CN104096961A - Low-temperature diffusion bonding method for red copper - Google Patents

Low-temperature diffusion bonding method for red copper Download PDF

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Publication number
CN104096961A
CN104096961A CN201410327948.8A CN201410327948A CN104096961A CN 104096961 A CN104096961 A CN 104096961A CN 201410327948 A CN201410327948 A CN 201410327948A CN 104096961 A CN104096961 A CN 104096961A
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China
Prior art keywords
red copper
welded
copper material
temperature
welding
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Pending
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CN201410327948.8A
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Chinese (zh)
Inventor
熊江涛
李京龙
张赋升
杜鹏
李鹏飞
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Northwestern Polytechnical University
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Northwestern Polytechnical University
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Priority to CN201410327948.8A priority Critical patent/CN104096961A/en
Publication of CN104096961A publication Critical patent/CN104096961A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/14—Preventing or minimising gas access, or using protective gases or vacuum during welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof

Abstract

The invention discloses a low-temperature diffusion bonding method for red copper and aims to solve the technical problem that existing copper bonding methods are poor in mechanical performance of bonding heads. The technical scheme includes that a to-be-welded surface of the red copper is ground through abrasive paper to create roughness, and pressure slightly lower than yield strength of 100MPa of the red copper at the temperature is applied under temperature slightly higher than 400 DEG C which is recrystallization temperature of the red copper for diffusion bonding. By the low-temperature diffusion bonding method, mechanical performance of the bonding head and transgranular phenomena of a weld interface are improved remarkably, welded rate reaches 95%, tensile strength after welding reaches 93-98% that of base metal before welding, and hardness after welding reaches 90% that of the base metal before welding.

