CN104078396A - Silicon-chip storage management method - Google Patents
Silicon-chip storage management method Download PDFInfo
- Publication number
- CN104078396A CN104078396A CN201410331756.4A CN201410331756A CN104078396A CN 104078396 A CN104078396 A CN 104078396A CN 201410331756 A CN201410331756 A CN 201410331756A CN 104078396 A CN104078396 A CN 104078396A
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- China
- Prior art keywords
- silicon
- chip
- silicon chip
- wafer
- sorter
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/0008—General problems related to the reading of electronic memory record carriers, independent of its reading method, e.g. power transfer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention provides a silicon-chip storage management method. The silicon-chip storage management method comprises the following steps that an RFID tag adheres to a white card, the white card is placed in a plastic bag, and the plastic bag adheres to the surface of a front opening shipping box; a virtual identification code is assigned to the RFID tag, so that each RFID tag corresponds to the unique virtual identification code; the front opening shipping box is placed at a first silicon-chip conveying port of a silicon-chip sorter, a silicon-chip front opening unified pod is placed at a second silicon-chip conveying port of the silicon-chip sorter, the silicon-chip sorter is used for obtaining the unique virtual identification code by reading the RFID tag, and therefore automatic conveying of silicon chips is conducted on the silicon-chip sorter. The silicon-chip storage management method can be used for achieving online conveying of the silicon chips in the front opening shipping box on a manufacturing execution system. According to the silicon-chip storage management method, the problem that human errors lead to wrong chip selection and therefore accidents are caused can be solved, and inaccurate silicon-chip information caused by the human errors can be avoided.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly, the present invention relates to a kind of silicon chip storage and managenent method.
Background technology
At present; in semiconductor industry, be generally to use wafer to transmit box (front opening unifiedpod; FOUP) and wafer escape defeated box (front opening shipping box, FOSB) be used as carrying, transmit and protection wafer container.
Transmit the silicon chip in box for wafer, the reading manner of existing silicon chip sorter (sorter) is that radio frequency discrimination RFID (the Radio Frequency Identification) label escaping on defeated box by wafer carries out reading of silicon chip information and confirms.
But, as shown in Figure 1, wafer escapes on defeated box 100 does not have RFID, silicon chip sorter is beyond recognition the information of silicon chip wherein thus, so according to prior art, the biography sheet escaping in defeated box for wafer can only be that under line, ((Offline) pass sheet, need on silicon chip sorter, carry out manually selection and need the silicon chip transmitting), cannot in Manufacturing Executive System MES (manufacturing execution system), (Online) execution online pass sheet (, cannot carry out automatic biography sheet).
For the wafer defeated box 100 that escapes, on silicon chip sorter, carry out manually selecting needing the silicon chip that transmits, easily because human negligence causes chip select mistake and and then causes the accident.On the other hand, easily cause the inaccuracy of silicon chip information due to human negligence.
Summary of the invention
Technical problem to be solved by this invention is for there being above-mentioned defect in prior art, and a kind of silicon chip storage and managenent method that can realize the silicon chip that wafer is escaped in defeated box and pass online sheet on manufacturing execution system is provided.
In order to realize above-mentioned technical purpose, according to the present invention, provide a kind of silicon chip storage and managenent method, comprising: RFID label is disposed to the wafer defeated box that escapes; By virtual identifying coding assignment to RFID label, so that each RFID label is encoded corresponding to unique virtual identifying; The wafer defeated box that escapes is placed on silicon chip sorter, to obtain corresponding unique virtual identifying coding by means of silicon chip sorter by reading RFID label, on silicon chip sorter, carries out automatic silicon and pass sheet.
Preferably, the wafer defeated box that escapes is placed on to the first chip transmission port of silicon chip sorter, and wafer is transmitted to box and is placed on the second chip transmission port of silicon chip sorter.
Preferably, RFID label is affixed on to the escape surface of defeated box of wafer.
