CN104112594B - Multi-layer ceramic capacitor and plate for mounting multi-layer ceramic capacitor - Google Patents
Multi-layer ceramic capacitor and plate for mounting multi-layer ceramic capacitor Download PDFInfo
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- CN104112594B CN104112594B CN201310342102.7A CN201310342102A CN104112594B CN 104112594 B CN104112594 B CN 104112594B CN 201310342102 A CN201310342102 A CN 201310342102A CN 104112594 B CN104112594 B CN 104112594B
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- outer electrode
- inner connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
Abstract
Provided is a multi-layer ceramic capacitor. The multi-layer ceramic capacitor comprises a ceramic body, a first capacitor part, a second capacitor part, a first inner connection conductor, a second inner connection conductor, and first to fourth outer electrodes. The ceramic body includes a dielectric layer, and has a first side surface and a second side surface that are opposite to each other. The first capacitor part includes a first inner electrode that is exposed from the first side surface, and a second inner electrode that is exposed from the second side surface. The second capacitor part includes a third inner electrode exposed from the first side surface and a fourth inner electrode exposed from the second side surface. The first and second inner connection conductors are exposed from the first and second side surfaces. The first to fourth outer electrodes are formed on the first and second side surfaces, and are electrically connected with the first to fourth inner electrodes and the first and second inner connection conductors. The first capacitor part and the second capacitor part are in series connection with the first inner connection conductor and the second inner connection conductor respectively.
Description
Cross-Reference to Related Applications
This application claims the korean patent application No.10-2013- that on April 22nd, 2013 submits to Korean Intellectual Property Office
0044156 priority, the disclosure of this application is integrated into by reference the application.
Technical field
The present invention relates to the plate of multilayer ceramic capacitor and the installation multilayer ceramic capacitor.
Background technology
Multilayer ceramic capacitor, a kind of multilayer sheet type（chip）Electronic component, is mounted in such as display device, calculates
For the flaky electric capacity of charging and discharging on the printed circuit board (PCB) of the various electronic products of machine, smart phone, mobile phone etc.
Device, the display device is, for example, liquid crystal display（LCD）, plasma display panel（PDP）Deng.
Because this multilayer ceramic capacitor（MLCC）Have the advantages that such as size is little, capacitance is high, easy to install, so
It is used as the part in various electronic equipments.
Multilayer ceramic capacitor may have a structure such that that is, multiple dielectric layers internal electrode different with polarity is alternately
Stack, and dielectric layer is inserted between internal electrode.
Especially, in the CPU for computer（CPU）Power-supply device in, provide low pressure process
In, because the quick change of load current can produce voltage noise.
Therefore, such multilayer ceramic capacitor is widely used in power-supply device pressing down as decoupling capacitors
Make this voltage noise.
Because its operating frequency increases, institute should have low equivalent series electric for the multilayer ceramic capacitor of decoupling
Sense（ESL）.The research for reducing this ESL is carried out.
Further, in order to more smoothly provide power, the multilayer ceramic capacitor for decoupling should be with controllable etc.
Effect series resistance（ESR）Characteristic.
When the ESR values of multilayer ceramic capacitor are less than desired level, due to the ESL and microprocessor package of capacitor
Plane capacitance（plane capacitance）And the Impedance Peak produced at parallel resonance frequency may increase, and electric capacity
Impedance at the series resonant frequency of device can extremely reduce.
Therefore, to enable users to realize flat impedance operator in a power distribution system, for the multilayer ceramic capacitor of decoupling
ESR characteristics should easily be controlled.
With regard to the control of ESR characteristics, it is contemplated that externally and internally have high-resistance material used in electrode.According to phase
Pass technology, the measurement for changing material as above can provide high ESR characteristics while low ESL structures are kept.
However, used in outer electrode it is this with high-resistance material in the case of, can because of pin hole（pin
hole）And producing causes current crowding effect（current crowding effect）Hot localised points.Further,
Used in internal electrode it is this with high-resistance material in the case of, in order that the material matches to realize with ceramic material
High capacitance, the material for forming internal electrode should also be as persistently being changed.
Consequently, because the existing measurement for controlling ESR has drawbacks described above, so still needing to the multilayer pottery controllable to ESR
Porcelain condenser is studied.
Additionally, according to such as tablet personal computer（PC）, the mobile terminal such as ultrabook fast-developing recent trend, it is micro-
Processor has been inverted to minimize the product with high integration.
Therefore, the area of printed circuit board (PCB) is reduced, and the installing space of decoupling capacitors is also restricted, accordingly
Ground, it is still necessary to the multilayer ceramic capacitor that can be mounted on limited installation space.
Correlation technique document
（Patent file 1）Japanese patent application publication No. No.2012-138415
The content of the invention
One aspect of the present invention provides multilayer ceramic capacitor and installs the plate of the multilayer ceramic capacitor.
According to an aspect of the invention, there is provided a kind of multilayer ceramic capacitor, the multilayer ceramic capacitor includes：
Including multiple dielectric layers and with the first and second first type surfaces relative to each other, the first and second side surfaces relative to each other and
The ceramic body of the first and second end faces opposing one another；The first capacitor part for being formed in the ceramic body and it is formed at
The second capacitor part in the ceramic body, first capacitor part includes thering is the lead for being exposed to the first side surface
The first internal electrode and the second internal electrode with the lead for being exposed to the second side surface, the second capacitor part bag
Include the 3rd internal electrode with the lead for being exposed to the first side surface and being spaced apart with the lead of the first internal electrode and have
It is exposed to the 4th internal electrode of the second side surface and the lead spaced apart with the lead of the second internal electrode；It is formed at the pottery
In porcelain body and it is exposed to the first and second inner connecting conductors of the first and second side surfaces；And it is formed at the ceramic body
On first and second side surfaces and it is electrically connected to first to fourth internal electrode and the first and second inner connecting conductors
First to fourth outer electrode, wherein the first and second capacitor parts are connected respectively with the first and second inner connecting conductors.
First and second outer electrodes can be configured to separated from one another, the Yi Ji on the first side surface of the ceramic body
Three and the 4th outer electrode can be configured to separated from one another on the second side surface of the ceramic body.
The mounting surface of multilayer ceramic capacitor can be the first of the ceramic body or the second side surface.
The lead of first internal electrode can be connected with the first outer electrode, and the lead of the second internal electrode can be with the 4th
Outer electrode is connected, and the lead of the 3rd internal electrode can be connected with the second outer electrode, and the lead of the 4th internal electrode can be with the
Three outer electrodes are connected.
First inner connecting conductors can be connected and by the 3rd external electrical by the first outer electrode with the first internal electrode
Pole is connected with the 4th internal electrode.
Second inner connecting conductors can be connected and by the second external electrical by the 4th outer electrode with the second internal electrode
Pole is connected with the 3rd internal electrode.
First and the 3rd internal electrode can growing-cross direction on divide each other on individual layer in the cross section of the ceramic body
From, and second and the 4th internal electrode can growing-cross direction on another individual layer in the cross section of the ceramic body that
This separation.
