CN104080311A - Metal/alloy solid-liquid phase change and vapor compression refrigeration cycle combined electronic component radiator and method - Google Patents

Abstract

Provided is a radiator that combines metal solid-liquid phase transition and vapor compression refrigeration cycle, which is applied to the cooling of high heat flux density electronic components. It uses a small amount of low-melting point metal, which can undergo phase transition below 60°C, thereby Quickly remove large amounts of heat to deal with sudden power increases of electronic components, providing start-up time for the vapor compression refrigeration cycle. After the power of the electronic components is stabilized, the liquid metal with high thermal conductivity can transfer heat from the surface of the electronic components to the evaporator well, and the heat will be taken away by the refrigerant liquid-vapor phase change evaporation. This radiator combines the passive cooling of metal phase transition and the active cooling characteristics of vapor compression refrigeration cycle, and at the same time meets the requirements of large power variation and high heat flux heat dissipation of high-power electronic components, and solves the problem of starting vapor compression refrigeration cycle and starting refrigeration. Due to the hysteresis problem of sudden power changes of electronic components, it is ensured that the operating temperature of electronic components changes steadily within a safe range.

Description

Metal/alloy solid-liquid phase transition and vapor compression refrigeration cycle combined electronic component heat sink and method

technical field

The invention relates to a radiator for electronic components and a method thereof, in particular to a radiator for electronic components and a method for combining metal phase transition and vapor compression refrigeration cycle.

Background technique

With the rapid development of microelectromechanical technology, the size of electronic components is getting smaller and smaller, while the number of transistors on them is increasing. According to Moore's Law: the number of transistors on electronic components doubles every 18 months. The heat dissipation problem caused by this has become more and more severe, and the heat flux density on the surface of some electronic components has reached or even exceeded . For such a high heat flux density, the traditional air cooling method has reached its limit, so new heat dissipation technologies have been proposed, such as water cooling, heat pipe technology, thermoelectric refrigeration, vapor compression refrigeration cycle and so on. Among them, the vapor compression refrigeration cycle is the least limited by the ambient temperature and has the most excellent heat dissipation capability. Theoretically, as long as the ambient temperature is lower than the temperature of electronic components, the vapor compression refrigeration cycle can dissipate heat. And this condition is usually satisfied.

However, the power of electronic components sometimes changes suddenly, and it is difficult for the vapor compression refrigeration cycle to respond quickly to this, which will cause the temperature of electronic components to rise rapidly, and the sudden change of temperature is also harmful to the performance of electronic components. Adverse. Therefore, there is a need to solve this problem.

Contents of the invention

As mentioned above, the thermal control problem brought about by the rapid rise in the temperature of electronic components at any time still needs to be solved. The inventor considers that a feasible approach is to play a buffer role by means of other auxiliary cooling methods. This auxiliary cooling method must be able to dissipate a large amount of heat in a relatively short period of time, so that the vapor compression refrigeration cycle can Use this buffer time to start, and when the refrigeration cycle starts to run normally, this auxiliary method must still have a good heat conduction effect, so that the excellent heat dissipation capacity of the refrigeration cycle will not be limited; those who can meet these requirements , the best is the low melting point metal phase transition, its large latent heat value and high thermal conductivity can meet the heat dissipation requirements when the temperature rises suddenly, and when the refrigeration cycle runs smoothly, its good thermal conductivity can well control Heat is transferred from the surface of the electronic component to the evaporator in the refrigeration cycle. When the temperature of the electronic components subsequently drops below the set value, the phase change metal is completely solidified, and the refrigeration subsystem stops running, which avoids condensation water that may be generated when the evaporation temperature of the refrigeration system is too low, thereby ensuring the safe operation of electronic equipment; A small amount of heat generated by the components is taken away by the air through the fins around the metal packaging box

To sum up, the vapor compression refrigeration cycle can meet the heat dissipation requirements of high heat flux. For the situation of sudden power increase, only a small amount of phase change metal can play the role of buffering the refrigeration system startup, and can avoid the possibility of low temperature supercooling. Condensation problems. Therefore, the combination of the two schemes is of great significance to the heat dissipation of the rapidly developing high-power microelectronic components.

On the basis of the above idea, the present invention provides a high-efficiency heat dissipation device for electronic components, which combines metal phase transition and vapor compression refrigeration cycle, and solves the problem of keeping the temperature of electronic components in a suitable range when they work stably and have sudden power changes. High heat flux and heat dissipation under various requirements such as no condensed water generation.

According to one aspect of the present invention, there is provided a radiator for electronic components combining metal solid-liquid phase transition and vapor compression refrigeration cycle, which is characterized in that it includes:

A phase-change metal packaging box, in which a low-temperature solid-liquid phase-change metal is encapsulated,

vapor compression refrigeration subsystem,

Wherein, the phase-change metal packaging box is in thermal contact with the electronic components to be cooled.

According to another aspect of the present invention, a method for heat dissipation of electronic components combining metal phase transition and vapor compression refrigeration cycle is provided, which is characterized in that it includes:

making the phase-change metal packaging box in thermal contact with the electronic components to be cooled, the phase-change metal packaging box is packaged with phase-change metal,

When the power of electronic components suddenly increases and the heat dissipation increases rapidly, the phase change metal melts into a liquid state, taking away a large amount of heat in a short period of time, and at the same time starts the vapor compression refrigeration subsystem,

in,

The refrigeration subsystem includes a condensing unit and an evaporator,

The evaporator is packaged in a phase-change metal packaging box and immersed in the phase-change metal.

Description of drawings

Fig. 1 is a schematic diagram of the principle of a heat sink for electronic components combined with a metal phase transition and a vapor compression refrigeration cycle according to an embodiment of the present invention.

Fig. 2 is a top sectional view of a phase-change metal packaging box of a radiator for electronic components combining metal phase-change and vapor compression refrigeration cycle according to an embodiment of the present invention.

Detailed ways

The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

As shown in FIG. 1 , the electronic component heat sink combining metal phase change and vapor compression refrigeration cycle of the present invention includes two parts, that is, a phase change metal packaging box 1 and a vapor compression refrigeration subsystem 2 .

According to a specific embodiment of the present invention, the phase-change metal packaging box 1 includes a phase-change metal 1-1 and fins 1-2 (see FIG. 2 ). Wherein, the phase-change metal 1-1 is encapsulated in the phase-change metal packaging box 1 , and the fins 1-2 are arranged on the outer wall of the phase-change metal packaging box 1 .

As shown in Figures 1 and 2, the refrigeration subsystem 2 includes a condensing unit 2-1 and an evaporator 2-2. Wherein, the evaporator 2-2 is soaked in the phase-change metal 1-1 and packaged in the phase-change metal packaging box 1 . The phase-change metal packaging box 1 is in thermal contact with the electronic components, and the contact is usually through thermal conductive glue, as shown in FIG. 1 .

When the electronic components work at low power, the heat is transmitted to the fins 1-2 arranged on the outer wall of the phase-change metal packaging box 1 through the solid phase-change metal 1-1 and the wall surface of the phase-change metal packaging box 1 in the form of heat conduction, Then it is diffused into the environment through the fins 1-2 in the form of natural convection or forced convection.

When the power of the electronic components increases and the surface temperature of the electronic components reaches a set value close to the melting point of the phase change metal 1-1, such as 60° C., the cooling subsystem 2 starts. As the temperature of electronic components continues to rise, such as 62 ° C, the phase change metal 1-1 melts, and the refrigeration subsystem 2 has entered a stable operating state at this time. System 2 dissipated.

When the power of the electronic components drops, the surface temperature of the electronic components drops below the melting point of the phase change metal 1-1, such as 58°C, the phase change metal 1-1 solidifies, the refrigeration subsystem 2 stops running, and returns to the low power of the electronic components Thermal mode at runtime.

The starting signal of the refrigeration subsystem (2) comes from a temperature sensor attached to the surface of the electronic component.

According to an embodiment of the present invention, the phase-change metal together with the evaporator (2-2) immersed in it is packaged in the phase-change metal packaging box (1), and the outer wall of the phase-change metal packaging box (1) is arranged with fins ( 1-2).

According to an embodiment of the present invention, the start and stop of the refrigeration subsystem (2) is controlled by the temperature signal sent by the temperature sensor on the surface of the electronic component, and the start and stop temperatures are slightly lower than those of the phase change metal (1-1) melting point.

In the above embodiments, the phase-change metal 1-1 may be Wood's metal, but it is not limited to this material.

The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of the present invention.

Claims (8)

1. The utility model provides an electronic components radiator that metal solid-liquid phase becomes and vapor compression refrigeration cycle combines together which characterized in that includes:

a phase-change metal packaging box (1) which is packaged with low-temperature solid-liquid phase-change metal (1-1),

a vapor compression refrigeration subsystem (2),

the phase change metal packaging box (1) is in thermal contact with an electronic component to be cooled.

2. The heat sink for electronic components combining metal phase transition and vapor compression refrigeration cycle as claimed in claim 1, wherein:

fins (1-2) can be arranged on the peripheral outer wall and the top of the phase-change metal packaging box (1), and the box body and the fins are made of materials with high heat conductivity coefficients.

3. The heat sink for electronic components combining metal phase transition and vapor compression refrigeration cycle as claimed in claim 2, wherein:

the refrigeration subsystem (2) comprises a condensing unit (2-1) and an evaporator (2-2),

wherein, the evaporator (2-2) is encapsulated in the phase-change metal encapsulation box (1) and soaked in the phase-change metal (1-1); the evaporator tubing enters the enclosure from a direction opposite gravity.

4. The heat sink for electronic components combining metal phase transition and vapor compression refrigeration cycle as claimed in claim 3, wherein:

when the power of the electronic component rises suddenly, the heat dissipation capacity is increased rapidly, the phase-change metal (1-1) is melted into liquid state, a large amount of heat is taken away in a short time, and meanwhile, the refrigeration subsystem (2) is started;

when the electronic component refrigeration subsystem (2) starts to enter a stable working state after being started, the refrigerant is compressed, condensed and throttled by the condensing unit (2-1), enters the evaporator (2-2) to be evaporated, takes away heat generated by the electronic components, takes away heat generated by liquid-solid phase change of metal, condenses the liquid metal into a solid state, and returns the evaporated refrigerant to the condensing unit (2-1) in a gaseous state to complete a vapor compression refrigeration cycle.

5. The heat sink for electronic components combining metal phase transition and vapor compression refrigeration cycle as claimed in claim 3, wherein:

the starting signal of the refrigeration subsystem (2) comes from a temperature sensor attached to the surface of an electronic component,

when the temperature of the electronic components reaches a set value close to the melting point of the phase-change metal (1), the refrigeration subsystem (2) is started;

when the temperature of the electronic component is reduced to a certain temperature below the set value, the phase-change metal (1-1) is completely solidified, the refrigeration subsystem (2) stops running, the possibility of generating condensed water due to too low evaporation temperature is avoided, and the safe operation of the electronic equipment is ensured; the small amount of heat generated by the electronic components is taken away by air through the fins on the periphery of the metal packaging box.

6. A heat dissipation method for an electronic component combining metal phase change and vapor compression refrigeration cycle is characterized by comprising the following steps:

the phase-change metal packaging box (1) is in thermal contact with an electronic component to be cooled, the phase-change metal (1-1) is packaged in the phase-change metal packaging box (1),

when the power of the electronic components rises suddenly and the heat dissipation capacity is increased rapidly, the phase change metal (1-1) is melted into liquid state at the moment, a large amount of heat is taken away in a short time, and simultaneously the steam compression type refrigeration subsystem (2) is started,

wherein,

the refrigeration subsystem (2) comprises a condensing unit (2-1) and an evaporator (2-2),

the evaporator (2-2) is packaged in the phase-change metal packaging box (1) and soaked in the phase-change metal (1-1).

7. The method of claim 6, wherein:

when the refrigeration subsystem (2) starts to enter a stable working state after being started, the refrigerant is compressed, condensed and throttled by the condensing unit (2-1), enters the evaporator (2-2) to be evaporated, takes away heat generated by electronic components, takes away heat generated by metal liquid-solid phase change, condenses liquid metal into a solid state, and returns to the condensing unit (2-1) in a gaseous state to finish a vapor compression refrigeration cycle.

8. The method of claim 7, wherein:

the starting signal of the refrigeration subsystem (2) comes from a temperature sensor attached to the surface of an electronic component,

when the temperature of the electronic components reaches a set value close to the melting point of the phase-change metal (1), the refrigeration subsystem (2) is started;

when the temperature of the electronic component is reduced to a certain temperature below the set value, the refrigeration subsystem (2) stops running, the phase-change metal (1-1) is completely solidified, the refrigeration subsystem (2) stops running, condensate water is prevented from being possibly generated due to too low evaporation temperature, and the safe operation of the electronic equipment is ensured; the small amount of heat generated by the electronic components is taken away by air through the fins on the periphery of the metal packaging box.