CN104098066A - Electrochemistry micro-nanomachining device - Google Patents
Electrochemistry micro-nanomachining device Download PDFInfo
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- CN104098066A CN104098066A CN201410346603.7A CN201410346603A CN104098066A CN 104098066 A CN104098066 A CN 104098066A CN 201410346603 A CN201410346603 A CN 201410346603A CN 104098066 A CN104098066 A CN 104098066A
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Abstract
The invention provides an electrochemistry micro-nanomachining device, and belongs to a nanometer machining device. The electrochemistry micro-nanomachining device solves the problems that an existing electrochemistry micro-nanomachining device is extremely high in cost and application of the electrochemistry machining technology is not perfect. A vibration isolation base comprises a tabletop, a support beam and a base body. The tabletop is fixedly arranged on the upper end face of the base body. The support beam is detachably arranged on the tabletop. An X-direction linear guide rail is fixedly and flat arranged on the tabletop. The support beam is arranged perpendicular to the X-direction linear guide rail. A horizontal rotating assembly is fixed to the X-direction linear guide rail. A horizontal adjustment part is fixed to the horizontal rotating assembly. A Y-direction linear guide rail is fixed to the front side face of the support beam. A Z-direction linear guide rail is fixed to the Y-direction linear guide rail. An electrode approach part is fixed to the Z-direction linear guide rail. The electrochemistry micro-nanomachining device has the advantages of being high in precision, good in machining effect and the like and is used for electrochemistry micro-nanomachining of workpieces.
Description
Technical field
The invention belongs to a kind of nanometer processing device, be specifically related to a kind of micro-nano process equipment that adopts method for electrochemical machining.
Background technology
Along with scientific and technical develop rapidly, microminiaturization is military and the total development trend of civilian research field.Development as large scale integrated circuit (ULSI), minute mechanical and electrical system (MEMS & NEMS), micro-total analysis system (μ-TAS) and precision optics, requires the size of each function element to reach micro-nano magnitude.Modern high-tech war requires weapon miniaturization, and as midget submarine, miniplane, micro missile etc., the component part of these new weapons requires its physical dimension to reach micron and even nanometer scale, and machining accuracy reaches nanometer scale.At civil area, take computer CPU chip as example, the characteristic line breadth of business-like super large integrated circuit reaches below 32nm.The manufacture of these parts or element needs various micro-nano process technologies, and therefore, development micro-nano process technology has become the heat subject of forefront, accurate manufacture field, the whole world, and has progressively formed on this basis a new industry---minute manufacturing.Usually, the industry demand of micro-nano process technology is embodied in following three aspects: the super-smooth surface of (1) nano-precision; (2) the 3 D complex structure of micro/nano-scale; (3) assembling of micro-nano device.
Electrochemistry micro-nano process technology, as one of micro-nano processing method, has without fuel factor, without residual stress, and precision is controlled, clearance is high, working (machining) efficiency is high, advantages of environment protection.Therefore, at micro-nano manufacture field, also occupy and consequence.The method that realizes the processing of electrochemistry micro-nano has: cathode electrodeposition (electroplating or electroforming), anodic solution, electrochemistry induction chemical etching technology.Electrochemical reaction occurs in Cathode/Solution Interface, owing to participating in the mass transfer in liquid phase process of the material of reaction, in interface solution one side, forms diffusion layer.Therefore, the key of control electrochemistry micro-/ nano machining accuracy is just to control the thickness of diffusion layer.Conventional electrochemistry micro-nano processing method has:
(1) scan-probe electrochemistry micro-nano process technology
electrochemical scanning tunneling microscopy(EC-STM) micro-nano processing method proposes in 1997 Nian You Kolb seminars: first on STM probe, be stained with Cu
2+solution, then move on on auri sheet and form copper nanocluster by electro-deposition.The electro-deposition in ionic liquid at room temperature environment of the Mao Bingwei of Xiamen University teach problem group has obtained the nanocluster pattern of active metal zinc and iron.The machining accuracy of the method is very high, and the diameter of cluster is generally other at Subnano-class, highly can be controlled at several nanometers.But it is very limited that the deficiency of its maximum is swash width, therefore process range scale very little.Schuster has proposed ultrashort potential pulse technology, this technology is by micro-/ nano electrode, electrod-array or approaches conductive substrates to be processed with the template of three-dimensional microstructures, between needle point and substrate, impose nanosecond potential pulse, only have the nearest workpiece position of the Distance tool that anodic solution occurs, thereby obtain the controlled microstructure of yardstick.This technology has distance sensitive, and machining accuracy is higher, but pointwise operating efficiency is low.