The lead of the first internal electrode may be connected on the first outer electrode, and the lead of the second internal electrode may be connected to
On three outer electrodes, the lead of the 3rd internal electrode may be connected on the second outer electrode, and the lead of the 4th internal electrode
May be connected on the 4th outer electrode.
First inner connecting conductors can be connected on the first internal electrode by the first outer electrode and be passed through outside the 4th
Electrode is connected on the 4th internal electrode.
Second inner connecting conductors can be connected to the second internal electrode and by the second external electrical by the 3rd outer electrode
Pole is connected to the 3rd internal electrode.
Multilayer ceramic capacitor can be further included：The 3rd capacitor part that is formed in ceramic body and it is formed at pottery
The 4th capacitor part in porcelain body, the 3rd capacitor part include be exposed to the first side surface the 5th internal electrode and
The 6th internal electrode of the second side surface is exposed to, the 4th capacitor part includes the 7th and the 8th internal electrode, wherein
5th and the 7th internal electrode growing-cross direction on separated from one another, Yi Ji on individual layer in the cross section of the ceramic body
Six and the 8th internal electrode growing-cross direction on it is separated from one another on another individual layer in the cross section of the ceramic body.
5th internal electrode can be connected with the first outer electrode, and the 6th internal electrode can be connected with the 3rd outer electrode, the
Seven internal electrodes can be connected with the second outer electrode, and the 8th internal electrode can be connected with the 4th outer electrode.
According to a further aspect in the invention, there is provided a kind of multilayer ceramic capacitor, the multilayer ceramic capacitor includes：
Ceramic body, the ceramic body include multiple dielectric layers and with the first and second first type surfaces opposing one another, opposing one another the
One and second side surface and the first and second end faces opposing one another；It is exposed on the first side surface and growing-cross direction
First, the three, the 5th and the 7th internal electrode separated from one another on individual layer in the cross section of the ceramic body, and be exposed to
Separated from one another second, on another individual layer on second side surface and growing-cross direction in the cross section of the ceramic body
4th, the 6th and the 8th internal electrode；It is formed in ceramic body and exposes to the first to the 4 of the first and second side surfaces
Connection conductor；And be formed on the first and second side surfaces and with the first to the 8th internal electrode and first to fourth inside connect
Connect the first to the 8th outer electrode of conductor electrical connection, wherein the first and second internal electrodes, the third and fourth internal electrode, the
Five and the 6th internal electrode and the 7th and the 8th internal electrode form respectively first, second, third and fourth capacitor part,
First and second capacitor parts are connected respectively with the first and second inner connecting conductors, and the third and fourth capacitor part point
Do not connect with the third and fourth inner connecting conductors.
First to fourth outer electrode can be configured to it is separated from one another on the first side surface of ceramic body, and the 5th to
Eight outer electrodes can be configured to separated from one another on the second side surface of ceramic body.
The mounting surface of multilayer ceramic capacitor can be the first of ceramic body or the second side surface.
Firstth, the three, the five, the seven, the second, the four, the six, the 8th internal electrodes can respectively with first to the 8th outside
Electrode is connected.
First inner connecting conductors can be connected and by the 6th external electrical by the first outer electrode and the first internal electrode
Pole is connected with the 4th internal electrode.
Second inner connecting conductors can be connected and by the second external electrical by the 5th outer electrode and the second internal electrode
Pole is connected with the 3rd internal electrode.
3rd inner connecting conductors can be connected and by the 8th external electrical by the 3rd outer electrode and the 5th internal electrode
Pole is connected with the 8th internal electrode.
4th inner connecting conductors can be connected and by the 4th external electrical by the 7th outer electrode and the 6th internal electrode
Pole is connected with the 7th internal electrode.
According to a further aspect in the invention, there is provided a kind of multilayer ceramic capacitor, the multilayer ceramic capacitor includes：
Ceramic body, the ceramic body include multiple dielectric layers and with the first and second first type surfaces relative to each other, opposing one another the
One and second side surface and the first and second end faces opposing one another；The first capacitor part for being formed in ceramic body and
The second capacitor part being formed in ceramic body, first capacitor part includes thering is exposure drawing to the second side surface
Second internal electrode of the first internal electrode of line and the lead with exposure to the first side surface, second capacitor part
Including the 3rd internal electrode with the lead for being exposed to the second side surface and being spaced apart with the lead of the first internal electrode and tool
There is the 4th internal electrode of the lead for being exposed to the first side surface and being spaced apart with the lead of the second internal electrode；It is formed at ceramics
In body and it is exposed to the first to the 3rd inner connecting conductors of the first and second side surfaces；And it is formed at the first He of ceramic body
First to the 6th electrically connected on second side surface and with first to fourth internal electrode and the first to the 3rd inner connecting conductors
Outer electrode, wherein the first capacitor part is connected with the first and second inner connecting conductors, and the second capacitor part and
Two and the 3rd inner connecting conductors are connected.
First to the 3rd outer electrode can be configured to it is separated from one another on the first side surface of ceramic body, and the 4th to
Six outer electrodes can be configured to separated from one another on the second side surface of ceramic body.
The mounting surface of multilayer ceramic capacitor can be the first of the ceramic body or the second side surface.
The lead of the first internal electrode can be connected with the 4th outer electrode, the lead of the second internal electrode can with second outside
Electrode is connected, and the lead of the 3rd internal electrode can be connected with the 5th outer electrode, and the lead of the 4th internal electrode can be with the
Three outer electrodes are connected.
First inner connecting conductors can be connected with the first outer electrode, and by the 4th outer electrode and the first inside electricity
Extremely it is connected.
Second inner connecting conductors can be connected and by the 5th external electrical by the second outer electrode with the second internal electrode
Pole is connected with the 3rd internal electrode.
3rd inner connecting conductors can be connected with the 6th outer electrode, and by the 3rd outer electrode and the 4th inside electricity
Extremely it is connected.
According to another aspect of the present invention, there is provided a kind of plate for installing multilayer ceramic capacitor, the plate includes：Print
Printed circuit board, has the first and second electrode pads on the printed circuit board (PCB)；And as above installed in the printing
Multilayer ceramic capacitor on circuit board.
