CN104076553A - Substrate structure and display panel - Google Patents
Substrate structure and display panel Download PDFInfo
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- CN104076553A CN104076553A CN201410335669.6A CN201410335669A CN104076553A CN 104076553 A CN104076553 A CN 104076553A CN 201410335669 A CN201410335669 A CN 201410335669A CN 104076553 A CN104076553 A CN 104076553A
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- 239000000758 substrate Substances 0.000 title claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 48
- 239000012780 transparent material Substances 0.000 claims abstract description 24
- 238000000926 separation method Methods 0.000 claims description 26
- 238000009413 insulation Methods 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 15
- 238000001914 filtration Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Abstract
A substrate structure comprises a substrate, a shading pattern layer and a plurality of position identification pattern codes. The shading pattern layer is arranged on the substrate and is provided with a plurality of openings so as to expose one surface of the substrate. The position identification pattern code is configured on the substrate and is arranged corresponding to the opening. Each position identification image code is completely overlapped with the corresponding opening in the vertical projection direction. The material of the position identification pattern code is a transparent light resistance, and the transparent light resistance comprises a transparent material capable of absorbing infrared light.
Description
[technical field]
The invention relates to a kind of board structure and display panel, and it applies the display panel of this board structure to relate to especially a kind of board structure with positional information.
[background technology]
For more convenient, volume are more lightly changed and more humane, the input mode of many information products, by traditional device such as keyboard or mouse, changes the mode of touch-control device as input that use into.Touch-control device can be assembled in the flat-panel screens of all multiple types, so that flat-panel screens has the function of display frame and input operation information concurrently.
The known display panel with location identification capability, on one board structure, dispose multiple location recognition figure codes that absorb infrared light material, wherein the plurality of location recognition figure code is to belong to same rete with black matrix layer, and corresponding being disposed in the slit of pixel electrode.That is to say, the plurality of location recognition figure code is to adopt the material with light-proofness, therefore the plurality of location recognition figure code cannot be disposed in pixel region (being transmission region), only configurable in the slit of pixel electrode, otherwise can cause the aperture opening ratio of overall display panel to decline.In other words, the configuration mode of known location recognition figure code, selects to still have its restriction because of its material, cannot arbitrarily change its position, therefore its flexible configuration degree is lower, and then causes the location identification capability of overall display panel not good.
[summary of the invention]
The invention provides a kind of board structure, it has location recognition figure code, and the function of recognizing site can be provided.
The present invention also provides a display panel, and it comprises above-mentioned board structure, can improve the location identification capability of display panel.
Board structure of the present invention comprises a substrate, a shielding pattern layer and multiple location recognition figure code.Shielding pattern layer is disposed on substrate, and wherein shielding pattern layer has multiple openings, to expose a surface of substrate.Location recognition figure code is disposed on substrate and corresponding opening setting.Each position identification figure code is overlapped in corresponding opening completely in vertical projection direction.The material of location recognition figure code is a transparent photoresistance, and transparent photoresistance comprises a transparent material that can absorb infrared light.
In one embodiment of this invention, above-mentioned board structure more comprises multiple color filter patterns, is disposed on substrate.Color filter patterns part covers shielding pattern layer and covers the opening of shielding pattern layer completely.
In one embodiment of this invention, above-mentioned board structure more comprises a protective seam, is disposed on substrate and covers color filter patterns and shielding pattern layer.Location recognition figure code is disposed on protective seam.
In one embodiment of this invention, above-mentioned board structure more comprises multiple separation materials, is disposed on protective seam.The height of each separation material is higher than the height of each position identification figure code.Each separation material is overlapped in shielding pattern layer in vertical projection direction, and separation material and location recognition figure code are same rete.
In one embodiment of this invention, above-mentioned board structure more comprises at least one transparent pattern, be disposed on protective seam, and at least one opening setting of corresponding shielding pattern layer.The height of transparent pattern is lower than the height of each position identification figure code.Transparent pattern is not overlapping with color filter patterns in vertical projection direction, and transparent pattern and location recognition figure code are same rete.