scan-type electrochemical microscope(SECM) be a kind of Scanning probe technique that ultramicroelectrode or nano-electrode be probe of take, by a three-dimensional Precision Position Location System, control the distance between probe electrode and processed substrate, by regional area between needle point and substrate, excite electrochemical reaction, can obtain various micro structured pattern.This technology space resolution ratio decreases, but chemical reactivity is enhanced, and has greatly expanded the object of micro-/ nano processing, becomes a kind of important micro-nano process technology.Scanning micro cell microscope (SECCM) is to utilize micro-drop of capillary tip to form and contact with electrically conductive workpiece, reference electrode, electrode is inserted in capillary with the processing substrate of conduction and forms micro cell, and using this micro cell as scan-probe.Because electrochemical reaction is limited in micro-drop, therefore the size of micro-drop has determined the precision of processing.
(2) mask electrochemistry micro-nano process technology
lIGAit is a kind of method of processing high-aspect-ratio micro/nano structure.The method first applies one deck photoresist in conductive substrates, by forming the micro/nano structure of high-aspect-ratio after photolithographic exposure, then at the photoresist template substrates metal that contains micro/nano structure, after removal photoresist, obtains metal micro/nano structure.The metal micro/nano structure obtaining can also be further used as the template of processing plastic and ceramic material workpiece.The depth-to-width ratio of LIGA processing can reach 10～50, and roughness is less than 50nm.But the X ray exposure light source of this utilization is expensive, and the depth-to-width ratio that uv-exposure technique obtains is lower.In addition, how in having compared with the photoresist micro/nano structure of high-aspect-ratio, realizing high-quality electroforming is also the problem that needs solution.
eFABa kind of micro-/ nano processing method that Adam professor Cohan of Shi You American South University of California proposes.First EFAB technology utilizes CAD that the three-dimensional micro/nano structure of target is resolved into easily by the multilayer two-dimension micro/nano structure of lithography process, then the micro/nano structure layer designing and sacrifice layer are deposited in two-dimentional photoresist template layer by layer, remove photoresist template and sacrifice layer metal just can obtain required micro/nano structure.But each electroformed layer requires high planarization, and chemically mechanical polishing (CMP) cost is high, and any alignment error between two-layer all will cause whole micro-/ nano work flow failure.
electrochemical nano stamping technique: AgS
2it is a kind of solid-state superionic conductors electrolyte with silver ion transmittability, when silver-colored surface of the work touches superionic conductors template, by apply certain voltage on workpiece, will there is silver-colored anodic solution in the junction of silver-colored surface of the work and template, and silver ion is at AgS
2in electrolyte, move, deposit to AgS
2template opposite side on electrode, thereby form nanostructured.But the solid electrolyte material that can be used for template construct is limited, bad mechanical strength, solid phase mass transfer rate is slow, and working (machining) efficiency is low.
(3) the electrochemical planarization technology of micro-nano precision
electrochemical polish(ECP) technology is to utilize principle that Anodic dissolves to realize the removal of material, can under the stressless condition of noncontact, realize efficient planarization, also can avoid producing the manufacturing deficiencies such as dielectric layer crackle, layering.But if machining gap is too small, easily cause both positive and negative polarity short circuit, affect the stability of technique, under current technical conditions, be difficult to realize the planarization process on submicron order surface precision surface.
electrochemical mechanical polishing(ECMP) technology is the planarization that Applied Materials company released in 2004.On the one hand, by electrochemical action, at finished surface, generate soft passivating film, under low polish pressure, with mechanism, remove fast this passivating film simultaneously; On the other hand, utilize the passivating film of electrochemical action formation to the protective effect at finished surface indentation position and porous polishing pad and the high selectivity removal effect of abrasive particle to finished surface protrusion position, can realize high-precision planarization.Yet, also cannot realize technically the processing of smoothization of high accuracy.
At present, electrochemistry micro-nano process technology with photoetching technique coupling, such as the dual damascene process of super large integrated circuit, the LIGA of minute mechanical and electrical system and EFAB technique, its process equipment is mainly expensive photoetching process equipment and chemical-mechanical polisher, and in fact its electrochemical process equipment be traditional electroforming and electroplating device.Electrochemical mechanical polishing is on the basis of chemical-mechanical polisher, to introduce anodised technique.In fact in this class technology, electrochemistry is just as one technique, is not directly by electrochemical method, to generate 3D micro-nano structure or super-smooth surface on strict.
To sum up, the development of existing electrochemistry micro-nano process equipment relatively lags behind.
Summary of the invention
In order to solve, existing electrochemistry micro-nano tooling cost is too high, electrochemistry process technology is applied incomplete problem in the present invention, and then the electrochemistry micro-nano that a kind of cost is low, effect good, precision is high process equipment is provided.
The present invention solves the problems of the technologies described above the technical scheme of taking to be: omit temporarily
The invention has the beneficial effects as follows: simple in structure, kinematic accuracy is high, effect is good, kinematic accuracy is high, and wherein, X, Y-direction line slideway stroke are 100mm, total travel linearity is better than 0.2 μ m, feeding resolution 10nm, can reach ± 0.5 μ m of repetitive positioning accuracy.Z-direction line slideway stroke is 100mm, and position resolution can reach 1 μ m, and positioning precision is higher than 5 μ m.Horizontally rotate assembly radially rotating accuracy be better than 0.5 μ m, axially rotating accuracy is better than 0.2 μ m.Electrode approaches assembly stroke 50 μ m, and position resolution is better than 0.5nm, and horizontal adjustment parts are adjusted resolution ratio and are better than 0.1 °, easy to operate, control simply, adopt electrochemical method to process completely.
Accompanying drawing explanation
Fig. 1 is the stereogram of electrochemistry micro-nano process equipment of the present invention, Fig. 2 is the front view of Fig. 1, Fig. 3 is the top view of Fig. 1, and Fig. 4 is the left view of Fig. 1, and Fig. 5 is the front view of vibro-damping mount 1, Fig. 6 is the top view of Fig. 5, Fig. 7 is the left view of Fig. 5, and Fig. 8 is the front view that electrode approaches parts 7, and Fig. 9 is the top view of Fig. 8, Figure 10 is the left view of Fig. 8, and Figure 11 is control system Organization Chart.
Component names in figure and label are as follows respectively:
Vibro-damping mount 1, table top 1-1, rack beam 1-2, pedestal 1-3, X-direction line slideway 2, X-direction base plate 2-1, X-direction guide rail 2-2, X-direction workbench 2-3, horizontally rotate assembly 3, rotating bottom board 3-1, rotary table 3-2, horizontal adjustment parts 4, adjustment component base plate 4-1, elastic support sheet 4-2, adjust knob 4-3, horizontal table 4-4, electrolyte container 4-5, workpiece 4-6, Y-direction line slideway 5, Y-direction base plate 5-1, Y-direction guide rail 5-2, Y-direction workbench 5-3, Z-direction line slideway 6, servomotor 6-1, ball-screw 6-2, Z-direction base plate 6-3, Z-direction guide rail 6-4, Z-direction workbench 6-5, electrode approaches assembly 7, PZT driver 7-1, sensor support base 7-2, power sensor 7-3, machined electrode 7-4, control system 8, liquid crystal touch screen industrial computer 8-1, A3200 motion controller 8-2.
The specific embodiment
As shown in Fig. 1 ~ 11, the electrochemistry micro-nano process equipment of present embodiment, it comprises vibro-damping mount 1, X-direction line slideway 2, horizontally rotate assembly 3, horizontal adjustment parts 4, Y-direction line slideway 5, Z-direction line slideway 6, electrode approaches assembly 7, described vibro-damping mount 1 comprises table top 1-1, rack beam 1-2 and pedestal 1-3, described table top 1-1 is fixedly mounted on pedestal 1-3 upper surface, on described table top 1-1, rack beam 1-2 is detachably installed, described X-direction line slideway 2 fixedly lies against on table top 1-1, described rack beam 1-2 arranges perpendicular to X-direction line slideway 2, the described assembly 3 that horizontally rotates is fixed on X-direction line slideway 2, described horizontal adjustment parts 4 are fixed on and horizontally rotate on assembly 3, described Y-direction line slideway 5 is fixed on the leading flank of rack beam 1-2, described Z-direction line slideway 6 is fixed on Y-direction line slideway 5, described electrode approaches parts 7 and is fixed on Z-direction line slideway 6.Wherein vibro-damping mount 1 is supportive body, by vibro-damping mount 1, is supported X-direction line slideway 2, Y-direction line slideway 5, Z-direction line slideway 6, is horizontally rotated assembly 3, horizontal adjustment parts 4 and electrode and approach parts 7.Described table top 1-1 is upper is provided with two groups of rectangular array screwed holes along X-direction, the two ends of rack beam 1-2 are threaded with corresponding rectangular array screwed hole by screw, and the object that two groups of rectangular array screwed holes are set is to be convenient to rack beam 1-2 along the adjustment of directions X position.On table top 1-1, be also provided with wiring hole, for the layout of wiring.
Described X-direction line slideway 2 comprises X-direction base plate 2-1, X-direction guide rail 2-2, X-direction workbench 2-3, described table top 1-1 is provided with the screwed hole of rectangular array arrangement, screwed hole and the X-direction base plate 2-1 of described X-direction base plate 2-1 by described rectangular array removably connect (can regulate X-direction line slideway 2 along the position of Y-direction), described X-direction guide rail 2-2 is fixed on X-direction base plate 2-1, it is upper that described X-direction workbench 2-3 is arranged on X-direction guide rail 2-2, and X-direction workbench 2-3 and X-direction guide rail 2-2 are slidably matched.
Described Y-direction line slideway 5 comprises Y-direction base plate 5-1, Y-direction guide rail 5-2, Y-direction workbench 5-3, described Y-direction base plate 5-1 is fixed on the leading flank of rack beam 1-2, Y-direction guide rail 5-2 is fixed on Y-direction base plate 5-1, it is upper that Y-direction workbench 5-3 is arranged on Y-direction guide rail 5-2, and Y-direction workbench 5-3 and Y-direction guide rail 5-2 are slidably matched.
Described Z-direction line slideway 6 comprises servomotor 6-1, ball-screw 6-2, Z-direction base plate 6-3, Z-direction guide rail 6-4, Z-direction workbench 6-5, described Z-direction base plate 6-3 is fixed on Y-direction workbench 5-3, described Z-direction guide rail 6-4 is fixed on Z-direction base plate 6-3, described Z-direction workbench 6-5 is arranged on Z-direction guide rail 6-4, Z-direction workbench 6-5 and Z-direction guide rail 6-4 are slidably matched, Z-direction workbench 6-5 is fixed on the lower end of ball-screw 6-2, ball-screw 6-2 is connected with servomotor 6-1, and servomotor 6-1 is fixed on the upper end of rack beam 1-2; When servomotor 6-1 drives ball-screw 6-2 to rotate, drive Z-direction workbench 6-5 to move along Z-direction guide rail 6-4, realize the position adjustments of Z direction.
The described assembly 3 that horizontally rotates comprises rotating bottom board 3-1, rotary table 3-2, and described rotating bottom board 3-1 is fixed on the upper surface of X-direction workbench 2-3, and the lower end of rotary table 3-2 is horizontally rotated and is arranged on rotating bottom board 3-1 by bearing.