Description of the drawings
Above and other aspect of the present invention, feature and other advantages will more from the detailed description later in conjunction with accompanying drawing
It is more clearly understood from, wherein：
Fig. 1 is the perspective view of multilayer ceramic capacitor according to the first embodiment of the invention；
Fig. 2 is the plane for illustrating the first and second inner connecting conductors for being applied to the multilayer ceramic capacitor shown in Fig. 1
Figure；
Fig. 3 is to illustrate first to fourth inside electricity being used together with the first and second inner connecting conductors shown in Fig. 2
The plan of pole；
Fig. 4 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Fig. 1；
Fig. 5 is illustrated in can be used for multilayer ceramic capacitor first and second second embodiment of the invention
Portion connects the plan of conductor；
Fig. 6 is to illustrate first to fourth inside electricity being used together with the first and second inner connecting conductors shown in Fig. 5
The plan of pole；
Fig. 7 is the equivalent circuit diagram of multilayer ceramic capacitor second embodiment of the invention；
Fig. 8 is in illustrate the 3rd embodiment of the invention can be used for multilayer ceramic capacitor first and second
Portion connects the plan of conductor；
Fig. 9 is to illustrate the first to the 8th internal electrode being used together with the first and second inner connecting conductors shown in Fig. 8
Plan；
Figure 10 is the equivalent circuit diagram of the multilayer ceramic capacitor of the 3rd embodiment of the invention；
Figure 11 is the perspective view of the multilayer ceramic capacitor according to four embodiment of the invention；
Figure 12 is to illustrate putting down for first to fourth inner connecting conductors for being applied to the multilayer ceramic capacitor shown in Figure 11
Face figure；
Figure 13 is illustrated inside the first to the 8th be used together with first to fourth inner connecting conductors shown in Figure 12
The plan of electrode；
Figure 14 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Figure 11；
Figure 15 is the perspective view of the multilayer ceramic capacitor of the 5th embodiment of the invention；
Figure 16 is to illustrate putting down for the first to the 3rd inner connecting conductors for being applied to the multilayer ceramic capacitor shown in Figure 15
Face figure；
Figure 17 is illustrated inside first to fourth be used together with first shown in Figure 16 to the 3rd inner connecting conductors
The plan of electrode；
Figure 18 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Figure 15；
Figure 19 is the perspective view for illustrating the multilayer ceramic capacitor shown in the Fig. 1 for installing on a printed circuit；And
Figure 20 is the curve map for being compared the impedance between embodiments of the invention and comparative example.
Specific embodiment
Hereinafter, the preferred embodiment of the present invention is described in detail with reference to the accompanying drawings.
However, the present invention can be accomplished in several ways, and should not be construed as limited to the embodiment enumerated thereafter.
Of course, the embodiment for being provided makes the present invention thoroughly and completely be disclosed, and to the abundant table of those skilled in the art
The scope of the present invention is reached.
In accompanying drawing, clearly the shape and size of element may be amplified to show, and will use from start to finish
Same or analogous reference is indicating same or analogous element.
Define hexahedral direction clearly to describe embodiments of the present invention.L, W and T shown in accompanying drawing refers to respectively length
Degree direction, width and thickness direction.Herein, thickness direction can be the direction that dielectric layer is piled up.
Multilayer ceramic capacitor
Hereinafter, embodiment of the invention will be described with reference to the accompanying drawings.
Fig. 1 is the perspective view of multilayer ceramic capacitor according to the first embodiment of the invention.
Fig. 2 is the plane for illustrating the first and second inner connecting conductors for being applied to the multilayer ceramic capacitor described in Fig. 1
Figure.
Fig. 3 is to illustrate first to fourth inside electricity being used together with the first and second inner connecting conductors described in Fig. 2
The plan of pole.
Referring to figs. 1 to Fig. 3, multilayer ceramic capacitor 100 according to the embodiment of the present invention may include ceramic body 110,
The ceramic body 110 include multiple dielectric layers 111 and with the first and second first type surfaces relative to each other, relative to each other first
With the second side surface and the first and second end faces relative to each other.
In the present embodiment, ceramic body 110 has the first first type surface 5 and the second first type surface 6 relative to each other, and will
The first side surface 3 and the second side surface 4 and first end face 1 and second end face 2 that first and second first type surfaces are connected to each other.
The shape of ceramic body 110 is not particularly limited to, but can be hexahedron as depicted.
Ceramic body 110, and multiple internal electrodes 121 to 124 can be formed by stacking multiple dielectric layers（It is successively
One to the 4th internal electrode）Can be configured to it is separated from one another, and between the internally positioned electrode of dielectric layer.
Multiple dielectric layers 111 of configuration ceramic body 110 can be the state and integrated each other so that phase cannot be confirmed of sintering
Border between adjacent dielectric layer.
Ceramic powder, organic solvent and organic bond can be included by sintering（binder）Ceramic green sheet（green
sheet）To form dielectric layer 111.Can be by based on barium titanate (BaTiO3) material, based on strontium titanates (SrTiO3) material
Etc. the ceramic powder for being used as high-g value.However, ceramic powder is not limited thereto.
Multilayer ceramic capacitor 100 may include the first capacitor part being formed in ceramic body 110, first electric capacity
Device part includes first internal electrode 121 with the lead 121a for being exposed to the first side surface 3 and with being exposed to the second side
Second internal electrode 122 of the lead 122a on surface 4, multilayer ceramic capacitor 100 also includes the second capacitor part, described the
Two capacitor parts include thering is the lead for being exposed to the first side surface 3 and separating with the lead 121a of the first internal electrode
3rd internal electrode 123 of 123a and with being exposed to the second side surface 4 and separate with the lead 122a of the second internal electrode
Lead 124a the 4th internal electrode 124.
According to the embodiment of the present invention, can with comprising conducting metal conducting resinl come be formed the first internal electrode 121 to
4th internal electrode 124.
Conductive material can be nickel（Ni）, copper（Cu）, palladium（Pd）Or their alloy, but it is not limited to this.
The printing process of such as method for printing screen or gravure process can be passed through, be situated between in configuration by using conducting resinl
Interior electrode layer is printed on the ceramic green sheet of electric layer.
Being printed with the ceramic green sheet of interior electrode layer thereon can alternately be sintered and stack to form ceramic body.
Additionally, multilayer ceramic capacitor 100 may include to be formed in ceramic body 110 and be exposed to the first side surface 3 and
First inner connecting conductors 125 and the second inner connecting conductors 126 of two side surfaces 4.
First inner connecting conductors 125 and the second inner connecting conductors 126 can use and for example include similar to first to fourth
The conducting resinl of the conducting metal of internal electrode 121 to 124 is made, but is not limited to this.
The conducting metal can be nickel（Ni）, copper（Cu）, palladium（Pd）Or their alloy, but it is not limited to this.
Additionally, multilayer ceramic capacitor 100 may include first to fourth outer electrode 131 to 134, described first to fourth
Outer electrode 131 to 134 be formed on the first and second side surfaces 3 and 4 of ceramic body 110 and with first to fourth internal electrode
121 to 124 and the first and second inner connecting conductors 125 and 126 electrically connect.
First and second outer electrodes 131 and 132 arrangement separated from one another on the first side surface 3 of ceramic body 110, and the
Three and the 4th outer electrode 133 and 134 arrangement separated from one another on the second side surface 4 of ceramic body 110.
The embodiment of the invention, the mounting surface of multilayer ceramic capacitor 100 can be the first of ceramic body 110
Or second side surface 3 or 4.
In other words, the multilayer ceramic capacitor of the embodiment of the invention can be mounted vertically, but be not limited to
This.Multilayer ceramic capacitor can be installed in a variety of forms.
Therefore, subsequent description for multilayer ceramic capacitor is installed plate on the electrode pad of contact first and second
Outer electrode can be the third and fourth outer electrode 133 and 134.
The embodiment of the invention, it may be appreciated that, except be used as being connected with power line the 3rd of outside terminal
Outside the 4th outer electrode 133 and 134, two outer electrodes 131 and 132 are by the outer electrode as control ESR.
However, because the third and fourth outer electrode for being used as outside terminal is picked out at random to be suitably used for obtaining
Desired ESR characteristics are obtained, so the third and fourth outer electrode is not particularly limited as to this.
As described above, the first and second outer electrodes 131 and 132 for controlling the outer electrode of ESR can be used as can
To be the contactless terminal for being free of attachment to power line, and they are placed on multilayer ceramic capacitor based on installation direction
On upper surface.
In other words, according to the embodiment of the present invention, because the first and second outer electrode of contactless terminal 131 and 132
It is placed on the upper surface of multilayer ceramic capacitor rather than on side surface, so when being mounted onboard, contactless end
Son can not hinder size reduction, and this is an advantage for the miniaturization of product.
First to fourth outer electrode 131 to 134 can be formed by the conducting resinl containing conducting metal.
The conducting metal can be nickel（Ni）, copper（Cu）, tin（Sn）Or their alloy, but it is not limited to this.
The conducting resinl can further include insulating materials.The insulating materials can be such as glass, but be not limited to
This.
The method for forming first to fourth outer electrode 131 to 134 is not particularly limited.In other words, can be by print
The methods such as brush method, dipping method, galvanoplastic form first to fourth outer electrode 131 to 134 on ceramic body.
Multilayer ceramic capacitor 100 is four termination capacitors with total of four outer electrode, but the present invention is not limited
In this.
Hereinafter, with regard to the configuration of multilayer ceramic capacitor 100 according to the embodiment of the present invention, by refer to the attached drawing 2
Internal electrode 121 to 124, inner connecting conductors 125 and 126 and outer electrode 131 to 134 are described in detail with 3.
The first capacitor part being formed in ceramic body 110 is exposed to the lead 121a of the first side surface 3 comprising having
The first internal electrode 121 and the second internal electrode with the lead 122a for being exposed to the second side surface 4, and form electric capacity.
Additionally, the second capacitor part comprising have be exposed to the first side surface 3 and with the lead of the first internal electrode
3rd internal electrode 123 of the lead 123a that 121a is separated and be exposed to the second side surface 4 and with the second internal electrode
The 4th internal electrodes 124 of lead 124a that separate of lead 122a, and form electric capacity.
The lead 121a of the first internal electrode can be connected with the first outer electrode 131, the lead of the second internal electrode
122a can be connected with the 4th outer electrode 134, and the lead 123a of the 3rd internal electrode can be with the phase of the second outer electrode 132
Connect, and the lead 124a of the 4th internal electrode can be connected with the 3rd outer electrode 133, but the invention is not restricted to this.
First and second capacitor parts can be formed among ceramic body 110 without special restriction, and for reality
Existing target capacitance value, stackable multiple first and second capacitor parts.
According to the embodiment of the present invention, in the multilayer ceramic capacitor 100, the first and second capacitor parts can
To be connected in parallel with each other.
First to fourth internal electrode 121 to 124 can together with the first and second inner connecting conductors 125 and 126 by
It is alternately arranged, and between the insertion internal electrode of dielectric layer 111.
Show the first and second inner connecting conductors 125 and 126 in Fig. 2, their quantity is respectively one, but can be by
There is provided multiple.
Similar, first to fourth internal electrode 121 to 124 is shown in Fig. 3, their quantity is respectively one, but
Can be provided multiple.
Meanwhile, internal electrode and inner connecting conductors can be stacked according to the order shown in Fig. 2 and Fig. 3, or if necessary with
Other order stackings.
For example, the first and second inner connecting conductors 125 and 126 can be disposed in the first and second capacitor parts it
Between or can be with separated from one another.
Particularly, by the width of the first and second inner connecting conductors 125 and 126 of change, length and the number of plies, can be accurate
Control desired ESR characteristics.
According to the embodiment of the present invention, the first inner connecting conductors 125 can be by the first outer electrode 131 and first
Portion's electrode 121 is connected and is connected with the 4th internal electrode 124 by the 3rd outer electrode 133.
Additionally, the second inner connecting conductors can be connected and be led to by the 4th outer electrode 134 with the second internal electrode 122
Cross the second outer electrode 132 to be connected with the 3rd internal electrode 123.
The pattern form of the first and second inner connecting conductors 125 and 126 shown in Fig. 2 is only enforcement of the invention
The example of mode, and the first and second inner connecting conductors 125 and 126 can have multiple patterns shape to control ESR.
For example, the first and second inner connecting conductors 125 and 126 have and first to fourth inside electricity shown in Fig. 3
The identical pattern form of pole 121 to 124.
According to the embodiment of the present invention, the controllable multi-layer ceramic capacitance of the first and second inner connecting conductors 125 and 126
The ESR of device.
In other words, including the first and second internal electrodes 121 and 122 the first capacitor part and including third and fourth
Second capacitor part of internal electrode 123 and 124 as described below can connect in parallel.
Additionally, the first and second capacitor parts can connect with the first and second inner connecting conductors 125 and 126.
Due to above-mentioned connected mode, the ESR of multilayer ceramic capacitor can be by the He of the first and second inner connecting conductors 125
126 controlling.
Additionally, in the present embodiment, the third and fourth outer electrode 133 and 134 can be used as being connected with power line
Outside terminal.For example, the 3rd outer electrode 133 can be connected with power line, and the 4th outer electrode 134 can be connected to ground.
Meanwhile, in addition to the third and fourth outer electrode 133 and 134, the first and second outer electrodes 131 and 132 can be used as
For controlling ESR and being understood to the outer electrode of contactless terminal.
Fig. 4 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Fig. 1.
With reference to Fig. 4, including the first capacitor part of the first and second internal electrodes 121 and 122 with include the 3rd and the
Second capacitor part of four internal electrodes 123 and 124 can be connected in parallel with each other.
Additionally, the first and second capacitor parts can connect with the first and second inner connecting conductors 125 and 126.
As described above, multilayer ceramic capacitor according to the embodiment of the present invention can have two kinds of resistors and two kinds of electricity
Container, the value of each of which is all controllable.
Multilayer ceramic capacitor according to the embodiment of the present invention has said structure, it include internal electrode 121 to
124th, inner connecting conductors 125 and 126 and outer electrode 131 and 134, so readily can reduce in wider frequency range
With control impedance, and installing space and manufacturing cost is caused to reduce due to reducing number of elements compared with existing structure
.
Additionally, because capacitor is mounted vertically, size reduction is not hindered by contactless terminal, and this is also beneficial to
The miniaturization of product.
Fig. 5 is illustrated in can be used for multilayer ceramic capacitor first and second second embodiment of the invention
Portion connects the plan of conductor.
Fig. 6 is to illustrate first to fourth inside electricity being used together with the first and second inner connecting conductors shown in Fig. 5
The plan of pole.
Fig. 7 is the equivalent circuit diagram of multilayer ceramic capacitor second embodiment of the invention.
With reference to Fig. 5 to 7, multilayer ceramic capacitor according to the embodiment of the present invention is characterised by, in above-mentioned basis
In the multilayer ceramic capacitor of the first embodiment of the present invention, growing-cross direction in the cross section of ceramic body 110, the
One and the 3rd internal electrode 121 ' and 123 ' is formed separated from one another on individual layer, and second and the 4th internal electrode 122 '
It is formed with 124 ' separated from one another on another individual layer.
Second embodiment of the invention, a of lead 121 ' of the first internal electrode can be with the phase of the first outer electrode 131
Even, a of lead 122 ' of the second internal electrode can be connected with the 3rd outer electrode 133, and a of lead 123 ' of the 3rd internal electrode can be with
Second outer electrode 132 is connected, and a of lead 124 ' of the 4th internal electrode can be connected with the 4th outer electrode 134.
This embodiment of the invention, the first inner connecting conductors 125 ' can by the first outer electrode 131 with
First internal electrode 121 ' is connected and is connected with the 4th internal electrode 124 ' by the 4th outer electrode 134.
This embodiment of the invention, the second inner connecting conductors 126 ' can by the 3rd outer electrode 133 with
Second internal electrode 122 ' is connected and is connected with the 3rd internal electrode 123 ' by the second outer electrode 132.
With reference to Fig. 7, the first and second inner connecting conductors 125 ' and 126 ' can be connected in parallel to each other.
Further, including the first and second internal electrodes 121 ' and 122 ' the first capacitor part and including the 3rd He
Second capacitor part of the 4th internal electrode 123 ' and 124 ' can go here and there with the first and second inner connecting conductors 125 ' and 126 '
Connection.
Because other features of multilayer ceramic capacitor second embodiment of the invention and of the invention
The multilayer ceramic capacitor of first embodiment is identical, so omitting detailed description.
Fig. 8 is in illustrate the 3rd embodiment of the invention can be used for multilayer ceramic capacitor first and second
Portion connects the plan of conductor.
Fig. 9 is to illustrate the first to the 8th internal electrode being used together with the first and second inner connecting conductors shown in Fig. 8
Plan.
Figure 10 is the equivalent circuit diagram of the multilayer ceramic capacitor of the 3rd embodiment of the invention.
With reference to Fig. 8 to 10, the multilayer ceramic capacitor of the 3rd embodiment of the invention is characterised by, above-mentioned
According to the first embodiment of the invention multilayer ceramic capacitor further includes that the be formed in ceramic body 110 the 3rd is electric
Container parts and the 4th capacitor part, growing-cross direction in the cross section of ceramic body 110, the 3rd capacitor unit
Part includes being exposed to the 5th internal electrode 11 of the first side surface 3 and the 6th internal electrode 12 for being exposed to the second side surface 4, institute
The 4th capacitor part is stated including the 7th and the 8th internal electrode 13 and 14, wherein the 5th and the 7th internal electrode 11 and 13 is by shape
Become separated from one another on individual layer, the 6th and the 8th internal electrode 12 and 14 is formed separated from one another on another individual layer.
This embodiment of the invention, the first internal electrode 11 can be connected with the first outer electrode 131, in the 6th
Portion's electrode 12 can be connected with the 3rd outer electrode 133, and the 7th internal electrode 13 can be connected with the second outer electrode 132, Yi Ji
Eight internal electrodes 14 can be connected with the 4th outer electrode 134.
The lead 121 of this embodiment of the invention, the first internal electrode 121 " " a can be with the first outer electrode
131 are connected, the second internal electrode 122 " lead 122 " a can be connected with the 3rd outer electrode 133, the 3rd internal electrode 123 "
Lead 123 " a can be connected with the second outer electrode 132, and the 4th internal electrode 124 " lead 124 " a can be with the 4th external electrical
Pole 134 is connected.
This embodiment of the invention, the first inner connecting conductors 125 " can by the first outer electrode 131 with
First internal electrode 121 " is connected and by the 4th outer electrode 134 and the 4th internal electrode 124 " it is connected.
This embodiment of the invention, the second inner connecting conductors 126 " can by the 3rd outer electrode 133 with
Second internal electrode 122 " is connected and by the second outer electrode 132 and the 3rd internal electrode 123 " it is connected.
With reference to Figure 10, the first and second inner connecting conductors 125 " and 126 " can be connected in parallel with each other.
Additionally, first to fourth capacitor part can be connected in parallel to each other.
Additionally, including the first and second internal electrodes 121 " and 122 " the first capacitor part, including third and fourth
Second capacitor part of internal electrode 123 " and 124 ", including the 3rd capacitor unit of the 5th and the 6th internal electrode 11 and 12
Part and can be with the first and second inner connecting conductors 125 including the 4th capacitor part of the 7th and the 8th internal electrode " and
126 " connect.
Because other features of the multilayer ceramic capacitor of the 3rd embodiment of the invention and of the invention
The multilayer ceramic capacitor of first embodiment is identical, so omitting the detailed description to it.
Figure 11 is the perspective view of the multilayer ceramic capacitor according to four embodiment of the invention.
Figure 12 is illustrate first to fourth inner connecting conductors suitable for the multilayer ceramic capacitor shown in Figure 11 flat
Face figure.
Figure 13 is illustrated inside the first to the 8th be used together with first to fourth inner connecting conductors shown in Figure 12
The plan of electrode.
Figure 14 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Figure 11.
With reference to figures 11 to 14, the multilayer ceramic capacitor 200 of the 4th embodiment of the invention may include：Ceramic body
210, the ceramic body 210 includes multiple dielectric layers and has the first and second first type surfaces 5 and 6 relative to each other, relative to each other
The first and second side surfaces 3 and 4 and the first and second end faces 1 and 2 relative to each other；Be exposed to the first side surface 3 and
It is formed separated from one another first, the 3rd, the 5th and on individual layer on length-cross direction in the cross section of ceramic body 210
Seven internal electrodes 221,223,225 and 227, and be exposed on the second side surface 4 and growing-cross direction in ceramic body 210
It is formed the internal electrode 222,224,226 of separated from one another second, the four, the 6th and the 8th on another individual layer in cross section
With 228；It is formed in ceramic body 210 and is exposed to first to fourth inner connecting conductors of the first and second side surfaces 3 and 4
241 to 244；And be formed at the first to the 8th outer electrode 231 on the first and second side surfaces 3 and 4 of ceramic body 210 to
238, in the described first to the 8th outer electrode 231 to 238 and the first to the 8th internal electrode 221 to 228 and first to fourth
Portion's connection conductor 241 to 244 is electrically connected.First and second internal electrodes 221 and the and of the 222, third and fourth internal electrode 223
224th, the 5th and the 6th internal electrode 225 and 226 and the 7th and the 8th internal electrode 227 and 228 form respectively first,
2nd, the 3rd and the 4th capacitor part.First and second capacitor parts respectively with the first and second inner connecting conductors 241
Connect with 242, and the third and fourth capacitor part is connected respectively with the third and fourth inner connecting conductors 243 and 244.
