CN104090121B - The hot type wind speed wind direction sensor device of three-dimensionally integrated front sense wind and method for packing - Google Patents
The hot type wind speed wind direction sensor device of three-dimensionally integrated front sense wind and method for packing Download PDFInfo
- Publication number
- CN104090121B CN104090121B CN201410325164.1A CN201410325164A CN104090121B CN 104090121 B CN104090121 B CN 104090121B CN 201410325164 A CN201410325164 A CN 201410325164A CN 104090121 B CN104090121 B CN 104090121B
- Authority
- CN
- China
- Prior art keywords
- substrate
- direction sensor
- pad
- hot type
- wind speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Testing Or Calibration Of Command Recording Devices (AREA)
- Indicating Or Recording The Presence, Absence, Or Direction Of Movement (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention discloses the hot type wind speed wind direction sensor device of a kind of three-dimensionally integrated front sense wind and method for packing; this device; including adopting the front sense hot type wind speed wind direction sensor of wind mode, cmos circuit chip and tellite; hot type wind speed wind direction sensor includes low heat conductivity substrate (thermal conductivity is lower than 1W/m K); the front of substrate is provided with heating element heater, temperature element and pad; passivation protection layer is deposited in the front of substrate; realize front sense wind, seal up heating element heater, temperature element and pad by passivation protection layer；Cmos circuit chip is arranged between the back side of substrate and tellite, the position of substrate pad corresponding to cmos circuit chip is provided with through hole, being filled with metallics in through hole, the two ends of metallics are welded with the solder joint on pad and tellite respectively.Encapsulating structure of the present invention and method can obtain high reliability, high integration.
Description
Technical field
The present invention relates to a kind of low-power consumption highly sensitive type hot type wind speed wind direction sensor device and method for packing feeling wind based on three-dimensionally integrated front, adopt the hot air velocity transducer of lower thermal conductivity substrate processing to assemble.
Background technology
Hot wind speed wind direction sensor system wind speed, wind direction measurement in be widely used, and along with in recent years both at home and abroad natural disaster progressively increase, requirement for weather monitoring is more and more higher, and the hot wind speed wind direction sensor system therefore realizing low-power-consumptiohigh-sensitivity high-sensitivity has great importance.The hot wind speed wind direction sensor system reported at present is generally adopted two kinds of methods to realize the encapsulation of sensing chip: the first is to utilize heat-conducting glue chip and ceramic substrate to be sticked together to realize encapsulation, by the one side of ceramic substrate as sense wind face；The second is that wind is directly felt in the front using sensor.But both approaches has some respective shortcomings, although wherein the first packaged type can protect sensor construction preferably, but its sensitivity does not adopt wind speed wind direction sensor highly sensitive of front sense wind.On the other hand, the sensing system of front sense wind is all adopt bonding line as the electric connection mode between sensor and circuit board, and the existence of bonding line can affect the air flow method on air velocity transducer surface to a certain extent, makes measurement result there is error；Meanwhile, because the needs of sense wind, bonding line is directly exposed in air, the impact of the humiture being subject in environment, it is easy to be short-circuited or open circuit, allows the air velocity transducer cannot normal operation.As the study hotspot in electronics science field, the three-dimension packaging method based on through hole technology receives extensive concern.By processing sensing arrangement at lower thermal conductivity substrate, through hole technology is utilized to realize the three-dimensionally integrated encapsulation of sensing chip and cmos circuit chip, it is possible to achieve the hot blast speed sensing system of low-power-consumptiohigh-sensitivity high-sensitivity.
Summary of the invention
Goal of the invention: in order to overcome the deficiencies in the prior art, the present invention provides low-power-consumptiohigh-sensitivity high-sensitivity type hot type wind speed wind direction sensor device and the method for packing of a kind of three-dimensionally integrated front sense wind, this device can have higher sensitivity and relatively low power consumption, and realizes electrically connecting the high reliability of path and the high integration with cmos circuit chip.
