CN104143399A - Flat type thermistor - Google Patents
Flat type thermistor Download PDFInfo
- Publication number
- CN104143399A CN104143399A CN201310301112.6A CN201310301112A CN104143399A CN 104143399 A CN104143399 A CN 104143399A CN 201310301112 A CN201310301112 A CN 201310301112A CN 104143399 A CN104143399 A CN 104143399A
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- thermistor
- wire
- lead wire
- lead
- flat type
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Abstract
The invention discloses a flat type thermistor, which includes a resistor body. The resistor body is composed of a lead wire, a thermistor body and an encapsulation layer. The thermistor body and the lead wire are encapsulated into a flat structure by the encapsulation layer. The lead wire adopts a platinum wire and has a diameter of 0.5mm. The surface of the thermistor body is provided with a silver coating. The lead wire involved in the invention employs the platinum wire to replace Dumet wires, the platinum wire has high temperature resistance, oxidation resistance and corrosion resistance, and the problems of easy discoloration, oxidation and fracture of the lead wire at high temperature in the production process are solved. Also, the platinum wire belongs to pure metal, and has no covering layer on the surface, thus omitting a nickel plating process, avoiding contact of the lead wire and acid, and avoiding the possible stress corrosion phenomenon of Dumet wires. The appearance structure of the product is improved from a circular to a flat structure, so that the product volume and heat capacity difference are reduced, and the sensitivity of the thermistor is also improved. Meanwhile, the flat type thermistor is convenient for installation and use by users, and can be mounted to devices completely.
Description
Technical field
The present invention relates to a kind of electronic devices and components, relate in particular to a kind of flat type thermistor.
Background technology
At present, have the contour structures of the thermistor of encapsulated layer mostly to be circular, lead-in wire material mostly is the Dumet wire of iron-nickel alloy.In process of manufacture, as the Dumet wire of lead-in wire, be at high temperature prone to the phenomenon of variable color, oxidation, fracture.In installing and using process, because the contour structures of existing thermistor is circular, inadequate with the laminating degree of device, its sensitivity is not high yet, and the phenomenon of stress corrosion in use also may appear in lead-in wire.
Summary of the invention
The problem existing for above-mentioned prior art, the object of the invention is to provide a kind of flat type thermistor, has solved in use not with the laminating degree of device, and sensitivity is not high, the problem of wire stress corrosion; Adopt platinum filament as lead-in wire simultaneously, solved in process of manufacture at high temperature easy to change, oxidation of lead-in wire, fracture.
Technical scheme of the present invention is: a kind of flat type thermistor, comprise resistor body, described resistor body by going between, thermistor body and encapsulated layer form, described thermistor body and lead-in wire are packaged into flat structure by encapsulated layer, described lead-in wire adopts platinum filament, and the diameter of lead-in wire is 0.5mm; Described thermistor surface is provided with silver coating.
As preferably, described encapsulated layer is glass tube, metal tube, epoxy resin layer or glass glaze layer.
The invention has the beneficial effects as follows: product lead-in wire selects platinum filament to substitute Dumet wire, that platinum filament has is high temperature resistant, non-oxidizability, corrosion resistance, at process of manufacture, solved the problem of at high temperature easy to change, oxidation of lead-in wire, fracture, and platinum filament belongs to simple metal, surface does not have cover layer, remove nickel plating process from, avoided lead-in wire to contact with acid, avoided Dumet wire may have the phenomenon of stress corrosion; Because product design structure is improved to flat structure by circle, the diameter of lead-in wire is 0.5mm, has reduced small product size and thermal capacitance is poor, so also improves the sensitivity of thermistor, facilitates user installation to use simultaneously, mounts completely with device.
Accompanying drawing explanation
Fig. 1 is front view of the present invention;
Fig. 2 is vertical view of the present invention.
In figure: 1, lead-in wire; 2, thermistor body; 3, encapsulated layer.
Embodiment
As one embodiment of the present invention, as depicted in figs. 1 and 2, a kind of flat type thermistor, comprise resistor body, described resistor body is by going between 1, thermistor body 2 and encapsulated layer 3 form, described encapsulated layer 3 is glass tube, metal tube, epoxy resin layer or glass glaze layer, described thermistor body 2 and lead-in wire 1 are packaged into flat structure by encapsulated layer 3, because product design structure is improved to flat structure by circle, reduced small product size and thermal capacitance is poor, so also improve the sensitivity of thermistor, facilitate user installation to use simultaneously, mount completely with device, described lead-in wire 1 adopts platinum filament, and the diameter of lead-in wire 1 is 0.5mm.That platinum filament has is high temperature resistant, non-oxidizability, corrosion resistance, process of manufacture solved go between 1 at high temperature easy to change, oxidation, fracture problem, and platinum filament belongs to simple metal, surface does not have cover layer, removed nickel plating process from, avoid lead-in wire 1 to contact with acid, avoided Dumet wire may have the phenomenon of stress corrosion.Described thermistor body 2 surfaces are provided with silver coating, make contact resistance of the present invention as far as possible little, guarantee its negative temperature coefficient feature and fast response speed.
Above a kind of flat type thermistor provided by the present invention has been carried out to detailed introduction, applied specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.To change of the present invention and improvement, will be possible, and can not exceed design and the scope that accessory claim can be stipulated.
Claims (2)
1. a flat type thermistor, comprise resistor body, described resistor body by going between, thermistor body and encapsulated layer form, it is characterized in that: described thermistor body and lead-in wire are packaged into flat structure by encapsulated layer, described lead-in wire adopts platinum filament, and the diameter of lead-in wire is 0.5mm; Described thermistor surface is provided with silver coating.
2. flat type thermistor according to claim 1, is characterized in that: described encapsulated layer is glass tube, metal tube, epoxy resin layer or glass glaze layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310301112.6A CN104143399A (en) | 2013-07-18 | 2013-07-18 | Flat type thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310301112.6A CN104143399A (en) | 2013-07-18 | 2013-07-18 | Flat type thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104143399A true CN104143399A (en) | 2014-11-12 |
Family
ID=51852551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310301112.6A Pending CN104143399A (en) | 2013-07-18 | 2013-07-18 | Flat type thermistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104143399A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108122651A (en) * | 2017-12-20 | 2018-06-05 | 肇庆爱晟传感器技术有限公司 | A kind of ceramic membrane glass-encapsulated resistance and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2501164Y (en) * | 2001-09-26 | 2002-07-17 | 成都宏明电子股份有限公司 | Single-layer sheet type thermistor |
| CN102627458A (en) * | 2012-05-04 | 2012-08-08 | 中国科学院新疆理化技术研究所 | Wide-warm-area negative temperature coefficient thermistor material |
| CN202584968U (en) * | 2012-04-06 | 2012-12-05 | 成都宏明电子股份有限公司 | Flat thermal resistor |
-
2013
- 2013-07-18 CN CN201310301112.6A patent/CN104143399A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2501164Y (en) * | 2001-09-26 | 2002-07-17 | 成都宏明电子股份有限公司 | Single-layer sheet type thermistor |
| CN202584968U (en) * | 2012-04-06 | 2012-12-05 | 成都宏明电子股份有限公司 | Flat thermal resistor |
| CN102627458A (en) * | 2012-05-04 | 2012-08-08 | 中国科学院新疆理化技术研究所 | Wide-warm-area negative temperature coefficient thermistor material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108122651A (en) * | 2017-12-20 | 2018-06-05 | 肇庆爱晟传感器技术有限公司 | A kind of ceramic membrane glass-encapsulated resistance and preparation method thereof |
| CN108122651B (en) * | 2017-12-20 | 2020-07-28 | 肇庆爱晟传感器技术有限公司 | Ceramic film glass packaging resistor and preparation method thereof |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141112 |