In one embodiment of this invention, above-mentioned board structure more comprises multiple active components, multiple pixel electrode, an insulation course and multiple color filter patterns.Active component is disposed on substrate.Pixel electrode is disposed on substrate and couples respectively active component.Insulation course is disposed on substrate and covers active component and pixel electrode, and wherein shielding pattern layer is positioned on insulation course.Color filter patterns is disposed on insulation course, and is disposed at respectively in the opening of shielding pattern layer, and covers location recognition figure code.
In one embodiment of this invention, above-mentioned shielding pattern layer is overlapped in active component completely in vertical projection direction.
In one embodiment of this invention, above-mentioned active component partially overlaps shielding pattern layer in vertical projection direction.
In one embodiment of this invention, above-mentioned board structure more comprises multiple separation materials, be disposed on insulation course, and separation material and location recognition figure code is same rete.
In one embodiment of this invention, the main absorbing wavelength of the transparent material of above-mentioned absorbed infrared light is the infrared light of 800 nanometer to 1100 nanometers.
In one embodiment of this invention, the external form profile of above-mentioned each position identification icon comprises strip, taper, column or point-like.
Display panel of the present invention, it comprises above-mentioned board structure, a subtend substrate and a display dielectric layer.Subtend substrate is disposed at the subtend of board structure.Display dielectric layer is disposed between board structure and subtend substrate.
In one embodiment of this invention, above-mentioned in the time that board structure is a colored optical filtering substrates, subtend substrate is an active elements array substrates.When board structure is one while being integrated with the active array base plate of colorized optical filtering layer pattern, subtend substrate is one to have the substrate of a common electrode.
In one embodiment of this invention, above-mentioned demonstration dielectric layer comprises a liquid crystal layer.
Based on above-mentioned, because the location recognition figure code of board structure of the present invention is using transparent photoresistance as its material, and this transparent photoresistance is to include the transparent material that can absorb infrared light.Therefore, to adopt the material with light-proofness identical with black matrix compared to the location recognition figure code of known board structure, and this location recognition figure code only can be disposed at the problem of avoiding aperture opening ratio to decline in slit, location recognition figure code of the present invention can allow visible ray penetrate, and the size of location recognition figure code can not affect aperture opening ratio, and the area of increase location recognition figure code also can increase location identification capability.Therefore the position configuration mode of location recognition figure code of the present invention is to be disposed in the opening of shielding pattern layer, can have preferably flexible configuration degree.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
[brief description of the drawings]
Fig. 1 illustrates the schematic diagram of overlooking for the board structure of one embodiment of the invention.
Fig. 2 illustrates the schematic diagram of overlooking for the board structure of another embodiment of the present invention.
Fig. 3 A illustrates the diagrammatic cross-section into a kind of board structure of one embodiment of the invention.
Fig. 3 B illustrates the schematic diagram into three color scheme formula light shield.
Fig. 4 illustrates the diagrammatic cross-section into a kind of board structure of another embodiment of the present invention.
Fig. 5 illustrates the diagrammatic cross-section into a kind of board structure of another embodiment of the present invention.
Fig. 6 illustrates the schematic diagram into a kind of display panel of one embodiment of the invention.
Fig. 7 illustrates the schematic diagram into a kind of display panel of another embodiment of the present invention.
[symbol description]
100a, 100b, 100c, 100d, 100e: board structure
110: substrate
112: surface
120,120d, 120e: shielding pattern layer
122,122a, 122b, 122c, 122d: opening
130,130a, 130b: location recognition figure code
140a, 140b, 140c, 140d, 140e, 140f, 140g: color filter patterns
150: protective seam
160,160a, 160b: separation material
170: transparent pattern
180: insulation course
200a, 200b: board structure
300a, 300b: subtend substrate
302: common electrode
400: display dielectric layer
T: active component
P: pixel electrode
H1, H2, H3: highly
GS: glass substrate
HT: semitransmissive layer
SL: light shield layer
AR: anti-reflecting layer
T1: the first opening
T2: the second opening
T3: the 3rd opening
M: three color scheme formula light shield
UV: ultraviolet light
[embodiment]
Fig. 1 illustrates the schematic diagram of the configuration mode of multiple location recognition figure code in the board structure into one embodiment of the invention.Please refer to Fig. 1, in the present embodiment, board structure 100a comprises substrate 110, shielding pattern layer 120 and multiple location recognition figure code 130a.Shielding pattern layer 120 is disposed on substrate 110, and wherein shielding pattern layer 120 has multiple openings 122 (comprising opening 122a, 122b, 122c, 122d), to expose the surface 112 of substrate 110.Location recognition figure code 130a is disposed on substrate 110 and corresponding opening 122a, 122b, 122c, 122d arrange.Each position identification figure code 130a is overlapped in corresponding opening 122a, 122b, 122c, 122d completely in vertical projection direction.The material of location recognition figure code 130a is transparent photoresistance, and transparent photoresistance comprises the transparent material that can absorb infrared light, wherein can absorb the material such as transparent material containing quantum point or the fluorescent powder of nano-scale of infrared light.