Preferably, RFID label being embedded to wafer escapes in defeated box.
Preferably, RFID label is affixed on to Bai Kashang, and will blocks in vain and put into polybag, and polybag is affixed on to the escape surface of defeated box of wafer.
The invention provides a kind of silicon chip storage and managenent method that can realize the silicon chip that wafer is escaped in defeated box and pass online sheet on manufacturing execution system.The present invention can avoid the chip select mistake that causes due to human negligence and and then cause the accident, and can avoid the silicon chip information inaccuracy causing due to human negligence.
Brief description of the drawings
By reference to the accompanying drawings, and by reference to detailed description below, will more easily there is more complete understanding to the present invention and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows according to the escape outward appearance of defeated box of the wafer of prior art.
Fig. 2 schematically shows the escape outward appearance of defeated box of wafer according to the preferred embodiment of the invention.
Fig. 3 schematically shows RFID label assembly according to the preferred embodiment of the invention.
The escape outward appearance of defeated box of the wafer that Fig. 4 schematically shows another preferred embodiment according to the present invention.
Fig. 5 schematically shows the silicon chip being arranged according to the preferred embodiment of the invention on silicon chip sorter and deposits arrangement.
It should be noted that, accompanying drawing is used for illustrating the present invention, and unrestricted the present invention.Note, the accompanying drawing that represents structure may not be to draw in proportion.And in accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
The defeated box FOSB (Front Opening Shipping Box) no matter wafer transmission box FOUP (Front Opening Unified Pod) or wafer escape, if wish to upload sheet at silicon chip sorter on-line automaticly, need to have RFID label just can carry out on-line automatic biography sheet; But existing wafer escapes on defeated box does not have RFID label, thus cannot be on silicon chip sorter on-line automatic biography sheet.Thus, the present invention is by the repacking to RFID label, and the RFID label that will write virtual identifying coding (for example, virtual identifying symbol) is affixed on wafer and escapes on defeated box, just can successfully be placed into and on silicon chip sorter, carry out on-line automatic biography sheet.
Specifically describe the preferred embodiments of the present invention below in conjunction with accompanying drawing.
In silicon chip storage and managenent method according to a preferred embodiment of the invention, RFID label 10 is disposed to the wafer defeated box 100 that escapes; For example, RFID label 10 can be affixed on to the escape surface of defeated box 100 of wafer, RFID label 10 can certainly be embedded to wafer and escape in defeated box 100, as shown in Figure 2.
And, in preferred exemplary, for example, RFID label 10 can be affixed on white card 20, and will block in vain 20 and put into polybag 30 (as shown in Figure 3), and polybag 30 is affixed on to the escape surface (as shown in Figure 4) of defeated box 100 of wafer.
In silicon chip storage and managenent method according to a preferred embodiment of the invention, need to carry out writing (of virtual identifying coding to RFID label 10, by virtual identifying coding assignment to RFID label 10), to make each RFID label 10 corresponding with corresponding unique virtual identifying coding.Like this, silicon chip sorter 300 can obtain corresponding unique virtual identifying coding by reading RFID label 10.
And, the wafer defeated box 100 that escapes is placed on silicon chip sorter 300, obtain corresponding unique virtual identifying coding by means of silicon chip sorter 300 by reading RFID label 10 thus, on silicon chip sorter 300, carry out automatic silicon and pass sheet.Thus, can on manufacturing execution system, realize the online biography sheet of the silicon chip that wafer is escaped in defeated box.Like this, can avoid the chip select mistake that causes due to human negligence and and then cause the accident, and can avoid the silicon chip information inaccuracy causing due to human negligence.
For example, as shown in Figure 5, the defeated box 100 that wafer can be escaped is placed on the first chip transmission port PO RT1 place of silicon chip sorter 300, and wafer is transmitted to box 200 and is placed on the second chip transmission port PO RT2 place of silicon chip sorter 300.Thus, can on manufacturing execution system, realize escape defeated box and wafer of wafer transmitted to the online biography sheet of the silicon chip in box.
