CN104155486A - Adapter plate needle die mechanism - Google Patents
Adapter plate needle die mechanism Download PDFInfo
- Publication number
- CN104155486A CN104155486A CN201410406971.6A CN201410406971A CN104155486A CN 104155486 A CN104155486 A CN 104155486A CN 201410406971 A CN201410406971 A CN 201410406971A CN 104155486 A CN104155486 A CN 104155486A
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- CN
- China
- Prior art keywords
- needle mould
- plate
- needle die
- test
- cover plate
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- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses an adapter plate needle die mechanism which comprises a test plate, a flat cable, a lower needle die, an upper needle die, a cover plate and an adapter plate. A cavity and a lower fixation plate are arranged on the test plate. The lower needle die is fixedly arranged on the cavity. One end of the flat cable is connected with the lower fixation plate, and the other end is connected with an upper fixation plate. The upper fixation plate is arranged at the lower part of the cover plate. The upper needle die is fixedly arranged at the lower part of the cover plate. The upper needle die is arranged right above the lower needle die. A pin is arranged at the lower part of the upper needle die. The adapter plate is arranged on the upper surface of the cover plate. A vacuum suction head is arranged on the lower needle die. A positioning groove is arranged on the lower needle die. A probe is arranged on the upper needle die. The test plate is connected with the lower needle die through the cavity. According to the invention, the test mechanism carries out an automatic test, and can accurately position a product; the test efficiency and the test yield are improved; and the service life of the mechanism is improved, and the service life is more than 17000 times.
Description
Technical field
The present invention relates to a kind of mechanism for testing, especially Precision Inspection field, is specially a kind of card extender needle mould mechanism.
Background technology
At present, in consumption electronic products, it is more and more less that product can become, and more and more accurate, the difficulty of the product quality of detection also strengthens greatly.Electronic product may cause short circuit or the open circuit between part in manufacture process, and open circuit or short circuit appear in damage, the circuit of part, so need each parts to guarantee from new detection the product that has been before complete machine assembling, could start main dress.Precision measurement part conventional in electronic product is at connector or golden finger.The method that in the past detected connector or golden finger is; Use connector male and female docking mode.Operator, by connector or golden finger docking wherein, is being fastened test.The method test duration is long, and efficiency is not high, under test yield, and easily maloperation, causes connector or golden finger damage.
Therefore,, for addressing the above problem, spy provides a kind of new technical scheme.
Summary of the invention
The object of this invention is to provide accurately product of one, improve the card extender needle mould mechanism of testing efficiency.
The present invention is achieved through the following technical solutions:
One card extender needle mould mechanism; comprise test board, winding displacement, lower needle mould, upper needle mould, cover plate and card extender; described test board is provided with a cavity and bottom plate; on described cavity, be installed with lower needle mould; described winding displacement one end connects bottom plate; the other end connects upper mounted plate; fixed plate is arranged on cover plate bottom; described cover plate bottom is installed with needle mould; described upper needle mould is arranged on directly over lower needle mould; upper needle mould bottom is provided with pin, and described card extender is arranged on cover plate upper surface.
Further, described lower needle mould is provided with vacuum cups.
Further, described lower needle mould is provided with locating slot.
Further, described upper needle mould is provided with probe.
Further, described test board is connected with lower needle mould by cavity.
The invention has the beneficial effects as follows: mechanism for testing provided by the invention, automatic test, accurately positioning product, improves testing efficiency and test yield, and improves mechanism serviceable life, reaches serviceable life more than 1.7 ten thousand times.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the present invention is described further.
Fig. 1 is a kind of front view of changing needle mould mechanism of the present invention.
Fig. 2 is needle mould structural drawing in the present invention.
Wherein: 1, test board, 2, winding displacement, 3, lower needle mould, 4, upper needle mould, 5, cover plate, 6, card extender, 7, cavity, 8, bottom plate, 9, upper mounted plate, 10, pin, 11, vacuum cups, 12 locating slots, 13, probe.