This embodiment of the invention, first to fourth outer electrode 231 to 234 is configured in ceramic body
Arrangement is spaced on first side surface 3, and the 5th to the 8th outer electrode 235 to 238 is configured to the second of ceramic body
Arrangement is spaced on side surface 4.
This embodiment of the invention, the mounting surface of multilayer ceramic capacitor 200 can be the of ceramic body 210
One or second side surface 3 or 4.
This embodiment of the invention, inside first, the three, the five, the seven, the second, the four, the 6th and the 8th
Electrode 221,223,225,227,222,224,226 and 228 can order respectively with the first to the 8th outer electrode 231,232,
233rd, 234,235,236,237 are connected with 238.
This embodiment of the invention, the first inner connecting conductors 241 can be by the first outer electrode 231 and the
One internal electrode 221 is connected and is connected with the 4th internal electrode 224 by the 6th outer electrode 236.
This embodiment of the invention, the second inner connecting conductors 242 can be by the 5th outer electrode 235 and the
Two internal electrodes 222 are connected and are connected with the 3rd internal electrode 223 by the second outer electrode 232.
This embodiment of the invention, the 3rd inner connecting conductors 243 can be by the 3rd outer electrode 233 and the
Five internal electrodes 225 are connected and are connected with the 8th internal electrode 228 by the 8th outer electrode 238.
This embodiment of the invention, the 4th inner connecting conductors 244 can be by the 7th outer electrode 237 and the
Six internal electrodes 226 are connected and are connected with the 7th internal electrode 227 by the 4th outer electrode 234.
With reference to Figure 14, the first and second inner connecting conductors 241 and 242 and the third and fourth inner connecting conductors 243
Can be connected in parallel with each other respectively with 244.
Additionally, first to fourth capacitor part can be connected in parallel to each other.
Further, including the first and second internal electrodes 221 and 222 the first capacitor part and including the 3rd He
Second capacitor part of the 4th internal electrode 223 and 224 can connect with the first and second inner connecting conductors 241 and 242.
Additionally, the 3rd capacitor part including the 5th and the 6th internal electrode 225 and 226 and including the 7th and the 8th
4th capacitor part of internal electrode 227 and 228 can connect with the third and fourth inner connecting conductors 243 and 244.
Because other features of the multilayer ceramic capacitor of the 4th embodiment of the invention with described above
Multilayer ceramic capacitor according to the first embodiment of the present invention is identical, so omitting detailed description.
Figure 15 is the perspective view of the multilayer ceramic capacitor of the 5th embodiment of the invention.
Figure 16 is illustrate the first to the 3rd inner connecting conductors suitable for the multilayer ceramic capacitor shown in Figure 15 flat
Face figure.
Figure 17 is illustrated inside first to fourth be used together with first shown in Figure 16 to the 3rd inner connecting conductors
The plan of electrode.
Figure 18 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Figure 15.
With reference to Figure 15 to Figure 18, the multilayer ceramic capacitor 300 of the 5th embodiment of the invention may include：Ceramics
Body 310, the ceramic body includes multiple dielectric layers 311 and has the first and second first type surfaces 5 and 6 relative to each other, each other phase
To the first and second side surfaces 3 and 4 and the first and second end faces 1 and 2 relative to each other；In being formed at ceramic body 310
First capacitor part and the second capacitor part, first capacitor part include have be exposed to the second side surface 4
Lead 321a the first internal electrode 321 and the second internal electrode with the lead 322a for being exposed to the first side surface 3
322a, second capacitor part include having be exposed to the second side surface 4 and with the lead 321a point of the first internal electrode
3rd internal electrode 323 of the lead 323a for separating and be exposed to first end face 3 and with the lead of the second internal electrode
4th internal electrode 324 of the lead 324a that 322a is separated；It is formed in ceramic body 310 and is exposed to the first and second side tables
First to the 3rd inner connecting conductors 325 to 327 in face 3 and 4；And it is formed at the first and second side surfaces 3 of ceramic body 310
With the first to the 6th outer electrode 331 to 336 on 4, the outer electrode 331 to 336 and first to fourth internal electrode 321
Electrically connect to three inner connecting conductors 325 to 327 to 324 and first, wherein in the first capacitor part and first and second
Portion connection conductor 325 and 326 connect, and the second capacitor part with second and the 3rd inner connecting conductors 326 and 327 connect.
This embodiment of the invention, the first to the 3rd outer electrode 331 to 333 can be arranged in ceramic body
The first side surface 3 on spaced-apart relation, and the 4th to the 6th outer electrode 334 to 336 can be arranged in ceramic body
The second side surface 4 on spaced-apart relation.
This embodiment of the invention, the mounting surface of multilayer ceramic capacitor 300 can be the first of ceramic body
Or second side surface 3 or 4.
This embodiment of the invention, the lead 321a of the first internal electrode 321 can be with the 4th outer electrode 334
It is connected, the lead 322a of the second internal electrode 322 can be connected with the second outer electrode 332, the lead of the 3rd internal electrode 323
323a can be connected with the 5th outer electrode 335, and the lead 324a of the 4th internal electrode 324 can be with the phase of the 3rd outer electrode 333
Even.
This embodiment of the invention, the first inner connecting conductors 325 may be connected to the first outer electrode 331 simultaneously
First internal electrode 321 can be connected to by the 4th outer electrode 334.
This embodiment of the invention, the second inner connecting conductors 326 can be connected by the second outer electrode 332
The 3rd internal electrode 323 is connected to the second internal electrode 322 and by the 5th outer electrode 335.
This embodiment of the invention, the first inner connecting conductors 327 may be connected to the 6th outer electrode 336 simultaneously
4th internal electrode 324 is connected to by the 3rd outer electrode 333.
With reference to Figure 18, the first to the 3rd inner connecting conductors 325 to 327 can be connected in parallel to each other.
Additionally, including the first and second internal electrodes 321 and 322 the first capacitor part can with first and second inside
Connection conductor 325 and 326 is connected.
Additionally, including the third and fourth internal electrode 323 and 324 the second capacitor part can with second and the 3rd inside
Connection conductor 326 and 327 is connected.
Because other features of the multilayer ceramic capacitor of the 5th embodiment of the invention with it is of the invention
The multilayer ceramic capacitor of first embodiment is identical, so omitting detailed description.
For installing the plate of multilayer ceramic capacitor
Figure 19 is the perspective view for illustrating the multilayer ceramic capacitor shown in the Fig. 1 for installing on a printed circuit.
With reference to Figure 19, the plate 400 for installing multilayer ceramic capacitor 100 according to the embodiment of the present invention includes print
Printed circuit board 410, multilayer ceramic capacitor 100 is vertically mounted on the printed circuit board (PCB) 410, and plate 400 also includes being formed
On printed circuit board (PCB) 410 and the first and second electrode pad separated from one another 421 and 422.
In the case, multilayer ceramic capacitor 100 is electrically connected with printed circuit board (PCB) 410 by solder 430, now
Three and the 4th outer electrode 133 and 134 is contacted respectively with the first and second electrode pads 421 and 422.