Description

The method of attachment of red copper low temperature diffusion
Technical field
The present invention relates to a kind of copper material method of attachment, particularly relate to the method for attachment of a kind of red copper low temperature diffusion.
Background technology
The diffusion welding (DW) of red copper and red copper has extensive use in the accurate complex structural member manufacture in the fields such as electronics, Aero-Space, chemical industry, boats and ships, energy source and power, traffic.
Document 1 " Diffusion bonds in copper, Derby B, Wallach E R.Journal of materials science, 1984,19 10 phases of volume " points out that the selected temperature range of traditional red copper diffusion welding (DW) should be between 500 DEG C～800 DEG C.
Document 2 " Measuring Flatness of Ultrafine Machined Copper Disk with Laser Interferometer and Strength of Diffusion Bonding Interface for High-Energy Accelerators; KOBAYASHI T; HIGASHI Y; HASHIMOTO R, et al.Experimental Mechanics, 2013, the 13 monographs " adopt the oxygen-free copper of lathe ultraprecise processing under low-pressure (0.005～0.05MPa), high-temperature (700～800 DEG C) technique, to obtain being about the hot strength of 200MPa welding point.But because temperature is higher and material is fine copper homogeneous structure, the serious coarsening of postwelding oxygen-free copper crystal grain, crystallite dimension is grown up to 200～300 μ m.Coarse grains causes interface straight, and surface can be reduced, and forms crystal boundary triple point quantity and reduces, and the migration difficulty of crystal boundary, is difficult at weld interface place forming " passing through of crystal boundary ".As deposited strength and hardness only reach respectively 74% and 50% left and right of work hardening state red copper bar simultaneously.
Document 3 " Al 2o 3disperse copper/fine copper diffusion welding craft, Chen Jian, Cui front yard.Solder technology, 2012,41 1 phases of volume " adopt vacuum diffusion welding mode to realize Al 2o 3disperse copper (W cu99.7%+W al2O30.3%) be connected with T2 fine copper.Welding temperature is down to 550 DEG C, and pressure is brought up to 25MPa, and temperature retention time increases to 3h, can obtain even tissue densification, the continuous Diffusion Bonding Joint in interface.But joint tensile strength is 116.9MPa, less than 50% of work hardening state copper rod tensile strength.
Thereby in conventional diffusion weldering temperature range, the connection of red copper does not reach optimal effectiveness, differs larger with the mechanical property of work hardening state mother metal before weldering.
Summary of the invention
In order to overcome the deficiency of existing copper material method of attachment jointing poor mechanical property, the invention provides the method for attachment of a kind of red copper low temperature diffusion.The method is manufactured roughness by sand papering red copper material welding surface, applying the pressure a little less than this temperature yield strength of red copper material 100MPa a little more than at 400 DEG C of red copper recrystallization temperatures, spreads connection.The method has significantly improved joint mechanical property, promoted to pass through phenomenon at the crystal boundary of both sides, weld interface, seam rate reaches 95%, and postwelding tensile strength reaches 93%～98% of the front mother metal tensile strength of weldering, postwelding hardness reaches 90% of the front mother metal of weldering, and post welding distortion rate is in 1%.
The technical solution adopted for the present invention to solve the technical problems is: the method for attachment of a kind of red copper low temperature diffusion, is characterized in adopting following steps:
Step 1, first use 360 #, 600 #, 800 #sand paper is successively to the polishing of red copper material surface to be welded, and making red copper material surface to be welded roughness Ra is 0.2～0.3 μ m, and then red copper material to-be-welded pieces is placed in the acid solution preparing and soaked 1～2min, the volume ratio H of acid solution 2sO 4: HNO 3: H 2o=2:1:12, to remove red copper material to-be-welded pieces surface film oxide.After pickling is complete, carry out water punching, place in 95%～99% alcohol and use Ultrasonic Cleaning 40～60s, dry for subsequent use.
Step 2, the red copper material to-be-welded pieces alignment through step 1 processing is put into stove, apply 15～20MPa precompression, close fire door, vacuumize.When vacuum reaches 3.0 × 10 -3～4.0 × 10 -3when Pa, start heating, the rate of heat addition is 10～15 DEG C/min, and temperature rises to 230～250 DEG C of insulation 3～5min, applies axial compressive force insulation 60～90min of 95～100MPa while reaching 400～450 DEG C, and it is cooling with stove that insulation sheds pressure later.
The invention has the beneficial effects as follows: the method is manufactured roughness by sand papering red copper material welding surface, applying the pressure a little less than this temperature yield strength of red copper material 100MPa a little more than at 400 DEG C of red copper recrystallization temperatures, spread connection.The method has significantly improved the transcrystallization of joint mechanical property and weld interface, and seam rate reaches 95%, and postwelding tensile strength reaches 93%～98% of the front mother metal tensile strength of weldering, and postwelding hardness reaches 90% of the front mother metal of weldering.
Before weldering, the grain size of work hardening state red copper bar is 50～100 μ m, and hot strength is between 260～270MPa, and hardness is between 100～104HV.Before weldering, the grain size of work hardening state red copper sheet material is 20～30 μ m, and shear strength is between 170～180MPa, and hardness is between 120～125HV.Owing to adopting the low temperature of 400 DEG C, can there is not coarsening in crystal grain, postwelding grain size is consistent with before weldering, red copper bar postwelding hot strength and hardness can reach respectively 263MPa and 97HV, red copper sheet material postwelding shear strength and hardness can reach respectively 165MPa and 120HV, have retained more than 90% mechanical property of mother metal before weldering.Post welding distortion rate, in 1%, has reached the effect that high-strength accurate connects.The fine grained region that produces approximately 10～30 μ m width by recrystallization in both sides, weld interface, grain size reaches micron order, is very favorable to the migration of crystal boundary simultaneously.And welding temperature is down to 400 DEG C, to reduce more than 30% for the manufacturing cost of diffusion facilities, weld interval, relatively-high temperature weldering shortened 1/2nd, and welding efficiency improves 70%～100%.
Below in conjunction with the drawings and specific embodiments, the present invention is elaborated.
Brief description of the drawings
Fig. 1 is the structure chart that is installed of red copper low temperature diffusion of the present invention method of attachment, and connector is red copper bar.
Fig. 2 is the structure chart that is installed of red copper low temperature diffusion of the present invention method of attachment, and connector is red copper sheet material.
In figure, 1-seaming chuck, 2-solder mask, 3-red copper, 4-push-down head.
Detailed description of the invention
Embodiment 1.With reference to Fig. 1.The present embodiment, taking two T1 red copper bars as example, illustrates the concrete steps of red copper low temperature diffusion method of attachment:
Material therefor is: T1 red copper bar, purity is 99.95wt.%, size Φ 38mmx35mm.Respectively the red copper bar of three kinds of trades mark is carried out the homogeneity diffusion welding (DW) of the method.Before weldering, red copper 3 surfaces to be welded are first used to 360 #, 600 #, 800 #sand paper is polished successively, makes surface roughness Ra be about 0.2 μ m, and then red copper 3 surfaces to be welded are placed to acid solution (the volume ratio H preparing 2sO 4: HNO 3: H 2o=2:1:12) invade bubble 2min, to remove red copper 3 surface film oxides.After pickling is complete, carry out water punching, place in 95% alcohol and use Ultrasonic Cleaning 60s, take hair-dryer that red copper 3 to-be-welded pieces are dried up.Red copper 3 to-be-welded pieces consistencies from top to bottom are put into stove, and be positioned between the interior seaming chuck 1 of Vacuum diffusion bonding furnace and push-down head 4, between seaming chuck 1 and red copper 3, push-down head 4 and red copper 3, place solder mask 2, apply 15MPa precompression, close fire door, vacuumize.When vacuum reaches 4.0 × 10 -3time, starting heating, the rate of heat addition is 10 DEG C/min, temperature rises to 250 DEG C of insulation 3min, applies 100MP while reaching 400 DEG C aaxial compressive force insulation 90min, it is cooling with stove that insulation sheds pressure later.
Researcher adopts said method, the T2 red copper bar that is also 99.90wt% to purity, and the T3 red copper bar that is 99.70wt% with purity has carried out diffusion and has been connected.Test proof, the large pressure homogeneity of the low temperature Diffusion Bonded Joint tensile strength of three kinds of trade mark red copper bars is between 250～263MPa, and hardness, between 94～97HV, has all reached the front red copper mother metal tensile strength of weldering and the more than 90% of hardness.Post welding distortion rate is between 0.7%～1%, and " crystal boundary passes through " phenomenon of weld interface is obvious.
Embodiment 2.With reference to Fig. 2.The present embodiment, taking three T1 red copper sheet materials as example, illustrates the concrete steps of red copper low temperature diffusion method of attachment:
Material therefor is: T1 red copper sheet material, purity is 99.95wt.%, size 35mmx35mmx5mm.T1 red copper sheet material is carried out to the homogeneity diffusion welding (DW) of the method.Before weldering, red copper 3 surfaces to be welded are first used to 360 #, 600 #, 800 #sand paper is polished successively, makes surface roughness Ra be about 0.3 μ m, and then red copper 3 surfaces to be welded are placed to acid solution (the volume ratio H preparing 2sO 4: HNO 3: H 2o=2:1:12) invade bubble 1min, to remove surface film oxide.After pickling is complete, carry out water punching, place in 99% alcohol and use Ultrasonic Cleaning 40s, take hair-dryer that red copper 3 to-be-welded pieces are dried up.Red copper 3 to-be-welded pieces are put into stove, and be positioned between the interior seaming chuck 1 of Vacuum diffusion bonding furnace and push-down head 4, between seaming chuck 1 and red copper 3, push-down head 4 and red copper 3, place solder mask 2, apply 20MPa precompression, close fire door, vacuumize.When vacuum reaches 3.0 × 10 -3when Pa, start heating, the rate of heat addition is 15 DEG C/min, and temperature rises to 230 DEG C of insulation 5min, applies the axial compressive force insulation 60min of 95MPa while reaching 450 DEG C, then cooling with stove.
Researcher adopts said method, and the T3 red copper sheet material that the T2 red copper sheet material that is also 99.90wt% to purity is 99.70wt% with purity has carried out diffusion and has been connected.Test proof, the shear strength of the large pressure diffusion plumb joint of low temperature of three kinds of trade mark red copper sheet materials is at 160～165MPa, and hardness 115～120HV, has all reached front the more than 90% of mother metal tensile strength of weldering.Post welding distortion rate is between 0.7%～1%, and " crystal boundary passes through " phenomenon of weld interface is obvious.

Claims (1)

1. a red copper low temperature diffusion method of attachment, is characterized in that comprising the following steps:
Step 1, first use 360 #, 600 #, 800 #sand paper is successively to the polishing of red copper material surface to be welded, and making red copper material surface to be welded roughness Ra is 0.2～0.3 μ m, and then red copper material to-be-welded pieces is placed in the acid solution preparing and soaked 1～2min, the volume ratio H of acid solution 2sO 4: HNO 3: H 2o=2:1:12, to remove red copper material to-be-welded pieces surface film oxide; After pickling is complete, carry out water punching, place in 95%～99% alcohol and use Ultrasonic Cleaning 40～60s, dry for subsequent use;
Step 2, the red copper material to-be-welded pieces alignment through step 1 processing is put into stove, apply 15～20MPa precompression, close fire door, vacuumize; When vacuum reaches 3.0 × 10 -3～4.0 × 10 -3when Pa, start heating, the rate of heat addition is 10～15 DEG C/min, and temperature rises to 230～250 DEG C of insulation 3～5min, applies axial compressive force insulation 60～90min of 95～100MPa while reaching 400～450 DEG C, and it is cooling with stove that insulation sheds pressure later.
CN201410327948.8A 2014-07-10 2014-07-10 Low-temperature diffusion bonding method for red copper Pending CN104096961A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106808079A (en) * 2017-01-11 2017-06-09 西北工业大学 A kind of TiAl alloy and Ti2The diffusion connection method of AlNb alloys
CN112872574A (en) * 2021-01-08 2021-06-01 固达电线电缆(集团)有限公司 Copper component welding method and device
CN115821397A (en) * 2022-12-22 2023-03-21 燕山大学 Bonded copper single crystal and atomic-scale diffusion bonding process method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101745736A (en) * 2009-12-23 2010-06-23 西北工业大学 Copper alloy and stainless diffusion welding method
CN102039484A (en) * 2010-11-30 2011-05-04 上海工程技术大学 Low-temperature diffusion welding method for metal materials
CN102218594A (en) * 2011-06-24 2011-10-19 武汉理工大学 Low-temperature diffusion welding method for molybdenum alloy and copper alloy
CN103692085A (en) * 2014-01-09 2014-04-02 北京航空航天大学 Aluminum alloy interface low-temperature diffusion bonding method applicable to interface enhancement heat transfer
CN103722304A (en) * 2014-01-09 2014-04-16 北京航空航天大学 Material used for aluminum alloy interface low-temperature diffusion bonding in field of interface heat transfer enhancement

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101745736A (en) * 2009-12-23 2010-06-23 西北工业大学 Copper alloy and stainless diffusion welding method
CN102039484A (en) * 2010-11-30 2011-05-04 上海工程技术大学 Low-temperature diffusion welding method for metal materials
CN102218594A (en) * 2011-06-24 2011-10-19 武汉理工大学 Low-temperature diffusion welding method for molybdenum alloy and copper alloy
CN103692085A (en) * 2014-01-09 2014-04-02 北京航空航天大学 Aluminum alloy interface low-temperature diffusion bonding method applicable to interface enhancement heat transfer
CN103722304A (en) * 2014-01-09 2014-04-16 北京航空航天大学 Material used for aluminum alloy interface low-temperature diffusion bonding in field of interface heat transfer enhancement

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106808079A (en) * 2017-01-11 2017-06-09 西北工业大学 A kind of TiAl alloy and Ti2The diffusion connection method of AlNb alloys
CN106808079B (en) * 2017-01-11 2021-01-01 西北工业大学 TiAl alloy and Ti2Diffusion bonding method of AlNb alloy
CN112872574A (en) * 2021-01-08 2021-06-01 固达电线电缆(集团)有限公司 Copper component welding method and device
CN112872574B (en) * 2021-01-08 2022-04-29 固达电线电缆(集团)有限公司 Copper component welding method and device
CN115821397A (en) * 2022-12-22 2023-03-21 燕山大学 Bonded copper single crystal and atomic-scale diffusion bonding process method thereof

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Application publication date: 20141015