Technical scheme: for achieving the above object, the technical solution used in the present invention is:
A kind of hot type wind speed wind direction sensor device of three-dimensionally integrated front sense wind; including adopting the front sense hot type wind speed wind direction sensor of wind mode, cmos circuit chip and tellite; hot type wind speed wind direction sensor includes lower thermal conductivity substrate (thermal conductivity is lower than 1W/m K); the front of substrate is provided with heating element heater, temperature element and pad; passivation protection layer is deposited in the front of substrate; realize front sense wind, seal up heating element heater, temperature element and pad by passivation protection layer；Cmos circuit chip is arranged between the back side of substrate and tellite, the position of substrate pad corresponding to cmos circuit chip is provided with through hole, being filled with metallics in through hole, the two ends of metallics are welded with the solder joint on pad and tellite respectively.
Preferably, in described hot type wind speed wind direction sensor: heating element heater is uniformly distributed and is formed centrosymmetric structure, formation temperature field centered by the center of hot type wind speed wind direction sensor；Temperature element is uniformly distributed and is formed symmetrical structure equally centered by the center of hot type wind speed wind direction sensor, and temperature element is arranged on the outside of heating element heater, in order to the distribution of temperature sensor field；Wind speed and direction information is reacted by the hot temperature difference on relative temperature element.
Preferably, the number of described heating element heater is four, is scattered in square, and each heating element heater corresponding is provided with a temperature element.
Preferably, the metallics filled in through hole is tungsten.
Preferably, apply voltage by cmos circuit chip to heating element heater, make heating element heater generate heat；Cmos circuit chip has the preliminary amplifying circuit of signal by CMOS technology processing, the signal of temperature element is tentatively amplified and is sent to tellite, tellite provides physical support for cmos circuit chip and hot type wind speed wind direction sensor on the one hand, amplified, filter and process the calculating of circuit realiration wind speed and direction on the other hand by the signal on plate, and the signal realized with ambient systems by communication interface circuit is transmitted.
The hot type wind speed wind direction sensor device packing method of a kind of three-dimensionally integrated front sense wind, comprises the steps:
(1) mode using localized hyperthermia's gasification of ultraviolet laser generation processes a section of through hole filler metal tungsten on substrate, forms turning circuit；
(2) substrate first step (1) obtained is processed by shot blasting; then at the sputtering of the front of substrate or thermal evaporation layer of metal layer; metal level is patterned by recycling photoetching and etching technics; then remove photoresist and form heating element heater, temperature element and pad, finally at the one layer very thin silicon dioxide of the surface deposition of substrate as passivation protection layer；Pad and tungsten electrical connection；
(3) prepare cmos circuit chip, cmos circuit chip uses another section of the method etching through hole of deep reaction ion etching (DRIE) filler metal tungsten, forms turning circuit；
(4) preparing tellite, by silk-screen printing technique, on tellite, through hole correspondence position processes solder bumps；
(5) by corresponding with another fragment position of the through hole of tellite for the through hole one section of the pad of hot type wind speed wind direction sensor, cmos circuit chip, realize three-dimensionally integrated by the mode of Reflow Soldering；Hot type wind speed wind direction sensor, realizing electrical connection by pad, tungsten and solder bumps between cmos circuit chip and tellite, whole system has the feature of high sensitivity, high reliability, high integration and low-power consumption.
Preferably, in described step (3), by mode filler metal tungsten on cmos circuit chip of plating or chemical vapor deposition.
The sensor device that the present invention proposes utilizes calorimetric flow sensor to measure wind speed and direction.Adopt lower thermal conductivity substrate and the mode of front sense wind, its purpose is to reduce the impact of the transverse direction heat transfer of substrate, and also to improve the sensitivity of sensor device and reduce power consumption.Adopt the three-dimension packaging method based on through hole technology, not only eliminate the bonding line impact on sensor surface air flow method, improve the reliability that device connects simultaneously.