In addition to above description, omission is retouched with above-mentioned multilayer ceramic capacitor feature according to the first embodiment of the invention
State the feature interpretation of repetition.
Figure 20 is the curve map for being compared the impedance between embodiments of the invention and comparative example.
With reference to Figure 20, it is appreciated that compared with comparative example according to the multilayer ceramic capacitor of correlation technique, according to this
Impedance in the multilayer ceramic capacitor of the embodiment of invention is flat in more wide frequency ranges and is reduced.
As it was previously stated, according to the embodiment of the present invention, multilayer ceramic capacitor can have two kinds of resistors and capacitor,
These resistors and the respective value of capacitor are controllable.
Therefore, compared with the structure according to correlation technique, it is easy to according to the embodiment of the present invention in broader frequency model
Enclose interior reduction and control impedance, and because component number is reduced, installing space and manufacturing cost can be reduced.
Additionally, because the capacitor is mounted vertically, therefore size reduction is not hindered by contactless terminal, this is being produced
The miniaturization aspect of product is an advantage.
Although illustrating and describing the present invention already in connection with embodiment, to those skilled in the art show and
It is clear to, modification can be made on the premise of the spirit and scope of the present invention limited without departing from appended claims
And variation.
Claims (13)
1. a kind of multilayer ceramic capacitor, the multilayer ceramic capacitor includes：
Ceramic body, the ceramic body include multiple dielectric layers and with the first first type surface and the second first type surface relative to each other, that
This first relative side surface and the second side surface and first end face relative to each other and second end face；
The first capacitor part being formed in the ceramic body and the second capacitor part being formed in the ceramic body,
First capacitor part includes first internal electrode with the lead for being exposed to first side surface and with exposed
In the second internal electrode of the lead of second side surface, second capacitor part include have be exposed to described first
Side surface and the 3rd internal electrode of the lead separated with the lead of first internal electrode and with being exposed to
4th internal electrode of the lead stated the second side surface and separate with the lead of second internal electrode；
Be formed in the ceramic body and be exposed to first side surface and the second side surface the first inner connecting conductors and
Second inner connecting conductors；And
The first outer electrode on first side surface and the second side surface of the ceramic body is formed to the 4th external electrical
In pole, first outer electrode to the 4th outer electrode and first internal electrode to the 4th internal electrode and described first
Portion connects conductor and the electrical connection of the second inner connecting conductors,
Wherein described first capacitor part and the second capacitor part respectively with first inner connecting conductors and second in
Portion's connection conductor series connection connection,
The lead of wherein described first internal electrode is connected with first outer electrode,
The lead of second internal electrode is connected with the 4th outer electrode,
The lead of the 3rd internal electrode is connected with second outer electrode, and
The lead of the 4th internal electrode is connected with the 3rd outer electrode,
Wherein described first inner connecting conductors are connected and are led to by first outer electrode with first internal electrode
Cross the 3rd outer electrode to be connected with the 4th internal electrode, and
Wherein described second inner connecting conductors are connected and are led to by the 4th outer electrode with second internal electrode
Cross second outer electrode to be connected with the 3rd internal electrode.
2. multilayer ceramic capacitor according to claim 1, wherein first outer electrode and the second outer electrode quilt
Be arranged to it is separated from one another on first side surface of the ceramic body, and
3rd outer electrode and the 4th outer electrode are arranged on second side surface of the ceramic body each other
Separate.
3. multilayer ceramic capacitor according to claim 1, wherein the mounting surface of the multilayer ceramic capacitor is described
First side surface of ceramic body or the second side surface.
4. multilayer ceramic capacitor according to claim 1, wherein first internal electrode and the 3rd internal electrode quilt
Be formed as growing-cross direction on it is separated from one another on individual layer in the cross section of the ceramic body, and
Second internal electrode and the 4th internal electrode are formed on the length-cross direction described in the ceramic body
It is separated from one another on another individual layer in cross section.
5. multilayer ceramic capacitor according to claim 4, the multilayer ceramic capacitor is further included：
The 3rd capacitor part being formed in the ceramic body and the 4th capacitor part being formed in the ceramic body,
3rd capacitor part includes being exposed to the 5th internal electrode of first side surface and is exposed to second side table
6th internal electrode in face, the 4th capacitor part includes the 7th internal electrode and the 8th internal electrode,
Wherein described 5th internal electrode and the 7th internal electrode are formed on the length-cross direction in the ceramic body
It is separated from one another on individual layer in the cross section, and
6th internal electrode and the 8th internal electrode are formed on the length-cross direction described in the ceramic body
It is separated from one another on another individual layer in cross section.
6. multilayer ceramic capacitor according to claim 5, wherein the 5th internal electrode is connected to described first
Outer electrode,
6th internal electrode is connected to the 3rd outer electrode,
7th internal electrode is connected to second outer electrode, and
8th internal electrode is connected to the 4th outer electrode.
7. a kind of multilayer ceramic capacitor, the multilayer ceramic capacitor includes：
Ceramic body, the ceramic body include multiple dielectric layers and with the first first type surface and the second first type surface relative to each other, that
This first relative side surface and the second side surface and first end face relative to each other and second end face；
Be exposed to first side surface and be formed growing-cross direction on individual layer in the cross section of the ceramic body
First internal electrode separated from one another, the 3rd internal electrode, the 5th internal electrode and the 7th internal electrode, and be exposed to described
Second side surface is simultaneously formed on another individual layer on the length-cross direction in the cross section of the ceramic body that
This detached second internal electrode, the 4th internal electrode, the 6th internal electrode and the 8th internal electrode；
It is formed in the ceramic body and is exposed to the first inner connecting conductors of first side surface and the second side surface extremely
4th inner connecting conductors；And
The first outer electrode on first side surface and the second side surface of the ceramic body is formed to the 8th external electrical
In pole, first outer electrode to the 8th outer electrode and first internal electrode to the 8th internal electrode and described first
Portion's connection conductor is electrically connected to the 4th inner connecting conductors,
Wherein described first internal electrode and the second internal electrode, the 3rd internal electrode and the 4th internal electrode, described
Five internal electrodes and the 6th internal electrode and the 7th internal electrode and the 8th internal electrode form respectively the first capacitor
Part, the second capacitor part, the 3rd capacitor part and the 4th capacitor part, first capacitor part and second electric
Container parts are connected respectively with first inner connecting conductors and the second inner connecting conductors, the 3rd capacitor part and
4th capacitor part is connected respectively with the 3rd inner connecting conductors and the 4th inner connecting conductors,
Wherein described first internal electrode, the 3rd internal electrode, the 5th internal electrode, the 7th internal electrode, the second internal electrode,
4th internal electrode, the 6th internal electrode and the 8th internal electrode are respectively with first outer electrode to the 8th outer electrode phase
Even,
Wherein described first inner connecting conductors are connected and are led to by first outer electrode with first internal electrode
Cross the 6th outer electrode to be connected with the 4th internal electrode,
Wherein described second inner connecting conductors are connected and are led to by the 5th outer electrode with second internal electrode
Cross second outer electrode to be connected with the 3rd internal electrode,
Wherein described 3rd inner connecting conductors are connected and are led to by the 3rd outer electrode with the 5th internal electrode
Cross the 8th outer electrode to be connected with the 8th internal electrode, and
Wherein described 4th inner connecting conductors are connected and are led to by the 7th outer electrode with the 6th internal electrode
Cross the 4th outer electrode to be connected with the 7th internal electrode.
8. multilayer ceramic capacitor according to claim 7, wherein first outer electrode is to the 4th outer electrode quilt
Be arranged to it is separated from one another on first side surface of the ceramic body, and
5th outer electrode is arranged on second side surface of the ceramic body each other to the 8th outer electrode
Separate.
9. multilayer ceramic capacitor according to claim 7, wherein the mounting surface of the multilayer ceramic capacitor is described
First side surface of ceramic body or the second side surface.
10. a kind of multilayer ceramic capacitor, the multilayer ceramic capacitor includes：
Ceramic body, the ceramic body include multiple dielectric layers and with the first first type surface and the second first type surface relative to each other, that
This first relative side surface and the second side surface and first end face relative to each other and second end face；
The first capacitor part being formed in the ceramic body and the second capacitor part being formed in the ceramic body,
First capacitor part includes first internal electrode with the lead for being exposed to second side surface and with exposed
In the second internal electrode of the lead of first side surface, second capacitor part include have be exposed to described second
Side surface and the 3rd internal electrode of the lead separated with the lead of first internal electrode and with being exposed to
4th internal electrode of the lead stated the first side surface and separate with the lead of second internal electrode；
It is formed in the ceramic body and is exposed to the first inner connecting conductors of first side surface and the second side surface extremely
3rd inner connecting conductors；And
Be formed on first side surface of the ceramic body and the second side surface and with first internal electrode to the 4th
The first outer electrode that internal electrode and first inner connecting conductors to the 3rd inner connecting conductors are electrically connected is to outside the 6th
Portion's electrode,
Wherein described first capacitor part is connected with first inner connecting conductors and the second inner connecting conductors, and
Second capacitor part is connected with second inner connecting conductors and the 3rd inner connecting conductors, wherein described
The lead of one internal electrode is connected to the 4th outer electrode,
The lead of second internal electrode is connected to second outer electrode,
The lead of the 3rd internal electrode is connected to the 5th outer electrode, and
The lead of the 4th internal electrode is connected to the 3rd outer electrode,
Wherein described first inner connecting conductors are connected to first outer electrode, and by the 4th outer electrode quilt
First internal electrode is connected to,
Wherein described second inner connecting conductors are connected and are led to by second outer electrode with second internal electrode
Cross the 5th outer electrode to be connected with the 3rd internal electrode, and
Wherein described 3rd inner connecting conductors are connected to the 6th outer electrode, and by the 3rd outer electrode with
4th internal electrode is connected.
11. multilayer ceramic capacitors according to claim 10, wherein first outer electrode is to the 3rd outer electrode
Be arranged in it is separated from one another on first side surface of the ceramic body, and
4th outer electrode is arranged on second side surface of the ceramic body each other to the 6th outer electrode
Separate.
12. multilayer ceramic capacitors according to claim 10, wherein the mounting surface of the multilayer ceramic capacitor is institute
State first side surface or the second side surface of ceramic body.
A kind of 13. plates for installing multilayer ceramic capacitor, the plate includes：
Printed circuit board (PCB), there is on the printed circuit board first electrode pad and second electrode pad；And
The multi-layer ceramics according to any claim in claim 1 to 12 on the printed circuit board is installed
Capacitor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130044156A KR101514514B1 (en) | 2013-04-22 | 2013-04-22 | Multi-layered ceramic capacitor and board for mounting the same |
| KR10-2013-0044156 | 2013-04-22 |
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| CN104112594A CN104112594A (en) | 2014-10-22 |
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| CN201310342102.7A Active CN104112594B (en) | 2013-04-22 | 2013-08-07 | Multi-layer ceramic capacitor and plate for mounting multi-layer ceramic capacitor |
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| JP (1) | JP5815607B2 (en) |
| KR (1) | KR101514514B1 (en) |
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| KR102052768B1 (en) * | 2014-12-15 | 2019-12-09 | 삼성전기주식회사 | Chip electronic component and board having the same mounted thereon |
| DE102015215942A1 (en) * | 2015-08-20 | 2017-02-23 | Robert Bosch Gmbh | Electronic assembly, in particular for a transmission control module |
| KR102450593B1 (en) | 2016-04-27 | 2022-10-07 | 삼성전기주식회사 | Capacitor Component |
| KR102437806B1 (en) * | 2017-07-25 | 2022-08-30 | 삼성전기주식회사 | Composite electronic component and board for mounting the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1397965A (en) * | 2001-07-16 | 2003-02-19 | Tdk株式会社 | Ceramic electronic device with multi-terminal and multiple layers |
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| JP3907599B2 (en) * | 2003-03-07 | 2007-04-18 | Ｔｄｋ株式会社 | Multilayer capacitor |
| JP4293560B2 (en) * | 2006-07-12 | 2009-07-08 | Ｔｄｋ株式会社 | Multilayer capacitor array |
| KR100809239B1 (en) * | 2006-12-29 | 2008-03-07 | 삼성전기주식회사 | Multilayer capacitor array |
| US7388738B1 (en) * | 2007-03-28 | 2008-06-17 | Tdk Corporation | Multilayer capacitor |
| DE102007020783A1 (en) * | 2007-05-03 | 2008-11-06 | Epcos Ag | Electrical multilayer component |
| JP4525773B2 (en) * | 2007-05-22 | 2010-08-18 | 株式会社村田製作所 | Multilayer ceramic capacitor |
| KR100925623B1 (en) * | 2007-08-31 | 2009-11-06 | 삼성전기주식회사 | Multilayer Chip Capacitor, Circuit Board Apparatus Having the Capacitor, and Circuit Board |
| KR100925603B1 (en) * | 2007-09-28 | 2009-11-06 | 삼성전기주식회사 | Multilayer capacitor |
| KR100916476B1 (en) * | 2007-11-30 | 2009-09-08 | 삼성전기주식회사 | Multilayer Chip Capacitor and Circuit Board Apparatus Having the Capacitor |
| JP5282634B2 (en) * | 2008-06-25 | 2013-09-04 | 株式会社村田製作所 | Multilayer ceramic electronic component and manufacturing method thereof |
| JP5152278B2 (en) * | 2010-08-31 | 2013-02-27 | Ｔｄｋ株式会社 | Manufacturing method of laminated electronic component and laminated electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1397965A (en) * | 2001-07-16 | 2003-02-19 | Tdk株式会社 | Ceramic electronic device with multi-terminal and multiple layers |
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| KR20140126083A (en) | 2014-10-30 |
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| KR101514514B1 (en) | 2015-04-22 |
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