Embodiment
As shown in Figure 1 and 2, one card extender needle mould mechanism, comprise test board 1, winding displacement 2, lower needle mould 3, upper needle mould 4, cover plate 5 and card extender 6, test board 1 is provided with a cavity 7 and bottom plate 8, on cavity 7, be installed with lower needle mould 3, winding displacement 2 one end connect bottom plate 8, the other end connects upper mounted plate 9, upper mounted plate 9 is arranged on cover plate 5 bottoms, cover plate 5 bottoms are installed with needle mould 4, upper needle mould 4 is arranged on directly over lower needle mould 3, and upper needle mould 4 bottoms are provided with pin 10, and card extender 6 is arranged on cover plate 5 upper surfaces; Lower needle mould 3 is provided with vacuum cups 11, and lower needle mould 3 is provided with locating slot 12, and upper needle mould 3 is provided with probe 13, and test board 1 is connected with lower needle mould 3 by cavity 7.
Principle of work, is placed on lower needle mould 3 locating slots 12 product to be measured, and vacuum cups 11 adsorption productions on lower needle mould 3, then go up needle mould 4 and press down by winding displacement 2, and probe 13 is pricked and touched product, and product is communicated with test board 1, and test board 1 starts software test.Wherein, locating slot 12, accurately positioning product, vacuum cups 11, adsorbs product smooth; Upper needle mould presses down and lower needle mould Surface Contact, and probe 13 is pricked and touched connector or golden finger; Pin 10 press down at upper needle mould time, play perpendicular positioning.
Mechanism for testing provided by the invention, automatic test, accurately positioning product, improves testing efficiency and test yield, and improves mechanism serviceable life, reaches serviceable life more than 1.7 ten thousand times.
Claims (5)
1. a card extender needle mould mechanism; comprise test board, winding displacement, lower needle mould, upper needle mould, cover plate and card extender; it is characterized in that: described test board is provided with a cavity and bottom plate; on described cavity, be installed with lower needle mould; described winding displacement one end connects bottom plate; the other end connects upper mounted plate; fixed plate is arranged on cover plate bottom; described cover plate bottom is installed with needle mould; described upper needle mould is arranged on directly over lower needle mould; upper needle mould bottom is provided with pin, and described card extender is arranged on cover plate upper surface.
2. a kind of card extender needle mould mechanism according to claim 1, is characterized in that: described lower needle mould is provided with vacuum cups.
3. a kind of card extender needle mould mechanism according to claim 1, is characterized in that: described lower needle mould is provided with locating slot.
4. a kind of card extender needle mould mechanism according to claim 1, is characterized in that: described upper needle mould is provided with probe.
5. a kind of card extender needle mould mechanism according to claim 1, is characterized in that: described test board is connected with lower needle mould by cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410406971.6A CN104155486A (en) | 2014-08-19 | 2014-08-19 | Adapter plate needle die mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410406971.6A CN104155486A (en) | 2014-08-19 | 2014-08-19 | Adapter plate needle die mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104155486A true CN104155486A (en) | 2014-11-19 |
Family
ID=51881039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410406971.6A Pending CN104155486A (en) | 2014-08-19 | 2014-08-19 | Adapter plate needle die mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104155486A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105182142A (en) * | 2015-10-16 | 2015-12-23 | 苏州赛腾精密电子股份有限公司 | Probe testing device |
| CN112394202A (en) * | 2020-10-29 | 2021-02-23 | 西安微电子技术研究所 | Interconnection test fixture and interconnection test method for silicon adapter plate |
-
2014
- 2014-08-19 CN CN201410406971.6A patent/CN104155486A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105182142A (en) * | 2015-10-16 | 2015-12-23 | 苏州赛腾精密电子股份有限公司 | Probe testing device |
| CN112394202A (en) * | 2020-10-29 | 2021-02-23 | 西安微电子技术研究所 | Interconnection test fixture and interconnection test method for silicon adapter plate |
| CN112394202B (en) * | 2020-10-29 | 2023-06-27 | 珠海天成先进半导体科技有限公司 | Interconnection test fixture and interconnection test method for silicon adapter plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141119 |
|
| RJ01 | Rejection of invention patent application after publication |