Specifically, the substrate 110 of the present embodiment is for example glass substrate or plastic substrate, and the material of shielding pattern layer 120 is for example black resin.It should be noted that, in the present embodiment, location recognition figure code 130a only opening 122b, 122c, the 122d of corresponding shielding pattern layer 120 arranges, and is not arranged in opening 122a.Moreover, the transparent photoresistance described in the present embodiment, its transmittance is almost 100%, and can absorb the transparent material of infrared light, and its main absorbing wavelength is the infrared light of 800 nanometer to 1100 nanometers.
In the time of Infrared irradiation board structure 100a, infrared light can be blocked but can penetrate opening 122b, 122c, 122d by shielding pattern layer 120.In other words, if be provided with corresponding location recognition figure code 130a in opening 122b, 122c, 122d, infrared light can partial penetration opening 122b, 122c, 122d; Otherwise if corresponding location recognition figure code 130a is not set in opening 122b, 122c, 122d, infrared light can directly penetrate opening 122b, 122c, 122d.Therefore, that corresponding opening 122b, 122c, 122d are while arranging when absorbing the location recognition figure code 130a of infrared light, can utilize as infrared light electric charge coupling element (charge couple device, CCD) image fetch device is identified and interpretation location recognition figure code 130a, thereby calculates the corresponding position of location recognition figure code 130a.Furthermore, infrared light sees through opening 122b, 122c, 122d is penetrated into film layer structure (such as diffusion sheet, prismatic lens or light guide plate etc.) the generation diffusion of backlight module and then reflects.Therefore in the time of infrared light reflection, CCD can receive infrared light.Now, be provided with location recognition figure code 130a region can because of absorb infrared light be shown as black.Afterwards, processor receives after the image of CCD, sees through algorithm decoding, can obtain location coordinate message.Generally speaking, the board structure 100a of the present embodiment is because having location recognition figure code 130a, therefore the function of recognizing site can be provided.
In addition, the present embodiment does not limit the shape of location recognition figure code 130a.Specifically, if the shape of the position code 130a in Fig. 1 is for example point-like, as circle.In other embodiments, please refer to Fig. 2, the shape of the location recognition figure code 130b of board structure 100b is for example strip, as rectangle.In other alternate embodiment, the shape of location recognition figure code also can be taper or column, is not limited in this.
In addition, the present embodiment does not also limit quantity and the configuration mode thereof of location recognition figure code 130a and 130b.Specifically, the quantity of the location recognition figure code 130 in each opening 122 is not necessarily identical, as shown in Figures 1 and 2, location recognition figure code 130a in middle two adjacent opening 122b, 122c, the quantity of 130b are respectively two, and the quantity of location recognition figure code 130a, 130b in the opening 122d of the rightmost side is three.Moreover the configuration mode of location recognition figure code 130a, 130b in each opening 122 is also not necessarily identical, for example, the arrangement mode of location recognition figure code 130a, 130b in the most left-of-center opening 122b represents that position is " 01 "; The arrangement mode of location recognition figure code 130a, 130b in the most center-right opening 122c represents that position is " 10 "; The arrangement mode of location recognition figure code 130a, 130b in rightmost opening 122d represents that position is " 11 "; The Far Left not opening 122a of setting position identification figure code 130a, 130b represents that position is " 00 ", but the invention is not restricted to this.