Described horizontal adjustment parts 4 comprise adjustment component base plate 4-1, elastic support sheet 4-2, adjust knob 4-3, horizontal table 4-4, electrolyte container 4-5, described adjustment component base plate 4-1 is fixed on the upper end of rotary table 3-2, described horizontal table 4-4 be arranged on adjustment component base plate 4-1 directly over, described elastic support sheet 4-2 is arranged between adjustment component base plate 4-1 and horizontal table 4-4, electrolyte container 4-5 is arranged on horizontal table 4-4, the upper surface of adjustment component base plate 4-1 is provided with screwed hole, described adjustment knob 4-3 is arranged between adjustment component base plate 4-1 and horizontal table 4-4, the end of thread of adjusting knob 4-3 is threaded with the screwed hole of adjustment component base plate 4-1.
When horizontal table 4-4 is out-of-level, by rotation, adjust knob 4-3, can realize the horizontal adjustment of horizontal table 4-4.
Described electrode approaches parts 7 and comprises PZT driver 7-1, sensor support base 7-2, power sensor 7-3, machined electrode 7-4, described PZT driver 7-1 is arranged on Z-direction workbench 6-5, described sensor support base 7-2 is arranged on PZT driver 7-1, one end and the sensor support base 7-2 of described power sensor 7-3 are connected, and the other end of power sensor 7-3 is provided with machined electrode 7-4.
Described electrochemistry micro-nano process equipment also comprises control system 8, and described control system 8 is fixed on the below in vibro-damping mount 1, and described control system 8 comprises liquid crystal touch screen industrial computer 8-1, A3200 motion controller 8-2, multidimensional interlock is housed in described liquid crystal touch screen industrial computer 8-1 and controls software, this software of microprocessor operation panel operation on liquid crystal touch screen industrial computer 8-1 is controlled and is operated A3200 motion controller 8-2, described A3200 motion controller 8-2 respectively with X-direction line slideway 2, Y-direction line slideway 5, Z-direction line slideway 6, electrode approaches assembly 7, horizontally rotating assembly 4 connects, A3200 motion controller 8-2 sends to respectively X-direction line slideway 2 by control signal, Y-direction line slideway 5, Z-direction line slideway 6, electrode approaches assembly 7, horizontally rotate assembly 4, the real time information that A3200 motion controller 8-2 collects above assembly and guide rail feeds back to liquid crystal touch screen industrial computer 8-1, and shown by liquid crystal touch screen industrial computer 8-1 multidimensional interlock control software.Can realize the functions such as high-precision motion control and on-line measurement, A3200 motion controller, with powerful motion control software, has good extensibility.
Control procedure:
Under control system 8 is controlled, X-direction workbench 2-3 can move along X-direction guide rail 2-2, realizes the position adjustments of directions X.At this moment be arranged on and horizontally rotate the also motion thereupon of assembly 3 and horizontal adjustment parts 4 on X-direction line slideway 2, horizontal adjustment parts 4 are mounted in and horizontally rotate on assembly 3.
Under the control of control system 8, rotary table 3-2 can horizontally rotate, thereby reconciles the relative position of workpiece 4-6 and machined electrode 7-4, is at this moment arranged on the also motion thereupon of horizontal adjustment parts 4 horizontally rotating on assembly 3.
Under the control of control system 8, Y-direction workbench 5-3 can move along Y-direction guide rail 5-2, realizes the position adjustments of Y-direction.At this moment the Z-direction line slideway 6 and the electrode that are arranged on Y-direction line slideway 5 approach also motion thereupon of parts 7.
When servomotor 6-1 drives ball-screw 6-2 to rotate, drive Z-direction workbench 6-5 to move along Z-direction guide rail 6-4, realize the position adjustments of Z direction, at this moment the electrode on Z-direction workbench 6-5 approaches also motion thereupon of parts 7.
Under the control of control system 8, PZT driver 7-1 can realize high accuracy straight line microfeed, thereby has realized the process that machined electrode 7-4 approaches workpiece 4-6 surface.When machined electrode 7-4 and workpiece 4-6 surface come in contact, due to the effect of contact force, power sensor 7-3 will detect force feedback signal, stops the driving signal of PZT driver 7-1, thereby the real-time online of realizing process detects and automation adjustment.
Electrochemistry micro-nano process equipment adopts the T-shaped layout of planer-type, and moving horizontally of X and Y-direction is separated, has avoided the error coupling of two guide rails.
The whole workflow of electrochemistry micro-nano process equipment of the present invention is as follows:
The mode that process adopts coarse adjustment, fine setting to combine is approached workpiece 4-6 work surface, and cooperation detects activation signal constantly with power sensor 7-3.Starting stage, first utilize electrode to approach parts 7 and realize fine setting, and in decline process, by power sensor 7-3, detect machined electrode 7-4 head constantly and whether come in contact with workpiece 4-6 work surface, if dropped to total length and do not come in contact yet, having regained machined electrode 7-4.And utilizing Z-direction line slideway 6 guide rails to realize coarse adjustment, coarse range should be less than fine setting distance, to avoid machined electrode 7-4 head and workpiece 4-6 work surface in coarse adjustment process to bump.After treating coarse adjustment, then finely tune, until power sensor 7-3 detects activation signal in trim process, just stop continue declining, in order to avoid damage machined electrode 7-4 head, and change into and moving upward, reach correct position and complete electrochemistry processing.
The all outsourcing piece models of this electrochemistry micro-nano process equipment, manufacturer and corresponding parts are as follows:
The A3200 motion controller of control system 8:Aerotech company;
The ABL20010 of X-direction line slideway 2:Aerotech company;
The ABL15010 of Y-direction line slideway 5:Aerotech company;
The ATS100-100 of Z-direction line slideway 6:Aerotech company;
Horizontally rotate the ABRS-150MP of assembly 3:Aerotech company;
Horizontal adjustment parts 4: the AIS-100B of Sigma ray machine Co., Ltd.;
PZT driver 7-1: the XP-633.1SL of core Science and Technology Ltd.'s tomorrow;
Power sensor 7-3: the FAB-6 type parallel girder load sensor of Shenzhen Jie Yingte sensor apparatus company.
Claims (8)
1. an electrochemistry micro-nano process equipment, it is characterized in that: it comprises vibro-damping mount (1), X-direction line slideway (2), horizontally rotate assembly (3), horizontal adjustment parts (4), Y-direction line slideway (5), Z-direction line slideway (6), electrode approaches assembly (7), described vibro-damping mount (1) comprises table top (1-1), rack beam (1-2) and pedestal (1-3), described table top (1-1) is fixedly mounted on pedestal (1-3) upper surface, rack beam (1-2) is detachably installed on described table top (1-1), described X-direction line slideway (2) fixedly lies against on table top (1-1), described rack beam (1-2) arranges perpendicular to X-direction line slideway (2), the described assembly (3) that horizontally rotates is fixed on X-direction line slideway (2), described horizontal adjustment parts (4) are fixed on and horizontally rotate on assembly (3), described Y-direction line slideway (5) is fixed on the leading flank of rack beam (1-2), described Z-direction line slideway (6) is fixed on Y-direction line slideway (5), described electrode approaches parts (7) and is fixed on Z-direction line slideway (6).
2. electrochemistry micro-nano process equipment according to claim 1, it is characterized in that: described X-direction line slideway (2) comprises X-direction base plate (2-1), X-direction guide rail (2-2), X-direction workbench (2-3), described table top (1-1) is provided with the screwed hole of rectangular array arrangement, described X-direction base plate (2-1) removably connects by screwed hole and the X-direction base plate 2-1 of described rectangular array, described X-direction guide rail (2-2) is fixed on X-direction base plate (2-1), described X-direction workbench (2-3) is arranged on X-direction guide rail (2-2), X-direction workbench (2-3) is slidably matched with X-direction guide rail (2-2).
3. electrochemistry micro-nano process equipment according to claim 2, it is characterized in that: described Y-direction line slideway (5) comprises Y-direction base plate (5-1), Y-direction guide rail (5-2), Y-direction workbench (5-3), described Y-direction base plate (5-1) is fixed on the leading flank of rack beam (1-2), Y-direction guide rail (5-2) is fixed on Y-direction base plate (5-1), it is upper that Y-direction workbench (5-3) is arranged on Y-direction guide rail (5-2), and Y-direction workbench (5-3) is slidably matched with Y-direction guide rail (5-2).
4. electrochemistry micro-nano process equipment according to claim 3, it is characterized in that: described Z-direction line slideway (6) comprises servomotor (6-1), ball-screw (6-2), Z-direction base plate (6-3), Z-direction guide rail (6-4), Z-direction workbench (6-5), described Z-direction base plate (6-3) is fixed on Y-direction workbench (5-3), described Z-direction guide rail (6-4) is fixed on Z-direction base plate (6-3), described Z-direction workbench (6-5) is arranged on Z-direction guide rail (6-4), Z-direction workbench (6-5) is slidably matched with Z-direction guide rail (6-4), Z-direction workbench (6-5) is fixed on the lower end of ball-screw (6-2), ball-screw (6-2) is connected with servomotor (6-1), servomotor (6-1) is fixed on the upper end of rack beam (1-2), when servomotor (6-1) drives ball-screw (6-2) to rotate, drive Z-direction workbench (6-5) along Z-direction guide rail (6-4) motion, realize the position adjustments of Z direction.
5. electrochemistry micro-nano process equipment according to claim 1, it is characterized in that: the described assembly (3) that horizontally rotates comprises rotating bottom board (3-1), rotary table (3-2), described rotating bottom board (3-1) is fixed on the upper surface of X-direction workbench (2-3), and the lower end of rotary table (3-2) is horizontally rotated and is arranged on rotating bottom board (3-1) by bearing.
6. electrochemistry micro-nano process equipment according to claim 5, it is characterized in that: described horizontal adjustment parts (4) comprise adjustment component base plate (4-1), elastic support sheet (4-2), adjust knob (4-3), horizontal table (4-4), electrolyte container (4-5), described adjustment component base plate (4-1) is fixed on the upper end of rotary table (3-2), described horizontal table (4-4) be arranged on adjustment component base plate (4-1) directly over, described elastic support sheet (4-2) is arranged between adjustment component base plate (4-1) and horizontal table (4-4), electrolyte container (4-5) is arranged on horizontal table (4-4), the upper surface of adjustment component base plate (4-1) is provided with screwed hole, described adjustment knob (4-3) is arranged between adjustment component base plate (4-1) and horizontal table (4-4), the end of thread of adjusting knob (4-3) is threaded with the screwed hole of adjustment component base plate (4-1).
7. electrochemistry micro-nano process equipment according to claim 1, it is characterized in that: described electrode approaches parts (7) and comprises PZT driver (7-1), sensor support base (7-2), power sensor (7-3), machined electrode (7-4), described PZT driver (7-1) is arranged on Z-direction workbench (6-5), described sensor support base (7-2) is arranged on PZT driver (7-1), one end and the sensor support base (7-2) of described power sensor (7-3) are connected, and the other end of power sensor (7-3) is provided with machined electrode (7-4).
8. according to the electrochemistry micro-nano process equipment described in any one in claim 1 to 7, it is characterized in that: described electrochemistry micro-nano process equipment also comprises control system (8), described control system (8) is fixed on the below in vibro-damping mount (1), and described control system (8) comprises liquid crystal touch screen industrial computer (8-1), A3200 motion controller (8-2), multidimensional interlock is housed in described liquid crystal touch screen industrial computer (8-1) and controls software, this software of microprocessor operation panel operation on liquid crystal touch screen industrial computer (8-1) is controlled and is operated A3200 motion controller (8-2), described A3200 motion controller (8-2) respectively with X-direction line slideway (2), Y-direction line slideway (5), Z-direction line slideway (6), electrode approaches assembly (7), horizontally rotating assembly (4) connects, A3200 motion controller (8-2) sends to respectively X-direction line slideway (2) by control signal, Y-direction line slideway (5), Z-direction line slideway (6), electrode approaches assembly (7), horizontally rotate assembly (4), the real time information that A3200 motion controller (8-2) is collected above assembly and guide rail feeds back to liquid crystal touch screen industrial computer (8-1), and shown by liquid crystal touch screen industrial computer (8-1) multidimensional interlock control software.
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| CN106801248A (en) * | 2017-02-03 | 2017-06-06 | 中山大学 | The preparation facilities and method of a kind of three-dimensional micro-nano structure device |
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