Wherein symmetrically placed heating element heater 2 is in the center of hot type wind speed wind direction sensor to produce symmetrical temperature field, and temperature field is sensed by the temperature element of heating element heater distribution symmetrical about；Wind speed and direction information is reflected according to the hot temperature difference on relative temperature element 3.Lower thermal conductivity substrate makes the heat transmitted by conduction of heat between heating element heater and temperature element minimum; passivation protection layer is in order to protect heating element heater and temperature element; through hole is for realizing the electrical connection between hot type wind speed wind direction sensor, cmos circuit chip and tellite 8, it is achieved the high reliability of connecting path and high integration.
When hot type wind speed wind direction sensor normal operation; namely voltage is applied to heating element heater; this element heating will be caused; due to the lower thermal conductivity of substrate, the heat major part produced on the heating element is all transmitted vertically upward, and namely the horizontal heat of substrate is transmitted only small; therefore heat will spill in air above by passivation protection layer; by the impact of ambient wind, passivation protection layer upper surface will produce heat distribution, and this heat distribution is by thermometric element senses.By measuring the temperature difference between relative temperature element, it is possible to obtain the information of wind speed and direction simultaneously.
Cmos circuit chip is had the preliminary amplifying circuit of signal by CMOS technology processing, it is achieved the preliminary amplification of the faint transducing signal (being generally microvolt or millivolt rank) of hot type wind speed wind direction sensor.Tellite provides physical support for hot type wind speed wind direction sensor and cmos circuit chip on the one hand, amplified, filter and process the calculating of circuit realiration wind speed and direction on the one hand by the signal on plate, and the signal realized with ambient systems by communication interface circuit is transmitted.Whole system has the feature of high sensitivity, high reliability, high integration and low-power consumption.
Beneficial effect: the hot type wind speed wind direction sensor device of three-dimensionally integrated front provided by the invention sense wind, the heat that the design that lower thermal conductivity substrate, front feel wind effectively reduces heating element heater generation is adopted by chip and to encapsulate the transmission to both sides measuring cell, improve the sensitivity of device, reduce power consumption；Sensor passes through passivation protection, has been effectively isolated the impact on device such as external environment such as steam；Total is without movable member, good reliability；Adopt through hole technology to realize three-dimension packaging, connect than tradition bonding line and there is higher reliability and integrated level.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the plan structure schematic diagram of the present invention；
Including: substrate 1, heating element heater 2, temperature element 3, pad 4, passivation protection layer 5, through hole 6, cmos circuit chip 7 and tellite 8.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is further described.
It is the hot type wind speed wind direction sensor device of a kind of three-dimensionally integrated front sense wind as shown in Figure 1 and Figure 2; including adopting the front sense hot type wind speed wind direction sensor of wind mode, cmos circuit chip 7 and tellite 8; hot type wind speed wind direction sensor includes lower thermal conductivity substrate (thermal conductivity is lower than 1W/m K) 1; heating element heater 2, temperature element 3 and pad 4 it is provided with in the front of substrate 1; passivation protection layer 5 is deposited in the front of substrate 1; realize front sense wind, seal up heating element heater 2, temperature element 3 and pad 4 by passivation protection layer 5；Cmos circuit chip 7 is arranged between the back side of substrate 1 and tellite 8, the position of the corresponding pad 4 of substrate 1 and cmos circuit chip 7 is provided with through hole 6, being filled with tungsten in through hole 6, the two ends of tungsten are welded with the solder joint on pad 4 and tellite 8 respectively.
In described hot type wind speed wind direction sensor: heating element heater 2 is uniformly distributed and is formed centrosymmetric structure, formation temperature field centered by the center of hot type wind speed wind direction sensor；Temperature element 3 by the center of hot type wind speed wind direction sensor centered by is uniformly distributed and is formed symmetrical structure equally, and temperature element 3 is arranged on the outside of heating element heater 2, in order to the distribution of temperature sensor field；Wind speed and direction information is reacted by the hot temperature difference on relative temperature element 3.Lower thermal conductivity substrate 1 makes the heat transmitted by conduction of heat between heating element heater 2 and temperature element 3 minimum; passivation protection layer 5 is in order to protect heating element heater 2 and temperature element 3, and through hole 6 is for realizing the electrical connection between sensor chip, cmos circuit chip 7 and circuit substrate 8.
As in figure 2 it is shown, the number of described heating element heater 2 is four, being scattered in square, each heating element heater 2 corresponding is provided with a temperature element 3.
Apply voltage by cmos circuit chip 7 to heating element heater 2, make heating element heater 2 generate heat；Cmos circuit chip 7 has the preliminary amplifying circuit of signal by CMOS technology processing, the signal of temperature element 3 is tentatively amplified and is sent to tellite 8, tellite 8 one aspect provides physical support for cmos circuit chip 7 and hot type wind speed wind direction sensor, amplified, filter and process the calculating of circuit realiration wind speed and direction on the other hand by the signal on plate, and the signal realized with ambient systems by communication interface circuit is transmitted.
The hot type wind speed wind direction sensor device packing method of above-mentioned three-dimensionally integrated front sense wind, comprises the steps:
(1) mode using localized hyperthermia's gasification of ultraviolet laser generation processes a section of through hole 6 filler metal tungsten on substrate 1, forms turning circuit；
(2) substrate 1 first step 1 obtained is processed by shot blasting; then at the sputtering of the front of substrate 1 or thermal evaporation layer of metal layer; metal level is patterned by recycling photoetching and etching technics; then remove photoresist and form heating element heater 2, temperature element 3 and pad 4, finally at the one layer very thin silicon dioxide of the surface deposition of substrate 1 as passivation protection layer 5；Pad 4 and tungsten electrical connection；
(3) prepare cmos circuit chip 7, cmos circuit chip 7 uses another section of the method etching through hole 6 of deep reaction ion etching (DRIE) filler metal tungsten, forms turning circuit；Mode filler metal tungsten on cmos circuit chip 7 of plating or chemical vapor deposition can be passed through；
(4) preparing tellite 8, by silk-screen printing technique, on tellite 8, through hole 6 correspondence position processes solder bumps；
(5) by corresponding with another fragment position of through hole 6 of tellite 8 for the through hole 6 one sections of the pad 4 of hot type wind speed wind direction sensor, cmos circuit chip 7, realize three-dimensionally integrated by the mode of Reflow Soldering.
The above is only the preferred embodiment of the present invention; it is noted that, for those skilled in the art; under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (2)
1. the hot type wind speed wind direction sensor device packing method of a three-dimensionally integrated front sense wind, the hot type wind speed wind direction sensor device of described three-dimensionally integrated front sense wind includes the hot type wind speed wind direction sensor adopting front sense wind mode, cmos circuit chip (7) and tellite (8), hot type wind speed wind direction sensor includes the substrate (1) of lower thermal conductivity, the front of substrate (1) is provided with heating element heater (2), temperature element (3) and pad (4), passivation protection layer (5) is deposited in the front of substrate (1), realize front sense wind, heating element heater (2) is sealed up by passivation protection layer (5), temperature element (3) and pad (4)；Cmos circuit chip (7) is arranged between the back side of substrate (1) and tellite (8), the position of the corresponding pad (4) of substrate (1) and cmos circuit chip (7) is provided with through hole (6), being filled with metallics in through hole (6), the two ends of metallics are welded with the solder joint on pad (4) and tellite (8) respectively；It is characterized in that: comprise the steps:
(1) mode using localized hyperthermia's gasification of ultraviolet laser generation processes a section of through hole (6) filler metal tungsten on substrate (1), forms turning circuit；
(2) substrate (1) first step (1) obtained is processed by shot blasting; then at the sputtering of the front of substrate (1) or thermal evaporation layer of metal layer; metal level is patterned by recycling photoetching and etching technics; then remove photoresist and form heating element heater (2), temperature element (3) and pad (4), finally in the surface deposition layer of silicon dioxide of substrate (1) as passivation protection layer (5)；Pad (4) and tungsten electrical connection；
(3) cmos circuit chip (7) is prepared, in another section of the upper method etching through hole (6) using deep reaction ion etching of cmos circuit chip (7), and filler metal tungsten, form turning circuit；
(4) prepare tellite (8), by silk-screen printing technique, process solder bumps at upper through hole (6) correspondence position of tellite (8)；
(5) by corresponding with the through hole of tellite (8) (6) another fragment position for the through hole (6) sections of the pad (4) of hot type wind speed wind direction sensor, cmos circuit chip (7), realize three-dimensionally integrated by the mode of Reflow Soldering.
