CN104100950B - Assembled radiator - Google Patents
Assembled radiator Download PDFInfo
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- CN104100950B CN104100950B CN201410385402.8A CN201410385402A CN104100950B CN 104100950 B CN104100950 B CN 104100950B CN 201410385402 A CN201410385402 A CN 201410385402A CN 104100950 B CN104100950 B CN 104100950B
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Abstract
The invention relates to an assembled radiator. The assembled radiator comprises a heat conducting main body, a heat dissipating main body and a plurality of heat transfer main body. The heat conducting main body comprises a plurality of heat conducting parts with first threaded holes and a plurality of transition parts; all the heat conducting parts are formed into an integrated structure by use of the transition parts. The heat dissipating main body comprises a plurality of heat dissipating pieces with second threaded holes and a plurality of connector clips; each connector clip comprises a screw joint part in screwed connection with the corresponding threaded hole and a clamping part. The heat transfer main body comprises screw joint parts for threaded connection with the first threaded holes, locking parts for engagement with the clamping parts, and connecting parts. The assembled radiator has the advantages that the heat dissipating pieces functioning in dissipating heat can be correspondingly replaced and combined according to the heat generated by an LED (Light Emitting Diode) lamp by use of the detachably threaded connection of the connector clips and the heat dissipating pieces, and the effects of flexible disassembling, assembling and changing are achieved; besides, the assembled radiator is easy to assemble and repair due to the engagement of the connector clips and the heat transfer main body. In addition, the assembled radiator is improved in heat dissipating path, and thus relatively high in heat dissipation property and good in heat conducting property.
Description
Technical field
The present invention relates to LED lamp radiator field, more particularly to a kind of modular radiator.
Background technology
Led (light emitting diode, light emitting diode), it can directly and efficiently convert electrical energy into visible
Light, and have the service life up to tens thousand of hours～100,000 hour.It is widely used in landscape, safety, special type and common photograph
The field such as bright, market potential is beyond measure.
LED lamp is to be referred to as the most frequently used lighting the advantages of of fine quality, durable, energy-conservation.But, current led
In light fixture, playing main heat sink effect is radiator, in the heat transfer that LED lamp operationally produces to radiator, and further
Transfer heat to the in the air in the external world by radiator, and then heat is scattered away, to ensure that LED lamp can continue normal work
Make.
Adopting aluminum alloy materials existing radiator more, but current aluminium alloy in thermal conductivity or not ideal enough, especially
It is for powerful LED lamp.And, existing LED lamp merely using aluminium alloy as heat sink material it is difficult to meet it
Radiating requirements, causing the reliability of LED lamp work to reduce, thus affecting illumination effect, reducing the service life of LED lamp.
At present, existing radiator is all to be integrally formed design it is impossible to realizing self disassembling, assembling and deformation.For example, led
Light fixture need to change the outfit different capacity and different number LED lamp when it is meant that heat that LED lamp produces will correspond to increase or
Person reduces.If radiator is unable to realizing self disassembling, assembling and deformation, when heat increases, heat cannot timely shed, just
The normal working performance of LED lamp can be affected, it is overheated and damage to even result in LED lamp, when heat reduces, will waste and partly dissipate
The heat sinking function of hot device, therefore, for the problems referred to above, is badly in need of the radiator of a kind of energy realizing self disassembling, assembling and deformation.
Additionally, when radiator carries out integrally assembling drawn game portion maintenance operation, also will be extremely inconvenient, lead to some radiatings
Device cannot keep in repair and go out of use because of some glitch, cause greatly to waste.
Patent cn102301021a discloses a kind of yield strength and elongation percentage is excellent, and not easy-sintering, replace adc
The 10 and adc 12 compression casting aluminium alloys obtaining and the high toughness Al-alloy foundry goods with this alloy compression casting.Its feature exists
In this aluminium alloy contains: below weight %, fe:0.55 weight % of si:4.0～9.0 weight %, mg:0.5～1.0, mn:0.30
～0.6 weight % and cr:0.10～0.25 weight %, surplus comprises al and inevitable impurity.
Patent cn101248200a discloses a kind of cast aluminium alloy gold comprising at least following 5 kinds of alloying components: si:2.5
, to 3.3 weight %, preferably 2.7 weight % are to 3.1 weight % for weight %；Mg:0.2 weight % is to 0.7 weight %, preferably 0.3 weight
Amount % to 0.6 weight %；Fe:＜ 0.18 weight %, preferably 0.05 weight % is to 0.16 weight %；Mn:＜ 0.5 weight %, excellent
Select 0.05 weight % to 0.4 weight %；Ti:＜ 0.1 weight %, preferably 0.01 weight % is to 0.08 weight %；Sr:＜ 0.03 weight
Amount %, preferably 0.01 weight % is to 0.03 weight %；Other: < 0.1 weight %；Under above-mentioned condition, balance of al, make the summation be
100 weight %.
Patent cn103469034a discloses a kind of led radiator aluminum alloy and preparation method thereof.It is characterized in that, should
Aluminium alloy each element consists of by mass percentage: si2.2-2.8, cu1.5-2.5, mg1.1-1.6, zn3.7-4.4, mn0.6-
1.2、fe0.5-1、ni0.4-0.8、cr0.2-0.3、ti0.15-0.25、ge0.08-0.12、th0.04-0.07、y0.03-
0.05th, sm0.02-0.03, tb0.02-0.03, balance of aluminium.
Aluminium alloy yield strength that patent cn102301021a and cn101248200a are provided and elongation percentage preferably, but
Thermal conductivity poor it is difficult to meet LED lamp radiating requirements.Although the aluminium alloy thermal conductivity phase that patent cn103469034a is provided
To preferable, but merely also still can not meet the radiating requirements of LED lamp using aluminium alloy.
Content of the invention
Based on this it is necessary to provide one kind can realizing self disassembling, assembling and deformation, be easily assembled and keep in repair, heat conductivility
Modular radiator preferable and that heat dispersion is stronger.
