CN104140681B - A kind of silicon composition for electronic component encapsulation - Google Patents

A kind of silicon composition for electronic component encapsulation Download PDF

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CN104140681B
CN104140681B CN201410357881.2A CN201410357881A CN104140681B CN 104140681 B CN104140681 B CN 104140681B CN 201410357881 A CN201410357881 A CN 201410357881A CN 104140681 B CN104140681 B CN 104140681B
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汤胜山
王全
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BEITELI NEW MATERIAL Co Ltd DONGGUAN CITY
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BEITELI NEW MATERIAL Co Ltd DONGGUAN CITY
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Abstract

The present invention relates to technical field of polymer materials, more particularly to a kind of silicon composition for electronic component encapsulation, including（1）Structural units are (R1SiMe2O0.5)a(R2SiO1.5)b(ViSiMe2R3SiO1.5)cPolysiloxane, a+c/b=0.01 1；（2）Structural units are (R4SiMe2O0.5)d(R5R6SiO)e(ViSiMe2R7Me2SiO0.5)fPolysiloxane,（d+f）/e=0.01‑1；（3）Structural units are (HSiMe2O0.5)m(R8 2SiO)n(MeR9SiO)pPolysiloxane, m/（n+p）=0.1‑1；（4）Hydrogen silicification reaction catalyst.The characteristics of silicon composition has tensile strength height, bonding force concurrently by force and is not easy xanthochromia.

Description

A kind of silicon composition for electronic component encapsulation
Technical field
The present invention relates to technical field of polymer materials, more particularly to a kind of organosilicon for electronic component encapsulation to combine Thing.
Background technology
For the sealing organosiloxane composition of electronic device, it can be good at solving weather-proof sex chromosome mosaicism, but due to poly- The inertia of organosiloxane in itself, it is to base material（Such as PPA）Adhesive force it is weaker, in the aging in later stage, easy degumming, cause Poor sealing.For this problem, US5744507 is pointed out in report, adds some materials containing epoxy radicals, acryloxy, And add some zirconates or aluminium salt does accelerator, the method can improve the adhesive force to base material really, but be combined in organosilicon After these materials are added in thing, at high temperature, these compositions after solidification are more prone to xanthochromia.
Therefore, a kind of high tensile of offer, bonding force are needed badly in the industry by force and is not easy the silicon composition of xanthochromia.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of silicon composition for electronic component encapsulation, and this has The characteristics of machine silicon composition has tensile strength height, bonding force concurrently by force and is not easy xanthochromia.
To achieve the above object, the technical solution adopted by the present invention is as follows.
A kind of silicon composition for electronic component encapsulation, including
（1）Structural units are (R1SiMe2O0.5)a (R2SiO1.5)b (ViSiMe2R3SiO1.5)cPolysiloxane, Wherein R1For the unsaturated fatty hydrocarbons base with 2-10 carbon atom, R2For the aromatic hydrocarbyl with 6-18 carbon atom, R3 For the saturated aliphatic hydrocarbons with 2-6 carbon atom, a, b, c meet following formula：a+c /b=0.01-1；Me is methyl（-CH3）, Vi is vinyl（-C2H4）；
（1）Structural units contain " ViSiMe2R3SiO1.5" it is modular, be a kind of Si-C-C-Si keys, i.e., silico-carbo-carbon- Silicon key, rather than traditional silicon-oxygen-silicon bound, this structure are easier to get close to sealing substrate（Base material is largely C-C keys）, it is non- Often it is advantageously implemented the bonding to base material.R1The main unsaturated group that crosslinked action is provided, R2Main provide has high refraction The group of rate, so as to ensure that composition has higher refractive index.Preferably, a=0-0.4, b=1, c=0.01-0.3, specifically, As a=0.35, when b=1, c=0.05, a+c/b=0.4, there is particularly preferred adhesive effect.
（2）Structural units are (R4SiMe2O0.5)d (R5R6SiO)e(ViSiMe2R7Me2SiO0.5)fPoly organo Alkane, wherein R4For the unsaturated fatty hydrocarbons base with 2-10 carbon atom, R5For the aromatic hydrocarbon with 6-18 carbon atom Base, R6For methyl or it is the aromatic hydrocarbyl with 6-18 carbon atom, R7For the saturated aliphatic hydrocarbon with 2-6 carbon atom Base, d, e, f meet following formula：（d+ f）/e=0.01-1；
（2）The effect of structural units is to provide a kind of material with soft structure, composition after being solidified with reduction Stress, meanwhile, the Si-C-C-Si keys for having bonding force to base material are also provided.Preferably, d=0-3, e=1-50, f=0-3, specifically, As d=0.48, when e=1, f=0.32,（d+ f）/ e=0.8, the stress of silicon composition are lower.