2. the hot type wind speed wind direction sensor device packing method of three-dimensionally integrated front according to claim 1 sense wind, it is characterized in that: in described step (3), by the mode of plating or chemical vapor deposition at the upper filler metal tungsten of cmos circuit chip (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410325164.1A CN104090121B (en) | 2014-07-09 | 2014-07-09 | The hot type wind speed wind direction sensor device of three-dimensionally integrated front sense wind and method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410325164.1A CN104090121B (en) | 2014-07-09 | 2014-07-09 | The hot type wind speed wind direction sensor device of three-dimensionally integrated front sense wind and method for packing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104090121A CN104090121A (en) | 2014-10-08 |
| CN104090121B true CN104090121B (en) | 2016-06-29 |
Family
ID=51637852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410325164.1A Expired - Fee Related CN104090121B (en) | 2014-07-09 | 2014-07-09 | The hot type wind speed wind direction sensor device of three-dimensionally integrated front sense wind and method for packing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104090121B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104535792B (en) * | 2015-01-16 | 2017-04-19 | 东南大学 | High-sensitive hot wind speed sensor structure and wind speed and wind direction measuring method |
| CN104977425B (en) * | 2015-06-19 | 2017-10-03 | 东南大学 | A kind of wind detection sensor chip structure and its manufacture method |
| CN104977429B (en) * | 2015-06-19 | 2017-09-29 | 东南大学 | A kind of hot type air velocity transducer structure and calibration method with zero point correction function |
| CN105319387B (en) * | 2015-12-03 | 2019-12-03 | 东南大学 | A kind of exchange self-heating type wind speed wind direction sensor and its measurement method |
| CN105527454B (en) * | 2016-01-19 | 2018-11-16 | 东南大学 | A kind of highly sensitive hot type air velocity transducer and its packaging method |
| CN106771339B (en) * | 2017-01-18 | 2019-06-25 | 东南大学 | Heat loss type air velocity transducer and preparation method thereof and detection method |
| CN106814212B (en) * | 2017-01-18 | 2019-06-25 | 东南大学 | A kind of hot temperature difference type air velocity transducer and preparation method thereof and detection method |
| CN106829850B (en) * | 2017-01-18 | 2019-03-05 | 东南大学 | Hot temperature difference type air velocity transducer and preparation method thereof and detection method |
| CN109188015B (en) * | 2018-06-21 | 2020-05-29 | 东南大学 | High-sensitivity silicon two-dimensional anemometer and manufacturing method thereof |
| CN109116050B (en) * | 2018-06-21 | 2020-01-31 | 东南大学 | microminiature high-sensitivity two-dimensional anemometer and manufacturing method thereof |
| CN109164271B (en) * | 2018-09-04 | 2024-02-13 | 南京英格玛仪器技术有限公司 | Integrated wind speed sensor and manufacturing method |
| CN109384189B (en) * | 2018-09-14 | 2020-06-12 | 常州大学 | Thermal type wind speed and direction sensor based on bonding process and preparation method thereof |
| CN110174526A (en) * | 2019-07-01 | 2019-08-27 | 哈尔滨理工大学 | A kind of hot type optical fiber tri-dimensional wind speed wind direction sensor and detection method |
| CN113092809B (en) * | 2021-04-09 | 2022-07-22 | 东南大学 | Film type wind speed and direction sensor with front wind sensing surface and back lead wire and manufacturing method thereof |
| CN113466488B (en) * | 2021-07-19 | 2022-05-27 | 东南大学 | Two-dimensional temperature balance mode MEMS wind speed and direction sensor and preparation method thereof |
| CN115598373A (en) * | 2022-10-24 | 2023-01-13 | 南方电网数字电网研究院有限公司（Cn） | Peltier effect-based wind speed and direction sensor, detection device and electronic equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100468618C (en) * | 2006-07-10 | 2009-03-11 | 中芯国际集成电路制造(上海)有限公司 | Making method for semiconductor part removing residual polyester in etching |
| CN100460875C (en) * | 2007-05-11 | 2009-02-11 | 东南大学 | Cross structure two-D wind speed wind direction sensor and its preparation method |
| CN101691200B (en) * | 2009-09-29 | 2012-07-18 | 中国科学院上海微系统与信息技术研究所 | Low temperature vacuum encapsulation structure of non-refrigeration infrared detector and manufacturing method thereof |
| CN102169126B (en) * | 2011-01-17 | 2012-12-19 | 东南大学 | Hot air speed and air direction sensor based on thinning process and manufacturing method thereof |
| CN102749473B (en) * | 2012-06-30 | 2014-04-16 | 东南大学 | Two-dimensional hot-film wind speed and direction sensor and preparation method thereof |
-
2014
- 2014-07-09 CN CN201410325164.1A patent/CN104090121B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN104090121A (en) | 2014-10-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104090121B (en) | The hot type wind speed wind direction sensor device of three-dimensionally integrated front sense wind and method for packing | |
| CN101819214B (en) | Integrated anemograph based on ceramics wafer level package and preparation method thereof | |
| CN102469956B (en) | Fall detectors and a method of detecting falls | |
| CN1325879C (en) | Temperature, wind speed, wind direction and air pressure integration sensor | |
| CN105745518B (en) | Internal temperature sensor | |
| CN102169126B (en) | Hot air speed and air direction sensor based on thinning process and manufacturing method thereof | |
| CN102095888B (en) | Heat-type wind-speed and wind-direction sensor with heat insulation structure and preparation method thereof | |
| CN104991087B (en) | A kind of MEMS hot type air velocity transducers with self calibrating function on piece | |
| US20120063093A1 (en) | Reducing thermal gradients to improve thermopile performance | |
| CN102072967B (en) | Gold-gold bonding process-based thermal type wind speed and direction sensor and preparation method thereof | |
| CN106443056A (en) | Wafer level packaging based MEMS wind speed and wind direction sensor structure and packaging method | |
| CN105466463B (en) | Sensor chip | |
| CN104482971B (en) | A kind of thermal flow rate sensor based on MEMS technology | |
| CN102147421B (en) | Thermal type wind sensor based on anisotropic heat-conducting substrate and preparation method therefor | |
| CN104061967B (en) | Heat type wind speed and direction sensor based on substrate transfer process and packaging method thereof | |
| CN102967725B (en) | Thermal wind speed sensor encapsulated based on carbon nanotube array | |
| CN201886035U (en) | Thermal type wind-speed and wind-direction sensor with thermal-insulating structure | |
| CN207851102U (en) | A kind of graphene wind speed wind direction sensor | |
| CN102721721B (en) | Thermal diffusivity sensor chip with silicon cup structure and preparation method of thermal diffusivity sensor chip | |
| CN106461438A (en) | Mass flowmeter and speedometer | |
| CN102082105A (en) | Thermal wind sensor based on anodic bonding technology and preparation method thereof | |
| CN105527454B (en) | A kind of highly sensitive hot type air velocity transducer and its packaging method | |
| CN202102009U (en) | Thermal wind speed and direction sensor based on Au-Au bonding process | |
| CN106768050A (en) | A kind of single-chip high-accuracy temperature-humidity sensor | |
| CN206057238U (en) | A kind of board-like gas detecting element of new slight fever |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160629 Termination date: 20200709 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |