distribution network (4), tested microprocessor (5), printed circuit board (PCB) (6), heated at constant temperature case (7), direct supply (8), oscillograph (9), is characterized in that:
RF interference signal source (1) produces the undesired signal of test use, and it is connected with power amplifier (2) by SMA connector; Power amplifier (2) carries out power amplification to the undesired signal of test use, and is connected with coupling capacitance (3) by SMA connector; Coupling capacitance (3) adopts high power capacity, and the undesired signal after amplifying is coupled on the pin of tested microprocessor, and coupling capacitance (3) is connected with the test pin of tested microprocessor (5); Tested (5) output connects oscillograph (9); Oscillograph (9) is for observing the output signal of tested microprocessor (5); Direct supply (8) provides operating voltage for tested microprocessor, and its connects power distribution network (4); Power distribution network (4) is for providing galvanic current source, the undesired signal of isolated power amplifier (2) output is simultaneously coupled to direct supply (8), power distribution network (4) comprises inductance and diode, and power distribution network (4) is connected with the power pins of tested microprocessor (5); Printed circuit board (PCB) (6) is for coupling capacitance (3), power distribution network (4) and tested microprocessor (5) are installed, and is placed in heated at constant temperature case (7); Heated at constant temperature case (7) is for providing tested microprocessor (5) adjustable operating ambient temperature.
2. utilize system described in claim 1 to realize the method for microprocessor electromagnetism and thermal stress combinational environment sensitivity tests, it is characterized in that, the method adopts following steps to realize:
The 1st step, build microprocessor electromagnetism and thermal stress combinational environment sensitivity tests system, 25 DEG C to 85 DEG C of constant temperature oven build-in test microprocessor chip operating ambient temperatures are set, set the output signal frequency bandwidth of RF interference signal source at 150KHz-1GHz, coupling capacitance value 6.8nF, power distribution network comprises 4.7 μ H inductance and low voltage difference diode, direct supply provides supply voltage by power distribution network for tested microprocessor, and direct supply adopts adjustable stabilized voltage supply;
The 2nd step, setting reflection microprocessor electromagnetism and thermal stress combinational environment sensitivity characteristic physical quantity, i.e. conducted susceptibility;
The 3rd step, structure microprocessor Conduction Interference coupled transfer path
Build microprocessor Conduction Interference coupled transfer path by 50 Ω impedances, comprise the PCB terminal at RF interference signal source, power amplifier, coupling capacitance, power distribution network and tested microprocessor place, undesired signal is injected into tested micro processor leg by coupling capacitance orientation, power distribution network ensures tested microprocessor direct current supply, blocks high-frequency ac simultaneously and disturbs feed-in external power source;
The 4th step, the environment temperature of microprocessor work is set
Adjust the temperature of constant temperature oven at 25 DEG C to 85 DEG C, to provide experiment required environment temperature.Constant temperature oven is the temperature in show case in real time, in the time that calorstat temperature arrives assigned temperature, tested equipment is put into constant temperature oven and should stablize and be not less than 10 minutes so that tested equipment physical attribute reaches stable.
The 5th step, define microprocessor electromagnetism and thermal stress combinational environment susceptibility threshold value criterion
Utilize the monitoring of RF signal source to inject the power of undesired signal, observe microprocessor output pin signal waveform by oscillograph, monitoring state, in the time of microprocessor work abnormal state, defines the power that injects undesired signal as setting microprocessor work environment temperature electromagnetic susceptibility threshold value;
The continuous sine wave of the 6th step, employing continuous sine wave and AM modulation is set coupling as disturbing pulse signal source and is injected disturbing pulse signal;
The 7th step, setting undesired signal frequency test conducted susceptibility
When test, on the undesired signal original frequency point of setting, progressively improve the power of undesired signal, if microprocessor work abnormal state is judged chip failure, record the power of the front undesired signal that breaks down; Otherwise continuing increases power, until finish while reaching power target value;
The 8th step, change undesired signal frequency test conducted susceptibility
Increase the frequency of undesired signal, repeat the test of the 6th step, finish in limited time until frequency reaches the upper of test frequency;
The 9th step, change calorstat temperature, after temperature stabilization, repeat the experiment of the 6th step and the 7th step, until temperature reaches the maximum of setting;
The 10th step, analyzing test data and result
Collection, record, output and storage microprocessor electromagnetism and thermal stress combinational environment sensitivity tests related data, shape information, carry out test result analysis, and then obtain varying environment temperature microprocessor susceptibility.
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