In addition, it should be noted that, unless stated otherwise or point out, otherwise the descriptions such as term " first " in specification, " second ", " the 3rd " are only for distinguishing each assembly, element, step of specification etc., instead of for representing logical relation or the ordinal relation etc. between each assembly, element, step.
Be understandable that, although the present invention discloses as above with preferred embodiment, but above-described embodiment is not in order to limit the present invention.For any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (5)
1. a silicon chip storage and managenent method, is characterized in that comprising:
RFID label is disposed to the wafer defeated box that escapes;
By virtual identifying coding assignment to RFID label, so that each RFID label is encoded corresponding to unique virtual identifying;
The wafer defeated box that escapes is placed on silicon chip sorter, to obtain corresponding unique virtual identifying coding by means of silicon chip sorter by reading RFID label, on silicon chip sorter, carries out automatic silicon and pass sheet.
2. silicon chip storage and managenent method according to claim 1, is characterized in that, the wafer defeated box that escapes is placed on to the first chip transmission port of silicon chip sorter, and wafer is transmitted to box and is placed on the second chip transmission port of silicon chip sorter.
3. silicon chip storage and managenent method according to claim 1 and 2, is characterized in that, RFID label is affixed on to the escape surface of defeated box of wafer.
4. silicon chip storage and managenent method according to claim 1 and 2, is characterized in that, RFID label is embedded to wafer and escape in defeated box.
5. silicon chip storage and managenent method according to claim 1 and 2, is characterized in that, RFID label is affixed on to Bai Kashang, and will block in vain and put into polybag, and polybag is affixed on to the escape surface of defeated box of wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410331756.4A CN104078396A (en) | 2014-07-11 | 2014-07-11 | Silicon-chip storage management method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410331756.4A CN104078396A (en) | 2014-07-11 | 2014-07-11 | Silicon-chip storage management method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104078396A true CN104078396A (en) | 2014-10-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410331756.4A Pending CN104078396A (en) | 2014-07-11 | 2014-07-11 | Silicon-chip storage management method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104078396A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200608463A (en) * | 2004-08-31 | 2006-03-01 | Taiwan Semiconductor Mfg Co Ltd | Carrier facilitating radio-frequency identification (RFID) operation in a semiconductor fabrication system |
| TW200939296A (en) * | 2008-03-13 | 2009-09-16 | Chipmos Technologies Inc | An RFID real-time information system accommodated to semiconductor supply chain |
| US20120321423A1 (en) * | 2011-05-19 | 2012-12-20 | Crossing Automation, Inc. | Dynamic Storage and Transfer System Integrated with Autonomous Guided/Roving Vehicle |
| TW201419437A (en) * | 2012-09-06 | 2014-05-16 | Brooks Automation Inc | Access arbitration system for semiconductor fabrication equipment and methods for using and operating the same |
-
2014
- 2014-07-11 CN CN201410331756.4A patent/CN104078396A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200608463A (en) * | 2004-08-31 | 2006-03-01 | Taiwan Semiconductor Mfg Co Ltd | Carrier facilitating radio-frequency identification (RFID) operation in a semiconductor fabrication system |
| TW200939296A (en) * | 2008-03-13 | 2009-09-16 | Chipmos Technologies Inc | An RFID real-time information system accommodated to semiconductor supply chain |
| US20120321423A1 (en) * | 2011-05-19 | 2012-12-20 | Crossing Automation, Inc. | Dynamic Storage and Transfer System Integrated with Autonomous Guided/Roving Vehicle |
| TW201419437A (en) * | 2012-09-06 | 2014-05-16 | Brooks Automation Inc | Access arbitration system for semiconductor fabrication equipment and methods for using and operating the same |
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Application publication date: 20141001 |
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