Because board structure 100a, the 100b of the present embodiment adopt the material of transparent photoresistance as location recognition figure code 130a, 130b, and this transparent material comprises the transparent material that can absorb infrared light.Therefore,, in the opening 122 that the location recognition figure code 130a of the present embodiment, 130b are disposed at shielding pattern layer 120, can there is preferably flexible configuration degree.
Should be noted that at this, following embodiment continues to use element numbers and the partial content of previous embodiment, wherein, adopts identical label to represent identical or approximate element, and has omitted the explanation of constructed content.Explanation about clipped can be with reference to previous embodiment, and it is no longer repeated for following embodiment.
Fig. 3 A illustrates the diagrammatic cross-section into a kind of board structure of one embodiment of the invention.Please refer to Fig. 3 A, the board structure 100c of the present embodiment is similar to the board structure 100a of Fig. 1, only the two Main Differences part is: the board structure 100c of the present embodiment more comprises multiple color filter patterns 140a, 140b, 140c, wherein, color filter patterns 140a, 140b, 140c are disposed on substrate 110, and color filter patterns 140a, 140b, 140c part covers shielding pattern layer 120 and covers the opening 122 of shielding pattern layer 120 completely.It should be noted that, color filter patterns 140a, 140b, 140c for example represent respectively red filter pattern, green filter pattern and blue filter pattern.
Moreover; the board structure 100c of the present embodiment can more comprise protective seam 150; wherein, protective seam 150 is disposed on substrate 110 and covers color filter patterns 140a, 140b, 140c and shielding pattern layer 120, to protect color filter patterns 140a, 140b, 140c and shielding pattern layer 120.The location recognition figure code 130 of the present embodiment is disposed on protective seam 150, and the shape of location recognition figure code 130 is for example coniform, but not as limit.
In addition, the board structure 100c of the present embodiment can more comprise multiple separation materials 160 (only schematically illustrating in Fig. 3 A), and wherein, separation material 160 is disposed on protective seam 150.More particularly, the height H 1 of each separation material 160 is higher than the height H 2 of each position identification figure code 130.Each separation material 160 is overlapped in shielding pattern layer 120 in vertical projection direction, and separation material 160 is same rete with location recognition figure code 130.That is to say, the material of separation material 160 is transparent photoresistance, and this transparent photoresistance comprises the transparent material that can absorb infrared light, wherein, can absorb the material such as transparent material containing quantum point or the fluorescent powder of nano-scale of infrared light.
In addition, the board structure 100c of the present embodiment more comprises transparent pattern 170, and wherein, transparent pattern 170 is disposed on protective seam 150, and one of them opening 122 of corresponding shielding pattern layer 120 arranges.Specifically, the height H 3 of the transparent pattern 170 of the present embodiment is lower than the height H 2 of each position identification figure code 130.Transparent pattern 170 is not overlapping with color filter patterns 140a, 140b, 140c in vertical projection direction, and transparent pattern 170 is same rete with location recognition figure code 130.That is to say, the material of transparent pattern 170 is transparent photoresistance, and this transparent photoresistance comprises the transparent material that can absorb infrared light, wherein, can absorb the material such as transparent material containing quantum point or the fluorescent powder of nano-scale of infrared light.
Fig. 3 B illustrates the schematic diagram of three color scheme formula light shield.Please refer to Fig. 3 B, in the present embodiment, the manufacturing method thereof of location recognition figure code 130, separation material 160 and transparent pattern 170, for example to see through three color scheme formula light shield (Tri-tone Mask) M, wherein, three color scheme formula light shield M sequentially forms semitransmissive layer HT, light shield layer SL and anti-reflecting layer AR on glass substrate GS.Specifically, three color scheme formula light shield M has the first opening T1, the second opening T2 and multiple the 3rd opening T3, and wherein, the first opening T1 exposes glass substrate GS, and the second opening T2 exposes semitransmissive layer HT, and the 3rd opening T3 exposes light shield layer SL.The aperture of the first opening T1 is greater than the aperture of the second opening T2, and the aperture of the second opening T2 is greater than the aperture of the 3rd opening T3.By the different pore size size of the first opening T1, the second opening T2 and the 3rd opening T3 to produce respectively location recognition figure code 130, separation material 160 and transparent pattern 170.Then; this three color scheme formula light shield M is disposed to the top of half-finished board structure 100c (cover a whole layer and comprise the transparent material that can absorb infrared light on protective seam 150); and by the direction of three color scheme formula light shield M towards board structure 100c irradiating ultraviolet light UV; wherein; the first opening T1 can form separation material 160 in the corresponding position of board structure 100c; the second opening T2 can form location recognition figure code 130 in the corresponding position of board structure 100c, and the 3rd opening T3 can form transparent pattern 170 in the corresponding position of board structure 100c.
