CN104103711A - Wafer arranging apparatus and adjusting method thereof - Google Patents

Wafer arranging apparatus and adjusting method thereof Download PDF

Info

Publication number
CN104103711A
CN104103711A CN201310122693.7A CN201310122693A CN104103711A CN 104103711 A CN104103711 A CN 104103711A CN 201310122693 A CN201310122693 A CN 201310122693A CN 104103711 A CN104103711 A CN 104103711A
Authority
CN
China
Prior art keywords
silicon chip
support plate
conveyer belt
portal frame
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310122693.7A
Other languages
Chinese (zh)
Other versions
CN104103711B (en
Inventor
韩盼盼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing North Microelectronics Co Ltd
Original Assignee
Beijing North Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing North Microelectronics Co Ltd filed Critical Beijing North Microelectronics Co Ltd
Priority to CN201310122693.7A priority Critical patent/CN104103711B/en
Publication of CN104103711A publication Critical patent/CN104103711A/en
Application granted granted Critical
Publication of CN104103711B publication Critical patent/CN104103711B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The embodiments of the invention belong to the technical field of semiconductor wafer processing, and disclose a wafer arranging apparatus and an adjusting method thereof, for solving the technical problem of affected production efficiency of crystalline silicon solar cells due to a quite complex method for adjusting a wafer overlapping problem. The water arranging apparatus comprises a loading bench, a conveyer belt and a portal frame. The loading bench is used for bearing a support plate, and the support plate is provided with a plurality of wafer grooves for arranging silicon wafers therein; the loading bench is provided with at least three positioning devices for adjusting and fixing the position of the support plate from at least three directions; the conveyer belt is disposed at one side of the loading bench for conveying the silicon wafers to be arranged; and the portal frame is used for arranging the silicon wafers on the conveyer belt on the support plate. The adjudging method comprises: when the silicon wafers are deviated from the wafer grooves, obtaining deviation distances of the silicon wafers; and according to the deviation distances of the silicon wafers, adjusting the positions of the support plate, the conveyer belt or the portal frame. The apparatus and the method provided by the invention are applied to a PECVD system for manufacturing the crystalline silicon solar cells.