（3）Structural units are (HSiMe2O0.5)m(R8 2SiO)n (MeR9SiO)pPolysiloxane, wherein, R8For Aromatic hydrocarbyl with 6-18 carbon atom, R9For the unsaturated fatty hydrocarbons base with 2-10 carbon atom, m, n, p meet Following formula：m/（n+ p）=0.1-1；
Preferably, m=1-3, n=1-6, p=0-3, (HSiMe2O0.5)mUnit is offer crosslinking points（It is hydrogeneous）；(R8 2SiO)nIt is single Member is to provide the group of high index of refraction；(MeR9SiO)pUnit provides Concentrative crosslinking point, improves composition intensity.
（4）Hydrogen silicification reaction catalyst, be platinum, ruthenium, palladium complex compound one or more kinds of compositions.
Preferably, it is described（1）The polysiloxane of structural units is one or more kinds of groups of following substances Compound body：
(PhSiO1.5)b (ViSiMe2C2H4SiO1.5)c；
(ViSiMe2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)c；
(ViSiMe2O0.5)a (PhSiO1.5)b(ViSiMe2C3H6SiO1.5)c；
(ViSiMe2O0.5)a (Ph C2H4SiO1.5)b (ViSiMe2C2H4SiO1.5)c；
(ViSiMe2O0.5)a (Ph C2H4SiO1.5)b (ViSiMe2C3H6SiO1.5)c；
(AllSiMe2O0.5)a (Ph SiO1.5)b (ViSiMe2 C2H4SiO1.5)c；
(AllSiMe2O0.5)a (Ph C2H4SiO1.5)b (ViSiMe2 C2H4SiO1.5)c；
(AllSiMe2O0.5)a (Ph C2H4SiO1.5)b (ViSiMe2 C3H6SiO1.5)c；
Wherein, Ph is phenyl, and All is pi-allyl.
Preferably, it is described（2）The polysiloxane of structural units is one or more kinds of in following substances Composition：
(ViSiMe2O0.5)d (Ph2SiO)e；
(Ph2SiO)e(ViSiMe2C2H4Me2SiO0.5)f；
(Ph2SiO)e(ViSiMe2C3H6Me2SiO0.5)f；
(ViSiMe2O0.5)d (Ph2SiO)e(ViSiMe2C2H4Me2SiO0.5)f；
(ViSiMe2O0.5)d (Ph2SiO)e(ViSiMe2C3H6Me2SiO0.5)f；
(ViSiMe2O0.5)d (PhMeSiO)e；
(PhMeSiO)e(ViSiMe2C2H4Me2SiO0.5)f；
(ViSiMe2O0.5)d (PhMeSiO)e(ViSiMe2C2H4Me2SiO0.5)f；
(ViSiMe2O0.5)d (PhMeSiO)e(ViSiMe2C3H6Me2SiO0.5)f；
(ViSiMe2O0.5)d [(PhC2H4)2SiO]e；
(ViSiMe2O0.5)d [(PhC2H4)2SiO]e(ViSiMe2C2H4Me2SiO0.5)f；
(ViSiMe2O0.5)d [(PhC2H4)2SiO]e (ViSiMe2C3H6Me2SiO0.5)f。
(PhMeSiO)e(ViSiMe2C2H4Me2SiO0.5)fPreparation
Weigh 542g tetramethyl tetraphenyls cyclotetrasiloxane is with 37.4g structural formulas：（ViSiMe2C2H4Si Me2）2O silicon Oxygen alkane heating stirring, treats that temperature rises to 160 DEG C, adds 0.1g potassium hydroxide, react 6 hours, cooling, add in there-necked flask 0.5g acetic acid neutralizes, and is washed to neutrality, except low boiling, the structural units for obtaining water white transparency are (PhMeSiO)4 (ViSiMe2C2H4Me2SiO0.5)0.2Phenyl silicone.
Preferably, it is described（3）The polysiloxane of structural units is one or more kinds of groups of following substances Compound：
(HSiMe2O0.5)m(Ph2SiO)n ；
(HSiMe2O0.5)m(Ph2SiO)n (MeViSiO)p；
(HSiMe2O0.5)m[(PhC2H4)2SiO]n；
(HSiMe2O0.5)m[(PhC2H4)2SiO]n (MeViSiO)p。
Preferably, it is described（4）Hydrogen silicification reaction catalyst is platinum and the silica of 1,3- divinyl -1,1,3,3- tetramethyls two The complex of alkane.
Platinum complex is platinum and 1,3- divinyl -1,1, the complex of 3,3- tetramethyl disiloxanes, the quality point of platinum Number is complex gross mass 1%, and 1,3- divinyl -1,1, the mass fraction of 3,3- tetramethyl disiloxanes is the total matter of complex The 99% of amount.
Further, silicon composition of the invention includes the component of following parts by weight：
（1）Structural units 40-60 parts
（2）Structural units 5-15 parts
（3）Structural units 35-45 parts
（4）Hydrogen silicification reaction catalyst 0.1-0.8 parts
It is well mixed, transparent curable silicon composition can be obtained.
Preferably, silicon composition of the invention can also include inhibitor acetylene cyclohexanol, and its parts by weight is 0.01-0.05 parts.
Preferably, it is described（1）Structural units are (ViSiMe2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5) c；
It is described（2）Structural units are (ViSiMe2O0.5)d (Ph2SiO)e；
It is described（3）Structural units are (HSiMe2O0.5)m(Ph2SiO)n；
It is described（4）Hydrogen silicification reaction catalyst is platinum complex.
The silicon composition of the component is keeping preferable adhesive force simultaneously, has higher refractive index, reaches 1.545 More than.
Preferably, it is described（1）Structural units are (ViSiMe2O0.5)a (PhSiO1.5)b(ViSiMe2C3H6SiO1.5)c;
It is described（2）Structural units are (ViSiMe2O0.5)d (Ph2SiO)e(ViSiMe2C3H6Me2SiO0.5)f;
It is described（3）Structural units are (HSiMe2O0.5)m(Ph2SiO)n (MeViSiO)p ;
It is described（4）Hydrogen silicification reaction catalyst is platinum complex.
The silicon composition of the component has extraordinary adhesive force, while has more preferably mechanical strength.
Preferably, it is described（1）(ViSiMe in structural units2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)c Or (ViSiMe2O0.5)a (PhSiO1.5)b(ViSiMe2C3H6SiO1.5)cComponent by following parts by weight is synthetically prepared：
1,3- divinyl -1,1,3,3- tetramethyl disiloxane 0-55 parts
Water 50-80 parts
Hydrolyst 2.5-40 parts
198 parts of phenyltrimethoxysila,e
Vi（Me）2SiC2H4Si(OCH3)3Or Vi（Me）2SiC3H6Si(OCH3)30.2-36 parts
Toluene 100-300 parts
Condensation catalyst 0.05-10 parts
Nertralizer 0.1-20 parts
Wherein, hydrolyst is one kind of the concentrated sulfuric acid or trifluoromethane sulfonic acid, and condensation catalyst is highly basic or carboxylic acid gold Belong to salt, highly basic is sodium hydroxide or one kind of potassium hydroxide or cesium hydroxide, and carboxylic metallic salt is zinc Isoocatanoate, and nertralizer is salt One kind in acid, phosphoric acid, formic acid, acetic acid, propionic acid；
Wherein, when（1）Structural units are (ViSiMe2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)cWhen, a= 0.2-0.4, b=1, c=0.05-0.1；
Wherein, when（1）Structural units are (ViSiMe2O0.5)a (PhSiO1.5)b(ViSiMe2C3H6SiO1.5)cWhen, a= 0-0.4, b=1, c=0.01-0.3.
It is it is highly preferred that described（1）(ViSiMe in structural units2O0.5)a (PhSiO1.5)b (ViSiMe2C3H6SiO1.5)c, a=0-0.4, b=1, c=0.01-0.3, it is made up of the component of following parts by weight；
1,3- divinyl -1,1,3,3- tetramethyl disiloxane 0-38 parts；
Water 50-80 parts；
Hydrolyst 2.5-40 parts；
198 parts of phenyltrimethoxysila,e；
Vi（Me）2SiC3H6Si(OCH3)32.5-75 part；
Toluene 100-300 parts
Condensation catalyst 0.05-10 parts
Nertralizer 0.1-20 parts
Wherein, hydrolyst is the concentrated sulfuric acid or trifluoromethane sulfonic acid, and condensation catalyst is highly basic or carboxylic metallic salt, by force Alkali is sodium hydroxide or potassium hydroxide or cesium hydroxide, and carboxylic metallic salt is zinc Isoocatanoate, nertralizer be hydrochloric acid, phosphoric acid, formic acid, One kind in acetic acid, propionic acid；
It is it is further preferred that described（1）(ViSiMe in structural units2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)c, a=0.02-0.4, b=1, c=0.05-0.1；It is made up of the component of following parts by weight：
1,3- divinyl -1,1,3,3- tetramethyl disiloxane 2-38 parts；
Water 50-80 parts；
Hydrolyst 2.5-40 parts；
198 parts of phenyltrimethoxysila,e；
Vi（Me）2SiC2H4Si(OCH3)312-24 parts；
Toluene 100-300 parts
Condensation catalyst 0.05-10 parts
Nertralizer 0.1-20 parts
Wherein, hydrolyst is one kind of the concentrated sulfuric acid or trifluoromethane sulfonic acid, and condensation catalyst is highly basic or carboxylic acid gold Belong to salt, highly basic is sodium hydroxide or one kind of potassium hydroxide or cesium hydroxide, and carboxylic metallic salt is zinc Isoocatanoate, and nertralizer is salt One kind in acid, phosphoric acid, formic acid, acetic acid, propionic acid.