In brief, because the board structure 100c of the present embodiment has color filter patterns 140a, 140b, 140c, therefore the board structure 100c of the present embodiment can be considered colored optical filtering substrates.Moreover because the board structure 100c of the present embodiment adopts the material of transparent photoresistance as location recognition figure code 130c, and this transparent material comprises the transparent material that can absorb infrared light.Therefore, the location recognition figure code 130c of the present embodiment is disposed in the opening 122 of shielding pattern layer 120, can have preferably flexible configuration degree.In addition, the board structure 100c of the present embodiment, except having location recognition figure code 130, can provide outside the function of recognizing site, and board structure 100c also has color filter patterns 140a, 140b, 140c, can be vertical and the colored function showing is provided with other substrate in batch.
Fig. 4 illustrates the diagrammatic cross-section into a kind of board structure of one embodiment of the invention.Please refer to Fig. 4, the board structure 100d of the present embodiment is similar to the board structure 100a of Fig. 1, and only the two Main Differences part is: the board structure 100d of the present embodiment more comprises multiple active component T, multiple pixel electrode P, insulation course 180 and multiple color filter patterns 140d, 140e, 140f, 140g.Active component T is disposed on substrate 110.Pixel electrode P is disposed on substrate 110 and couples respectively active elements T.Insulation course 180 is disposed on substrate 110 and covers active elements T and pixel electrode P, and wherein, shielding pattern layer 120d is positioned on insulation course 180.Color filter patterns 140d, 140e, 140f, 140g are disposed on insulation course 180, and are disposed at respectively in the opening 122d of shielding pattern layer 120d, and cover location recognition figure code 130.The active component T of the present embodiment partially overlaps shielding pattern layer 120d in vertical projection direction, and the shape of location recognition figure code 130 is for example coniform, but not as limit.
In addition, the board structure 100d of the present embodiment can more comprise multiple separation material 160a, 160b, and wherein, separation material 160a, 160b are disposed on insulation course 180, and separation material 160a, 160b and location recognition figure code 130 are same rete.That is to say, the material of separation material 160a, 160b is transparent photoresistance, and this transparent photoresistance comprises the transparent material that can absorb infrared light.Herein, because board structure 100d has active component T and color filter patterns 140d, 140e, 140f, 140g, therefore board structure 100d can be considered the active array base plate that is integrated with colorized optical filtering layer pattern.
In brief, because the board structure 100d of the present embodiment adopts the material of transparent photoresistance as location recognition figure code 130, and this transparent material comprises the transparent material that can absorb infrared light.Therefore, the location recognition figure code 130 of the present embodiment is disposed in the opening 122d of shielding pattern layer 120d, can have preferably flexible configuration degree.In addition, the board structure 100d of the present embodiment is except having location recognition figure code 130, can provide outside the function of recognizing site, board structure 100d also has color filter patterns 140d, 140e, 140f, 140g and active component T, can stand and provide colour to show and drive the function of display medium with other substrates and display dielectric layer group.
Fig. 5 illustrates the diagrammatic cross-section into a kind of board structure of one embodiment of the invention.Please refer to Fig. 5, the board structure 100e of the present embodiment is similar to the board structure 100d of Fig. 4, and only the two Main Differences part is: the shielding pattern layer 120e of the board structure 100e of the present embodiment is overlapped in active component T completely in vertical projection direction.