A kind of modular radiator, comprising: heat conduction main body, heat sink body and some heat transfer body；
Described heat conduction main body includes several heat-conducting parts and several transition parts, described in each described heat-conducting part connects two
Transition part, each described heat-conducting part is connected to form one structure by described transition part, described heat-conducting part offer several first
Screw；
Described heat sink body include several radiating pieces and with several plug connectors, described radiating piece offers some
Individual second screw, described plug connector includes spiro union portion and the Access Division being connected with described spiro union portion, described spiro union portion with described
Second screwhole spiro bonding；
Described heat transfer body includes all fixing with the described screw part and holding section company in screw part, holding section and two ends
Socket part, described screw part is spirally connected with described first screw, and described Access Division is arranged on described holding section.
In one of embodiment, described transition part includes First Transition portion and the second transition part, at least several institutes
State heat-conducting part and described First Transition portion and be sequentially connected and surround a closing structure, several described heat-conducting parts all with described second mistake
Portion of crossing connects.
In one of embodiment, formed between described First Transition portion, described second transition part and described heat-conducting part
Several breach.
In one of embodiment, described radiating piece include radiating part, two arc wing plates, several main radiating fins with
And several auxiliary fins, two described arc wing plates are fixedly installed on the both sides of described radiating part respectively, described in several
Main radiating fin is arranged at intervals at the side of described radiating part, and several described auxiliary fins are arranged at intervals at described arc shaped wing
On plate.
In one of embodiment, described second screw is opened on described radiating part, and described spiro union portion passes through described the
Two screws are spirally connected with described radiating part.
In one of embodiment, described heat-conductive body arranges several installation positions.
In one of embodiment, also include several LED lamps, several described LED lamps are arranged on described installation position.
In one of embodiment, described heat conduction main body includes each component of following mass parts: 93 parts～97 parts of copper, aluminium 2
Part～4.5 parts, 0.1 part～0.3 part of nickel, 0.2 part～1.2 parts of vanadium, 0.1 part～0.4 part of manganese, 0.1 part～0.3 part of titanium, 0.1 part of chromium
～0.3 part and 0.1 part～0.3 part of vanadium.
In one of embodiment, described heat transfer body includes each component of following mass parts: 45 parts～52 parts of copper, aluminium 47
Part～54 parts, 0.3 part～0.7 part of magnesium, 0.2 part～0.8 part of iron, 0.2 part～0.5 part of manganese, 0.05 part～0.3 part of titanium, chromium 0.05
Part～0.1 part and 0.05 part～0.3 part of vanadium.
In one of embodiment, described heat sink body includes each component of following mass parts: 88 parts～93 parts of aluminium, silicon
5.5 parts～10.5 parts, 0.3 part～0.7 part of magnesium, 0.05 part～0.3 part of copper, 0.2 part～0.8 part of iron, 0.2 part～0.5 part of manganese, titanium
0.05 part～0.3 part, 0.05 part～0.1 part of chromium and 0.05 part～0.3 part of vanadium.
The heat sink body of above-mentioned modular radiator is passed through setting plug connector and is detachably spirally connected with radiating piece, can basis
LED lamp produces how many corresponding replacings of heat and group closes the radiating piece of main heat sink function it is achieved that realizing self disassembling, group are filled with
And the effect of deformation, and by arranging plug connector with the detachable clamping of heat transfer body it is easy to assembling and keeping in repair.Additionally, passing through
Heat conduction main body, heat transfer body and the heat sink body being sequentially connected is set, and heat conduction main body, heat transfer body and radiating master
The heat-conductive characteristic of body successively decreases successively, defines heat-conductive characteristic gradient, thus optimizing modular radiator further
Heat dissipation path, heat dispersion is preferable compared with strong and heat conductivility.
Brief description
Fig. 1 is the structural representation of the modular radiator of an embodiment of the present invention；
Fig. 2 is the structural representation of the heat conduction main body shown in Fig. 1；
Fig. 3 is the overlooking the structure diagram of the heat sink body shown in Fig. 1；
The structural representation of the radiating piece of another embodiment of Fig. 4 present invention；
Fig. 5 is the structural representation of the heat transfer body shown in Fig. 1；
Fig. 6 is the structural representation of the plug connector shown in Fig. 1.
Specific embodiment
Understandable for enabling the above objects, features and advantages of the present invention to become apparent from, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.Elaborate a lot of details in order to fully understand this in the following description
Bright.But the present invention can be much to implement different from alternate manner described here, and those skilled in the art can be not
Similar improvement is done, therefore the present invention is not limited by following public specific embodiment in the case of running counter to intension of the present invention.
Refer to Fig. 1, if the modular radiator 10 of an embodiment includes heat conduction main body 100, heat sink body 200
Dry heat transfer body 300 and several LED lamps.The two ends end of heat transfer body 300 is respectively arranged at heat conduction main body 100 and dissipates
In hot main body 200, so that heat conduction main body 100, heat sink body 200 and several heat transfer body 300 three's phase are fixed.LED lamp
400 are arranged in heat conduction main body 100.It is appreciated that the heat that LED lamp 400 produces passes to heat conduction main body 100, afterwards first
Again heat transfer body 200 is passed to by heat conduction main body 100, finally again heat sink body 300, Jin Erzai is passed to by heat transfer body 200
Scattered away by heat sink body 300.And, in the transmission dispersion process of the heat of LED lamp 400, heat conduction main body 100, heat transfer body
200 and heat sink body 300 all to extraneous air dissipated heat.
Refer to Fig. 2, heat conduction main body 100 includes heat-conducting part 110 and several transition parts 120.Each heat-conducting part 110 connects
At least three transition parts 120, so that each heat-conducting part 110 is connected to form one structure that is to say, that respectively leading by transition part 120
Hot portion 110 is to connect transition member to be interconnected to form network structure by transition part 120.First is offered on heat-conducting part 110
Screw 111.
In order that the terminal with compact integral structure of heat conduction main body 100 is well-balanced, there is industrial design sense.For example, Fig. 2, mistake are referred to
Cross portion 120 and include First Transition portion 121 and the second transition part 122, at least several heat-conducting parts 110 and First Transition portion 121
Connect and surround a closing structure, that is, at least several heat-conducting parts 110 are connected with First Transition portion 121 and surround closed figures, some
Individual heat-conducting part 110 is all connected with the second transition part 122, and that is, heat-conducting part 110 passes through the second transition part 122 in described closing structure
Form network structure.And for example, heat-conducting part 110 is five, and First Transition portion 121 is four, and the second transition part 122 is four, its
In four heat-conducting parts 110 and four First Transition portions 121 be in turn connected to form rectangular-shaped closing structure, i.e. four heat-conducting parts
110 are simultaneously connected the rectangular-shaped closing structure of formation, another heat-conducting part from beginning to end with four First Transition portions 121 successively interval setting
110 pass through four the second transition parts 122 is connected formation network structure respectively with other four heat-conducting part 110.As such, it is possible to make heat conduction
The terminal with compact integral structure of main body 100 is well-balanced, has industrial design sense.
In order to strengthen the radiating effect of heat conduction main body 100, for example, Fig. 2, First Transition portion 121, the second transition part are referred to
Form the breach 130 of several connection extraneous airs, several breach 130 can form independence between 122 and heat-conducting part 110
Heat-dissipating space radiated, and the heat conducting and radiating of heat conduction main body 100 itself synergy, additionally, also increase radiating ratio
Surface area, play auxiliary heat dissipation effect, further enhance radiating effect, share bear described heat transfer body and described dissipate
The radiating load of hot main body.
For the ease of the installation of LED lamp 400, for example, heat-conductive body 100 arranges several installation positions, several LED lamps
400 one-to-one corresponding are installed on several described installation positions, and for example, heat-conductive body 100 are evenly arranged with several described peaces
Dress position, so can be in order to the installation of LED lamp 400, further, it is also possible to optimize LED lamp 400 distribution spatially, to increase
LED lamp launches the range of exposures of light, and makes light irradiate the brightness uniformity unification in each region in space.
Refer to Fig. 1, heat sink body 200 includes several radiating pieces 210 and several plug connectors 220.Please join simultaneously
Read Fig. 3, Fig. 6, radiating piece 210 offers several the second screws 211.Plug connector 220 include spiro union portion 221 and be spirally connected
The Access Division 222 that portion 221 connects, spiro union portion 221 is screwed togather with the second screw 211, so that radiating piece 210 and plug connector 220 are mutually solid
Fixed.
It is pointed out that above-mentioned radiating piece not concrete restriction shape and structure, for example, in some red-letter day celebratory events,
Described radiating piece can be shapes such as " smiling face " " Zongzis ", " love ", " moon " and " lantern ", and for example, in the trip of some cartoons
In happy field, the acceptable shape such as " Donald duck " " Micky Mouse " " cucurbit baby " and " dwarf " of described radiating piece, other shapes exist
This does not enumerate, and the application of the present invention is extremely extensive, and especially suitable user diy designs and assembles.And for example, several are described scattered
The shape of warmware is different, and several described radiating pieces correspond described plug connector.As such, it is possible to it is voluntarily right according to actual needs
Described radiating piece is dismantled, assembled and is deformed, and enhances experience sense and the entertaining sense of user, further, it is also possible to according to
Described LED lamp produce heat number, correspondent transform adjusts the described radiating piece of different heat-sinking capabilities, so that institute
The heat stating LED lamp generation is matched with described radiating piece, has both protected the normal usage function of described LED lamp, has prevented again
Waste the heat sinking function of partly described radiating piece.
In order to strengthen the radiating effect of above-mentioned radiating piece, an example is to refer to Fig. 4, and it is another enforcement of the present invention
The structural representation of the radiating piece 210a of mode, radiating piece 210a include radiating part 211a, two arc wing plate 212a, several
Main radiating fin 213a and several auxiliary fins 214a.Two arc wing plate 212a are fixedly installed on radiating part respectively
The both sides of 211a.Several main radiating fin 213a are arranged at intervals at the side away from plug connector 220 for the radiating part 211a successively, if
A dry auxiliary fin 214a is arranged at intervals on arc wing plate 212a successively, as such, it is possible to increase the radiating of radiating piece 210a
Specific surface area, to strengthen the radiating effect of radiating piece 210a.And for example, several auxiliary fins 214a radially distributes in arc
On shape wing plate 212a, as such, it is possible to relatively increase the space between two neighboring auxiliary fin 214a, dissipate beneficial to cross-ventilation
Heat, further enhancing the radiating effect of radiating piece 210a.And for example, described second screw is opened on described radiating part, described
Spiro connecting piece is spirally connected by described second screw and described radiating part.
Refer to Fig. 5, heat transfer body 300 includes screw part 310, holding section 320 and connecting portion 330, screw part 310 with
And holding section 320 is fixedly installed on two ends of connecting portion 330 respectively, please refer to Fig. 2, screw part 310 and first
Screw 111 is spirally connected, so that heat transfer body 300 is detachably connected with heat conduction main body 100, is easy to assembling dismounting.Please refer to figure
3rd, Fig. 6, Access Division 222 is arranged on holding section 320, so that heat transfer body 300 is detachably connected with heat sink body 200, is easy to
Assembling is installed.
In order to prevent Access Division 222 from coming off from holding section 320, so that Access Division 222 and holding section 320 more securely phase
Fixing, and then prevent heat transfer body 300 from separating with heat sink body 200, for example, refer to Fig. 5, holding section 320 offers card
Groove 321, the madial wall of draw-in groove 321 has the first inclined-plane 321a, and that is, draw-in groove 321 is in round table-like structure, so that the bottom of draw-in groove 321
Diameter is less than the opening diameter of draw-in groove 321.The madial wall of draw-in groove 321 is radially further opened with annular spacing groove 321b.Refer to
Fig. 6, Access Division 222 has second inclined-plane 222a corresponding with the first inclined-plane 321a, that is, when Access Division 222 is arranged in holding section
On 320, the first inclined-plane 321a and the second inclined-plane 222a is in close contact, so, when the mistake that Access Division 222 snaps in holding section 320
Cheng Zhong, the second inclined-plane 222a can slide along the first inclined-plane 321a, and the first inclined-plane 321a is used for playing more accurately guiding and snaps in
The effect in direction.Additionally, Access Division 222 is radially additionally provided with the annular stop boss corresponding with annular spacing groove 321b
222b, during Access Division 222 is snapped in holding section 320, there is reversible deformation in the stress using the side wall of draw-in groove 321,
Annular stop boss 222b can be made smoothly to embed in annular spacing groove 321b, as such, it is possible to prevent Access Division 222 from holding section
Come off on 320, so that Access Division 222 is more securely mutually fixed with holding section 320, meanwhile, also allow for assembling dismounting.And for example, it is
It is easily installed, annular stop boss also sets up annular rubber ring, and it deforms upon when mounted, and have no substantial effect on radiating effect
Really.
In order to be easier to carry out consolidation to heat transfer body 300 and heat conduction main body 100, for example, described plug connector is more
Easily consolidation is carried out to heat transfer body 300 and heat conduction main body 100.
In order to be easier that consolidation is carried out to heat transfer body 300 and heat sink body 200, for example, on described connecting portion
Setting second-hand twist area, described second-hand twist area include the 3rd extension and the 4th extension, and for example, described 3rd extension and
Described 4th extension forms 180 degree angle, and that is, described 3rd extension and described 4th extension are located along the same line.This
Sample, can be easier to carry out consolidation to heat transfer body 300 and heat sink body 200.
The heat sink body 200 of above-mentioned modular radiator 10 passes through to arrange plug connector 220 and the detachable spiral shell of radiating piece 210
Connect, how many corresponding replacings of heat can be produced according to LED lamp 400 and group closes the radiating piece 210 of main heat sink function, realize
The effect of realizing self disassembling, assembling and deformation, and by arranging plug connector 220 and heat transfer body 300 detachable clamping, easily
In assembling and maintenance.Additionally, the heat conduction main body 100, heat transfer body 300 and the heat sink body 200 that are sequentially connected by setting,
And the heat-conductive characteristic of heat conduction main body 100, heat transfer body 300 and heat sink body 200 successively decreases successively, defines heat transfer
Capability gradient, thus optimizing the heat dissipation path of modular radiator 10 further, heat dispersion is relatively strong and heat conductivility
Preferably.
For example, the thickness of heat conduction main body 100 is 1mm～2mm, and the length of heat transfer body 300 is 5mm～10mm, radiating master
The height of body 200 is 20mm～30mm, as such, it is possible to make radiating effect preferable.
For example, in described modular radiator, the material of heat conduction main body, heat transfer body and heat sink body identical or
Different setting, for example, by arranging heat conduction main body, heat transfer body and the heat sink body being sequentially connected, and, heat conduction main body,
The heat-conductive characteristic of heat transfer body and heat sink body successively decreases successively, defines heat-conductive characteristic gradient, thus optimizing further
The heat dissipation path of described modular radiator, drastically increases the heat dispersion of described modular radiator, can
Meet the radiating requirements of the big LED lamp of caloric value, there is wide variety of market value basis.
For example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
93 parts～97 parts of copper, 2 parts～4.5 parts of aluminium, 0.1 part～0.3 part of nickel, 0.2 part～1.2 parts of vanadium, manganese 0.1 part～0.4
Part, 0.1 part～0.3 part of titanium, 0.1 part～0.3 part of chromium and 0.1 part～0.3 part of vanadium.
Above-mentioned heat conduction main body contains copper (cu) can make the heat conductivility of heat conduction main body be maintained at a high level of comparison.
When the mass parts of copper are 93 parts～97 parts, the coefficient of heat conduction of heat conduction main body can reach more than 380w/mk, can be rapidly
The heat that LED lamp is produced siphons away, and then is evenly dispersed in the overall structure of heat conduction main body, to prevent heat in LED lamp
Accumulate on contact position and heat conduction main body between, cause the generation of hot-spot phenomenon.And, the density of heat conduction main body is but only
There is 8.0kg/m3～8.1kg/m3, the density of far smaller than fine copper, so can effectively mitigate the weight of heat conduction main body, more sharp
Manufacture in installing, also greatly reduce cost simultaneously.Wherein, the definition of the coefficient of heat conduction is: per unit length, every k, permissible
Transmit the energy of how many w, unit is w/mk, wherein " w " refers to thermal power unit, and " m " represents long measure rice, and " k " is absolute
Temperature unit, this numerical value bigger explanation heat conductivility is better.
Additionally, heat conduction main body contain the aluminium that mass parts are 2 parts～4.5 parts, 0.1 part～0.3 part of nickel, 0.2 part～1.2 parts
Vanadium, 0.1 part～0.4 part of manganese, 0.1 part～0.3 part of titanium, the vanadium of 0.1 part～0.3 part of chromium and 0.1 part～0.3 part.
With respect to fine copper, the ductility of heat conduction main body, toughness, intensity and resistance to elevated temperatures are all improved significantly, and are difficult to burn
Knot；So, when being installed to LED lamp in heat conduction main body it is possible to prevent the high temperature that LED lamp produces from heat conduction main body is caused damage
Bad, and, have preferable ductility, toughness and intensity be also possible to prevent heat conduction main body install LED lamp when be subject to
Big stress and lead to deform.For example, heat conduction main body contains the nickel (ni) that mass parts are 0.1 part～0.3 part, can improve heat conduction master
The resistance to elevated temperatures of body.And for example, heat conduction main body contains the vanadium (v) that mass parts are 0.2 part～1.2 parts heat conduction main body can be suppressed brilliant
Grain length is big, obtains more uniform tiny grain structure, to reduce the fragility of heat conduction main body, improves the overall mechanical property of heat conduction main body
Can, to improve toughness and intensity.And for example, heat conduction main body contains the titanium (ti) that mass parts are 0.1 part～0.3 part, so that leading
The crystal grain miniaturization of hot main body, to improve the ductility of heat conduction main body.
For example, heat conduction main body also includes the silicon (si) that mass parts are 1 part～2.5 parts, when heat conduction main body contains appropriate silicon
When, can be on the premise of not affecting heat conduction main body heat conductivility, the effectively hardness of lifting heat conduction main body and abrasion resistance.But,
Find through multiple theory analysis and experiment evidence, when the quality of silicon in heat conduction main body is too many, such as mass percent is more than 15 parts
When above, the appearance of heat conduction main body can be made to be distributed black particles, and ductility reduces, and is unfavorable for that the production of heat conduction main body becomes
Type.
For example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
93 parts～97 parts of copper, 2 parts～4.5 parts of aluminium, 0.1 part～0.3 part of nickel, 0.2 part～1.2 parts of vanadium, manganese 0.1 part～0.4
Part, 0.1 part～0.3 part of titanium, 0.1 part～0.3 part of chromium, 0.1 part～0.3 part of vanadium and 1 part～2.5 parts of silicon.
For example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
95 parts～96.5 parts of copper, 2 parts～3.2 parts of aluminium, 0.2 part～0.25 part of magnesium, 0.4 part～0.9 part of iron, 0.2 part of manganese～
0.3 part, 0.2 part～0.3 part of titanium, 0.1 part～0.2 part of chromium and 0.1 part～0.2 part of vanadium.
For example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
95 parts～96.5 parts of copper, 2 parts～3.2 parts of aluminium, 0.2 part～0.25 part of magnesium, 0.4 part～0.9 part of iron, 0.2 part of manganese～
0.3 part, 0.2 part～0.3 part of titanium, 0.1 part～0.2 part of chromium, 0.1 part～0.2 part of vanadium and 1 part～2.5 parts of silicon.
For example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
93 parts of copper, 2 parts of aluminium, 0.1 part of nickel, 0.2 part of vanadium, 0.1 part of manganese, 0.1 part of titanium, 0.1 part of chromium and 0.1 part of vanadium.
And for example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
95 parts of copper, 3.5 parts of aluminium, 0.2 part of nickel, 0.8 part of vanadium, 0.3 part of manganese, 0.2 part of titanium, 0.2 part of chromium and 0.2 part of vanadium.
And for example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
97 parts of copper, 4.5 parts of aluminium, 0.3 part of nickel, 1.2 parts of vanadium, 0.4 part of manganese, 0.3 part of titanium, 0.3 part of chromium and 0.3 part of vanadium.
And for example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
93 parts of copper, 2 parts of aluminium, 0.1 part of nickel, 0.2 part of vanadium, 0.1 part of manganese, 0.1 part of titanium, 0.1 part of chromium, 0.1 part of vanadium and silicon 1
Part.
And for example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
95 parts of copper, 3.5 parts of aluminium, 0.2 part of nickel, 0.8 part of vanadium, 0.3 part of manganese, 0.2 part of titanium, 0.2 part of chromium, 0.2 part of vanadium and silicon 2
Part.
And for example, the heat conduction main body of an embodiment, it includes each component of following mass parts:
97 parts of copper, 4.5 parts of aluminium, 0.3 part of nickel, 1.2 parts of vanadium, 0.4 part of manganese, 0.3 part of titanium, 0.3 part of chromium, 0.3 part of vanadium and silicon
2.5 part.
For example, the heat transfer body of an embodiment, it includes each component of following mass parts:
45 parts～52 parts of copper, 47 parts～54 parts of aluminium, 0.3 part～0.7 part of magnesium, 0.2 part～0.8 part of iron, manganese 0.2 part～0.5
Part, 0.05 part～0.3 part of titanium, 0.05 part～0.1 part of chromium and 0.05 part～0.3 part of vanadium.
Above-mentioned heat transfer body contains the aluminium of the copper that mass parts are 45 parts～52 parts and 47 parts～54 parts, so that heat transfer
The coefficient of heat conduction of main body is maintained at 300w/mk～350w/mk, to ensure that heat transfer body can be by by heat conduction absorbent body
The heat that LED lamp produces is quickly transmitted to heat sink body, and then prevents heat from piling up in heat transfer body, causes hot-spot
Phenomenon produces.With respect to prior art, merely adopt price costly and the larger copper of quality, above-mentioned heat transfer body was both permissible
Ensure the heat transfer of heat conduction main body quickly to heat sink body there is lighter weight again, to be easily installed casting, price less expensive
Advantage.Meanwhile, with respect to prior art, merely adopt the poor aluminium alloy of radiating effect, above-mentioned heat transfer body has more
Good heat transfer property.
Additionally, heat transfer body contain the magnesium that mass parts are 0.3 part～0.7 part, 0.2 part～0.8 part of iron, 0.2 part～0.5
The vanadium of the manganese of part, 0.05 part～0.3 part of titanium, 0.05 part～0.1 part of chromium and 0.05 part～0.3 part, improving heat transfer master
The yield strength of body, tensile strength and resistance to elevated temperatures.For example, find through many experiments evidence and theory analysis, heat transfer master
Body contains the magnesium that mass parts are 0.3 part～0.7 part, can give heat transfer body yield strength to a certain extent and tension is strong
Degree, due to above-mentioned modular radiator in the fabrication process, needs heat conduction main body, heat transfer body and heat sink body is overall
Punching press is integrally formed, and this is accomplished by heat sink body and has stronger yield strength, to prevent heat sink body to be subject in process
Produce non-reversible deformation to excessive punching press stress, and then guarantee the proper heat reduction performance of above-mentioned modular radiator.When magnesium
When relative mass is too low, such as mass parts are less than when 0.3 part it is impossible to substantially ensure that the yield strength satisfaction requirement of heat transfer body,
However, when the relative mass of magnesium is too high, such as when mass parts are more than 0.7 part, can make again heat transfer body ductility and
Heat conductivility dramatic decrease.For example, heat transfer body contains the iron that mass parts are 0.2 part～0.8 part, can give heat transfer body relatively
High resistance to elevated temperatures and high temperature resistant mechanical performance, beneficial to the processing casting of heat transfer body.
For example, the heat transfer body of an embodiment, it includes each component of following mass parts:
47 parts～50 parts of copper, 49 parts～52 parts of aluminium, 0.2 part～0.7 part of magnesium, 0.2 part～0.7 part of iron, manganese 0.2 part～0.5
Part, 0.1 part～0.3 part of titanium, 0.05 part～0.1 part of chromium and 0.1 part～0.3 part of vanadium.
For example, the heat transfer body of an embodiment, it includes each component of following mass parts:
45 parts of copper, 47 parts of aluminium, 0.3 part of magnesium, 0.2 part of iron, 0.2 part of manganese, 0.05 part of titanium, 0.05 part of chromium and 0.05 part of vanadium.
And for example, the heat transfer body of an embodiment, it includes each component of following mass parts:
50 parts of copper, 48 parts of aluminium, 0.5 part of magnesium, 0.6 part of iron, 0.4 part of manganese, 0.2 part of titanium, 0.08 part of chromium and 0.2 part of vanadium.