(ViSiMe2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)cPreparation：
Weigh 55.8 g 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes, 130g water, the 1.5g concentrated sulfuric acid and 300g toluene, is separately added into four-hole bottle, stirs, and 396g phenyltrimethoxysila,es and 23.4g structures is slowly added dropwise Formula is：Vi（Me）2SiC2H4Si(OCH3)3Mixture, control 60-70 DEG C of hydrolysis temperature, after being added dropwise, it is 1 small to continue backflow When.After cooling, lower floor is separated, and toluene solution is washed with water 3-4 times.Then 0.20g potassium hydroxide is added in solution, and Flowed back, at the same time, moisture is fallen by distributive pipe, and carry out backflow 4 hours.After the cooling period, 0.3g acetic acid is added Neutralize, and toluene solution is washed with water 3-4 times.Distillation abjection low-boiling-point substance, obtains semi-solid phenyl type organic siliconresin, this resin Water white transparency, structural units are：(ViSiMe2O0.5)0.3(PhSiO1.5)1 (ViSiMe2C2H4SiO1.5)0.05。
Preferably, it is described（2）(ViSiMe in structural units2O0.5)d (Ph2SiO)e(ViSiMe2C2H4Me2SiO0.5)f It is made up of the component of following parts by weight：
1,3- divinyl -1,1,3,3- tetramethyl disiloxane 0.5-500 parts；
3960 parts of octaphenylcyclotetrasiloxane,
ViSiMe2C2H4Si Me2OSi Me2 C2H4 Si Vi Me21-540 parts；
Highly basic 0.05-1.5 parts；
Nertralizer 0.1-5 parts；
Wherein, highly basic is sodium hydroxide or one kind of potassium hydroxide or cesium hydroxide, nertralizer be hydrochloric acid, phosphoric acid, formic acid, One kind in acetic acid, propionic acid.
Preferably, it is described（3）(HSiMe in structural units2O0.5)m(Ph2SiO)n (MeViSiO)pBy following parts by weight Component it is synthetically prepared：
HMe2SiO (Ph2SiO)3SiMe2828 parts of H；
T etram-ethyltetravinylcyclotetrasiloxane 0.5-86 parts；
Strong acid 5-60 parts；
Nertralizer 10-500 parts；
Wherein, strong acid is sulfuric acid or trifluoromethane sulfonic acid, and nertralizer is sodium carbonate or sodium acid carbonate,（3）Structural units Middle m=1-3, n=1-6, p=0-3.
(HSiMe2O0.5)m(Ph2SiO)n (MeViSiO)pPreparation
It is HMe to weigh 828g molecular formula2SiO (Ph2SiO)3 SiMe2H polysiloxanes and the ethene of 21.5g tetramethyls four Basic ring tetrasiloxane adds the 2.5g concentrated sulfuric acids in there-necked flask, controls 40-50 DEG C of temperature, reacts 6 hours, cooling, adds 6g Sodium carbonate neutralizes, washing, removes low-boiling-point substance, and the structural formula for obtaining water white transparency is（HSiMe2O0.5）2（Ph2SiO)3 (MeViSiO)0.25Polysiloxanes.
The beneficial effects of the present invention are：The silicon composition of the present invention is particularly suitable for the sealing of electronic device, such as sends out Optical diode（LED）Sealing, the characteristics of this composition has that transparency is high, high mechanical strength, and adhesive force is strong.The present invention's Silicon composition, its appearance colorless is transparent, viscosity 4200-5000（Mpa.s, 25 DEG C）, light transmittance is not less than 95%, refraction Rate is not less than 1.53, and hardness is not less than 35shore D after solidification, and tensile strength is not less than 6Mpa, and elongation is not less than 70%, with PPA bonding forces are not less than 8kgf/cm2, light transmittance rate of descent be no more than 5%, also occur without xanthochromia（150℃/1000h）, passing through After 150 DEG C/1500h agings, just there is the phenomenon of micro- flavescence.
Embodiment
Synthesis example 1
Structural formula is (ViSiMe2O0.5)0.3(PhSiO1.5)1 (ViSiMe2C2H4SiO1.5)0.1Polysiloxanes synthesis side Method is：Weigh 55.8 g 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes, 130g water, the 1.5g concentrated sulfuric acid and 300g toluene, is separately added into four-hole bottle, stirs, and 396g phenyltrimethoxysila,es and 46.8g structures is slowly added dropwise Formula is：Vi（Me）2SiC2H4Si(OCH3)3Mixture, control 60-70 DEG C of hydrolysis temperature, after being added dropwise, it is 1 small to continue backflow When.After cooling, lower floor is separated, and toluene solution is washed with water 3-4 times.Then 0.20g potassium hydroxide is added in solution, and Flowed back, at the same time, moisture is fallen by distributive pipe, and carry out backflow 4 hours.After the cooling period, 0.3g acetic acid is added Neutralize, and toluene solution is washed with water 3-4 times.Distillation abjection low-boiling-point substance, obtains semi-solid phenyl type organic siliconresin, this resin Water white transparency, structural units are：(ViSiMe2O0.5)0.3(PhSiO1.5)1 (ViSiMe2C2H4SiO1.5)0.1。
Synthesis example 2
Structural formula is (PhMeSiO)4(ViSiMe2C2H4Me2SiO0.5)0.2Polysiloxanes synthesis：Weigh 542g tetramethyls Base tetraphenyl cyclotetrasiloxane is with 37.4g structural formulas：（ViSiMe2C2H4Si Me2）2O siloxanes is in there-necked flask, heating Stirring, treat that temperature rises to 160 DEG C, add 0.1g potassium hydroxide, react 6 hours, cooling, add 0.5g acetic acid to neutralize, be washed to Neutrality, except low boiling, the structural units for obtaining water white transparency are (PhMeSiO)4(ViSiMe2C2H4Me2SiO0.5)0.2Polyphenylene Siloxanes.
Synthesis example 3
Structural formula is（HSiMe2O0.5）2（Ph2SiO)3(MeViSiO)0.25Polysiloxanes synthesis：Weigh 828g molecules Formula is HMe2SiO (Ph2SiO)2 SiMe2H polysiloxanes is with 21.5g t etram-ethyltetravinylcyclotetrasiloxanes in there-necked flask In, the 2.5g concentrated sulfuric acids are added, control 40-50 DEG C of temperature, are reacted 6 hours, cooling, 6g sodium carbonate is added and neutralizes, wash, removing Low-boiling-point substance, the structural formula for obtaining water white transparency are（HSiMe2O0.5）2（Ph2SiO)2 (MeViSiO)0.25Polysiloxanes.
Embodiment 1.
Specifically, silicon composition of the invention includes the component of following parts by weight：
（1）Structural units are (ViSiMe2O0.5)0.3 (PhSiO1.5)1 (ViSiMe2C2H4SiO1.5)0.08Poly- silica 50 parts of alkane；
（2）Structural units are (ViSiMe2O0.5)0.1 (Ph2SiO)210 parts of polysiloxanes；
（3）Structural units are (HSiMe2O0.5)2(Ph2SiO)340 parts of polysiloxanes；
（4）Hydrogen silicification reaction catalyst：The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes （The mass fraction of platinum is 1%）0.5 part；
It is well mixed, transparent curable silicon composition can be obtained.
Preferably, silicon composition of the invention can also include inhibitor acetylene cyclohexanol, and its parts by weight is 0.02 part.
Embodiment 2.
The present embodiment and the difference of embodiment 1 are；The silicon composition of the present embodiment includes following parts by weight Component：
Specifically, silicon composition of the invention includes the component of following parts by weight：
（1）Structural units are (ViSiMe2O0.5)0.3 (PhSiO1.5)1 (ViSiMe2C2H4SiO1.5)0.08Poly- silica 40 parts of alkane；
（2）Structural units are (ViSiMe2O0.5)0.1 (Ph2SiO)215 parts of polysiloxanes；
（3）Structural units are (HSiMe2O0.5)2(Ph2SiO)345 parts of polysiloxanes；
（4）The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes（The mass fraction of platinum is 1%） 0.8 part
It is well mixed, transparent curable silicon composition can be obtained.
Preferably, silicon composition of the invention can also include inhibitor acetylene cyclohexanol, and its parts by weight is 0.01 part.
Embodiment 3.
The present embodiment and the difference of embodiment 1 are；The silicon composition of the present embodiment includes following parts by weight Component：
Specifically, silicon composition of the invention includes the component of following parts by weight：
（1）Structural units are (ViSiMe2O0.5)0.4 (PhSiO1.5)1(ViSiMe2C3H6SiO1.5)0.1 Polysiloxanes 40 parts；
（2）Structural units are (ViSiMe2O0.5)0.1 (Ph2SiO)2(ViSiMe2C3H6Me2SiO0.5)0.05Poly- silica 15 parts of alkane；
（3）Structural units are (HSiMe2O0.5)2(Ph2SiO)345 parts of polysiloxanes；
（4）The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes（The mass fraction of platinum is 1%） 0.2 part
It is well mixed, transparent curable silicon composition can be obtained.
Preferably, silicon composition of the invention can also include inhibitor acetylene cyclohexanol, and its parts by weight is 0.01 part.
Embodiment 4.
The present embodiment and the difference of embodiment 1 are；The silicon composition of the present embodiment includes following parts by weight Component：
（1）Structural units are (ViSiMe2O0.5)0.4 (PhSiO1.5)1(ViSiMe2C3H6SiO1.5)0.1Polysiloxanes 40 parts；
（2）Structural units are (ViSiMe2O0.5)0.1 (Ph2SiO)2(ViSiMe2C3H6Me2SiO0.5)0.05Poly- silica 5 parts of alkane；
（3）Structural units are (HSiMe2O0.5)2(Ph2SiO)3 (MeViSiO)0.145 parts of polysiloxanes；
（4）The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes（The mass fraction of platinum is 1%） 0.8 part；
It is well mixed, transparent curable silicon composition can be obtained.
Preferably, silicon composition of the invention can also include inhibitor acetylene cyclohexanol, and its parts by weight is 0.05 part.
Embodiment 5.
The present embodiment and the difference of embodiment 4 are；The silicon composition of the present embodiment includes following parts by weight Component：
（1）Structural units are (ViSiMe2O0.5)0.4 (PhSiO1.5)1(ViSiMe2C3H6SiO1.5)0.1Polysiloxanes 50 parts；
（2）Structural units are (ViSiMe2O0.5)0.1 (PhMeSiO)210 parts of polysiloxanes；
（3）Structural units are (HSiMe2O0.5)2(Ph2SiO)3 (MeViSiO)0.145 parts of polysiloxanes；
（4）The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes（The mass fraction of platinum is 1%） 0.5 part；
It is well mixed, transparent curable silicon composition can be obtained.
Preferably, silicon composition of the invention can also include inhibitor acetylene cyclohexanol, and its parts by weight is 0.03 part.
Embodiment 6.
The present embodiment and the difference of embodiment 4 are；The silicon composition of the present embodiment includes following parts by weight Component：
（1）Structural units are (ViSiMe2O0.5)0.4 (PhSiO1.5)1(ViSiMe2C3H6SiO1.5)0.1Polysiloxanes 40 parts；
（2）Structural units are (ViSiMe2O0.5)0.1 (Ph2SiO)2(ViSiMe2C3H6Me2SiO0.5)0.05Poly- silica 5 parts of alkane；
（3）Structural units are (HSiMe2O0.5)2[(PhC2H4)2SiO]345 parts；
（4）The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes（The mass fraction of platinum is 1%） 0.8 part；
It is well mixed, transparent curable silicon composition can be obtained.
Preferably, silicon composition of the invention can also include inhibitor acetylene cyclohexanol, and its parts by weight is 0.02 part.
Embodiment 7.
The present embodiment and the difference of embodiment 1 are；The silicon composition of the present embodiment includes following parts by weight Component：
（1）Structural units are (ViSiMe2O0.5)0.4 (PhSiO1.5)1(ViSiMe2C3H6SiO1.5)0.1Polysiloxanes 40 parts；
（2）Structural units are (ViSiMe2O0.5)0.1 (Ph2SiO)2(ViSiMe2C3H6Me2SiO0.5)0.05Poly- silica 5 parts of alkane；
（3）Structural units are (HSiMe2O0.5)2[(PhC2H4)2SiO]3 (MeViSiO)0.145 parts of polysiloxanes；
（4）The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes（The mass fraction of platinum is 1%） 0.8 part；
It is well mixed, transparent curable silicon composition can be obtained.
Preferably, silicon composition of the invention can also include inhibitor acetylene cyclohexanol, and its parts by weight is 0.02 part.
Embodiment 8.
The present embodiment and the difference of embodiment 1 are；The silicon composition of the present embodiment includes following parts by weight Component：
（1）Structural units are (ViSiMe2O0.5)0.4 (PhSiO1.5)1(ViSiMe2C3H6SiO1.5)0.05Polysiloxanes 50 parts；
（2）Structural units are (ViSiMe2O0.5)0.1 (Ph2SiO)2(ViSiMe2C3H6Me2SiO0.5)0.05Poly- silica 10 parts of alkane；
（3）Structural units are (HSiMe2O0.5)2(Ph2SiO)350 parts of polysiloxanes；
（4）The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes（The mass fraction of platinum is 1%） 0.2 part
It is well mixed, transparent curable silicon composition can be obtained.
Preferably, silicon composition of the invention can also include inhibitor acetylene cyclohexanol, and its parts by weight is 0.04 part.
Comparative example 1
This comparative example and the difference of embodiment 1 are；The silicon composition of the present embodiment includes following parts by weight Component：
（1）Structural units are (ViSiMe2O0.5)0.4 (PhSiO1.5)140 parts of polysiloxanes；
（2）Structural units are (ViSiMe2O0.5)0.1 (Ph2SiO)25 parts of polysiloxanes；
（3）Structural units are (HSiMe2O0.5)2(Ph2SiO)345 parts of polysiloxanes；
（4）The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes（The mass fraction of platinum is 1%） 0.8 part；
It is well mixed, transparent curable silicon composition can be obtained.
Comparative example 2
This comparative example and the difference of embodiment 1 are；The silicon composition of the present embodiment includes following parts by weight Component：
（1）Structural units are (ViSiMe2O0.5)0.4 (PhSiO1.5)140 parts of polysiloxanes；
（2）Structural units are (ViSiMe2O0.5)0.1 (Ph2SiO)25 parts of polysiloxanes；
（3）Structural units are (HSiMe2O0.5)2(Ph2SiO)345 parts of polysiloxanes；
（4）The complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes（The mass fraction of platinum is 1%） 0.8 part；
（5）0.3 part of vinyltrimethoxy silane；
（6）0.2 part of aluminium acetylacetonate；
It is well mixed, transparent curable silicon composition can be obtained.
The silicon composition that embodiments of the invention 1-8 and comparative example 1-2 are obtained, its physical property such as following table：
Above-mentioned data are measured based on following condition of cure：80℃/1h+150℃/3h.
Embodiment described above, simply the present invention better embodiment, be not to limit the scope of the present invention, therefore The equivalent change or modification that all construction, feature and principles according to described in scope of the present invention patent are done, all should include this hair In bright patent claim.

Claims (10)

  1. A kind of 1. silicon composition for electronic component encapsulation, it is characterised in that：Including
    （1）Structural units are (R1SiMe2O0.5)a (R2SiO1.5)b (ViSiMe2R3SiO1.5)cPolysiloxane, wherein R1For the unsaturated fatty hydrocarbons base with 2-10 carbon atom, R2For the aromatic hydrocarbyl with 6-18 carbon atom, R3For tool There is the saturated aliphatic hydrocarbons of 2-6 carbon atom, a, b, c meet following formula：A+c/b=0.01-1, and c=0.01-0.3；Me is first Base（-CH3）, Vi is vinyl（-C2H3）；
    （2）Structural units are (R4SiMe2O0.5)d (R5R6SiO)e(ViSiMe2R7Me2SiO0.5)fPolysiloxane, its Middle R4For the unsaturated fatty hydrocarbons base with 2-10 carbon atom, R5For the aromatic hydrocarbyl with 6-18 carbon atom, R6For Methyl is the aromatic hydrocarbyl with 6-18 carbon atom, R7For the saturated aliphatic hydrocarbons with 2-6 carbon atom, d, e, F meets following formula：（d+ f）/e=0.01-1；
    （3）Structural units are (HSiMe2O0.5)m(R8 2SiO)n (MeR9SiO)pPolysiloxane, wherein, R8For with The aromatic hydrocarbyl of 6-18 carbon atom, R9For the unsaturated fatty hydrocarbons base with 2-10 carbon atom, under m, n, p meet Formula：m/（n+ p）=0.1-1；
    （4）Hydrogen silicification reaction catalyst, be platinum, ruthenium, palladium complex compound one or more kinds of compositions.
  2. A kind of 2. silicon composition for electronic component encapsulation according to claim 1, it is characterised in that：It is described （1）The polysiloxane of structural units is one or more kinds of combination objects of following substances：
    (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)c；
    (ViSiMe2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)c；
    (ViSiMe2O0.5)a (PhSiO1.5)b(ViSiMe2C3H6SiO1.5)c；
    (ViSiMe2O0.5)a (Ph C2H4SiO1.5)b (ViSiMe2C2H4SiO1.5)c；
    (ViSiMe2O0.5)a (Ph C2H4SiO1.5)b (ViSiMe2C3H6SiO1.5)c；
    (AllSiMe2O0.5)a (Ph SiO1.5)b (ViSiMe2 C2H4SiO1.5)c；
    (AllSiMe2O0.5)a (Ph C2H4SiO1.5)b (ViSiMe2 C2H4SiO1.5)c；
    (AllSiMe2O0.5)a (Ph C2H4SiO1.5)b (ViSiMe2 C3H6SiO1.5)c；
    Wherein, Ph is phenyl, and All is pi-allyl.
  3. A kind of 3. silicon composition for electronic component encapsulation according to claim 1, it is characterised in that：It is described （2）The polysiloxane of structural units is one or more kinds of compositions in following substances：
    (ViSiMe2O0.5)d (Ph2SiO)e；
    (Ph2SiO)e(ViSiMe2C2H4Me2SiO0.5)f；
    (Ph2SiO)e(ViSiMe2C3H6Me2SiO0.5)f；
    (ViSiMe2O0.5)d (Ph2SiO)e(ViSiMe2C2H4Me2SiO0.5)f；
    (ViSiMe2O0.5)d (Ph2SiO)e(ViSiMe2C3H6Me2SiO0.5)f；
    (ViSiMe2O0.5)d (PhMeSiO)e；
    (PhMeSiO)e(ViSiMe2C2H4Me2SiO0.5)f；
    (ViSiMe2O0.5)d (PhMeSiO)e(ViSiMe2C2H4Me2SiO0.5)f；
    (ViSiMe2O0.5)d (PhMeSiO)e(ViSiMe2C3H6Me2SiO0.5)f；
    (ViSiMe2O0.5)d [(PhC2H4)2SiO]e；
    (ViSiMe2O0.5)d [(PhC2H4)2SiO]e(ViSiMe2C2H4Me2SiO0.5)f；
    (ViSiMe2O0.5)d [(PhC2H4)2SiO]e (ViSiMe2C3H6Me2SiO0.5)f。
  4. A kind of 4. silicon composition for electronic component encapsulation according to claim 1, it is characterised in that：It is described （3）The polysiloxane of structural units is one or more kinds of compositions of following substances：
    (HSiMe2O0.5)m(Ph2SiO)n ；
    (HSiMe2O0.5)m(Ph2SiO)n (MeViSiO)p；
    (HSiMe2O0.5)m[(PhC2H4)2SiO]n；
    (HSiMe2O0.5)m[(PhC2H4)2SiO]n (MeViSiO)p。
  5. A kind of 5. silicon composition for electronic component encapsulation according to claim 1, it is characterised in that：It is described （4）Hydrogen silicification reaction catalyst is the complex of platinum and 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes.
  6. A kind of 6. silicon composition for electronic component encapsulation according to claim 1, it is characterised in that：
    It is described（1）Structural units are (ViSiMe2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)c；
    It is described（2）Structural units are (ViSiMe2O0.5)d (Ph2SiO)e；
    It is described（3）Structural units are (HSiMe2O0.5)m(Ph2SiO)n；
    It is described（4）Hydrogen silicification reaction catalyst is platinum complex.