Fig. 6 illustrates the schematic diagram into a kind of display panel of one embodiment of the invention.Please refer to Fig. 6, the display panel 200a of the present embodiment comprises the board structure 100c of above-mentioned Fig. 2, subtend substrate 300a and display dielectric layer 400.Subtend substrate 300a is disposed at the subtend of board structure 100c, and display dielectric layer 400 is disposed between board structure 100c and subtend substrate 300a., show that dielectric layer 400 is for example liquid crystal layer herein, but not as limit, and board structure 100c is colored optical filtering substrates, and subtend substrate 300a is active elements array substrates.Because the board structure 100c of the present embodiment has location recognition figure code 130, therefore the display panel 200a of the present embodiment can provide the function of recognizing site.In addition, because the present embodiment is to adopt the material of transparent photoresistance as location recognition figure code 130, and this transparent material comprises the transparent material that can absorb infrared light.Therefore, the location recognition figure code 130 of the present embodiment is disposed in the opening 122 of shielding pattern layer 120, can have preferably flexible configuration degree, and the display panel 200a with board structure 100c can effectively improve its location identification capability.
Fig. 7 illustrates the schematic diagram into a kind of display panel of another embodiment of the present invention.Please refer to Fig. 7, the display panel 200b of the present embodiment is similar to the display panel 200a of Fig. 6, only the two Main Differences part is: the board structure 100d of the present embodiment is the active array base plate that is integrated with colorized optical filtering layer pattern, and subtend substrate 300b is the substrate with common electrode 302.
In sum, because the location recognition figure code of board structure of the present invention is using transparent photoresistance as its material, and this transparent photoresistance is to include the transparent material that can absorb infrared light.Therefore, to adopt the material with light-proofness identical with black matrix compared to the location recognition figure code of known board structure, and this location recognition figure code only can be disposed at the problem of avoiding aperture opening ratio to decline in slit, the position configuration mode of location recognition figure code of the present invention is to be disposed in the opening of shielding pattern layer, can have preferably flexible configuration degree.In addition, adopt the display panel of board structure of the present invention, can effectively improve its location identification capability.
Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; under any, in technical field, have and conventionally know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on the accompanying claim person of defining.
Claims (14)
1. a board structure, comprising:
One substrate;
One shielding pattern layer, is disposed on this substrate, and wherein this shielding pattern layer has multiple openings, to expose a surface of this substrate; And
Multiple location recognition figure codes, be disposed on this substrate and corresponding the plurality of opening setting, wherein respectively this location recognition figure code is overlapped in corresponding this opening completely in vertical projection direction, and the material of the plurality of location recognition figure code is a transparent photoresistance, this transparent photoresistance comprises a transparent material that can absorb infrared light.
2. board structure as claimed in claim 1, is characterized in that, more comprises:
Multiple color filter patterns, are disposed on this substrate, and wherein the plurality of color filter patterns part covers this shielding pattern layer and covers the plurality of opening of this shielding pattern layer completely.
3. board structure as claimed in claim 2, is characterized in that, more comprises:
One protective seam, is disposed on this substrate and covers the plurality of color filter patterns and this shielding pattern layer, and wherein the plurality of location recognition figure code is disposed on this protective seam.
4. board structure as claimed in claim 3, is characterized in that, more comprises:
Multiple separation materials; be disposed on this protective seam; and respectively the height of this separation material is higher than the each height of this location recognition figure code, and wherein respectively this separation material is overlapped in this shielding pattern layer in vertical projection direction, and the plurality of separation material and the plurality of location recognition figure code are same rete.
5. board structure as claimed in claim 3, is characterized in that, more comprises:
At least one transparent pattern; be disposed on this protective seam; and at least one this opening that should shielding pattern layer is arranged; the height of this transparent pattern is lower than the each height of this location recognition figure code; wherein this transparent pattern is not overlapping with the plurality of color filter patterns in vertical projection direction, and this transparent pattern and the plurality of location recognition figure code are same rete.
6. board structure as claimed in claim 1, is characterized in that, more comprises:
Multiple active components, are disposed on this substrate;
Multiple pixel electrodes, are disposed on this substrate and couple respectively the plurality of active component;
One insulation course, is disposed on this substrate and covers the plurality of active component and the plurality of pixel electrode, and wherein this shielding pattern layer is positioned on this insulation course; And
Multiple color filter patterns, are disposed on this insulation course, and are disposed at respectively in the plurality of opening of this shielding pattern layer, and cover the plurality of location recognition figure code.
7. board structure as claimed in claim 6, is characterized in that, this shielding pattern layer is overlapped in the plurality of active component completely in vertical projection direction.
8. board structure as claimed in claim 6, is characterized in that, the plurality of active component partially overlaps this shielding pattern layer in vertical projection direction.
9. board structure as claimed in claim 6, is characterized in that, more comprises:
Multiple separation materials, are disposed on this insulation course, and the plurality of separation material and the plurality of location recognition figure code are same rete.
10. board structure as claimed in claim 1, is characterized in that, this main absorbing wavelength that can absorb the transparent material of infrared light is the infrared light of 800 nanometer to 1100 nanometers.
11. board structures as claimed in claim 1, is characterized in that, respectively the external form profile of this location recognition pattern comprises strip, taper, column or point-like.
12. 1 kinds of display panels, comprising:
One board structure as claimed in claim 1;
One subtend substrate, is disposed at the subtend of this board structure; And
One display dielectric layer, is disposed between this board structure and this subtend substrate.
13. display panels as claimed in claim 12, it is characterized in that, in the time that this board structure is a colored optical filtering substrates, this subtend substrate is an active elements array substrates, and when this board structure be one while being integrated with the active array base plate of colorized optical filtering layer pattern, this subtend substrate is one to have the substrate of a common electrode.
14. display panels as claimed in claim 12, is characterized in that, this demonstration dielectric layer comprises a liquid crystal layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103109034 | 2014-03-13 | ||
| TW103109034A TWI529451B (en) | 2014-03-13 | 2014-03-13 | Substrate structure and display panel |
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| Publication Number | Publication Date |
|---|---|
| CN104076553A true CN104076553A (en) | 2014-10-01 |
| CN104076553B CN104076553B (en) | 2017-06-06 |
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| CN201410335669.6A Expired - Fee Related CN104076553B (en) | 2014-03-13 | 2014-07-15 | Substrate structure and display panel |
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| TW (1) | TWI529451B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109656423A (en) * | 2018-09-07 | 2019-04-19 | 友达光电股份有限公司 | Sense display device and the display module using it |
| TWI699569B (en) * | 2019-09-05 | 2020-07-21 | 奇景光電股份有限公司 | Patterned light guide structure and method to form the same |
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| CN1635338A (en) * | 2004-02-19 | 2005-07-06 | 友达光电股份有限公司 | Position encoding sensor, method and system for position in the sensor display device |
| CN1614625A (en) * | 2004-12-03 | 2005-05-11 | 友达光电股份有限公司 | Handwritten inputting devices |
| JP2007304680A (en) * | 2006-05-09 | 2007-11-22 | Three M Innovative Properties Co | Functional film and method for using the same |
| CN101105736A (en) * | 2006-07-13 | 2008-01-16 | 富士施乐株式会社 | Handwriting detection sheet and handwriting system |
| CN103123427A (en) * | 2012-09-26 | 2013-05-29 | 友达光电股份有限公司 | display with position information |
| CN103226258A (en) * | 2013-03-25 | 2013-07-31 | 京东方科技集团股份有限公司 | Liquid crystal display panel and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109656423A (en) * | 2018-09-07 | 2019-04-19 | 友达光电股份有限公司 | Sense display device and the display module using it |
| CN109656423B (en) * | 2018-09-07 | 2022-03-29 | 友达光电股份有限公司 | Sensing display device and display module using same |
| TWI699569B (en) * | 2019-09-05 | 2020-07-21 | 奇景光電股份有限公司 | Patterned light guide structure and method to form the same |
| US11249245B2 (en) | 2019-09-05 | 2022-02-15 | Himax Technologies Limited | Patterned light guide structure and method to form the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201535014A (en) | 2015-09-16 |
| CN104076553B (en) | 2017-06-06 |
| TWI529451B (en) | 2016-04-11 |
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