JP5815607B2 - Multilayer ceramic capacitor and its mounting board - Google Patents

Description

  The present invention relates to a multilayer ceramic capacitor and a mounting substrate thereof.

  Multilayer ceramic capacitors, which are one of the multilayer chip electronic components, include a variety of video devices such as liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones. It is a chip-type capacitor that is mounted on a printed circuit board of an electronic product and serves to charge or discharge electricity.

  Such a multi-layered ceramic capacitor (MLCC) can be used as a component of various electronic devices because of its small size, high capacity, and easy mounting.

  The multilayer ceramic capacitor may have a structure in which a plurality of dielectric layers and internal electrodes having different polarities are alternately stacked between the dielectric layers.

  In particular, a power supply device for a central processing unit (CPU) such as a computer has a problem that voltage noise is generated due to a rapid change in load current in the process of providing a low voltage.

  Therefore, multilayer capacitors are widely used in power supply devices as applications of decoupling capacitors for suppressing such voltage noise.

  The decoupling monolithic ceramic capacitor is required to have a lower ESL value as the operating frequency is increased, and many studies for reducing such ESL are actively underway.

  In order to supply more stable power, the decoupling multilayer ceramic capacitor is required to have adjustable ESR characteristics.

  If the ESR value of the multilayer ceramic capacitor is lower than the required level, the impedance peak at the parallel resonant frequency generated by the ESL of the capacitor and the plane capacitance of the microprocessor package becomes high, and at the series resonant frequency of the capacitor. There is a problem that the impedance becomes very low.

  Accordingly, it is preferable that the ESR characteristic of the decoupling multilayer ceramic capacitor is easily adjusted so that the user can realize the flat impedance characteristic of the power distribution network.

  In connection with ESR adjustment, a method using a material having high electrical resistance for the external electrode and the internal electrode can be considered. Such a material change method has an advantage that it can maintain a conventional low ESL structure and provide high ESR characteristics.

  However, when a high-resistance material is used for the external electrode, there is a problem in that a localized heat spot is generated due to a current concentration phenomenon caused by a pinhole. In addition, when a high resistance material is used for the internal electrode, there is a disadvantage in that the material of the internal electrode must also be changed for matching with a ceramic material due to the increase in capacity.

  Therefore, since the conventional ESR adjustment method has the disadvantages described above, research on a multilayer ceramic capacitor capable of adjusting ESR is required.

  Recently, with the rapid development of mobile terminals such as tablet PCs and ultra books, microprocessors have also been converted into small and highly integrated products.

  Therefore, the area of the printed circuit board is reduced, and the mounting space for the decoupling capacitor is also limited. Therefore, a multilayer ceramic capacitor capable of satisfying this has been continuously demanded.

JP 2012-138415 A

  An object of the present invention is to provide a multilayer ceramic capacitor and a mounting substrate thereof.

  One embodiment of the present invention includes a ceramic body including a plurality of dielectric layers and having opposing first and second main surfaces, opposing first and second side surfaces, and opposing first and second end surfaces. And a first capacitor portion including a first internal electrode formed in the ceramic body and having a lead exposed on the first side surface and a second internal electrode having a lead exposed on the second side surface, and A third internal electrode having a lead exposed on the first side and spaced apart from the lead of the first internal electrode, and a fourth having a lead exposed on the second side and spaced from the lead of the second internal electrode. A second capacitor portion including a plurality of internal electrodes, first and second internal connection conductors formed in the ceramic body and exposed on the first and second side surfaces, and the first and second of the ceramic body. Formed on the side surface of the first to fourth internal power supplies. , First to fourth external electrodes electrically connected to the first and second internal connection conductors, wherein the first capacitor portion and the second capacitor portion are the first and second capacitor portions, respectively. A multilayer ceramic capacitor connected in series with an internal connection conductor is provided.

  In one embodiment of the present invention, the first and second external electrodes are spaced apart from each other on the first side surface of the ceramic body, and the third and fourth external electrodes are the second side of the ceramic body. Can be spaced apart from each other.

  In one embodiment of the present invention, the mounting surface of the multilayer ceramic capacitor may be the first or second side surface of the ceramic body.

  In one embodiment of the present invention, the lead of the first internal electrode is connected to a first external electrode, the lead of the second internal electrode is connected to a fourth external electrode, and the third internal electrode The lead of the fourth internal electrode may be connected to the second external electrode, and the lead of the fourth internal electrode may be connected to the third external electrode.

  In one embodiment of the present invention, the first internal connection conductor is connected to the first internal electrode through a first external electrode, and the fourth internal electrode is connected to the fourth internal electrode through a third external electrode. Can be linked.

  In one embodiment of the present invention, the second internal connection conductor is connected to the second internal electrode via a fourth external electrode, and the third internal electrode is connected to the third internal electrode via a second external electrode. Can be linked.

  In another embodiment of the present invention, the first internal electrode and the third internal electrode are formed to be separated from each other in one layer in a cross section in the length-width direction of the ceramic body. The electrode and the fourth internal electrode may be formed to be separated from each other in another layer in the cross section in the length-width direction of the ceramic body.

  In another embodiment of the present invention, the lead of the first internal electrode is connected to a first external electrode, the lead of the second internal electrode is connected to a third external electrode, and the third internal electrode is connected to the third internal electrode. The lead of the electrode may be connected to the second external electrode, and the lead of the fourth internal electrode may be connected to the fourth external electrode.

  In another embodiment of the present invention, the first internal connection conductor is connected to the first internal electrode via a first external electrode, and the fourth internal electrode is connected via a fourth external electrode. Can be concatenated with.

  In another embodiment of the present invention, the second internal connection conductor is connected to the second internal electrode through a third external electrode, and the third internal electrode is connected through the second external electrode. Can be concatenated with.

  In another embodiment of the present invention, the multilayer ceramic capacitor includes a fifth internal electrode exposed in the first side surface and a sixth internal electrode exposed in the second side surface, formed in the ceramic body. And further including a third capacitor portion and a fourth capacitor portion including a seventh internal electrode and an eighth internal electrode, wherein the fifth internal electrode and the seventh internal electrode are length-width of the ceramic body. The sixth internal electrode and the eighth internal electrode are formed apart from each other in another cross-section in the length-width direction of the ceramic body. Can be done.

  In another embodiment of the present invention, the fifth internal electrode is connected to the first external electrode, the sixth internal electrode is connected to the third external electrode, and the seventh internal electrode is connected to the first external electrode. And the eighth internal electrode may be connected to the fourth external electrode.

  Another embodiment of the present invention includes a plurality of dielectric layers, ceramics having opposing first and second major surfaces, opposing first and second side surfaces, and opposing first and second end surfaces. The first, third, fifth and seventh portions exposed on the first side surface in the main body and the ceramic main body and separated from each other in one layer in the length-width cross section of the ceramic main body. And the second, fourth, sixth and eighth electrodes formed on the second side surface and spaced apart from each other in the length-width cross section of the ceramic body. An inner electrode, first to fourth inner connecting conductors formed in the ceramic body and exposed on the first and second side surfaces; formed on the first and second side surfaces of the ceramic body; The first to eighth inner electrodes and the first to fourth inner connecting conductors are electrically connected. First to eighth external electrodes, the first and second internal electrodes, the third and fourth internal electrodes, the fifth and sixth internal electrodes, and the seventh and eighth internal electrodes. Internal electrodes form first, second, third, and fourth capacitor portions, respectively, and the first capacitor portion and the second capacitor portion are in series with the first and second internal connection conductors, respectively. The third capacitor unit and the fourth capacitor unit are connected to each other in series with the third and fourth inner connection conductors, respectively.

  In one embodiment of the present invention, the first to fourth external electrodes are spaced apart from each other on the first side surface of the ceramic body, and the fifth to eighth external electrodes are the second side of the ceramic body. Can be spaced apart from each other.

  In one embodiment of the present invention, the mounting surface of the multilayer ceramic capacitor may be the first or second side surface of the ceramic body.

  In one embodiment of the present invention, the first, third, fifth, seventh, second, fourth, sixth and eighth internal electrodes are connected to the first to eighth external electrodes, respectively. be able to.

  In one embodiment of the present invention, the first inner connecting conductor is connected to the first inner electrode via a first outer electrode, and the fourth inner electrode via a sixth outer electrode. Can be linked.

  In one embodiment of the present invention, the second internal connection conductor is connected to the second internal electrode via a fifth external electrode, and the third internal electrode via the second external electrode. Can be linked.

  In one embodiment of the present invention, the third inner connecting conductor is connected to the fifth inner electrode via a third outer electrode, and the eighth inner electrode via the eighth outer electrode. Can be linked.

  In one embodiment of the present invention, the fourth internal connection conductor is connected to the sixth internal electrode via a seventh external electrode, and the seventh internal electrode is connected to the seventh internal electrode via a fourth external electrode. Can be linked.

  Another embodiment of the present invention includes a plurality of dielectric layers, ceramics having opposing first and second major surfaces, opposing first and second side surfaces, and opposing first and second end surfaces. A first capacitor unit including a main body, a first internal electrode formed in the ceramic main body and having a lead exposed on a second side surface, and a second internal electrode having a lead exposed on the first side surface; A third internal electrode having a lead exposed on the second side and spaced apart from the lead of the first internal electrode; and a third internal electrode having a lead exposed on the first side and spaced from the lead of the second internal electrode. 4, the second capacitor portion including the four internal electrodes, first to third internal connection conductors formed in the ceramic body and exposed on the first and second side surfaces, and the first and second of the ceramic body. Formed on the side surface of the first and second interiors First to sixth external electrodes electrically connected to the poles and the first to third internal connection conductors, wherein the first capacitor portion is in series with the first and second internal connection conductors. And the second capacitor part provides a multilayer ceramic capacitor connected in series with the second and third internal connection conductors.

  In one embodiment of the present invention, the first to third external electrodes are spaced apart from each other on the first side surface of the ceramic body, and the fourth to sixth external electrodes are the second side of the ceramic body. Can be spaced apart from each other.

  In one embodiment of the present invention, the mounting surface of the multilayer ceramic capacitor may be the first or second side surface of the ceramic body.

  In one embodiment of the present invention, the lead of the first internal electrode is connected to the fourth external electrode, the lead of the second internal electrode is connected to the second external electrode, and the third internal electrode The lead of the fourth internal electrode may be connected to the fifth external electrode, and the lead of the fourth internal electrode may be connected to the third external electrode.

  In one embodiment of the present invention, the first internal connection conductor may be connected to the first external electrode and connected to the first internal electrode through a fourth external electrode.

  In one embodiment of the present invention, the second internal connection conductor is connected to the second internal electrode through a second external electrode, and the third internal electrode is connected to the third internal electrode through a fifth external electrode. Can be linked.

  In one embodiment of the present invention, the third internal connection conductor may be connected to the sixth external electrode, and may be connected to the fourth internal electrode through the third external electrode.

  According to still another embodiment of the present invention, there is provided a multilayer ceramic capacitor mounting board comprising: a printed circuit board having first and second electrode pads on the upper part; and the multilayer ceramic capacitor installed on the printed circuit board. I will provide a.

  According to the present invention, there are two types of resistors and capacitors, and each value can be controlled.

  As a result, it is easy to reduce and adjust the impedance in a wider frequency range as compared with the conventional structure, and it is possible to reduce the mounting space and cost due to the reduction of components.

  Further, since the vertical mounting does not interfere with downsizing due to non-contact terminals, there is an effect that it is advantageous for downsizing of the product.