Description

Pendulum device and method of adjustment thereof
Technical field
The invention belongs to processing technology of semiconductor wafer field, be specifically related to a kind of pendulum device and method of adjustment thereof.
Background technology
Along with the development of heliotechnics, crystal silicon solar batteries, as emerging clean reproducible energy, has obtained application more and more widely.The manufacture of crystal silicon solar batteries need to utilize plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) system, silicon chip is in PECVD system, first to silicon chip be put to (pendulum process) in the support plate on loading stage from conveyer belt by portal frame, then enter preheating cavity in PECVD system, process cavity, cooling chamber, relieving platform etc. and process.The gripper cylinder arranging on loading stage can be fixed on support plate on loading stage, and on support plate, be provided with several for putting the film trap of silicon chip, the size of film trap almost equates with silicon chip, should be fast in pendulum process, accurately silicon chip is placed in film trap, to guarantee efficiency and the quality of follow-up coating process.
The inventor finds in realizing process of the present invention, and prior art at least exists following problem: in actual production process, may occur that silicon chip departs from film trap, and cause silicon chip to ride over the phenomenon on the edge of film trap, i.e. butt strip phenomenon.The main cause of butt strip phenomenon is that gripper cylinder is inhomogeneous to the application of force of support plate, and makes the position of support plate produce skew.At present, can only support plate be reorientated by manual adjustments gripper cylinder, to adjust butt strip problem, but the dynamics of manual adjustments gripper cylinder is difficult to hold, sometimes also need gripper cylinder to unload down and reinstall, lose time so very much, the therefore method more complicated of existing adjustment butt strip problem, affects the production efficiency of crystal silicon solar batteries.
Summary of the invention
The embodiment of the present invention provides a kind of pendulum device and method of adjustment thereof, has solved the method more complicated of existing adjustment butt strip problem, affects the technical problem of the production efficiency of crystal silicon solar batteries.
For achieving the above object, embodiments of the invention adopt following technical scheme:
The invention provides a kind of pendulum device, comprise loading stage, conveyer belt and portal frame;
Described loading stage is used for carrying support plate, is provided with several for putting the film trap of silicon chip on described support plate;
On described loading stage, be provided with at least three locators, for regulate and fix the position of described support plate from least three directions;
Described conveyer belt is positioned at a side of described loading stage, for transmitting silicon chip to be put;
Described portal frame is for putting described support plate by the silicon chip on described conveyer belt.
Further, this pendulum device also comprises feeding platform and manipulator;
Described feeding platform is for placing the magazine that silicon chip is housed;
Described manipulator is used for the silicon chip extracting of described magazine and is placed on described conveyer belt.
Preferably, described locator is servomotor.
Preferably, the quantity of described locator is three, and these three locators are arranged at respectively front side, left side, the rear side of described loading stage.
The present invention also provides a kind of method of adjustment based on above-mentioned pendulum device, comprising:
When silicon chip departs from film trap,
Obtain the distance that described silicon chip departs from;
The distance departing from according to described silicon chip, the position of adjusting support plate, conveyer belt or portal frame.
Further, described obtain the distance that described silicon chip departs from before, also comprise:
The reason that judgement causes described silicon chip to depart from;
The distance departing from according to described silicon chip, the position of adjusting support plate, conveyer belt or portal frame, is specially:
The reason departing from according to described silicon chip and distance, the position of adjusting support plate, conveyer belt or portal frame.
Compared with prior art, technique scheme tool provided by the present invention has the following advantages: because support plate is to be fixed on loading stage from least three directions by least three locators, and can regulate very easily and the fixing position of support plate by locator, so while there is butt strip phenomenon in pendulum process, staff just can be after obtaining the distance that silicon chip departs from, according to the real-time manual adjustments support plate of this distance, the position of conveyer belt or portal frame, thereby can be simple, solve efficiently butt strip problem, improve the production efficiency of crystal silicon solar batteries.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below.
The structural representation of the pendulum device that Fig. 1 provides for embodiments of the invention;
The flow chart of the method for adjustment that Fig. 2 provides for embodiments of the invention;
Another flow chart of the method for adjustment that Fig. 3 provides for embodiments of the invention;
Fig. 4 a and Fig. 4 b are the silicon chip schematic diagram that direction departs from forwards, backwards in embodiments of the invention;
Fig. 5 a and Fig. 5 b are the silicon chip schematic diagram that direction departs to the left and right in embodiments of the invention;
Fig. 6 a to Fig. 6 d is the schematic diagram that in embodiments of the invention, silicon chip departs to oblique direction.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.
As shown in Figure 1, the pendulum device that the embodiment of the present invention provides, comprises loading stage 1, conveyer belt 2 and portal frame 3.Loading stage 1, for carrying support plate 4, is provided with several for putting the film trap 40 of silicon chip 41 on support plate 4; On loading stage 1, be provided with at least three locators, for regulating from least three directions and the fixing position of support plate.As a preferred version, in the present embodiment, the quantity of locator is three, and the first locator 11 wherein, the second locator 12, the 3rd locator 13 are arranged at respectively front side, left side, the rear side of loading stage 1, namely from the place ahead, left, three, rear direction exert pressure to support plate 4, to fix the position of support plate 4.
The pendulum device that the embodiment of the present invention provides further comprises feeding platform 5 and manipulator (not shown).Feeding platform 5 is for placing the magazine 6 that silicon chip 41 is housed, and manipulator is for taking out the silicon chip of magazine 6 41 be placed on the conveyer belt 2 in loading stage 1 left side.The silicon chip 41 of portal frame 3 for putting on the conveyer belt 2 of taking, and silicon chip 41 is put in the film trap 40 of support plate 4.
Preferably, the locator in the embodiment of the present invention is servomotor, and certainly in other embodiments, locator also can adopt other can facilitate the control device of adjusting position.
The present invention also provides the method for adjustment based on above-mentioned pendulum device, to adjust the problem of butt strip.As shown in Figure 2, this method of adjustment comprises:
When silicon chip departs from film trap, while there is butt strip phenomenon, obtain the distance that silicon chip departs from, certainly wherein also comprise the direction that silicon chip departs from.
Then, the distance departing from according to obtained silicon chip and direction, the position of adjusting support plate, conveyer belt or portal frame.
Further, before obtaining the distance that silicon chip departs from, can also comprise the reason that judgement causes silicon chip to depart from.As shown in Figure 3, this method of adjustment comprises:
When there is butt strip phenomenon, judgement causes the reason of butt strip.Specifically can judge according to the direction of butt strip and deviation distance:
Conventionally by conveyer belt or portal frame, cause the deviation distance of butt strip very little, and the butt strip being caused by conveyer belt normally silicon chip 41 with respect to film trap 40, depart from forward or backward (as shown in Fig. 4 a and Fig. 4 b), the butt strip being caused by portal frame normally silicon chip 41 departs from (as shown in Fig. 5 a and Fig. 5 b) to the left or to the right with respect to film trap 40.If the butt strip being caused by support plate skew, the distance departing from is conventionally larger, and silicon chip 41 often with respect to film trap 40 to oblique departing from (as shown in Fig. 6 a-Fig. 6 d).
After judging the reason that causes butt strip, then obtain distance and the direction that silicon chip departs from.
Then, the reason departing from according to silicon chip, distance and direction, the position of adjusting support plate, conveyer belt or portal frame.
For example, when silicon chip departs to left front, support plate should be adjusted to right back.Can in controlling software, be inputted by staff the first locator and the 3rd locator mobile distance backward, then input the distance that the second locator moves right, then just can be by the position of three locators adjusting support plates, and support plate is fixed.The distance that each locator regulates support plate is conventionally within 1 to 6 millimeter.
And for example, the distance that departs from backward and depart from when silicon chip hour, is only adjusted forward the position of conveyer belt.By staff's distance that entrance conveyor is transmitted forward in controlling software, then regulate conveyer belt just can solve the problem of butt strip according to inputted transmission range.Or the distance that departs to the right and depart from when silicon chip hour, is only adjusted the position of portal frame left.Staff inputs the distance that portal frame is moved to the left in controlling software, more just can solve the problem of butt strip according to inputted displacement mobile gantry frame.
It should be noted that in other execution modes of the present invention, can the position of three locators be changed according to actual conditions, such as three locators being separately positioned on to left side, rear side, the right side of loading stage.Or, four locater can also be set, lay respectively on the four direction all around of support plate.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.

Claims (6)

1. a pendulum device, is characterized in that: comprise loading stage, conveyer belt and portal frame;
Described loading stage is used for carrying support plate, is provided with several for putting the film trap of silicon chip on described support plate;
On described loading stage, be provided with at least three locators, for regulate and fix the position of described support plate from least three directions;
Described conveyer belt is positioned at a side of described loading stage, for transmitting silicon chip to be put;
Described portal frame is for putting described support plate by the silicon chip on described conveyer belt.
2. pendulum device according to claim 1, is characterized in that: also comprise feeding platform and manipulator;
Described feeding platform is for placing the magazine that silicon chip is housed;
Described manipulator is used for the silicon chip extracting of described magazine and is placed on described conveyer belt.
3. pendulum device according to claim 1, is characterized in that: described locator is servomotor.
4. pendulum device according to claim 1, is characterized in that: the quantity of described locator is three, and these three locators are arranged at respectively front side, left side, the rear side of described loading stage.
5. the method for adjustment based on pendulum device claimed in claim 1, is characterized in that, comprising:
When silicon chip departs from film trap,
Obtain the distance that described silicon chip departs from;
The distance departing from according to described silicon chip, the position of adjusting support plate, conveyer belt or portal frame.
6. method of adjustment according to claim 5, is characterized in that, described obtain the distance that described silicon chip departs from before, also comprise:
The reason that judgement causes described silicon chip to depart from;
The distance departing from according to described silicon chip, the position of adjusting support plate, conveyer belt or portal frame, is specially:
The reason departing from according to described silicon chip and distance, the position of adjusting support plate, conveyer belt or portal frame.
CN201310122693.7A 2013-04-10 2013-04-10 Pendulum device and method of adjustment thereof Active CN104103711B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310122693.7A CN104103711B (en) 2013-04-10 2013-04-10 Pendulum device and method of adjustment thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310122693.7A CN104103711B (en) 2013-04-10 2013-04-10 Pendulum device and method of adjustment thereof

Publications (2)

Publication Number Publication Date
CN104103711A true CN104103711A (en) 2014-10-15
CN104103711B CN104103711B (en) 2016-08-31

Family

ID=51671689

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310122693.7A Active CN104103711B (en) 2013-04-10 2013-04-10 Pendulum device and method of adjustment thereof

Country Status (1)

Country Link
CN (1) CN104103711B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114322853A (en) * 2021-12-31 2022-04-12 上海果纳半导体技术有限公司 Air-floating platform dynamic levelness detection method and wafer transmission system applying same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864659A (en) * 1994-06-03 1996-03-08 Lg Semicon Co Ltd Transfer apparatus for semiconductor device
KR20090019984A (en) * 2007-08-22 2009-02-26 세크론 주식회사 Apparatus for adjusting pitch of buffer tray and apparatus for transferring semiconductor devices using the buffer tray
CN102299196A (en) * 2010-06-28 2011-12-28 北京北方微电子基地设备工艺研究中心有限责任公司 Carrying board positioning device and positioning method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864659A (en) * 1994-06-03 1996-03-08 Lg Semicon Co Ltd Transfer apparatus for semiconductor device
KR20090019984A (en) * 2007-08-22 2009-02-26 세크론 주식회사 Apparatus for adjusting pitch of buffer tray and apparatus for transferring semiconductor devices using the buffer tray
CN102299196A (en) * 2010-06-28 2011-12-28 北京北方微电子基地设备工艺研究中心有限责任公司 Carrying board positioning device and positioning method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114322853A (en) * 2021-12-31 2022-04-12 上海果纳半导体技术有限公司 Air-floating platform dynamic levelness detection method and wafer transmission system applying same

Also Published As

Publication number Publication date
CN104103711B (en) 2016-08-31

Similar Documents

Publication Publication Date Title
EP2352163B1 (en) Scribing apparatus for thin film solar cells
CN102132378B (en) Laser material removal methods and apparatus
US20150340725A1 (en) Double-folding device for softly-packaged lithium ion batteries
SG11201807215RA (en) Chip bonding apparatus and method
KR20190019019A (en) Method and device for soldering hetero-junction with intrinsic thin-film solar cells together to form string
ITUD20090129A1 (en) SUBSTRATE PROCESSING SYSTEM
CN203345713U (en) Pole lug deviation rectification device
MX359183B (en) Method and system for improving solar cell manufacturing yield.
US20180315633A1 (en) Workpiece conveyance apparatus, semiconductor manufacturing apparatus, and workpiece conveyance method
TW200730450A (en) Apparatus and method for scribing substrate using synchronized multi-axis
CN104103711A (en) Wafer arranging apparatus and adjusting method thereof
CN109742182B (en) Battery piece scribing and visual positioning method before printing
CN102768973B (en) Laser auxiliary device for ion injection and using method for laser auxiliary device
TW201414561A (en) Laser scribing system
CN105390415A (en) Adhesive band peeling method and adhesive band peeling device
CN201960677U (en) Fixture for directionally processing sapphire crystal
KR20180084440A (en) Apparatus for loading Wire in Tabbing Machine
US10941011B2 (en) Exposure machine and method of transferring a substrate of same
CN104979228A (en) Film thickness control method and semiconductor processing device
JP2010089142A (en) Apparatus and method of processing workpiece by laser
CN106104819A (en) In the device producing printing on solar cell substrate and the method transmitting this substrate
CN103100798B (en) Laser machining equipment of shell nosing nut
CN110273142B (en) Silicon wafer alignment device and method
CN103579058B (en) A kind of method of multiple batches of continuous operation
CN103594392A (en) Wafer rapid thermal processing machine platform

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 100176 No. 8, Wenchang Avenue, Beijing economic and Technological Development Zone

Patentee after: Beijing North China microelectronics equipment Co Ltd

Address before: 100026 Jiuxianqiao East Road, Chaoyang District, building, No. 1, M5

Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing