CN104097152A - Grinding stone used for grinding of high-hardness brittle materials - Google Patents
Grinding stone used for grinding of high-hardness brittle materials Download PDFInfo
- Publication number
- CN104097152A CN104097152A CN201410148164.9A CN201410148164A CN104097152A CN 104097152 A CN104097152 A CN 104097152A CN 201410148164 A CN201410148164 A CN 201410148164A CN 104097152 A CN104097152 A CN 104097152A
- Authority
- CN
- China
- Prior art keywords
- grinding
- grinding stone
- abrasive particle
- abrasive grain
- high rigidity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention provides a grinding stone used for grinding of high-hardness brittle materials. The grinding stone used for grinding is suitable for performing grinding with high precision, high efficiency and stable grinding capacity for high-hardness brittle materials such as sapphire and SiC by controlling force acting on grains and dropping of the grains during processing. The grinding stone (1) used for grinding of high-hardness brittle materials is characterized by comprising a grain layer (10) of which grain concentration ratio is adjusted so that the number of diamond grains (11) existing on a grain layer surface (10a) contacted with a ground material of the high-hardness brittle material is 1-5000 per square centimeter, and the strength of a binder (12) for holding the diamond grains (11) is 100-200 MPa.
Description
Technical field
The grinding grinding stone of the high rigidity fragile material of sapphire, SiC etc. that substrate that the present invention relates to LED etc. uses.
Background technology
Along with the illumination of LED in recent years need increase, demand high efficiency, high-precision sapphire, SiC grinding grinding stone.For example, in patent documentation 1, proposed a kind of can by the substrate peripheral part of sapphire, carborundum etc. with stable grinding capacity high accuracy and long-life carry out the wheeled grindstone of chamfer machining.This grindstone, diamond abrasive grain layer is fragment (segment) structure, and the total length of each fragment length is made as to A, when the length summation that is arranged at each intersegmental clearance portion is made as to B, makes B/A be greater than 0.
In addition, in patent documentation 2, proposed a kind of by the substrate peripheral part of sapphire, carborundum etc. with stable grinding capacity high accuracy and hole expeditiously cup grinding stone.This glass of grinding stone is made as the segments of installation more than 14, fragment and the intersegmental interval area of sheet is made as more than 40% with respect to the area of fragment, and the concentration degree of the diamond abrasive grain of fragment is made as below 20.In an embodiment, the cup grinding stone that to have recorded concentration degree be 12.5～30.0.
In addition, in patent documentation 3, record a kind of method for grinding of sapphire substrate, comprise and use the 1st bonded-abrasive to carry out the operation of grinding, the operation that uses the 2nd bonded-abrasive to carry out grinding to the 1st face of sapphire substrate to the 1st face of sapphire substrate, the 2nd bonded-abrasive has than the little average grain diameter of the 1st bonded-abrasive.As a mode of abrasive particle, record as approximately 0.5 volume % is above and approximately 25 volume % are following, mode (with reference to paragraph [0033]) between approximately 1.0 volume % and approximately 15 volume %, approximately 2.0 volume % and approximately 10 volume %.
If make the super abrasive particle grinding stone High Rotation Speed of ciamond grinder, CBN grinding stone etc. carry out grinding to workpiece,, in wearing and tearing gradually in abrasive particle top, the binding agent of bonded-abrasive is pruned bit by bit by chip.Its result, the binding agent of abrasive particle and/or its periphery is pruned to be retreated, end-of-life Grain Falling Off, the new abrasive particle head that underlaps.By such authigenesis, can utilize grinding stone grinding object.
On the other hand, abrasive particle is firmly held by binder matrix, if but with respect to the power applying, the confining force of binding agent is insufficient, and abrasive particle comes off before the life-span exhausts sometimes.In situation using diamond as abrasive particle, between grinding stone and workpiece in grinding, always the top of abrasive particle maintains sharp state, if abrasive particle confining force is poor, although sometimes abrasive particle be the state that can also use, but whole abscission.Become the abrasive particle of section, if there is come off, burst (shedding) of abrasive particle, not only uneconomical, also because the surface of grinding stone outstanding " sword " itself disappears, thereby can not bring into play the performance of grinding stone.
In addition, wear and tear by using in the top of grinding stone, insufficient if binding agent retreats, and the abrasive particle that has reached the life-span can not come off and planarization occurs, and forms so-called " passivation ".This passivation retreats inappropriate situation resulting from binding agent, and the vickers hardness hv 1(load=9.807N of sapphire, SiC etc.) lower 20GPa is above, Young's modulus 400GPa is above, Fracture Toughness is
when following high rigidity fragile material, wanting the much higher hard of workpiece of processing, therefore abrasive particle is kept out in situation incessantly and is occurred.