1 is a perspective view of a multilayer ceramic capacitor according to a first embodiment of the present invention. FIG. 3 is a plan view showing first and second internal connection conductors that can be employed in the multilayer ceramic capacitor shown in FIG. 1. FIG. 3 is a plan view showing first to fourth internal electrodes that can be used with the first and second internal connection conductors shown in FIG. 2. FIG. 2 is an equivalent circuit diagram of the multilayer ceramic capacitor shown in FIG. 1. It is a top view which shows the 1st and 2nd internal connection conductor employable for the multilayer ceramic capacitor by the 2nd Embodiment of this invention. FIG. 6 is a plan view showing first to fourth internal electrodes that can be used with the first and second internal connection conductors shown in FIG. 5. FIG. 6 is an equivalent circuit diagram of the multilayer ceramic capacitor according to the second embodiment of the present invention. It is a top view which shows the 1st and 2nd internal connection conductor employable for the multilayer ceramic capacitor by the 3rd Embodiment of this invention. FIG. 9 is a plan view showing first to eighth internal electrodes that can be used with the first and second internal connection conductors shown in FIG. 8. FIG. 6 is an equivalent circuit diagram of a multilayer ceramic capacitor according to a third embodiment of the present invention. It is a perspective view of the multilayer ceramic capacitor by the 4th Embodiment of this invention. FIG. 12 is a plan view showing first to fourth internal connection conductors that can be employed in the multilayer ceramic capacitor shown in FIG. 11. FIG. 13 is a plan view showing first to eighth internal electrodes that can be used with the first to fourth internal connection conductors shown in FIG. 12. FIG. 12 is an equivalent circuit diagram of the multilayer ceramic capacitor shown in FIG. 11. It is a perspective view of the multilayer ceramic capacitor by the 5th Embodiment of this invention. FIG. 16 is a plan view showing first to third internal connection conductors that can be employed in the multilayer ceramic capacitor shown in FIG. 15. FIG. 17 is a plan view showing first to fourth internal electrodes that can be used with the first to third internal connection conductors shown in FIG. 16. FIG. 16 is an equivalent circuit diagram of the multilayer ceramic capacitor shown in FIG. 15. FIG. 2 is a perspective view illustrating an aspect in which the multilayer ceramic capacitor of FIG. 1 is mounted on a printed circuit board. It is the graph which compared the impedance of the Example and comparative example of this invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description.

  In order to clearly describe the embodiment of the present invention, when the direction of the hexahedron is defined, L, W, and T displayed on the drawing indicate a length direction, a width direction, and a thickness direction, respectively. Here, the thickness direction can be used in the same concept as the stacking direction in which the dielectric layers are stacked.

MLCC hereinafter be described with reference to the accompanying drawings of embodiments of the present invention in detail.

  FIG. 1 is a perspective view of a multilayer ceramic capacitor according to a first embodiment of the present invention, and FIG. 2 is a plan view showing first and second internal connection conductors that can be employed in the multilayer ceramic capacitor shown in FIG. FIG. 3 is a plan view showing first to fourth internal electrodes that can be used with the first and second internal connection conductors shown in FIG.

  1 to 3, a multilayer ceramic capacitor 100 according to a first embodiment of the present invention includes a plurality of dielectric layers 111, opposed first and second principal surfaces, opposed first and first opposing layers. A ceramic body 110 having two side surfaces and opposing first and second end surfaces may be included.

  In the present embodiment, the ceramic body 110 includes the first main surface 5 and the second main surface 6 facing each other, the first side surface 3 and the second main surface connecting the first main surface and the second main surface. Side surface 4, and first end surface 1 and second end surface 2.

  The shape of the ceramic body 110 is not particularly limited, and may be a hexahedral shape as illustrated.

  The ceramic body 110 is formed by laminating a plurality of dielectric layers, and a plurality of internal electrodes 121, 122, 123, and 124 (first to fourth internal electrodes in order) are formed in the ceramic body 110. The dielectric layers may be arranged separately from each other.

  The plurality of dielectric layers 111 constituting the ceramic body 110 are integrated in such a manner that the boundary between adjacent dielectric layers cannot be confirmed in a sintered state.

The dielectric layer 111 may be formed by firing a ceramic green sheet containing ceramic powder, an organic solvent, and an organic binder. As the ceramic powder, a barium titanate (BaTiO ₃ ) -based material, a strontium titanate (SrTiO ₃ ) -based material, or the like can be used as a substance having a high dielectric constant, but is not particularly limited.

  The multilayer ceramic capacitor 100 includes a first internal electrode 121 having a lead 121a exposed on the first side surface 3 and a lead 122a exposed on the second side surface 4 formed in the ceramic body 110. The first capacitor portion including the internal electrode 122 and the third internal electrode 123 having the lead 123a exposed to the first side surface 3 and separated from the lead 121a of the first internal electrode, and the second side surface 4 are exposed. And a second capacitor part including a fourth internal electrode 124 having a lead 124a spaced apart from the lead 122a of the second internal electrode.

  According to the first embodiment of the present invention, the first to fourth internal electrodes 121, 122, 123, and 124 may be formed of a conductive paste containing a conductive metal.

  The conductive metal is not particularly limited, and can be nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof.

  An internal electrode layer can be printed with a conductive paste on a ceramic green sheet forming a dielectric layer by a printing method such as a screen printing method or a gravure printing method.

  The ceramic body can be formed by alternately laminating and firing ceramic green sheets on which internal electrodes are printed.

  The multilayer ceramic capacitor 100 may include first and second internal connection conductors 125 and 126 formed in the ceramic body 110 and exposed at the first and second side surfaces 3 and 4.

  The first and second inner connecting conductors 125 and 126 are not particularly limited. For example, similar to the first to fourth inner electrodes 121, 122, 123, and 124, a conductive paste containing a conductive metal is used. Can be formed.

  The conductive metal is not particularly limited, and may be nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof.

  The multilayer ceramic capacitor 100 is formed on the first and second side surfaces 3 and 4 of the ceramic body 110, and the first to fourth internal electrodes 121, 122, 123, and 124, the first and second side electrodes. First to fourth outer electrodes 131, 132, 133, 134 may be included that are electrically connected to the inner connection conductors 125, 126.

  The first and second external electrodes 131 and 132 are spaced apart from each other on the first side surface 3 of the ceramic body 110, and the third and fourth external electrodes 133 and 134 are second electrodes of the ceramic body. The side surfaces 4 can be spaced apart from each other.

  According to the first embodiment of the present invention, the mounting surface of the multilayer ceramic capacitor 100 is the first or second side surface 3 or 4 of the ceramic body 110.

  That is, the multilayer ceramic capacitor according to the first embodiment of the present invention may have a vertically mounted form, but is not particularly limited and can be mounted in various forms.

  Therefore, the third and fourth external electrodes 133 and 134 can be external electrodes that come into contact with the first and second electrode pads on the mounting board of the multilayer ceramic substrate described later.

  According to the first embodiment of the present invention, the two external electrodes 131 and 132 excluding the third and fourth external electrodes 133 and 134 used as external terminals for connection with the power supply line are used for ESR adjustment. It can be used as an external electrode.

  However, the third and fourth external electrodes used as external terminals are not particularly limited, and can be arbitrarily selected according to desired ESR characteristics.

  The first and second external electrodes 131 and 132 that can be used as the ESR adjusting external electrodes are non-contact terminals that are not connected to the power supply line as described above, and are laminated ceramics in the mounted state. It can be located on the top surface of the capacitor.

  That is, according to the first embodiment of the present invention, the first and second external electrodes 131 and 132 that are the non-contact terminals are formed on the upper surface rather than the side surface of the multilayer ceramic capacitor. Since there is no interference with downsizing of the contact terminals, there is an effect that it is advantageous for downsizing of the product.

  The first to fourth external electrodes 131, 132, 133, 134 can be formed of a conductive paste containing a conductive metal.

  The conductive metal is not particularly limited, and may be nickel (Ni), copper (Cu), tin (Sn), or an alloy thereof.

  The conductive paste may further include an insulating material. For example, the insulating material may be glass, but is not particularly limited.

  The method of forming the first to fourth external electrodes 131, 132, 133, and 134 is not particularly limited, and can be formed on the ceramic body by a printing method, or can be formed by a dipping method. It can also be formed by other methods such as plating.

  The multilayer ceramic capacitor 100 is a four-terminal capacitor having a total of four external electrodes, but is not limited thereto.

  Hereinafter, the internal electrodes 121, 122, 123, 124, the internal connection conductors 125, 126, and the external electrodes 131, 132, 133, 134 in the configuration of the multilayer ceramic capacitor 100 according to the first embodiment of the present invention will be described with reference to FIGS. This will be described in detail with reference to FIG.

  The first capacitor portion is formed in the ceramic body 110 and has a first internal electrode 121 having a lead 121a exposed on the first side surface 3 and a lead 122a exposed on the second side surface 4. 2 internal electrodes 122, and a capacitance can be formed.

  The second capacitor portion is exposed on the first side surface 3 and exposed on the second side surface 4 and the third inner electrode 123 having the lead 123 a spaced from the lead 121 a of the first inner electrode. And a fourth internal electrode 124 having a lead 124a spaced apart from the lead 122a of the second internal electrode, and a capacitance can be formed.

  The lead 121a of the first internal electrode is connected to the first external electrode 131, the lead 122a of the second internal electrode is connected to the fourth external electrode 134, and the lead 123a of the third internal electrode is The lead 124a of the fourth internal electrode connected to the second external electrode 132 can be connected to the third external electrode 133, but is not limited thereto.

  The first capacitor unit and the second capacitor unit may be disposed in the ceramic body 110 without any particular limitation, and a plurality of the first capacitor unit and the second capacitor unit may be stacked to implement a target capacitance value.

  In one embodiment of the present invention, the first capacitor unit and the second capacitor unit may be connected in parallel in the multilayer ceramic capacitor 100.

  The first to fourth inner electrodes 121, 122, 123, and 124 may be alternately disposed with the first and second inner connecting conductors 125 and 126 through the dielectric layer 111.

  Although FIG. 2 shows that each of the first and second inner connecting conductors 125 and 126 is one, there may be a plurality of inner connecting conductors having at least one polarity.

  Similarly, FIG. 3 shows that each of the first to fourth internal electrodes 121, 122, 123, 124 is one, but actually there are a plurality of internal electrodes. You can also.

  On the other hand, the layers may be stacked in the order shown in FIGS. 2 and 3, or may be stacked in various orders as required.

  For example, the first and second inner connecting conductors 125 and 126 may be disposed between the first capacitor unit and the second capacitor unit, and the first and second inner connecting conductors 125 may be disposed. 126 can be spaced apart.

  In particular, desired ESR characteristics can be adjusted more precisely by changing the width, length, and number of layers of the first and second inner connecting conductors 125 and 126.

  According to the first embodiment of the present invention, the first internal connection conductor 125 is connected to the first internal electrode 121 via the first external electrode 131 and via the third external electrode 133. The fourth inner electrode 124 can be connected.

  The second internal connection conductor 126 is connected to the second internal electrode 122 through a fourth external electrode 134, and is connected to the third internal electrode 123 through a second external electrode 132. Can be done.

  The pattern shape of the first and second inner connecting conductors 125 and 126 is not limited to the shape according to the embodiment of the present invention of FIG. 2, and may be variously changed to adjust the ESR.

  For example, it may be the same as the pattern shape of the first to fourth internal electrodes 121, 122, 123, 124 shown in FIG.

  According to the first embodiment of the present invention, the equivalent series resistance (ESR) of the multilayer ceramic capacitor may be adjusted by the first and second inner connecting conductors 125 and 126.

  That is, as will be described later, a first capacitor portion including the first internal electrode 121 and the second internal electrode 122, and a second capacitor including the third internal electrode 123 and the fourth internal electrode 124. The parts can be connected in parallel to each other.

  The first capacitor unit and the second capacitor unit may be connected in series with the first and second inner connecting conductors 125 and 126.

  When connected as described above, the equivalent series resistance (ESR) of the multilayer ceramic capacitor may be adjusted by the first and second inner connection conductors 125 and 126.

  In the present embodiment, the third and fourth external electrodes 133 and 134 are used as external terminals for connection to the power supply line. For example, the third external electrode 133 is connected to the power supply end, and the fourth The external electrode 134 may be connected to the ground.

  On the other hand, the first and second external electrodes 131 and 132, which are two external electrodes excluding the third and fourth external electrodes 133 and 134, are used as external electrodes for ESR adjustment, and are non-contact terminals (Non Contact Terminal).

  FIG. 4 is an equivalent circuit diagram of the multilayer ceramic capacitor shown in FIG.

  Referring to FIG. 4, a first capacitor unit including the first internal electrode 121 and the second internal electrode 122, and a second capacitor unit including the third internal electrode 123 and the fourth internal electrode 124. Can be connected to each other in parallel.

  The first capacitor unit and the second capacitor unit may be connected in series with the first and second inner connecting conductors 125 and 126.

  As described above, the multilayer ceramic capacitor according to the first embodiment of the present invention has two types of resistors and two types of capacitors, and each value can be controlled.