  7. A kind of 7. silicon composition for electronic component encapsulation according to claim 1, it is characterised in that：
    It is described（1）Structural units are (ViSiMe2O0.5)a (PhSiO1.5)b(ViSiMe2C3H6SiO1.5)c;
    It is described（2）Structural units are (ViSiMe2O0.5)d (Ph2SiO)e(ViSiMe2C3H6Me2SiO0.5)f;
    It is described（3）Structural units are (HSiMe2O0.5)m(Ph2SiO)n (MeViSiO)p ;
    It is described（4）Hydrogen silicification reaction catalyst is platinum complex.
  8. A kind of 8. silicon composition for electronic component encapsulation according to claim 2, it is characterised in that：It is described （1）(ViSiMe in structural units2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)cOr (ViSiMe2O0.5)a (PhSiO1.5)b(ViSiMe2C3H6SiO1.5)cComponent by following parts by weight is synthetically prepared：
    1,3- divinyl -1,1,3,3- tetramethyl disiloxane 0-55 parts
    Water 50-80 parts
    Hydrolyst 2.5-40 parts
    198 parts of phenyltrimethoxysila,e
    Vi（Me）2SiC2H4Si(OCH3)3Or Vi（Me）2SiC3H6Si(OCH3)30.2-36 parts
    Toluene 100-300 parts
    Condensation catalyst 0.05-10 parts
    Nertralizer 0.1-20 parts
    Wherein, hydrolyst is one kind of the concentrated sulfuric acid or trifluoromethane sulfonic acid, and condensation catalyst is highly basic or carboxylic metallic salt, Highly basic is sodium hydroxide or one kind of potassium hydroxide or cesium hydroxide, and carboxylic metallic salt is zinc Isoocatanoate, and nertralizer is hydrochloric acid, phosphorus One kind in acid, formic acid, acetic acid, propionic acid；
    Wherein, when（1）Structural units are (ViSiMe2O0.5)a (PhSiO1.5)b (ViSiMe2C2H4SiO1.5)cWhen, a=0.2- 0.4, b=1, c=0.05-0.1；
    Wherein, when（1）Structural units are (ViSiMe2O0.5)a (PhSiO1.5)b(ViSiMe2C3H6SiO1.5)cWhen, a=0- 0.4, b=1, c=0.01-0.3.
  9. A kind of 9. silicon composition for electronic component encapsulation according to claim 3, it is characterised in that：It is described （2）(ViSiMe in structural units2O0.5)d (Ph2SiO)e(ViSiMe2C2H4Me2SiO0.5)fClosed by the component of following parts by weight Into preparation：
    1,3- divinyl -1,1,3,3- tetramethyl disiloxane 0.5-500 parts；
    3960 parts of octaphenylcyclotetrasiloxane,
    ViSiMe2C2H4Si Me2OSi Me2 C2H4 Si Vi Me21-540 parts；
    Highly basic 0.05-1.5 parts；
    Nertralizer 0.1-5 parts；
    Wherein, highly basic is sodium hydroxide or one kind of potassium hydroxide or cesium hydroxide, and nertralizer is hydrochloric acid, phosphoric acid, formic acid, second One kind in acid, propionic acid.
  10. A kind of 10. silicon composition for electronic component encapsulation according to claim 4, it is characterised in that：It is described （3）(HSiMe in structural units2O0.5)m(Ph2SiO)n (MeViSiO)pComponent by following parts by weight is synthetically prepared：
    HMe2SiO (Ph2SiO)3SiMe2828 parts of H；
    T etram-ethyltetravinylcyclotetrasiloxane 0.5-86 parts；
    Strong acid 5-60 parts；
    Nertralizer 10-500 parts；
    Wherein, strong acid is sulfuric acid or trifluoromethane sulfonic acid, and nertralizer is sodium carbonate or sodium acid carbonate,（3）M in structural units= 1-3、n=1-6、p=0-3。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102066493A (en) * 2008-06-18 2011-05-18 道康宁东丽株式会社 Curable organopolysiloxane composition and semiconductor device
CN103168078A (en) * 2010-10-19 2013-06-19 积水化学工业株式会社 Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same
CN103619981A (en) * 2010-12-22 2014-03-05 道康宁公司 Silicone composition, silicone adhesive, coated and laminated substrates
CN103709760A (en) * 2012-10-02 2014-04-09 达兴材料股份有限公司 Curable resin composition, cured product and semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102066493A (en) * 2008-06-18 2011-05-18 道康宁东丽株式会社 Curable organopolysiloxane composition and semiconductor device
CN103168078A (en) * 2010-10-19 2013-06-19 积水化学工业株式会社 Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same
CN103619981A (en) * 2010-12-22 2014-03-05 道康宁公司 Silicone composition, silicone adhesive, coated and laminated substrates
CN103709760A (en) * 2012-10-02 2014-04-09 达兴材料股份有限公司 Curable resin composition, cured product and semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LED 封装用硅树脂的研究进展;方高;《广州化工》;20150331;第43卷(第6期);第20-22页 *

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