Super abrasive particle grinding stone is according to the function of workpiece and/or requirement, respectively on affect acutance abrasive particle, affect acutance maintains, abrasive particle is fixing binding agent, affect the pore that chip flees from and control to design, so that unfavorable condition as above is not occurred.In the past, for the such high rigidity fragile material of sapphire is processed, as shown in known document, general application adopted the processing method of diamond abrasive grain.Grinding stone is by the granularity of diamond abrasive grain, abrasive particle, decide for the combination of multiple key elements such as intensity, the concentration degree of abrasive particle of kind, combination of the bonding agent that keeps abrasive particle, in the case of the such high rigidity fragile material of sapphire is ground, need to there is the grinding stone being suitable for as the performance of the state of the material surface of target.
Formerly technical literature
Patent documentation 1: TOHKEMY 2008-36771 communique
Patent documentation 2: TOHKEMY 2008-12606 communique
Patent documentation 3: Japanese Unexamined Patent Application Publication 2010-514580 communique
Summary of the invention
But, the high rigidity fragile material of sapphire etc. be it be unclear that as the grinding principle of being cut in the situation that material carries out.Therefore, actual conditions are that grinding performance is unstable, shortage repeatability, and grinding capacity is insufficient, completion proterties is also bad.In addition, the grinding demand of the such high rigidity fragile material of sapphire, SiC was not so much in the past, and therefore, spended time carries out just much of that, but universal rapidly along with recent LED expects that this substrate uses sapphire with high efficiency, high-precision grinding.
Therefore, in the present invention, object is to provide a kind of grinding grinding stone of high rigidity fragile material, this grinding grinding stone is that the power and the coming off of abrasive particle that are applicable to by act on abrasive particle man-hour to adding are controlled, and sapphire, the such high rigidity fragile material of SiC are ground with stable grinding capacity high accuracy, expeditiously.
In the past, general ciamond grinder be granularity #230(average grain diameter approximately 74 μ m), abrasive particle concentration degree is 40～100.This is in order to make abrasive particle carry out work, come off and the new abrasive particle of appearance that changes, to determine in experience.The present inventors fundamentally re-recognize such idea, and being present in the abrasive particle quantity of being cut the abrasive grain layer surface that material contacts of expecting making in the past not studying completely becomes 1～5000/cm
2adjust like that abrasive particle concentration degree, and considering can be by this with keep the intensity of binding agent of abrasive particle to control, carry out the grinding for the high rigidity fragile material of sapphire etc., thereby completed the present invention.
That is, the grinding grinding stone of high rigidity fragile material of the present invention, is characterized in that, has and has adjusted abrasive particle concentration degree to make becoming 1～5000/cm with the quantity of being cut the diamond abrasive grain that abrasive grain layer surface that material contacts exists of high rigidity fragile material
2abrasive grain layer, and to keep the intensity of binding agent of diamond abrasive grain be 100～200MPa.Moreover, abrasive particle concentration degree represents that (concentration degree 200 is 50% for the volume containing ratio of abrasive particle, concentration degree 100 is 25%), m) descend the ciamond grinder of abrasive particle concentration degree 40～100 at granularity #230(average grain diameter approximately 74 μ in the past, the quantity of the diamond abrasive grain on abrasive grain layer surface is 6000～12000/cm
2left and right.According to the present invention, diamond abrasive grain is invaded the material of being cut of high rigidity fragile material dearly, even also can carry out grinding with underload under high-speed pushing, and authigenesis plays a role effectively, can carry out continuous grinding with stable load.
Moreover the quantity of the diamond abrasive grain on abrasive grain layer surface exceedes 5000/cm
2time, add the power that applies man-hour and disperse and reduce on an abrasive particle, do not invade the material of being cut of high rigidity fragile material, abrasive wear and become can not grinding.Being cut material and carried out in the situation of grinding high rigidity fragile material, diamond abrasive grain is being cut the surface sliding of material, but the grinding grinding stone of high rigidity fragile material of the present invention, by being reduced to 1～5000/cm with this quantity of being cut the diamond abrasive grain that abrasive grain layer surface that material contacts exists
2thereby, guarantee the degree of depth that diamond abrasive grain is cut.