And for example, the heat transfer body of an embodiment, it includes each component of following mass parts:
52 parts of copper, 54 parts of aluminium, 0.7 part of magnesium, 0.8 part of iron, 0.5 part of manganese, 0.3 part of titanium, 0.1 part of chromium and 0.3 part of vanadium.
For example, the heat sink body of an embodiment, it includes each component of following mass parts:
88 parts～93 parts of aluminium, 5.5 parts～10.5 parts of silicon, 0.3 part～0.7 part of magnesium, 0.05 part～0.3 part of copper, 0.2 part of iron～
0.8 part, 0.2 part～0.5 part of manganese, 0.05 part～0.3 part of titanium, 0.05 part～0.1 part of chromium and 0.05 part～0.3 part of vanadium.
Above-mentioned heat sink body contains the aluminium that mass parts are 88 parts～93 parts, so that the coefficient of heat conduction of heat sink body is protected
Hold in 200w/mk～220w/mk, when the heat that LED lamp produces is after heat conduction main body and heat transfer body part radiate, remaining
Heat when again heat sink body being passed to by heat transfer body, heat sink body may insure uniformly to be held these remaining heats
Scatter away continuously, and then prevent heat from piling up on heat sink body, cause hot-spot phenomenon.
Additionally, heat sink body contain the silicon that mass parts are 5.5 parts～10.5 parts, 0.3 part～0.7 part of magnesium, 0.05 part～
0.3 part of copper, 0.2 part～0.8 part of iron, 0.2 part～0.5 part of manganese, 0.05 part～0.3 part of titanium, 0.05 part～0.1 part
The vanadium of chromium and 0.05 part～0.3 part, can significantly improve the heat dispersion of heat sink body.For example, heat sink body contains matter
Amount part be 5.5 parts～10.5 parts of silicon and 0.05 part～0.3 part of copper it can be ensured that heat sink body have good mechanical properties and
The advantage of lighter weight, at the same time it can also improve the heat-conductive characteristic of heat sink body further, further ensures that heat sink body can
Will scatter away via the after-heat consistent after heat conduction main body and heat transfer body transmission, and then prevent heat in radiating
Pile up in main body, cause hot-spot phenomenon.
For example, heat sink body also includes the lead (pb) that mass parts are 0.3 part～0.6 part, when heat sink body contain 0.3 part～
0.6 part of lead can improve the tensile strength of heat sink body, as such, it is possible to prevent from working as to be cast heat sink body striking out radiating
Fin, that is, during laminated structure, ruptures due to being pullled stress by excessive punching press.
For example, heat sink body also includes the niobium (nb) that mass parts are 0.02 part～0.04 part, through many experiments evidence and reason
Find by analysis, when the mass parts of niobium are more than 0.02 part, the antioxygenic property of heat sink body, Ke Yili can be greatly enhanced
Solution, as maximum with contacting external air area part in modular radiator, it is to high temperature oxidation resistance for heat sink body
Can require higher.However, when the mass parts of niobium are more than 0.04 part, the magnetic of heat sink body can be led to sharply increase, can be to led
Miscellaneous part in light fixture produces impact.
For example, heat sink body also includes the germanium (ge) that mass parts are 0.02 part～0.03 part, through many experiments evidence and reason
Find by analysis, when the mass parts of germanium are more than 0.02 part, the raising of the heat dispersion of heat sink body can be played unexpected
Effect, however, when the quality accounting of germanium is excessive, such as the mass parts of germanium are more than 2 parts, the brittleness of heat sink body can be made to increase again
Plus.
For example, the heat sink body of an embodiment, it includes each component of following mass parts:
90 parts～93 parts of aluminium, 5.5 parts～8.5 parts of silicon, 0.3 part～0.7 part of magnesium, 0.05 part～0.3 part of copper, 0.2 part of iron～
0.7 part, 0.2 part～0.5 part of manganese, 0.05 part～0.3 part of titanium, 0.05 part～0.1 part of chromium and 0.05 part～0.2 part of vanadium.
For example, the heat sink body of an embodiment, it includes each component of following mass parts:
88 parts of aluminium, 5.5 parts of silicon, 0.3 part of magnesium, 0.05 part of copper, 0.2 part of iron, 0.2 part of manganese, 0.05 part of titanium, 0.05 part of chromium and
0.05 part of vanadium.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
90 parts of aluminium, 8 parts of silicon, 0.5 part of magnesium, 0.2 part of copper, 0.6 part of iron, 0.4 part of manganese, 0.1 part of titanium, 0.08 part of chromium and vanadium
0.25 part.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
93 parts of aluminium, 10.5 parts of silicon, 0.7 part of magnesium, 0.3 part of copper, 0.8 part of iron, 0.5 part of manganese, 0.3 part of titanium, 0.1 part of chromium and vanadium
0.3 part.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
88 parts of aluminium, 5.5 parts of silicon, 0.3 part of magnesium, 0.05 part of copper, 0.2 part of iron, 0.2 part of manganese, 0.05 part of titanium, 0.05 part of chromium, vanadium
0.05 part and 0.3 part of lead.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
88 parts of aluminium, 5.5 parts of silicon, 0.3 part of magnesium, 0.05 part of copper, 0.2 part of iron, 0.2 part of manganese, 0.05 part of titanium, 0.05 part of chromium, vanadium
0.05 part and 0.5 part of lead.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
88 parts of aluminium, 5.5 parts of silicon, 0.3 part of magnesium, 0.05 part of copper, 0.2 part of iron, 0.2 part of manganese, 0.05 part of titanium, 0.05 part of chromium, vanadium
0.05 part and 0.6 part of lead.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
90 parts of aluminium, 8 parts of silicon, 0.5 part of magnesium, 0.2 part of copper, 0.6 part of iron, 0.4 part of manganese, 0.1 part of titanium, 0.08 part of chromium, vanadium 0.25
Part and 0.02 part of niobium.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
90 parts of aluminium, 8 parts of silicon, 0.5 part of magnesium, 0.2 part of copper, 0.6 part of iron, 0.4 part of manganese, 0.1 part of titanium, 0.08 part of chromium, vanadium 0.25
Part and 0.03 part of niobium.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
90 parts of aluminium, 8 parts of silicon, 0.5 part of magnesium, 0.2 part of copper, 0.6 part of iron, 0.4 part of manganese, 0.1 part of titanium, 0.08 part of chromium, vanadium 0.25
Part and 0.04 part of niobium.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
93 parts of aluminium, 10.5 parts of silicon, 0.7 part of magnesium, 0.3 part of copper, 0.8 part of iron, 0.5 part of manganese, 0.3 part of titanium, 0.1 part of chromium, vanadium 0.3
Part and 0.02 part of germanium.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
93 parts of aluminium, 10.5 parts of silicon, 0.7 part of magnesium, 0.3 part of copper, 0.8 part of iron, 0.5 part of manganese, 0.3 part of titanium, 0.1 part of chromium, vanadium 0.3
Part and 0.025 part of germanium.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
93 parts of aluminium, 10.5 parts of silicon, 0.7 part of magnesium, 0.3 part of copper, 0.8 part of iron, 0.5 part of manganese, 0.3 part of titanium, 0.1 part of chromium, vanadium 0.3
Part and 0.03 part of germanium.
And for example, the heat sink body of an embodiment, it includes each component of following mass parts:
88 parts of aluminium, 5.5 parts of silicon, 0.3 part of magnesium, 0.05 part of copper, 0.2 part of iron, 0.2 part of manganese, 0.05 part of titanium, 0.05 part of chromium, vanadium
0.05 part, 0.5 part of lead, 0.03 part of niobium and 0.025 part of germanium.
It should be noted that existing radiator, aluminium alloy is merely adopted to manufacture raw material as radiator, due to existing
Aluminium alloy radiating effect not ideal enough, lead to radiator heat-dissipation load excessive, radiating effect is not ideal enough, in particular for big
The LED lamp of power, is even more difficult to meet its needs that radiate.
Above-mentioned modular radiator passes through heat conduction main body, heat transfer body and the heat sink body that setting is sequentially connected, and
And, the heat-conductive characteristic of heat conduction main body, heat transfer body and heat sink body successively decreases successively, defines heat-conductive characteristic gradient, from
And optimize the heat dissipation path of modular radiator further, drastically increase the heat dispersion of modular radiator,
Disclosure satisfy that the radiating requirements of the big LED lamp of caloric value.For simple copper alloy, above-mentioned modular radiator matter
Amount is relatively light, and cost is relatively low.For simple aluminium alloy, the heat dispersion of above-mentioned modular radiator is more excellent.
Additionally, present invention is alternatively directed to heat conduction main body, the heat transfer body and heat sink body difference played in modular radiator
Effect, by improved quality proportioning, improves resistance to elevated temperatures, toughness and the intensity of heat conduction main body, improves heat transfer body
Yield strength, tensile strength and resistance to elevated temperatures, improve heat-conductive characteristic and the antioxygenic property of heat sink body.
Provide some specific embodiments below again, the present invention will be described for continuation.
Embodiment 1
The vanadium of the copper of 950g, the aluminium of 35g, the nickel of 2g, the vanadium of 8g, the manganese of 3g, the titanium of 2g, the chromium of 2g and 2g is mixed,
Then put in melting furnace, after fusing, obtain solution, then carry out the refinement treatment such as Dehydroepiandrosterone derivative and removing impurities process, then process
Solution-cast afterwards, in predetermined mould, obtains heat conduction main body after solidification.
The vanadium of the copper of 500g, the aluminium of 480g, the magnesium of 5g, the iron of 6g, the manganese of 4g, the titanium of 2g, the chromium of 0.8g and 2g is mixed
Close, then put in melting furnace, after fusing, obtain solution, then carry out the refinement treatment such as Dehydroepiandrosterone derivative and removing impurities process, then
Solution-cast after process, in predetermined mould, obtains heat transfer body after solidification.
By the aluminium of 900g, the silicon of 80g, the magnesium of 5g, the copper of 2g, the iron of 6g, the manganese of 4g, the titanium of 1g, the chromium of 0.8g and
The vanadium mixing of 0.5g, then puts in melting furnace, obtains solution after fusing, then carries out Dehydroepiandrosterone derivative and removing impurities process etc. refined
Process, the solution-cast after then processing, in predetermined mould, obtains heat sink body after solidification.
The assembling of heat conduction main body, heat transfer body and heat sink body is obtained modular radiator.
Embodiment 2
The vanadium of the copper of 930g, the aluminium of 20g, the nickel of 1g, the vanadium of 2g, the manganese of 1g, the titanium of 1g, the chromium of 1g and 1g is mixed,
Then put in melting furnace, after fusing, obtain solution, then carry out the refinement treatment such as Dehydroepiandrosterone derivative and removing impurities process, then process
Solution-cast afterwards, in predetermined mould, obtains heat conduction main body after solidification.
By the copper of 450g, the aluminium of 470g, the magnesium of 3g, the iron of 2g, the manganese of 2g, the titanium of 0.5g, the chromium of 0.5g and 0.5g
Vanadium mixes, and then puts in melting furnace, obtains solution after fusing, then carries out the refinement treatment such as Dehydroepiandrosterone derivative and removing impurities process,
Then the solution-cast after processing, in predetermined mould, obtains heat transfer body after solidification.
By the aluminium of 930g, the silicon of 105g, the magnesium of 7g, the copper of 3g, the iron of 8g, the manganese of 5g, the titanium of 3g, the chromium of 1g and 3g
Vanadium mixes, and then puts in melting furnace, obtains solution after fusing, then carries out the refinement treatment such as Dehydroepiandrosterone derivative and removing impurities process,
Then the solution-cast after processing, in predetermined mould, obtains heat sink body after solidification.
The assembling of heat conduction main body, heat transfer body and heat sink body is obtained modular radiator.
Embodiment 3
The vanadium of the copper of 970g, the aluminium of 45g, the nickel of 3g, the vanadium of 12g, the manganese of 4g, the titanium of 3g, the chromium of 3g and 3g is mixed,
Then put in melting furnace, after fusing, obtain solution, then carry out the refinement treatment such as Dehydroepiandrosterone derivative and removing impurities process, then process
Solution-cast afterwards, in predetermined mould, obtains heat conduction main body after solidification.
The vanadium of the copper of 520g, the aluminium of 540g, the magnesium of 7g, the iron of 8g, the manganese of 5g, the titanium of 3g, the chromium of 1g and 3g is mixed,
Then put in melting furnace, after fusing, obtain solution, then carry out the refinement treatment such as Dehydroepiandrosterone derivative and removing impurities process, then process
Solution-cast afterwards, in predetermined mould, obtains heat transfer body after solidification.
By the aluminium of 880g, the silicon of 55g, the magnesium of 3g, the copper of 0.5g, the iron of 2g, the manganese of 2g, the titanium of 0.5g, 0.5g chromium with
And the vanadium mixing of 0.5g, then put in melting furnace, after fusing, obtain solution, then carry out the essence such as Dehydroepiandrosterone derivative and removing impurities process
System is processed, and the solution-cast after then processing, in predetermined mould, obtains heat sink body after solidification.
The assembling of heat conduction main body, heat transfer body and heat sink body is obtained modular radiator.
Heat-conductive characteristic test is carried out to the modular radiator of embodiment 1～3 preparation, the results are shown in Table 1.
Table 1
As it can be seen from table 1 embodiment 1～3 preparation the heat conduction main body of modular radiator, heat transfer body and dissipate
The heat-conductive characteristic of hot main body successively decreases successively, defines heat-conductive characteristic gradient, and, by having large specific surface area radiating
Heat is distributed in external environment condition by main body, compared to the modular radiator of fine copper, on the premise of guaranteeing heat dispersion, weight
It is greatly lowered；Compared to the modular radiators of aluminium alloy existing a large amount of on market, from upper table 1, heat dispersion is greatly
Strengthen.
Embodiment described above only have expressed the several embodiments of the present invention, and its description is more concrete and detailed, but simultaneously
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the guarantor of the present invention
Shield scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (7)
1. a kind of modular radiator is it is characterised in that include: heat conduction main body, heat sink body and several heat transfer body；
Described heat conduction main body includes several heat-conducting parts and several transition parts, and each described heat-conducting part connects described at least three
Transition part, each described heat-conducting part is connected to form one structure by described transition part, described heat-conducting part offer several first
Screw；
Described heat sink body include several radiating pieces and with several plug connectors, described radiating piece offers several
Two screws, described plug connector includes spiro union portion and the Access Division being connected with described spiro union portion, described spiro union portion and described second
Screwhole spiro bonding；
Described heat transfer body includes screw part, holding section and connecting portion, and described screw part and described holding section are fixed respectively
It is arranged on two ends of described connecting portion, described screw part is spirally connected with described first screw, and described Access Division is arranged in institute
State on holding section；
Described heat transfer body includes each component of following mass parts: 45 parts～52 parts of copper, 47 parts～54 parts of aluminium, magnesium 0.3 part～0.7
Part, 0.2 part～0.8 part of iron, 0.2 part～0.5 part of manganese, 0.05 part～0.3 part of titanium, 0.05 part～0.1 part of chromium and 0.05 part of vanadium
～0.3 part；
Described heat sink body includes each component of following mass parts: 88 parts～93 parts of aluminium, 5.5 parts～10.5 parts of silicon, 0.3 part of magnesium～
0.7 part, 0.05 part～0.3 part of copper, 0.2 part～0.8 part of iron, 0.2 part～0.5 part of manganese, 0.05 part～0.3 part of titanium, 0.05 part of chromium
～0.1 part and 0.05 part～0.3 part of vanadium.
2. modular radiator according to claim 1 it is characterised in that described transition part include First Transition portion with
And second transition part, at least several described heat-conducting parts and described First Transition portion is sequentially connected and surrounds a closing structure, some
Individual described heat-conducting part is all connected with described second transition part.
3. modular radiator according to claim 2 is it is characterised in that described First Transition portion, described second mistake
Cross and between portion and described heat-conducting part, form several breach.
4. modular radiator according to claim 1 it is characterised in that described radiating piece include radiating part, two
Arc wing plate, several main radiating fins and several auxiliary fins, two described arc wing plates are fixedly installed on respectively
The both sides of described radiating part, several described main radiating fins are arranged at intervals at the side of described radiating part, and several are described auxiliary
Radiating fin is arranged at intervals on described arc wing plate.
5. modular radiator according to claim 4 is it is characterised in that described second screw is opened in described radiating
In portion, described spiro union portion is spirally connected by described second screw and described radiating part.
6. modular radiator according to claim 1 is it is characterised in that arrange several peaces on described heat-conductive body
Dress position.
7. modular radiator according to claim 6 is it is characterised in that also include several LED lamps, several institutes
State LED lamp to be arranged on described installation position.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201133615Y (en) * | 2007-11-23 | 2008-10-15 | 孙威 | LED energy conserving lamp |
| CN201277450Y (en) * | 2008-05-23 | 2009-07-22 | 郑沈秀 | Combined semiconductor lamp |
| CN202253517U (en) * | 2011-10-18 | 2012-05-30 | 山东开元电子有限公司 | Assembled LED lamp radiator |
| CN103469034A (en) * | 2013-08-12 | 2013-12-25 | 安徽盛达前亮铝业有限公司 | LED radiator aluminum alloy and preparation method thereof |
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| JP5045784B2 (en) * | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
| CN102131371B (en) * | 2010-11-11 | 2014-03-26 | 华为技术有限公司 | Heat-conducting device and electronic device using same |
| CN102703773B (en) * | 2012-06-11 | 2014-04-16 | 东莞市闻誉实业有限公司 | Aluminum alloy plate and production process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201133615Y (en) * | 2007-11-23 | 2008-10-15 | 孙威 | LED energy conserving lamp |
| CN201277450Y (en) * | 2008-05-23 | 2009-07-22 | 郑沈秀 | Combined semiconductor lamp |
| CN202253517U (en) * | 2011-10-18 | 2012-05-30 | 山东开元电子有限公司 | Assembled LED lamp radiator |
| CN103469034A (en) * | 2013-08-12 | 2013-12-25 | 安徽盛达前亮铝业有限公司 | LED radiator aluminum alloy and preparation method thereof |
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