  The multilayer ceramic capacitor according to the first embodiment of the present invention is wider than the conventional structure by having the structure of the internal electrodes 121, 122, 123, 124, the internal connection conductors 125, 126 and the external electrodes described above. It is easy to reduce and adjust the impedance in the frequency domain, and it is possible to reduce the mounting space and cost due to the reduction of components.

  Further, since the vertical mounting does not interfere with downsizing due to non-contact terminals, there is an effect that it is advantageous for downsizing of the product.

  FIG. 5 is a plan view showing first and second internal connection conductors that can be employed in the multilayer ceramic capacitor according to the second embodiment of the present invention. FIG. 6 is a plan view showing the first and second internal connection conductors shown in FIG. FIG. 7 is a plan view showing first to fourth internal electrodes that can be used with the internal connection conductor, and FIG. 7 is an equivalent circuit diagram of the multilayer ceramic capacitor according to the second embodiment of the present invention.

  Referring to FIGS. 5 to 7, the multilayer ceramic capacitor according to the second embodiment of the present invention is similar to the multilayer ceramic capacitor according to the first embodiment. The electrode 123 ′ is formed to be separated from each other in one layer in the length-width section of the ceramic body 110, and the second internal electrode 122 ′ and the fourth internal electrode 124 ′ are formed on the ceramic body 110. In the cross section in the length-width direction, the layers can be formed apart from each other.

  In the second embodiment of the present invention, the lead 121′a of the first internal electrode is connected to the first external electrode 131, and the lead 122′a of the second internal electrode is connected to the third external electrode 133. The third internal electrode lead 123'a is connected to the second external electrode 132, and the fourth internal electrode lead 124'a is connected to the fourth external electrode 134. Can do.

  In the second embodiment of the present invention, the first inner connecting conductor 125 ′ is connected to the first inner electrode 121 ′ via the first outer electrode 131 and via the fourth outer electrode 134. The fourth internal electrode 124 ′ may be connected to the fourth internal electrode 124 ′.

  In the second embodiment of the present invention, the second inner connecting conductor 126 ′ is connected to the second inner electrode 122 ′ via a third outer electrode 133 and via the second outer electrode 132. The third internal electrode 123 ′ may be connected to the third internal electrode 123 ′.

  Referring to FIG. 7, the first and second inner connecting conductors 125 'and 126' may be connected in parallel to each other.

  In addition, a first capacitor part including the first internal electrode 121 ′ and the second internal electrode 122 ′, and a second capacitor part including the third internal electrode 123 ′ and the fourth internal electrode 124 ′. May be connected in series with the first and second inner connecting conductors 125 ′ and 126 ′.

  In addition, the characteristics of the multilayer ceramic capacitor according to the second embodiment of the present invention are the same as the characteristics of the multilayer ceramic capacitor according to the first embodiment of the present invention described above. Therefore, the description thereof is omitted here.

  FIG. 8 is a plan view showing first and second internal connection conductors that can be employed in the multilayer ceramic capacitor according to the third embodiment of the present invention. FIG. 9 is a plan view showing the first and second internal connection conductors shown in FIG. FIG. 10 is a plan view showing first to eighth internal electrodes that can be used with the internal connection conductor, and FIG. 10 is an equivalent circuit diagram of the multilayer ceramic capacitor according to the third embodiment of the present invention.

  8 to 10, the multilayer ceramic capacitor according to the third embodiment of the present invention is formed in the ceramic body 110 and has a first side surface, like the multilayer ceramic capacitor according to the first embodiment. A third capacitor portion including a fifth internal electrode 11 exposed at 3 and a sixth internal electrode 12 exposed at the second side surface 4, and a third capacitor portion including a seventh internal electrode 13 and an eighth internal electrode 14. 4 capacitor portions, wherein the fifth internal electrode 11 and the seventh internal electrode 13 are formed to be separated from each other in one layer in the cross section in the length-width direction of the ceramic body 110, and The inner electrode 12 and the eighth inner electrode 14 may be formed separately from each other in another layer in the cross section in the length-width direction of the ceramic body 110.

  In another embodiment of the present invention, the fifth internal electrode 11 is connected to the first external electrode 131, the sixth internal electrode 12 is connected to the third external electrode 133, and the seventh internal electrode is connected. The electrode 13 may be connected to the second external electrode 132, and the eighth internal electrode 14 may be connected to the fourth external electrode 134.

  In the third embodiment of the present invention, the lead 121 ″ a of the first internal electrode is connected to the first external electrode 131, and the lead 122 ″ a of the second internal electrode is connected to the third external electrode 131. The third internal electrode lead 123 ″ a is connected to the second external electrode 132, and the fourth internal electrode lead 124 ″ a is connected to the fourth external electrode 134. Can be linked.

  In the third embodiment of the present invention, the first inner connecting conductor 125 '' is connected to the first inner electrode 121 '' via the first outer electrode 131, and the fourth outer electrode 134 is connected to the first inner electrode 121 ''. And the fourth inner electrode 124 ''.

  In the third embodiment of the present invention, the second inner connecting conductor 126 ″ is connected to the second inner electrode 122 ″ through the third outer electrode 133, and the second outer electrode 132 is connected to the second inner electrode 132 ″. The third internal electrode 123 ″ may be connected to the third internal electrode 123 ″.

  Referring to FIG. 10, the first and second inner connection conductors 125 ″ and 126 ″ may be connected in parallel to each other.

  In addition, the first to fourth capacitor units may be connected in parallel to each other.

  In addition, a first capacitor unit including the first internal electrode 121 ″ and the second internal electrode 122 ″, and a second capacitor unit including the third internal electrode 123 ″ and the fourth internal electrode 124 ″. The capacitor section, the third capacitor section including the fifth internal electrode 11 and the sixth internal electrode 12, and the fourth capacitor section including the seventh internal electrode 13 and the eighth internal electrode 14 are the first And the second inner connecting conductors 125 ″ and 126 ″.

  In addition, the characteristics of the multilayer ceramic capacitor according to the third embodiment of the present invention are the same as the characteristics of the multilayer ceramic capacitor according to the first embodiment of the present invention described above.

  FIG. 11 is a perspective view of a multilayer ceramic capacitor according to a fourth embodiment of the present invention, and FIG. 12 is a plan view showing first to fourth internal connecting conductors that can be employed in the multilayer ceramic capacitor shown in FIG. FIG. 13 is a plan view showing first to eighth internal electrodes that can be used with the first to fourth internal connection conductors shown in FIG. 12, and FIG. 14 is a stacked view shown in FIG. It is an equivalent circuit diagram of a ceramic capacitor.

  Referring to FIGS. 11 to 14, a multilayer ceramic capacitor 200 according to the fourth embodiment of the present invention includes a plurality of dielectric layers 211, opposed first and second principal surfaces 5 and 6, opposed first and second main surfaces 5 and 6. A ceramic body 210 having first and second side faces 3 and 4 and opposing first and second end faces 1 and 2; and the length of the ceramic body 210 exposed to the first side face 3 in the ceramic body 210; The first, third, fifth, and seventh inner electrodes 221, 223, 225, 227 and the second side surface 4 that are formed to be separated from each other in one layer in the cross-section in the width direction; Second, fourth, sixth, and eighth internal electrodes 222, 224, 226, 228 formed in separate layers in the length-width section of the ceramic body 210, and the ceramic body Formed in 210 The first to fourth inner connecting conductors 241, 242, 243, 244 exposed on the first and second side surfaces 3, 4 and the first and second side surfaces 3, 4 of the ceramic body 210 are formed. The first to eighth inner electrodes 221, 222, 223, 224, 225, 226, 227, 228 and the first to fourth inner connection conductors 241, 242, 243, 244 are electrically connected to the first to eighth inner electrodes 221, 222, 223, 224, 225, 226, 227, 228. 1 to 8 external electrodes 231, 232, 233, 234, 235, 236, 237, 238, and the first and second internal electrodes 221 and 222 and the third and fourth internal electrodes 223. 224 and the fifth and sixth inner electrodes 225 and 226 and the seventh and eighth inner electrodes 227 and 228 form first, second, third and fourth capacitor portions, respectively. Capacitor part and the above Are connected in series with the first and second inner connecting conductors 241 and 242, respectively, and the third capacitor section and the fourth capacitor section are the third and fourth inner connecting conductors 243, A multilayer ceramic capacitor connected in series with 244 is provided.

  In the fourth embodiment of the present invention, the first to fourth external electrodes 231, 232, 233, 234 are spaced apart from each other on the first side surface 3 of the ceramic body, and the fifth to eighth The external electrodes 235, 236, 237, and 238 may be spaced apart from each other on the second side surface 4 of the ceramic body.

  In the fourth embodiment of the present invention, the mounting surface of the multilayer ceramic capacitor 200 is the first or second side surface 3 or 4 of the ceramic body 210.

  In the fourth embodiment of the present invention, the first, third, fifth, seventh, second, fourth, sixth and eighth internal electrodes 221, 223, 225, 227, 222, 224, 226 are provided. 228 may be sequentially connected to the first to eighth external electrodes 231, 232, 233, 234, 235, 236, 237, and 238, respectively.

  In the fourth embodiment of the present invention, the first inner connecting conductor 241 is connected to the first inner electrode 221 through the first outer electrode 231, and is connected to the first inner electrode 221 through the sixth outer electrode 236. The fourth internal electrode 224 may be connected.

  In the fourth embodiment of the present invention, the second inner connecting conductor 242 is connected to the second inner electrode 222 through a fifth outer electrode 235, and the second inner connecting conductor 242 is connected to the second inner electrode 222 through the second outer electrode 232. The third internal electrode 223 may be connected.

  In the fourth embodiment of the present invention, the third inner connecting conductor 243 is connected to the fifth inner electrode 225 via a third outer electrode 233 and is connected to the fifth inner electrode 238 via an eighth outer electrode 238. The eighth internal electrode 228 may be connected.

  In the fourth embodiment of the present invention, the fourth inner connecting conductor 244 is connected to the sixth inner electrode 226 via a seventh outer electrode 237 and is connected to the sixth inner electrode 234 via the fourth outer electrode 234. The seventh internal electrode 227 may be connected.

  Referring to FIG. 14, the first and second inner connecting conductors 241 and 242 and the third and fourth inner connecting conductors 243 and 244 may be connected in parallel to each other.

  In addition, the first to fourth capacitor units may be connected in parallel to each other.

  In addition, the first capacitor part including the first internal electrode 221 and the second internal electrode 222, and the second capacitor part including the third internal electrode 223 and the fourth internal electrode 224 include the first capacitor part. The first and second inner connecting conductors 241 and 242 may be connected in series.

  The third capacitor portion including the fifth internal electrode 225 and the sixth internal electrode 226, and the fourth capacitor portion including the seventh internal electrode 227 and the eighth internal electrode 228 are the third and the third capacitor portions. The fourth inner connection conductors 243 and 244 may be connected in series.

  In addition, the characteristics of the multilayer ceramic capacitor according to the fourth embodiment of the present invention are the same as the characteristics of the multilayer ceramic capacitor according to the first embodiment of the present invention described above.

  FIG. 15 is a perspective view of a multilayer ceramic capacitor according to a fifth embodiment of the present invention, and FIG. 16 is a plan view showing first to third internal connecting conductors that can be employed in the multilayer ceramic capacitor shown in FIG. 17 is a plan view showing first to fourth internal electrodes that can be used with the first to third internal connection conductors shown in FIG. 16, and FIG. 18 is a laminate view shown in FIG. It is an equivalent circuit diagram of a ceramic capacitor.

  Referring to FIGS. 15 to 18, a multilayer ceramic capacitor 300 according to the fifth embodiment of the present invention includes a plurality of dielectric layers 311, opposed first and second principal surfaces 5, 6, opposed first layers. A ceramic body 310 having first and second side surfaces 3 and 4 and opposing first and second end surfaces 1 and 2, and a lead 321a formed in the ceramic body 310 and exposed to the second side surface 4; A first capacitor portion including a second internal electrode 322 having a first internal electrode 321 and a lead 322a exposed on the first side surface 3, and a lead of the first internal electrode exposed on the second side surface 4 A third internal electrode 323 having a lead 323a spaced apart from 321a and a fourth internal electrode 324 having a lead 324a exposed at the first side surface 3 and spaced from the lead 322a of the second internal electrode are included. Capacitor portions, first to third inner connecting conductors 325, 326, and 327 formed in the ceramic body 310 and exposed to the first and second side surfaces 3 and 4, and the first ceramic body 310 first. And are electrically connected to the first to fourth inner electrodes 321, 322, 323, 324 and the first to third inner connecting conductors 325, 326, 327. First to sixth external electrodes 331, 332, 333, 334, 335, 336, and the first capacitor unit is connected in series with the first and second internal connection conductors 325, 326, The second capacitor unit provides a multilayer ceramic capacitor connected in series with the second and third inner connecting conductors 326 and 327.

  In the fifth embodiment of the present invention, the first to third external electrodes 331, 332, and 333 are spaced apart from each other on the first side surface 3 of the ceramic body, and the fourth to sixth external electrodes are disposed. The electrodes 334, 335, 336 may be spaced apart from each other on the second side surface 4 of the ceramic body.

  In the fifth embodiment of the present invention, the mounting surface of the multilayer ceramic capacitor 300 is the first or second side surface 3 or 4 of the ceramic body.

  In the fifth embodiment of the present invention, the lead 321a of the first internal electrode is connected to the fourth external electrode 334, the lead 322a of the second internal electrode is connected to the second external electrode 332, The third internal electrode lead 323a may be connected to the fifth external electrode 335, and the fourth internal electrode lead 324a may be connected to the third external electrode 333.

  In the fifth embodiment of the present invention, the first inner connecting conductor 325 is connected to the first outer electrode 331 and is connected to the first inner electrode 321 through the fourth outer electrode 334. Can.

  In the fifth embodiment of the present invention, the second internal connection conductor 326 is connected to the second internal electrode 322 through a second external electrode 332, and the above-mentioned through the fifth external electrode 335. The third internal electrode 323 may be connected.

  In the fifth embodiment of the present invention, the third internal connection conductor 327 is connected to the sixth external electrode 336 and is connected to the fourth internal electrode 324 through the third external electrode 333. Can.

  Referring to FIG. 18, the first to third inner connecting conductors 325, 326, and 327 may be connected in parallel to each other.

  In addition, the first capacitor unit including the first internal electrode 221 and the second internal electrode 222 may be connected in series with the first and second internal connection conductors 325 and 326.

  In addition, the second capacitor unit including the third internal electrode 223 and the fourth internal electrode 224 may be connected in series with the second and third internal connection conductors 326 and 327.

  The other features of the multilayer ceramic capacitor according to the fifth embodiment of the present invention are the same as the features of the multilayer ceramic capacitor according to the first embodiment of the present invention described above.

Mounting Board of Multilayer Ceramic Capacitor FIG. 19 is a perspective view showing a state in which the multilayer ceramic capacitor of FIG. 1 is mounted on a printed circuit board.

  Referring to FIG. 19, the mounting substrate 400 of the multilayer ceramic capacitor 100 according to the present embodiment is formed on the upper surface of the printed circuit board 410 and the printed circuit board 410 on which the multilayer ceramic capacitor 100 is vertically mounted. First and second electrode pads 421, 422.

  At this time, the multilayer ceramic capacitor 100 is printed circuit board by soldering 430 in a state where the third and fourth external electrodes 131 and 132 are positioned on the first and second electrode pads 421 and 422, respectively. 410 can be electrically connected.

  In addition, the description which overlaps with the characteristic of the multilayer ceramic capacitor by the 1st Embodiment of this invention mentioned above is abbreviate | omitted.

  FIG. 20 is a graph comparing impedances of an example of the present invention and a comparative example.

  Referring to FIG. 20, the multilayer ceramic capacitor according to the embodiment of the present invention has a flat impedance in a wider frequency range than the comparative example, which is a conventional multilayer ceramic capacitor, and the impedance (Impedance). ).

  The embodiment of the present invention has been described in detail above, but the scope of the present invention is not limited to this, and various modifications and variations can be made without departing from the technical idea of the present invention described in the claims. It will be apparent to those having ordinary knowledge in the art.

100, 200, 300 Multilayer ceramic capacitors 110, 210, 310 Ceramic bodies 111, 211, 311 Dielectric layers 121 (121 ′, 121 ″), 122 (122 ′, 122 ″), 123 (123 ′, 123 ′ '), 124 (124', 124 ''), 221, 222, 223, 224, 321, 322, 322, 323, 324 1st to 4th internal electrodes 11, 12, 13, 14, 225, 226, 227, 228 Fifth to eighth inner electrodes 125 (125 ′, 125 ″), 126 (126 ′, 126 ″) First and second inner connecting conductors 241, 242, 243, 244 First to fourth Internal connection conductors 121a (121′a, 121 ″ a), 122a (122′a, 122 ″ a), 123a (123′a, 123 ″ a), 124a (124′a, 124 ″ a) 221 a, 222a, 223a, 224a, 225a, 226a, 227a, 228a, 321a, 322a, 323a, 324a Leads 131, 132, 133, 134 First to fourth external electrodes 231, 232, 233, 234, 235, 236 237, 238 First to eighth external electrodes 331, 332, 333, 334, 335, 336 First to sixth external electrodes 400 Mounting board 410 Printed circuit board 421, 422 First and second electrode pads 430 Soldering

Claims (13)

A ceramic body including a plurality of dielectric layers and having opposing first and second main faces, opposing first and second side faces and opposing first and second end faces;
A first capacitor unit including a first internal electrode formed in the ceramic body and having a lead exposed on the first side surface; and a second internal electrode having a lead exposed on the second side surface; A third internal electrode having a lead exposed on the side surface of the first internal electrode and spaced apart from the lead of the first internal electrode; and a fourth internal electrode having a lead exposed on the second side surface and spaced from the lead of the second internal electrode. A second capacitor portion including an electrode;
First and second inner connecting conductors formed in the ceramic body and exposed on first and second side surfaces;
First to fourth external electrodes formed on the first and second side surfaces of the ceramic body and electrically connected to the first to fourth internal electrodes and the first and second internal connection conductors; ,
Including
The first capacitor unit and the first inner connecting conductor are connected in series, the second capacitor unit and the second inner connecting conductor are connected in series ,
The lead of the first internal electrode is connected to the first external electrode, the lead of the second internal electrode is connected to the fourth external electrode, and the lead of the third internal electrode is connected to the second external electrode Connected to an electrode, and the lead of the fourth internal electrode is connected to a third external electrode,
The first internal connection conductor is connected to the first internal electrode via a first external electrode, and is connected to the fourth internal electrode via a third external electrode;
Said second internal connecting conductors, the fourth is connected to the second internal electrodes through the external electrodes, via the second external electrodes Ru is connected to the third internal electrode, a multilayer ceramic capacitor.   The first and second external electrodes are spaced apart from each other on the first side of the ceramic body, and the third and fourth external electrodes are spaced apart from each other on the second side of the ceramic body. The multilayer ceramic capacitor according to claim 1, wherein   The multilayer ceramic capacitor according to claim 1, wherein a mounting surface of the multilayer ceramic capacitor is the first or second side surface of the ceramic body.   The first internal electrode and the third internal electrode are formed to be separated from each other in one layer in a cross section in the length-width direction of the ceramic body, and the second internal electrode and the fourth internal electrode are The multilayer ceramic capacitor of claim 1, wherein the multilayer ceramic capacitor is formed to be separated from each other in another layer in a length-width cross section of the ceramic body. A third capacitor portion formed in the ceramic body and including a fifth internal electrode exposed on the first side surface and a sixth internal electrode exposed on the second side surface, and a seventh internal electrode and an eighth internal electrode A fourth capacitor portion including internal electrodes of
The fifth internal electrode and the seventh internal electrode are formed to be separated from each other in one layer in a cross section in the length-width direction of the ceramic body, and the sixth internal electrode and the eighth internal electrode are The multilayer ceramic capacitor according to claim 4 , wherein the multilayer ceramic capacitor is formed to be separated from each other in another layer in a cross section in the length-width direction of the ceramic body. The fifth internal electrode is connected to a first external electrode, the sixth internal electrode is connected to a third external electrode, the seventh internal electrode is connected to the second external electrode, and The multilayer ceramic capacitor of claim 5 , wherein the eighth inner electrode is connected to the fourth outer electrode. A ceramic body including a plurality of dielectric layers and having opposing first and second main faces, opposing first and second side faces and opposing first and second end faces;
First, third, fifth, and seventh internal electrodes that are exposed on the first side surface in the ceramic body and are separated from each other in one layer in a cross section in the length-width direction of the ceramic body. And second, fourth, sixth, and eighth internal electrodes that are exposed on the second side surface and are spaced apart from each other in another cross-section in the length-width direction of the ceramic body. ,
First to fourth inner connecting conductors formed in the ceramic body and exposed on the first and second side surfaces;
First to eighth external electrodes formed on the first and second side surfaces of the ceramic body and electrically connected to the first to eighth internal electrodes and the first to fourth internal connection conductors; ,
Including
The first and second internal electrodes, the third and fourth internal electrodes, the fifth and sixth internal electrodes, and the seventh and eighth internal electrodes are respectively the first, second, third, and third. 4 capacitor portions, the first capacitor portion and the first internal connection conductor are connected in series, the second capacitor portion and the second internal connection conductor are connected in series, 3 capacitor portions and the third inner connecting conductor are connected in series, the fourth capacitor portion and the fourth inner connecting conductor are connected in series ,
The first, third, fifth, seventh, second, fourth, sixth and eighth internal electrodes are connected to the first to eighth external electrodes, respectively;
The first internal connection conductor is connected to the first internal electrode via a first external electrode, and connected to the fourth internal electrode via a sixth external electrode;
The second internal connection conductor is connected to the second internal electrode via a fifth external electrode, and is connected to the third internal electrode via a second external electrode;
The third internal connection conductor is connected to the fifth internal electrode through a third external electrode, and is connected to the eighth internal electrode through an eighth external electrode,
It said fourth internal connection conductor is connected to the through seventh external electrode of the sixth internal electrodes, Ru is connected to the through fourth external electrode seventh internal electrode of multilayer ceramic capacitors. The first to fourth external electrodes are spaced apart from each other on the first side surface of the ceramic body, and the fifth to eighth external electrodes are spaced apart from each other on the second side surface of the ceramic body. The multilayer ceramic capacitor according to claim 7 . The multilayer ceramic capacitor according to claim 7 , wherein a mounting surface of the multilayer ceramic capacitor is a first side surface or a second side surface of the ceramic body. A ceramic body including a plurality of dielectric layers and having opposing first and second main faces, opposing first and second side faces and opposing first and second end faces;
A first capacitor portion including a first internal electrode formed in the ceramic body and having a lead exposed on a second side surface; and a second internal electrode having a lead exposed on the first side surface; A third internal electrode having a lead exposed on the side surface of the first internal electrode and spaced apart from the lead of the first internal electrode; and a fourth internal electrode having a lead exposed on the first side surface and spaced apart from the lead of the second internal electrode. A second capacitor portion including an electrode;
First to third inner connecting conductors formed in the ceramic body and exposed on the first and second side surfaces;
First to sixth external electrodes formed on the first and second side surfaces of the ceramic body and electrically connected to the first to fourth internal electrodes and the first to third internal connection conductors; ,
Including
The first capacitor unit is connected in series with the first and second inner connecting conductors, and the second capacitor unit is connected in series with the second and third inner connecting conductors ,
The lead of the first internal electrode is connected to a fourth external electrode, the lead of the second internal electrode is connected to a second external electrode, and the lead of the third internal electrode is connected to the fifth external electrode Connected to an electrode, and the lead of the fourth internal electrode is connected to a third external electrode,
The first internal connection conductor is connected to the first external electrode, and is connected to the first internal electrode via a fourth external electrode,
The second internal connection conductor is connected to the second internal electrode via a second external electrode, and is connected to the third internal electrode via a fifth external electrode,
The third internal connection conductor, the sixth is connected to the external electrode of Ru is connected to the through third external electrode fourth internal electrodes, the multilayer ceramic capacitor. The first to third external electrodes are spaced apart from each other on the first side surface of the ceramic body, and the fourth to sixth external electrodes are spaced apart from each other on the second side surface of the ceramic body. The multilayer ceramic capacitor according to claim 10 , wherein The multilayer ceramic capacitor according to claim 10 , wherein a mounting surface of the multilayer ceramic capacitor is a first or second side surface of the ceramic body. A printed circuit board having first and second electrode pads thereon;
The multilayer ceramic capacitor according to any one of claims 1 to 12 , which is installed on the printed circuit board;
A mounting substrate for a multilayer ceramic capacitor.

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