In addition, even be 1～5000/cm in the quantity of diamond abrasive grain
2situation under, if adhesive strength exceedes 200MPa,, owing to keeping the power of diamond abrasive grain large, the authigenesis of abrasive particle does not play a role, and becomes because processing causes the bit by bit maintained state of worn out abrasive particle, becoming soon can not grinding.In addition, adhesive strength during lower than 100MPa, keeps the power of abrasive particle too small, can not bring into play the performance of grinding stone.
According to the present invention, can obtain being applicable to by high rigidity fragile material such to sapphire, SiC with stable grinding capacity high accuracy, the grinding grinding stone of the high rigidity fragile material that grinds expeditiously.
Brief description of the drawings
Fig. 1 is the figure that represents the grinding grinding stone of the high rigidity fragile material in embodiments of the present invention.
Description of reference numerals
1 grinding grinding stone
2 parent metals
3 fragment grinding stones
4 grinding planes
10 abrasive grain layers
10a abrasive grain layer surface
11 ciamond grinders
12 binding agents
Detailed description of the invention
Fig. 1 expresses the grinding stone 1 for grinding of the high rigidity fragile material in embodiments of the present invention.Multiple fragment grinding stones 3 that this grinding possesses metal discoideus parent metal 2 and fixes along the outer peripheral edges of parent metal 2 with grinding stone 1.Fragment grinding stone 3, forms to the outstanding ring-type grinding plane 4 of one side side (direction (top of figure) parallel with axis of rotation).
Fragment grinding stone 3 has has adjusted abrasive particle concentration degree to make becoming 1～5000/cm with the quantity of being cut the diamond abrasive grain 11 that abrasive grain layer surface 10a that material contacts exists of high rigidity fragile material
2abrasive grain layer 10.Moreover the abrasive grain layer surface 10a of each fragment grinding stone 3 is 1cm
2the roughly rectangle of left and right, preferably at least exists 1 Ge Bing center to have 1 diamond abrasive grain 11 at each angle at four angles, this situation is at least 5/cm
2above.In addition, from the durability aspect with respect to machining load, be preferably made as 100/cm
2above, be more preferably made as 500/cm
2above.On the other hand, be above limited to 5000/cm
2below, be preferably made as 4500/cm
2below, be more preferably made as 4000/cm
2below.In addition, keep the intensity of the binding agent 12 of diamond abrasive grain 11 to be made as 100～200MPa.Moreover the binding agent 12 in present embodiment is metal adhesive, as long as but the intensity that can obtain same degree other binding agent is also passable.
This is grinding stone 1 for grinding, what diamond abrasive grain 11 was invaded high rigidity fragile material dearly is cut material, even if high-speed pushing also can carry out grinding with underload, and authigenesis plays a role effectively, can carry out continuous grinding with stable load, be applicable to high rigidity fragile material such to sapphire, SiC with stable grinding capacity high accuracy, grind expeditiously.
Embodiment
Grinding in the embodiment of the invention described above is compared with grinding stone 1 and grinding grinding stone in the past.The grinding stone 1 for grinding of the present embodiment, by average grain diameter approximately 74 μ m(#230) diamond abrasive grain 11 respectively using concentration degree 20(embodiment 1), 30(embodiment 2) with mix as the metal adhesive of binding agent 12, carried out sintering.In addition, as a comparative example, by average grain diameter approximately 74 μ m(#230) diamond abrasive grain mix with metal adhesive with concentration degree 40, carried out sintering.By sintering fragment grinding stone be bonded in parent metal effects on surface and grind, formed surperficial abrasive particle number and be respectively 3800/cm
2(embodiment 1), 5000/cm
2(embodiment 2), 5500/cm
2(comparative example 1), 6000/cm
2the grinding grinding stone of (comparative example 2).
This grinding is arranged on longitudinal axis flat surface grinding dish with grinding stone, to having carried out grinding with 4 inches of sapphire wafers of the circle-shaped thickness 900 μ m that arranged on the table 4 pieces.The grinding of embodiment 1,2, with in grinding stone, is also stably passed even process velocity is brought up to 400 μ m/ minute machining loads, wafer do not burn until skiving to thickness 300 μ m.
On the other hand, the grinding of comparative example 1 is with in grinding stone, and machining load is unstable, passing up and down, has produced several pieces of wafers that burn.In addition, adopt the grinding grinding stone of comparative example 2, in the case of carrying out grinding with the process velocity of 100 μ m/ minutes, in processing way, load and rise, can not continue grinding.Now, grinding becomes worn out state with the abrasive particle of grinding face, wafer become burn variable color state.
In industry, utilize possibility
The grinding grinding stone of high rigidity fragile material of the present invention, is applicable to high rigidity fragile material such to sapphire, SiC with stable grinding capacity high accuracy, grinds expeditiously.
Claims (1)
1. a grinding grinding stone for high rigidity fragile material, has and has adjusted abrasive particle concentration degree to make becoming 1～5000/cm with the quantity of being cut the diamond abrasive grain that abrasive grain layer surface that material contacts exists of high rigidity fragile material
2abrasive grain layer, and to keep the intensity of the binding agent of described diamond abrasive grain be 100～200MPa.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013085119A JP2014205225A (en) | 2013-04-15 | 2013-04-15 | Grinding abrasive wheel for high-hardness brittle material |
| JP2013-085119 | 2013-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104097152A true CN104097152A (en) | 2014-10-15 |
Family
ID=51665898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410148164.9A Pending CN104097152A (en) | 2013-04-15 | 2014-04-15 | Grinding stone used for grinding of high-hardness brittle materials |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014205225A (en) |
| KR (1) | KR20140123906A (en) |
| CN (1) | CN104097152A (en) |
| TW (1) | TW201501870A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108698202A (en) * | 2016-02-22 | 2018-10-23 | 联合材料公司 | Abrasive material tools |
| CN109746842A (en) * | 2017-11-06 | 2019-05-14 | 株式会社迪思科 | It is ground emery wheel |
| CN110125822A (en) * | 2019-04-29 | 2019-08-16 | 宁波大学 | Fixed grinding tool and preparation method thereof for sapphire substrate wafer grinding |
| CN113329846A (en) * | 2019-02-01 | 2021-08-31 | 株式会社则武 | Metal bond grindstone for high-hardness brittle material |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2762661B2 (en) * | 1990-03-15 | 1998-06-04 | 三菱マテリアル株式会社 | Porous metal bond whetstone and method of manufacturing the same |
| JPH07241773A (en) * | 1994-03-03 | 1995-09-19 | Ryobi Ltd | Manufacture of electrodeposited grinding wheel |
| JP3770712B2 (en) * | 1997-09-29 | 2006-04-26 | 株式会社ノリタケスーパーアブレーシブ | Super abrasive wheel and method for manufacturing the same |
| JP2003011065A (en) * | 2001-06-29 | 2003-01-15 | Fujimi Inc | Grinding wheel, manufacturing method therefor, and grinding method by use of the same |
| JP5506141B2 (en) * | 2006-04-18 | 2014-05-28 | 新日鐵住金株式会社 | Rotating grinding tool excellent in rust removal and substrate adjustment of weathering steel, manufacturing method thereof, and substrate adjustment method of weathering steel using the same |
-
2013
- 2013-04-15 JP JP2013085119A patent/JP2014205225A/en active Pending
-
2014
- 2014-03-27 TW TW103111456A patent/TW201501870A/en unknown
- 2014-04-10 KR KR1020140042858A patent/KR20140123906A/en not_active Application Discontinuation
- 2014-04-15 CN CN201410148164.9A patent/CN104097152A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108698202A (en) * | 2016-02-22 | 2018-10-23 | 联合材料公司 | Abrasive material tools |
| CN108698202B (en) * | 2016-02-22 | 2021-06-04 | 联合材料公司 | Abrasive tool |
| US11819979B2 (en) | 2016-02-22 | 2023-11-21 | A.L.M.T. Corp. | Abrasive tool |
| CN109746842A (en) * | 2017-11-06 | 2019-05-14 | 株式会社迪思科 | It is ground emery wheel |
| CN113329846A (en) * | 2019-02-01 | 2021-08-31 | 株式会社则武 | Metal bond grindstone for high-hardness brittle material |
| CN113329846B (en) * | 2019-02-01 | 2024-01-02 | 株式会社则武 | Metal bond grindstone for high-hardness brittle material |
| CN110125822A (en) * | 2019-04-29 | 2019-08-16 | 宁波大学 | Fixed grinding tool and preparation method thereof for sapphire substrate wafer grinding |
| CN110125822B (en) * | 2019-04-29 | 2021-06-15 | 宁波大学 | Fixed grinding tool for grinding sapphire substrate wafer and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201501870A (en) | 2015-01-16 |
| KR20140123906A (en) | 2014-10-23 |
| JP2014205225A (en) | 2014-10-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141015 |